Abstract: An actuator includes a base member and an electro-mechanical transducer element including a first electrode, an electro-mechanical transducer film, and a second electrode. Further, the base member includes a thin wall part having a concave shape, the electro-mechanical transducer film is formed in a manner such that a film thickness of the electro-mechanical transducer film is gradually reduced from a center part of the electro-mechanical transducer film to both end parts of the electro-mechanical transducer film in at least one direction crossing a film thickness direction of the electro-mechanical transducer film.

Abstract: Disclosed are a vibration generator, which can increase the vibration force of a vibration plate by additionally applying the mass of a mass body to the vibration plate, and an electronic device including the same. The vibration generator includes at least one piezoelectric element mounted inside the case and subjected to compression and expansion in response to input power, a vibration plate including a body elongated in a preset lengthwise direction and having the at least one piezoelectric element mounted thereon, and generating vibrations by the compression and expansion of the at least one piezoelectric element, and at least one mass part adding a preset magnitude of mass to the vibration plate.

Abstract: A piezoelectric device includes a vibrator, a piezoelectric drive unit, and a first piezoelectric detector. The vibrator includes a first surface, a first groove formed along a first axis direction, and a second groove formed to be parallel to the first groove. The piezoelectric drive unit includes a first electrode pair provided in the first groove and opposed to each other in a second axis direction orthogonal to the first axis direction and parallel to the first surface, and a first piezoelectric body provided between the first electrode pair, and is capable of vibrating the vibrator. The first piezoelectric detector includes a second electrode pair provided in the second groove and opposed to each other in the second axis direction, and a second piezoelectric body provided between the second electrode pair, and is capable of detecting a vibration of the vibrator.

Abstract: A piezoelectric vibrating piece includes an excitation electrode and an extraction electrode. The excitation electrode is formed in a vibrating portion. The extraction electrode is extracted from the excitation electrode to one side portion. The piezoelectric vibrating piece includes a front surface and a back surface. At least one of the front surface and the back surface includes an index mark formed in a region. The region includes at least a part of a side portion on an opposite side of the one side portion. The region allows application of an adhesive.

Abstract: A resonator element includes a base portion, a pair of vibrating arms that extend in a first direction from the base portion and are arranged along a second direction perpendicular to the first direction, and a supporting arm that extends in the first direction from the base portion and is disposed between the pair of vibrating arms when seen in a plan view.

Abstract: A surface mount type quartz crystal device includes a quartz crystal vibrating piece and a base plate. The quartz crystal vibrating piece is configured to vibrate at a predetermined frequency. The base plate is made of a crystal or a glass. The base plate includes an external electrode disposed on a bottom surface of the base plate to mount the quartz crystal device. The quartz crystal vibrating piece is placed on an opposite surface of the bottom face. The external electrode includes a metal film formed on a surface of the base plate by sputtering, and an electroless plating film formed on a surface of the metal film by electroless plating. The electroless plating film includes a nickel layer including lead and bismuth.

Abstract: A mesa-structure crystal element includes a circumferential portion having a thin thickness, a first convex portion formed on a plane in a center side from the circumferential portion and having a first height from the circumferential portion in a first principal face and a first planar shape, and a second convex portion formed in a center side from the circumferential portion and having a second height from the circumferential portion in a second principal face opposite to the first principal face and a second planar shape, wherein at least one of an area and a planar shape is different between the first planar shape of the first convex portion and the second planar shape of the second convex portion, or the first height of the first convex portion is different from the second height of the second convex portion.

Abstract: The present invention is a rotary actuator having segments, which are spaced apart and are connected by means of at least one support structure, and at least one actuator for exerting forces, characterized in that the support structure is substantially rotationally symmetrical about an axis and is composed of elements which are not oriented parallel to the axis or which are twisted through an angle in relation to the axis, and the elements can be changed by rotation about the axis and the actuator can exert forces to at least one of the segments and the support structure in the direction of the axis.

