Abstract: A piezoelectric transformer device is disclosed having a decreased thickness. In particular, a piezoelectric transformer device is disclosed that includes a piezoelectric transformer element in which first and second element electrodes are provided on first and second side surfaces of a piezoelectric transformer main body, respectively, and first and second flexible electrode members which are arranged at the lateral sides of the first and second side surfaces of the piezoelectric transformer main body, respectively, and are electrically and mechanically connected to the first and second element electrodes, respectively.

Abstract: A quartz crystal resonator includes a quartz crystal resonator element, a thermistor, and a package base having a first principal surface and a second principal surface having an opposed surface relationship with each other, the quartz crystal resonator element is mounted on the first principal surface side, the thermistor is housed in a recessed section of the second principal surface side of the package base, a plurality of electrode terminals connected to the quartz crystal resonator element or the thermistor is disposed on the second principal surface side of the package base, and a distance in a first direction perpendicular to the first principal surface from a mounting surface of the electrode terminals to the thermistor is equal to or longer than 0.05 mm.

Abstract: An ultrasonic sensor includes a substrate on which an opening portion is formed; a vibration plate that is provided on the substrate so as to block the opening portion; and a piezoelectric element including a first electrode, a piezoelectric layer, and a second electrode that are stacked on an opposite side of the opening portion of the vibration plate, in which when a direction in which the first electrode, the piezoelectric layer, and the second electrode are stacked is set to be a Z direction, and a portion that is completely overlapped by the first electrode, the piezoelectric layer, and the second electrode in the Z direction is set to be an active portion, the plural active portions are provided so as to face the one opening portion, and a suppressing portion (column portion) that suppresses vibrations of the vibration plate is provided between the adjacent active portions.

Abstract: In order to reduce crosstalk between analog and digital signals, a circuit device includes a vibrator element, a semiconductor device, and a package. In the semiconductor device, an analog pad is provided along a first side facing in a first direction when the semiconductor device is seen in plan view. In addition, a digital pad is provided along aside facing in a second direction opposite to the first direction, that is, a second side facing the first side. In the package, an analog terminal which is connected to the analog pad is provided on a first side of the package facing in the first direction. In addition, a digital terminal which is connected to the digital pad is provided on a second side of the package facing in the second direction.

Abstract: A rectangular quartz crystal blank having long sides substantially parallel to a Z? axis of the quartz crystal blank, and short sides substantially parallel to an X axis of the quartz crystal blank. The quartz crystal blank includes a first center region, a second region and a third region that are adjacent to the first region along a long-side direction, and a fourth region and a fifth region that are adjacent to the first region along a short-side direction. A thickness of the second region and a thickness of the third region are smaller than the thickness of the first region, and/or a thickness of the fourth region and a thickness of the fifth region are smaller than the thickness of the first region, and 12.26?W/T?13.02, where W is a length of a short side and T is a thickness.

Abstract: A method of manufacturing a vibrator which includes a method of manufacturing a wiring board includes disposing one granular conductor within each of through holes of a ceramic substrate having the through holes formed therein, supplying a glass paste into the through holes, baking the glass paste, forming an electrode, and disposing a vibrator element and a lid. When a maximum diameter of the granular conductor is set to d1 and a minimum diameter of each of the through holes is set to d2, d1/d2 is preferably equal to or greater than 0.8 and equal to or less than 1.

Abstract: A power module composite includes a power module (34) in which switching devices (32) included in an electric-power conversion circuit are molded, a driver module (37) that includes a control circuit (35) for controlling the switching devices (32) and is molded, a housing (39) containing the power module (34) and the driver module (37), and a heat sink (38) that is fixed to the housing (39) and refrigerates the switching devices (32); the power module 34 and the driver module 37 are mounted in that order on the heat sink (38) in such a way as to be superimposed on each other.

Abstract: A piezoelectric transformer includes a piezoelectric element. Two primary side electrodes exist on the primary side of the piezoelectric element. The primary side electrodes are coupled by a resistor formed from a conductive coating. A discharge current is discharged via the resistor to protect a semiconductor component from the discharge current. Since neither a short-circuit terminal nor conductive jig is required, electrostatic discharge damage to a semiconductor component can be prevented by a low-cost arrangement.