Abstract: A solidly mounted resonator (SMR) includes an acoustic resonator on a substrate, the acoustic resonator having multiple acoustic impedance layers having different acoustic impedances, respectively. The SMR further includes a bottom electrode on a top acoustic impedance layer of the plurality of acoustic impedance layers, a piezoelectric layer on the bottom electrode, a top electrode on the piezoelectric layer, and multiple lateral features on a surface of the top electrode. The lateral features include multiple stepped structures.

Abstract: Providing a method for manufacturing a package capable of achieving reliable anodic bonding between the bonding material and a base board wafer even when the bonding material having a large resistance value is used. Providing a method for manufacturing a package by anodically bonding a bonding material, which is fixed in advance to an inner surface of a lid board wafer made of an insulator, to an inner surface of a base board wafer made of an insulator, the method including an anodic bonding step where an auxiliary bonding material serving as an anode is disposed on an outer surface of the lid board wafer, a cathode is disposed on an outer surface of the base board wafer, and a voltage is applied between the auxiliary bonding material and the cathode, wherein the auxiliary bonding material is made of a material that causes an anodic bonding reaction between the auxiliary bonding material and the lid board wafer in the anodic bonding step.

Abstract: A piezoelectric device (100) comprises: a piezoelectric vibrating piece (101); a frame body (105) separated from piezoelectric vibrating piece by through-hole (108); a piezoelectric frame (10) having a supporting portion (104), a first surface (Me) and a second surface (Mi); a package lid (11) having a first connecting surface (M1) a package base (12), including a mounting surface (M4) for forming a pair of external electrodes (125) and a top surface having a second connecting surface (M2); a first sealing material (LG1) formed between the first connecting surface and the first surface; and a second sealing material (LG2) formed between the second connecting surface and the second surface. The first sealing material or the second sealing material extends to a side surface (M3) of the through-hole.

Abstract: Disclosed is an apparatus used in an electronic device for providing haptic feedback. The apparatus includes a holder having a pair fastening holes, a piezoelectric vibrator having a first though holes, a terminal with a second though hole mounted on the piezoelectric vibrator and electrically connected to the piezoelectric vibrator, and a pair of fixing portions fixing the terminal and the piezoelectric vibrator on the holder though the second though hole of the terminal, a first though holes of the piezoelectric vibrator and the fastening holes of the holder. The fixing portions fix the terminal and piezoelectric vibrator on the holder, which makes the assembling process much easier.

Abstract: A thin film bulk acoustic resonator and a method of manufacturing the same is disclosed. The thin film bulk acoustic resonator includes an acoustic resonator including a first electrode, a second electrode, and a piezoelectric layer disposed between the first electrode and the second electrode; an air gap disposed below the acoustic resonator and above a substrate to reflect the acoustic wave; and an anchor disposed on each of both surfaces of the air gap and having the same thickness as the air gap.

Abstract: A piezoelectric actuator including first and second piezoelectric cantilevers is disclosed. Wirings are provided on an upper surface of a support body on which the first and second piezoelectric cantilevers are formed. The wirings are formed of patterned metal films.

Abstract: The present invention provides a piezoelectric sensor that can reduce spurious vibration of a transducer. The piezoelectric sensor includes a transducer which has a piezoelectric body and a vibration plate and which transmits/receives ultrasound, and a mount supporting the transducer near nodes of mechanical vibration generated to the transducer. The mount includes ribs that contact the transducer near the nodes of vibration in a point by point, line by line or partially plane by plane contact manner to support the transducer, and retract portions which are provided side by side to respective ribs near the nodes of vibration and which are distant from the transducer so as not to support the transducer.

Abstract: Provided is a method of producing a piezoelectric/electrorestrictive film type device including a vibrating laminate obtained by laminating electrode films and piezoelectric/electrorestrictive films on a substrate containing a cavity. The method of producing the vibrating laminate includes: producing the substrate with a cavity, forming the first photoresist film on first principal surface of substrate, irradiating substrate from the second principal surface side of the substrate, transferring the plane shape of the cavity to the first photoresist film, developing and removing the first photoresist film formed in the region where the shape of cavity was formed, forming a lowermost electrode film by plating, and forming additional films other than the lowermost electrode film constituting the vibrating laminate.

Abstract: A film actuator is disclosed. The actuator includes a frameless actuator film. The frameless actuator film includes at least one elastomeric dielectric film disposed between first and second electrodes, at least one adhesive applied on one side of the frameless actuator film. It can also include a second adhesive applied on an opposite side of the frameless actuator film. A method of making the actuator is disclosed. A configurable actuator element also is disclosed.

Abstract: A method of forming an array of piezoelectric actuators on a membrane (18) which includes the steps of preparing a piezoelectric comb-like structure having an array of islands that are integrally connected by a continuous top portion and that form piezoelectric layers of the actuators, the islands having an electrode at a bottom side, attaching the comb-like structure with its bottom electrode to a surface of the membrane, removing the continuous top portion of the comb-like structure to thereby separate the actuators from one another, and forming top electrodes on the top surfaces of the piezoelectric layers of the actuators.

Abstract: An electronic component includes: a base material having a first conductive section; an oscillation piece having a second conductive section; a first member which is covered with a third conductive section making conductive contact with the first and second conductive sections and is provided between the base material and the oscillation piece; and a second member which is provided so as to be surrounded with the base material, the oscillation piece, and the first member and holds the base material and the oscillation piece.

Abstract: A resonator in which in addition to the normal anchor at a nodal point, a second anchor arrangement is provided and an associated connecting arm between the resonator body and the second anchor arrangement. The connecting arm connects to the resonator body at a non-nodal point so that it is not connected to a normal position where fixed connections are made. The connecting arm is used to suppress transverse modes of vibration.

Abstract: An ultrasonic sensor device includes a housing, a circuit board disposed at the housing, and a transducer. The transducer includes an electrically conductive casing having a bottom wall and a surrounding wall. A piezoelectric member is disposed on top of the bottom wall. A first connecting pin set is disposed in the housing, and includes a first connecting pin having one end connected to the circuit board and another end connected to the piezoelectric member, and a second connecting pin having one end connected to the circuit board and another end connected to the surrounding wall. A second connecting pin set is disposed in the housing, has one end connected to the circuit board, and another end extended into a connecting portion of the housing.

Abstract: A method and apparatus for bonding on a silicon substrate are disclosed. An apparatus includes a membrane having a membrane surface, a groove in the membrane surface, a transducer having a transducer surface substantially parallel to the membrane surface, and an adhesive connecting the membrane surface to the transducer surface. The groove can be configured to permit flow of adhesive into and through the groove while minimizing voids or air gaps that could result from incomplete filling of the groove. Multiple grooves can be formed in the membrane surface and can be of uniform depth.

Abstract: A piezoelectric and ferroelectric bulk wave transducer operating at a predetermined frequency includes a block of substrate, having a first thickness and in a first material, and a piezoelectric and ferroelectric transduction plate, having a length, a width and a second thickness, and in a second piezoelectric material, first and second metal electrodes covering the plate in the direction of the length thereof. The plate has first and second ferroelectric domains with alternating polarizations, distributed along the length of the plate according to a periodic pattern of pitch. The plate is attached perpendicularly to the block so that the width of the plate and the first thickness of the block are the same direction. The first and second material, the first thickness of the block, the length, the width, the second thickness, the pitch of the plate are configured for generating and trapping bulk waves at the operating frequency of the transducer, guided between both electrodes.