Abstract: A piezoelectric device is provided with a rectangular crystal piece having driving electrodes on front and back main faces thereof, and a base member having two electrode pads near one short side of the crystal piece. The crystal piece is supported on the base member by two support portions near one short side thereof, and by an auxiliary support portion on the other short side thereof. A position of the auxiliary support portion relative to the other short side, where L is a distance between two short sides, and H is a distance from the other short side to a peripheral edge of the auxiliary support portion nearest to the other short side, is set to a position at which the distance H stays in a range of distances in which a maximum tensile stress acting on the auxiliary support portion and a maximum von Mises stress of the crystal piece are within predetermined ranges.

Abstract: A surface mount type quartz crystal device according to a first aspect of the disclosure includes a ceramic package, a pedestal blank, a quartz-crystal vibrating piece. The pedestal blank is placed within the ceramic package via a conductive adhesive. The quartz-crystal vibrating piece is placed on the pedestal blank. The conductive adhesive is formed along an outer peripheral side of the pedestal blank so as to avoid overlap with the excitation electrode viewed in a normal direction of the excitation electrode. The pedestal blank is formed to avoid a region where a distance from the quartz-crystal vibrating piece is equal to or smaller than a size of a clearance between the pedestal blank and the quartz-crystal vibrating piece at the outer peripheral side, in a region where the excitation electrode faces at the pedestal blank side viewed in the normal direction.

Abstract: A piezoelectric vibrator element includes a pair of vibrating arms extending from a base, and having a groove on each of opposing principal surfaces in the longitudinal direction of the vibrating arms. Two systems of excitation electrodes are included on the side surfaces and the opposing principal surfaces, and in the grooves of the vibrating arms. A width of a bank part formed by a side surface of the vibrating arms and a side surface of the groves is W0, and the separation distance between the excitation electrodes on the opposing principal surfaces is W1, such that 1 ?m<W1<3 ?m and W0>W1.

Abstract: A vibratory gyroscope system is described which utilizes a mechanical resonator having a first mode of vibration and an associated first natural frequency, and a second mode of vibration having an associated second natural frequency. The angular rate of motion input couples energy between the first and second modes of vibration. The gyroscope has driver circuits, sensors and actuators for the first and second modes. The invention utilizes a bias error shifting method which provides for shifting the bias error away from DC to a higher frequency, where it can be removed by low pass filtering. As a result of the inventive method, gyroscope systems can be produced with significantly lower bias error.

Abstract: A piezoelectric vibrator according to the invention has a base, an integrated circuit element, and a piezoelectric vibration element. The base has internal terminal pads, and external terminals including an AC output terminal. The base includes rectangular ceramic substrate layers stacked in at least three layers, each of which has castellations formed at four corners. Among the internal terminal pads, internal terminal pads for the integrated circuit element and internal terminal pads for the piezoelectric vibration element are connected to each other by externally exposed wiring patterns formed on upper surfaces of the castellations at the corners of the ceramic substrate constituting a middle layer.

Abstract: An acoustic matching layer is formed on individual ultrasonic transducer elements on a base. Electric conductors are arranged between adjacent ultrasonic transducer elements, the electric conductors being connected to electrodes of the ultrasonic transducer elements. Protective films overlap the electric conductors. The protective films have smaller moisture permeability than the acoustic matching layer. Wall portions are arranged on the protective films, the wall portions separating portions of the acoustic matching layer that are respectively located on adjacent ultrasonic transducer elements from each other at least in a part of a height range with respect to a height direction from the base, and having an acoustic impedance that is different from the acoustic impedance of the acoustic matching layer.

Abstract: A purpose of the present disclosure is to provide an optical unit that is capable of effectively sealing one or a plurality of optical devices even without a special material, a special structure, etc. In an optical unit of the present disclosure, the sealing section (50) includes: a circular seal section (51) surrounding one or a plurality of optical devices (40) on a wiring substrate from an in-plane direction of the wiring substrate; and an inside filling section (52) with which inside of the seal section (51) is filled and that seals the one or plurality of optical devices (40). The optical devices (40) are each a light emitting unit, a light receiving device, an image sensor, an X-ray sensor, or a power generating device. The seal section (51) and the inside filling section (52) are each configured of a cured thermosetting resin. The inside filling section (52) has light transmittance that is higher than light transmittance of the seal section (51).

Abstract: According to one of aspects, provided is an electronic device including a panel 10, a piezoelectric element 30 attached to the panel 10, and a substrate 25 attached to a main surface of the piezoelectric element 30. The panel 10 is configured to be deformed due to deformation of the piezoelectric element 30, and sound is transmitted to an object that is in contact with the deformed panel 10. The substrate 25 includes a base 25a made of resin, and signal lines 25b and 25c laminated with the base 25a and connected to the main surface of the piezoelectric element 30. The substantially the entire main surface of the piezoelectric element 30 is covered by the base 25a.