Abstract: A resonator element includes a piezoelectric substrate including a vibrating section and a thick section having a thickness larger than that of the vibrating section. The thick section includes a first thick section provided along a first outer edge of the vibrating section, a second thick section provided along a second outer edge, and a third thick section provided along a third outer edge. A first inclined outer edge section that is inclined with respect to both of an X axis direction and a Z? axis direction is provided in a corner section of the piezoelectric substrate where the second thick section and the third thick section are connected to each other.

Abstract: A vibration element includes a piezoelectric substrate including a vibrating section and a thick section having a thickness larger than that of the vibrating section. The thick section includes a first thick section provided along a first outer edge of the vibrating section, a second thick section provided along a second outer edge, and a third thick section provided along another first outer edge. An inclined outer edge section that intersects with each of an X axis and a Z? axis is provided in a tip section of the piezoelectric substrate.

Abstract: A method of manufacturing resonation device (a quartz crystal oscillator) includes the steps of applying a thermosetting thermal insulating connection material and an electrically-conductive connection material, which is higher in curing temperature than the thermosetting thermal insulating connection material, on a principal surface of a substrate, mounting fixation terminals of a resonator (a quartz crystal resonator), which has a heating element, and to which the fixation terminals and connection terminals are connected, in application positions of the insulating connection material on the substrate, and connection terminals in application positions of the electrically-conductive connection material, and heating the insulating connection material and the electrically-conductive connection material based on a reflow profile to make the insulating connection material and the electrically-conductive connection material cure in this order.

Abstract: A vibration element includes a piezoelectric substrate including a vibrating section and a thick section having a thickness larger than that of the vibrating section. The thick section includes a first thick section provided along a first outer edge of the vibrating section, a second thick section provided along a second outer edge thereof, and a third thick section provided along a third outer edge thereof. When a maximum size of the second thick section in the vibration direction is Lmax and a minimum size thereof is Lmin, an average size expressed by (Lmax+Lmin)/2 is 100 ?m or smaller.

Abstract: A method for manufacturing a vibrator according to the present invention includes: forming a coating layer that covers a silicon substrate; patterning the coating layer; forming a semiconductor layer that covers the silicon substrate and the coating layer; forming a vibrating portion having a beam shape on the coating layer and a support portion that supports the vibrating portion by patterning the semiconductor layer; forming an opening that exposes the silicon substrate; forming a recess portion by removing the silicon substrate through the opening; and removing the coating layer. In the step of forming the vibrating portion and the support portion, the support portion having a first portion that is located on the silicon substrate, and a second portion that connects the first portion and the vibrating portion and is located on the coating layer is formed.

Abstract: In a composite substrate, a back surface of a piezoelectric substrate and a front surface of a support substrate are bonded to each other with an adhesive layer. The adhesive layer includes a swelling portion at an outer peripheral area thereof, and the piezoelectric substrate is bonded to the support substrate in an area excluding the swelling portion 16a. Accordingly, air bubbles do not easily enter between the swelling portion of the adhesive layer and the piezoelectric substrate, and separations caused by the air bubbles can be prevented. As a result, the support substrate and the piezoelectric substrate can be reliably bonded to each other with the adhesive layer including the swelling portion in the outer peripheral area thereof.

Abstract: The present invention relates to an energy harvester device comprising an elongate resonator beam extending between first and second ends. A base connected to the resonator beam at the first end with the second end being freely extending from the base as a cantilever. A mass is attached to the second end of the elongate resonator beam. The elongate resonator beam comprises either: (1) a first oxide layer on a first piezoelectric stack layer over a cantilever layer on a second oxide layer over a second piezoelectric stack layer on a third oxide layer or (2) a first oxide layer on a first piezoelectric stack layer over a second oxide layer on a cantilever layer over a third oxide layer on a second piezoelectric stack over a fourth oxide layer. Also disclosed is a system comprising an electrically powered apparatus and the energy harvester device, as well as methods of making and using the energy harvester.

Abstract: The piezoelectric element includes first and second sheets 30 and 40 that are stacked and burned. In this stacked state, a second electrode 60 is located on a first long side 30a having a first non-electrode region 51. Thus, before a conductive film 100A is formed, the end face of a first electrode 50 and the end face of the second electrode 60 are exposed on lateral surfaces 20b and 20d on the same side and can be observed thereon. Slits 91 are formed at certain intervals in a lengthwise direction X. The conductive film 100A is formed so as to apply a voltage between the second electrode 60 exposed on a front surface 20a and ends 20ab and 20ad, thereby driving the piezoelectric element only with connection from the front surface 20a.

Abstract: A piezoelectric transformer includes a rectangular plate-shaped piezoelectric board having a length L in a longitudinal direction. In the piezoelectric board, five regions having a length L/5 are formed. In the two of regions, inner electrodes are formed in a thickness direction and conducted to outer electrodes provided in these regions. In a third region, outer electrodes are provided. The two regions of the piezoelectric board are polarized in the thickness direction, and two adjacent regions thereof are polarized in the longitudinal direction, and the third region is non-polarized. When a voltage is applied to the outer electrodes, the piezoelectric board expands and contracts in the longitudinal direction due to a piezoelectric effect. Thus, a piezoelectric transformer which enables high-efficient energy conversion even when a driving frequency is increased and a wireless power transmission system using the piezoelectric transformer are provided.

Abstract: A surface mount piezoelectric oscillator includes a piezoelectric resonator with a container main body, a plurality of external terminals, a mounting board with an IC chip, a plurality of connecting terminals, and a solder ball. The solder ball bonds the plurality of external terminals and the plurality of connecting terminals by melting and hardening. The solder bonding portion has approximately a circular shape with approximately a same size as a size of the connecting terminal of the mounting board. The solder ball placed on the connecting terminal of the mounting board is melted, self-aligned, and hardened so as to form a solder fillet of nearly axial symmetry. The solder fillet bridges between the both electrodes and bonds the connecting terminal of the mounting board and the solder bonding portion of the external terminal of the piezoelectric resonator.

Abstract: A piezoelectric vibrating piece includes: a pair of vibrating arm sections which are disposed at a distance away from each other in a width direction of a base section; the base section to which each base end of the pair of vibrating arm sections is connected; and a support arm section that is connected to the base section between the pair of vibrating arm sections and extends from the base section to the same side as the pair of vibrating arm sections, in which convex sections are formed continuous with side surfaces of roots of the vibrating arm sections and side surfaces of the base section.

Abstract: A resonator element includes: at least one resonating arm extending, wherein the resonating arm has a mechanical resonance frequency which is higher than a thermal relaxation frequency thereof, the resonating arm has a groove portion, the groove portion includes a bottom portion, a first side surface that extends along the longitudinal direction of the resonating arm and comes into contact with the opened principal surface and the bottom portion, and a second side surface that faces the first side surface with the bottom portion disposed therebetween and comes into contact with the opened principal surface and the bottom portion, and the groove portion has a non-electrode region which extends from a part of the first side surface close to the bottom portion to a part of the second side surface close to the bottom portion and in which no electrode is provided.

Abstract: A piezoelectric actuator device includes a substrate anchor region; a support beam arrangement having first and second ends, wherein the first end is fixed to the anchor region and the second end is freely suspended; first and second beams having first and second ends, wherein the first end of each beam is mechanically fixed to at least a part of the second end of the support beam arrangement and the second end of each beam is freely suspended; a coupling beam mechanically coupling the second end of the first and second beams; wherein the first and second beams are arranged such that the first end of the support beam arrangement is located between the coupling beam and the second end of the support beam arrangement.

Abstract: Disclosed is a haptic feedback device used in an electronic device for providing haptic feedback. The haptic feedback device includes an electronic board defining at least two supporting elements and a receiving cavity, a piezoelectric vibrator coupling to the supporting elements and at least partially received in the receiving cavity. The piezoelectric vibrator is capable of vibrating along a direction parallel to the electronic board. At least two bolts are provided to fix the piezoelectric vibrator on the electronic board through the supporting element along a direction parallel to the electronic board.