Abstract: An electronic component has a support member, an SAW element which is mounted on the support member with a space S therebetween and which has a facing surface which faces the support member, and a resin portion which covers the SAW element and which is provided so as to seal the space S. The SAW element has a piezoelectric substrate, an IDT provided on the facing surface of the piezoelectric board, an wiring (an outer wiring) which is provided on the facing surface of the piezoelectric board and extends from the IDT toward the periphery side of the piezoelectric board, and a dam member which is adjacent to a lateral edge portion of the wiring and which is provided locally relative to the circumferential direction which surrounds the IDT.

Abstract: A piezoelectric device has: a ceramic substrate having a first principal surface and a second principal surface opposed to each other; a piezoelectric element arranged on the first principal surface; a frame having a first face and a second face opposed to each other and arranged on the ceramic substrate so as to surround the piezoelectric element; a metal layer arranged on the second face of the frame; and a metal lid arranged on the metal layer so as to close a space surrounded by the frame. The first face of the frame is in contact with the first principal surface of the ceramic substrate. The metal layer and the metal lid are joined to each other by resistance welding. The frame has a composite portion containing a metal and a metal oxide and the composite portion includes the second face and is in contact with the metal layer.

Abstract: A producing method for a diaphragm-type resonant MEMS device includes forming a first silicon oxide film, forming a second silicon oxide film, forming a lower electrode, forming a piezoelectric film, forming an upper electrode, laminating the first silicon oxide film, the second silicon oxide film, the lower electrode, the piezoelectric film, and the upper electrode in this order on a first surface of a silicon substrate, and etching the opposite side surface of the first surface of the silicon substrate by deep reactive ion etching to form a diaphragm structure, in which the proportion R2 of the film thickness t2 of the second silicon oxide film with respect to the sum of the film thickness t1 of the first silicon oxide film and the film thickness t2 of the second silicon oxide film satisfies the following condition: 0.10 ?m?t1?2.00 ?m; and R2?0.70.

Abstract: A single crystal micromechanical resonator includes a suspended plate of lithium niobate or lithium tantalate. The suspended plate and a support structure are formed from a single crystal.

Abstract: An electronic device includes: a wiring substrate; a plurality of device chips that are flip-chip mounted on an upper surface of the wiring substrate through bumps, have gaps which expose the bumps between the device chips and the upper surface of the wiring substrate, and include at least one device chip that has a substrate having a thermal expansion coefficient more than a thermal expansion coefficient of the wiring substrate; a junction substrate that is joined to the plurality of device chips, and has a thermal expansion coefficient equal to or less than the thermal expansion coefficient of the substrate included in the at least one device chip; and a sealer that covers the junction substrate, and seals the plurality of device chips.

Abstract: The present invention presents a method of fabrication for a physiological sensor with electronic, electrochemical and chemical components. The fabrication method comprises steps for manufacturing an apparatus comprising at least one electrochemical sensor, a microcontroller, and a transceiver. The physiological sensor is operable to analyze biological fluids such as sweat.

Abstract: The present invention relates to an electronic component package, an electronic component package sealing member, and a method for producing the electronic component package sealing member. A through hole 49 is formed in a base 4 so as to pass through between both main surfaces 42 and 43 of a base material of the base 4. An inner side surface 491 of the through hole 49 includes a curved surface 495 that expands outward in a width direction of the through hole 49.

Abstract: Embodiments of the invention include micromechanical resonators. These resonators can be fabricated from thin silicon layers. Both rotational and translational resonators are disclosed. Translational resonators can include two plates coupled by two resonate beams. A stable DC bias current can be applied across the two beams that causes the plates to resonate. In other embodiments, disk resonators can be used in a rotational mode. Other embodiments of the invention include using resonators as timing references, frequency sources, particle mass sensors, etc.

Abstract: An acoustic wave device includes: a substrate; a functional element formed on the substrate and including an excitation electrode that excites an acoustic wave; a columnar electrode formed on the substrate and electrically connected to the excitation electrode; a metal frame body formed on the substrate and surrounding the functional element and the columnar electrode; and a ceramic substrate sealing the functional element in combination with the metal frame body, a first metal layer bonded to the columnar electrode and a second metal layer bonded to the metal frame body being formed on a surface of the ceramic substrate.

Abstract: A combination retainer and electrical contact mechanism for a deposition monitor sensor includes a sensor body and a removable flexible electrical contact spanning between a fixed electrical (contact) element in the sensor's body and one face of an associated monitor crystal. A retainer insulates or insures electrical isolation of the spanning electrical contact from unwanted contact to electrically grounded components in which at least one of the retainer and crystal holder include features that maintain the electrical contact with the retainer in order to provide a single mechanism.

Abstract: The temperature compensated crystal oscillator has a rectangular substrate, a frame which is provided on an upper surface of the substrate, a mounting frame which has joining pads which are provided along an outer circumferential edge of the upper surface and which is provided on a lower surface of the substrate by bonding of joining terminals which are provided along the outer circumferential edge of the lower surface of the substrate and the joining pads, a crystal element which is mounted on an electrode pad which is provided on the upper surface of the substrate in a region surrounded by the frame, an integrated circuit element which has a temperature sensor and which is mounted on a connection pad which is provided on the lower surface of the substrate in a region surrounded by the mounting frame, and a lid which is joined to the upper surface of the frame.

Abstract: An acoustic wave device includes: a substrate; a functional element formed on the substrate and including an excitation electrode that excites an acoustic wave; a columnar electrode formed on the substrate and electrically connected to the excitation electrode; a metal frame body formed on the substrate and surrounding the functional element and the columnar electrode; and a ceramic substrate sealing the functional element in combination with the metal frame body, a first metal layer bonded to the columnar electrode and a second metal layer bonded to the metal frame body being formed on a surface of the ceramic substrate.

Abstract: A bulk acoustic wave (BAW) resonator device includes a bottom electrode on a substrate over one of a cavity and an acoustic reflector, a piezoelectric layer on the bottom electrode, and a top electrode on the piezoelectric layer. At one of the bottom electrode and the top electrode is a composite electrode having an integrated lateral feature, arranged between planar top and bottom surfaces of the composite electrode and configured to create a cut-off frequency mismatch.

Abstract: A suspension board with circuit includes a slider mounting region configured to mount a slider thereon, a pedestal portion provided in the slider mounting region and configured to support the slider, and a dam portion provided in the slider mounting region and configured to prevent an adhesive fixing the slider from flowing out of the slider mounting region. The thickness of the pedestal portion is thicker than that of the dam portion.

Abstract: A piezoelectric device includes a fiber mat comprising polymer fibers with ferroelectric particles embedded in the polymer fibers. The ferroelectric particles are oriented to generate a net polarization in the fiber mat. The ferroelectric particles may comprise barium titanate particles. The polymer fibers may comprise polylactic acid (PLA) fibers. The piezoelectric device may further include substrates sandwiching the fiber mat, and the fiber mat may be formed by electrospinning polymer fibers containing ferroelectric particles onto one of the substrates. The piezoelectric device may be a piezoelectric actuator configured to receive an input voltage applied across the fiber mat and to output a mechanical displacement in response to the voltage, or the piezoelectric device may be configured to output a voltage in response to a mechanical force applied to the fiber mat.

Abstract: A package includes an accommodation space portion, and a first base body that forms at least a part of the accommodation space portion. A first through-hole, which extends toward a second surface on an accommodation space portion side from a first main surface opposite to the accommodation space portion, is provided in the first base body, in a cross-sectional view of the first through-hole, the first through-hole includes a first inclined portion that is inclined from the second surface toward the first main surface, and a second inclined portion that is inclined from one end on a first main surface side of the first inclined portion toward the first main surface, a second angle made by the second inclined portion and the second surface is larger than a first angle made by the first inclined portion and the second surface, and the first through-hole is sealed with a sealing member.

Abstract: A rotary motor and a method of making the same include a vibrating motor body which has two orthogonal first bending modes and is substantially enclosed within a housing. A shaft is frictionally coupled to the vibrating motor body and is arranged to rotate in at least one direction about a rotation axis in response to the vibrating motor body. The shaft is frictionally coupled the vibrating motor body by a force substantially perpendicular to the rotation axis. One or more bearings support the shaft, are connected to the housing, and define the axis of rotation of the shaft.

Abstract: The temperature compensated crystal oscillator has a rectangular substrate, a frame which is provided on an upper surface of the substrate, a mounting frame which has joining pads which are provided along an outer circumferential edge of the upper surface and which is provided on a lower surface of the substrate by bonding of joining terminals which are provided along the outer circumferential edge of the lower surface of the substrate and the joining pads, a crystal element which is mounted on an electrode pad which is provided on the upper surface of the substrate in a region surrounded by the frame, an integrated circuit element which has a temperature sensor and which is mounted on a connection pad which is provided on the lower surface of the substrate in a region surrounded by the mounting frame, and a lid which is joined to the upper surface of the frame.