Abstract: A manufacturing method of a piezoelectric element includes: forming a first conductive layer upon a substrate; forming a piezoelectric layer upon the first conductive layer; forming a second conductive layer upon the piezoelectric layer; forming a third conductive layer upon the second conductive layer; forming a first portion, a second portion, and an opening portion provided between the first portion and the second portion by patterning the third conductive layer; forming a resist layer that covers the opening portion and covers the edges of the first portion and the second portion that face the opening portion side; and forming a first conductive portion and a second conductive portion configured from the first portion and the second portion, and forming a third conductive portion configured from the second conductive layer, by dry-etching the second conductive layer using the first portion, the second portion, and the resist layer as a mask.

Abstract: A piezoelectric device includes an insulating substrate, a piezoelectric vibration device that is mounted on a device mounting pad, a metal lid member that seals the piezoelectric vibration device in an airtight manner, an external pad that is arranged outside the insulating substrate, an oscillation circuit, a temperature compensation circuit, and a temperature sensor. The lid member and the temperature sensor or the lid member and the IC component are connected to each other so as to be heat-transferable, and a heat transfer member having thermal conductivity higher than that of the material of the insulating substrate is additionally included.

Abstract: In a piezoelectric device, a piezoelectric substrate includes a vibrating piece with respective excitation electrodes on each principal surface thereof. The piezoelectric substrate is surrounded by an outer frame separated therefrom by a through-void except for a supporting portion connecting the vibrating piece to the frame. Extraction electrodes extend from the excitation electrodes across the supporting portion to the frame, and on edge surfaces of the supporting portion. The piezoelectric substrate is sandwiched between a lid and a package base to form a piezoelectric device. The outer surface of the package base is a mounting surface to which the extraction electrodes extend via an edge surface of the through-void in a region that does not overlap the excitation electrode.

Abstract: An SAW device (1) has a piezoelectric substrate (3) propagating acoustic waves, and a comb-shaped electrode (6) arranged on a first surface (3a) of the piezoelectric substrate (3). The SAW device (1) has a columnar terminal (15) located on the first surface (3a) and electrically connected to the comb-shaped electrode (6), and a cover member (9) covering a side surface of the terminal (15). The terminal (15) comprises, in a first region in the direction of height thereof, a larger diameter on the side of the first surface (3a) compared with the diameter on the side opposite to the first surface (3a).

Abstract: A method of fabricating a thickness shear mode (TSM) gas and organic vapor sensor having a visco-elastic polymer coating and a fundamental frequency greater than 20 MHz. The method begins by providing a piezoelectric crystal and milling a central region of the crystal. Milling the crystal creates a central oscillating region of reduced thickness surrounded by a thicker outer region. Two electrodes are then deposited in the oscillating region of the crystal—one on each side of the crystal. The oscillating region on both sides of the crystal and the electrodes are then coated with a polymer coating.

Abstract: A micro-electrical-mechanical system (MEMS) vibrating structure includes a carrier substrate, a first anchor, a second anchor, a single crystal piezoelectric body, and a conducting layer. The first anchor and the second anchor are provided on the surface of the carrier substrate. The single-crystal piezoelectric body is suspended between the first anchor and the second anchor, and includes a uniform crystalline orientation defined by a set of Euler angles. The single-crystal piezoelectric body includes a first surface parallel to and facing the surface of the carrier substrate on which the first anchor and the second anchor are formed and a second surface opposite the first surface. The conducting layer is inter-digitally dispersed, and is formed on the second surface of the single-crystal piezoelectric body. The first surface of the single-crystal piezoelectric body is left exposed.