Abstract: In an electronic-component package made up of a laminated-ceramic, cavity-forming base and an electroconductive lid that is hermetically bonded to the base by a heat-melting sealant, contamination of electromagnetic-interference-reducing grounding metallization lines by melted sealant is prevented. A wall-portion grounding metallization line partially embedded in an enclosing wall portion of the base, and partially exposed to the package cavity, electrically connects lid, when sealant-bonded to the wall portion of the base, with a grounding external terminal on the base exterior. An electronic-component grounding metallization line exposed in the bottom of the base is connected to the grounding external terminal. A connecting portion that joins the wall-portion and electronic-component grounding metallization lines is disposed between laminations of the bottom and wall portions of the base, where the connecting portion is unexposed to the package cavity.

Abstract: A semiconductor device includes a lead frame, an oscillator, an integrated circuit and first bonding wires. The oscillator includes plural terminals separated from each other by a predetermined distance, and that is mounted to an oscillator mounting region formed on a first face of the lead frame. The oscillator mounting region has a narrower width than the distance between the plural terminals. The integrated circuit is mounted to a second face of the lead frame, which is on an opposite side to the first face. The first bonding wires connect the plural terminals of the oscillator to terminals of the integrated circuit.

Abstract: When a length along a vibrating direction of the thickness shear vibration of a multi-stage type mesa substrate of A resonator element is x, a thickness of the vibration section is t, and a distance between the vibration section and the bonding region is y, y is in a range of ?0.0151×(x/t)+0.3471?y??0.0121×(x/t)+0.3471.

Abstract: A low-profile vibration device capable of generation of great vibration and a portable terminal employing the vibration device. The vibration device includes: a support body; a vibration member supported so that its periphery is connected to the support body, the vibration member having a first portion which is connected to the support body, and a second portion which is located inside the first portion and is not connected to the support body; and a vibration element whose one surface in a first direction is connected to one main surface of the second portion in the vibration member, bending vibration of the vibration element in the first direction whose amplitudes vary along a second direction perpendicular to the first direction being caused by electrical signal input.

Abstract: Approaches to a flexure gimbal assembly for a hard-disk drive (HDD), having a feature for reducing the risk of electrical shorts, include a flexure having an electrically conductive layer and an insulating layer having a flexure tongue with which one or more microactuator piezo actuating device is coupled, where the flexure tongue comprises a gap positioned to inhibit contact between the conductive adhesive and the conductive layer of the flexure which may otherwise cause an electrical short.

Abstract: A piezoelectric oscillator has an insulating base having a housing portion where internal terminal pads are formed, an integrated circuit (IC) element having rectangular pads bonded to the internal terminal (IT) pads, and a piezoelectric oscillation element (POE) connected to the base and IC element. The IT pads include two opposing first IT pads connected to the POE, two opposing second IT pads, one of which is for AC output, and two opposing third IT pads formed between the first IT pads and the second IT pads. Along a part of perimeter of the first IT pads, the third IT pads and wiring patterns which respectively extend the third IT pads are formed as conductive paths for blocking radiation noise. The first IT pads and the second IT pads are spaced apart with the conductive paths interposed therebetween.

Abstract: A quartz crystal unit comprises a quartz crystal tuning fork resonator having a quartz crystal tuning fork base, and first and second quartz crystal tuning fork arms. Each of the first and second quartz crystal tuning fork arms has a first main surface and a second main surface opposite the first main surface, and at least one groove formed in at least one of the first and second main surfaces of each of the first and second quartz crystal tuning fork arms. At least one mounting arm having a width less than 0.45 mm protrudes from the quartz crystal tuning fork base, and the overall length of the quartz crystal tuning fork resonator is less than 2.1 mm.

Abstract: A oscillator device includes: a first substrate that has a first surface, a second surface, and a through hole extending between the first surface and the second surface; a crystal oscillator that is disposed on the first surface of the first substrate, the crystal oscillator including an electrode; a second substrate that is disposed on the crystal oscillator; a through electrode that is disposed in the through hole, that has a diameter smaller than a diameter of the through hole, that is electrically coupled to the electrode, and that extends between the first surface and the second surface; and a filling member with which an area between an inner wall of the through hole and the through electrode is filled.

Abstract: A piezoelectric oscillator includes a piezoelectric vibrating piece, an integrated circuit, and a package. The package includes a first layer, a second layer, a third layer, and a fourth layer. The ceiling surface as a portion of the inferior surface of the third layer has a rectangular shape surrounded by short sides and long sides. The ceiling surface includes a pair of frequency checking terminals electrically connected to the connecting electrodes and control terminals to control the integrated circuit. The pair of the frequency checking terminal are adjacent to one another. The respective frequency checking terminals are disposed in contact with any of the long sides and one of the short sides. The control terminals are extracted to the top surface of the third layer, and overlap the frequency checking terminals in a vertical direction on the top surface of the third layer to be connected to the mounting terminals.

Abstract: In a piezoelectric oscillation device in which a support substrate is oscillated using a bimorph-type piezoelectric oscillation element, the click sensation when the support substrate is operated is improved, and shock resistance of a control panel is improved. Provided is a piezoelectric oscillation device in which wiring is not easily broken. On the rear side of a touch panel (16), one main surface of a bimorph-type piezoelectric oscillation element (20) is entirely bonded via an elastic body (18) having a tensile elasticity of 20-100 MPa as measured according to JIS K7161. The piezoelectric oscillation element (20) has surface electrode layers (30A, 30B) connected to terminal electrodes (36A, 36B) via wiring lines (38A, 38B). The wiring lines (38A, 38B) are formed on top of a wiring protection layer (32) made of an elastic body provided on the rear side of the touch panel (16), and because the wiring lines can move following the displacement and are therefore resistant to breakage.

Abstract: A stress isolator that allows a sensor to be attached to materials of the same coefficient of thermal expansion and still provide the required elastic isolation between the sensor and the system to which it is mounted. The isolator is made of two materials, borosilicate glass and silicon. The glass is the same material as the mounting surface of the microelectromechanical system (MEMS) sensors. The silicon makes an excellent isolator, being very elastic and easy to form into complex shapes. The two materials of the isolator are joined using an anodic bond. The construction of the isolator can be specific to different types of MEMS sensors, making the most of their geometry to reduce overall volume.

Abstract: A suspension board with circuit includes a piezoelectric element mounting portion for mounting thereon a piezoelectric element. The conductive pattern is configured to be electrically connected to the piezoelectric element. The piezoelectric element mounting portion includes a facing portion placed on one side of a bonding agent for bonding the piezoelectric element to the piezoelectric element mounting portion in an expanding/contracting direction of the piezoelectric element so as to face the bonding agent. The facing portion is configured to be pressed by the bonding agent when the piezoelectric element bonded to the piezoelectric element mounting portion expands/contracts.

Abstract: An acoustic resonator device includes an annular acoustic resonator, a heater coil and a heat sensor. The annular acoustic resonator is positioned over a trench formed in a substrate of the acoustic resonator device. The heater coil is disposed around a perimeter of the annular acoustic resonator, the heater coil including a resistor configured to receive a heater current. The heat sensor is configured to adjust the heater current in response to a temperature of the heater coil.

Abstract: Provided are a sound generator including a frame body, a vibration body provided to the frame body in a state where a tensile force is applied to the vibration body, and a piezoelectric vibration element provided to the vibration body. In the sound generator, when a first direction and a second direction are directions along a main surface of the vibration body and intersect with each other, the tensile force in the first direction and the tensile force in the second direction are different from each other. A sound generation device and an electronic apparatus including the sound generator are also provided.

Abstract: A piezoelectric vibrating piece including: a pair of vibrating arm sections which has a groove section, respectively; a base section which is disposed between the pair of vibrating arm sections; and a connecting section which connects each base end of the pair of vibrating arm sections and the base section. If a length from a base end to a leading end of the vibrating arm section in a longitudinal direction of the vibrating arm section is Lv, and a length from the base end of the vibrating arm section to an end of the connecting section on the opposite side to the vibrating arm section is Lc, a relationship of Lc/Lv?0.1 is satisfied.

Abstract: A method for fabricating a crystal unit, including a preparing step, a bonding step, and a separating step, is provided. The preparing step prepares a quartz plate and a supporting substrate with a recess that is larger than the vibrating region on a surface of the supporting substrate. The recess corresponds to a vibrating region in the crystal unit. The bonding step bonds the quartz plate to the surface of the supporting substrate such that the quartz plate is separated from the supporting substrate in the recess. The separating step separates the quartz plate into the vibrating region and the framing portion by performing dry etching on the quartz plate such that the quartz plate has a shape that connects the vibrating region to the framing portion via a supporting beam. The framing portion surrounds the vibrating region.