Abstract: The present invention provides a composite substrate comprising a piezoelectric substrate that is a single-crystal lithium tantalate or lithium niobate substrate, a support substrate that is a single-crystal silicon substrate, and an amorphous layer containing argon and joining together the piezoelectric substrate and the support substrate. The amorphous layer includes, in order from the piezoelectric substrate toward the composite substrate, a first layer, a second layer, and a third layer. The first layer contains a larger amount of a constituent element of the piezoelectric substrate than the second and third layers, the third layer contains a larger amount of a constituent element of the support substrate than the first and second layers, and the second layer contains a larger amount of argon than the first and third layers.

Abstract: A micro-electrical-mechanical system (MEMS) vibrating structure includes a carrier substrate, a first anchor, a second anchor, a single crystal piezoelectric body, a first conducting layer, and a second conducting layer. The first anchor and the second anchor are provided on the surface of the carrier substrate. The single-crystal piezoelectric body is suspended between the first anchor and the second anchor, and includes a uniform crystalline orientation defined by a set of Euler angles. The single-crystal piezoelectric body includes a first surface parallel to and facing the surface of the carrier substrate on which the first anchor and the second anchor are formed and a second surface opposite the first surface. The first conducting layer is inter-digitally dispersed on the second surface of the single-crystal piezoelectric body. The second conducting layer is inter-digitally dispersed on the first surface of the single-crystal piezoelectric body.

Abstract: A composite substrate according to the present invention includes a piezoelectric substrate that is a single-crystal lithium tantalate or lithium niobate substrate, a support substrate that is a single-crystal silicon substrate, and an amorphous layer joining together the piezoelectric substrate and the support substrate. The amorphous layer contains 3 to 14 atomic percent of argon. The amorphous layer includes, in order from the piezoelectric substrate toward the composite substrate, a first layer, a second layer, and a third layer. The first layer contains a larger amount of a constituent element (such as tantalum) of the piezoelectric substrate than the second and third layers. The third layer contains a larger amount of a constituent element (silicon) of the support substrate than the first and second layers. The second layer contains a larger amount of argon than the first and third layers.

Abstract: A piezoelectric resonating element includes a piezoelectric substrate having a rectangular vibrating portion and a thick-walled portion, excitation electrodes and, and lead electrodes. The thick-walled portion includes a fourth thick-walled portion, a third thick-walled portion, a first thick-walled portion, and a second thick-walled portion. The third thick-walled portion includes a third slope portion and a third thick-walled body, and at least one slit is formed in the third thick-walled portion.

Abstract: A resonator element has a piezoelectric substrate including a vibration section and a thick section having a thickness which is thicker than that of the vibration section, and a pair of excitation electrodes provided on a surface and aback surface of the vibration section. In addition, the thick section has a second thick section provided along a second outer edge of the vibration section. The second thick section has an outer edge section intersecting with both axes of an X axis and a Z? axis in an end portion opposite to the fixing section in a plan view of the resonator element.

Abstract: A leadless package and method for manufacturing silicon based leadless QFN/SON compatible packages are described. In addition the package allows for hermetic sealing of devices while maintaining electrical and optical access. Micro-vias with feed-through metallization through a silicon structure facilitates a surface mount technology-compatible silicon package with bottom SMT pads and top surface device integration. Sloped edges on the SMT side enable solder filleting for post solder inspection. Hermetic seal can be attained for example using anodic bonding of a glass lid or using metal soldering. Metal soldering enables the use of solder bumps to provide electrical connections for the package to the lid with integrated device functionality used for sealing. Hermetically sealed silicon packages eliminates the need for an extra packaging layer required in plastic packages and provides a standard interface for enclosing one or more discrete devices.

Abstract: An ultrasonic transducer includes a case having a closed end in the main axis direction, a piezoelectric element located substantially at the center of the closed end of the case, and a body arranged inside the case so as to be opposed to the piezoelectric element. The body has an irregular surface opposed to and spaced from the piezoelectric element.