Using Surface Acoustic Waves Patents (Class 333/193)
  • Patent number: 11527487
    Abstract: The invention provides a package structure, comprising: a substrate disposed with a solid grounded copper layer; at least two radio frequency chip modules disposed on the substrate; a plastic encapsulation disposed on the substrate, covered on a surface of the substrate, and coating the at least two radio frequency chip modules therein; a groove located between the adjacent two radio frequency chip modules, and penetrating an upper surface and a lower surface of the plastic encapsulation; a solder filling body filled in the groove, wherein an upper surface of the solder filling body is flushed with the upper surface of the plastic encapsulation; and a shielding layer covered on the upper surface and lateral surfaces of the plastic encapsulation, an upper surface of the solder filling body and lateral surfaces of the substrate; wherein a position of the solid grounded copper layer corresponds to a position of the groove, and makes contact with the solder filling body in the groove.
    Type: Grant
    Filed: February 4, 2021
    Date of Patent: December 13, 2022
    Assignee: LUXSHARE ELECTRONIC TECHNOLOGY (KUNSHAN) LTD.
    Inventors: Xiaolei Zhou, Wenbin Kang, Peng Liu
  • Patent number: 11482984
    Abstract: An elastic wave device includes an LiNbO3 substrate, a first elastic wave resonator including a first IDT electrode and a first dielectric film, and a second elastic wave resonator including a second IDT electrode and a second dielectric film. A Rayleigh wave travels along at least one surface of the elastic wave device. A thickness of the first dielectric film differs from a thickness of the second dielectric film. A propagation direction of an elastic wave in the first elastic wave resonator coincides with a propagation direction of an elastic wave in the second elastic wave resonator. Euler angles of the LiNbO3 substrate fall within a range of (0°±5°, ?, 0°±10°).
    Type: Grant
    Filed: October 8, 2020
    Date of Patent: October 25, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Masakazu Mimura
  • Patent number: 11476823
    Abstract: Embodiments of resonator circuits and modulating resonators and are described generally herein. One or more acoustic wave resonators may be coupled in series or parallel to generate tunable filters. One or more acoustic wave resonances may be modulated by one or more capacitors or tunable capacitors. One or more acoustic wave modules may also be switchable in a filter. Other embodiments may be described and claimed.
    Type: Grant
    Filed: September 25, 2020
    Date of Patent: October 18, 2022
    Assignee: pSemi Corporation
    Inventors: Mark L. Burgener, James S. Cable
  • Patent number: 11444601
    Abstract: An acoustic wave device including series arm resonators including a first IDT electrode and parallel arm resonators including a second IDT electrode, in the first IDT electrode, a first envelope obliquely extends with respect to the acoustic wave propagation direction, and a second envelope obliquely extends with respect to the acoustic wave propagation direction, the second IDT electrode includes a central region, a first low acoustic velocity region in which an acoustic velocity is lower than an acoustic velocity in the central region, a second low acoustic velocity region in which an acoustic velocity is lower than the acoustic velocity in the central region, a first high acoustic velocity region in which an acoustic velocity is higher than the acoustic velocity in the central region, and a second high acoustic velocity region in which an acoustic velocity is higher than the acoustic velocity in the central region.
    Type: Grant
    Filed: September 2, 2020
    Date of Patent: September 13, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Katsuya Daimon, Takuya Koyanagi
  • Patent number: 11394366
    Abstract: An acoustic wave filter includes: a piezoelectric substrate; series resonators connected in series and located on the piezoelectric substrate, each of the series resonators including first electrode fingers that are arranged with a first duty ratio and excite an acoustic wave; parallel resonators connected in parallel and located on the piezoelectric substrate, each of the parallel resonators including second electrode fingers that are arranged with a second duty ratio and excite an acoustic wave, the second duty ratio in at least one parallel resonator being less than the first duty ratio in at least one series resonator; and a dielectric film that has a temperature coefficient of elastic modulus that is opposite in sign to that of the piezoelectric substrate, is located on the piezoelectric substrate so as to cover the first and second electrode fingers, has a film thickness greater than those of the first and second electrode fingers.
    Type: Grant
    Filed: April 25, 2018
    Date of Patent: July 19, 2022
    Assignee: TAIYO YUDEN CO., LTD.
    Inventor: Jyunichi Hamasaki
  • Patent number: 11374549
    Abstract: Acoustic filters and methods of fabrication are disclosed. A filter device includes a substrate and a single-crystal piezoelectric plate, a back surface of the piezoelectric plate attached to a surface of the substrate. The filter device includes a plurality of acoustic resonators including one or more shunt resonators and one or more series resonators. Each of the plurality of acoustic resonators includes an interdigital transducer (IDT) formed on the front surface of the piezoelectric plate, interleaved fingers of the IDT disposed on a respective diaphragm formed by a respective portion of the piezoelectric plate that spans a respective cavity in the substrate. A divided frequency setting layer is formed on at least some of the one or more shunt resonators but not on the one or more series resonators.
    Type: Grant
    Filed: October 27, 2020
    Date of Patent: June 28, 2022
    Assignee: Resonant Inc.
    Inventor: Ventsislav Yantchev
  • Patent number: 11362642
    Abstract: An acoustic wave filter device includes a longitudinally coupled resonator acoustic wave filter on a series arm that connects an input terminal and an output terminal, first and second parallel arm resonators on first and second parallel arms that connect the series arm and a ground potential, an input-side ground port of the longitudinally coupled resonator acoustic wave filter and a ground port of at least one of the first and second parallel arm resonators are connected in common, an output-side ground port of the longitudinally coupled resonator acoustic wave filter and a ground port of at least another of the first and second parallel arm resonators are connected in common, and an electrostatic capacitance of the first parallel arm resonator is different from an electrostatic capacitance of the second parallel arm resonator.
    Type: Grant
    Filed: December 5, 2019
    Date of Patent: June 14, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Hiroshi Muranaka
  • Patent number: 11335669
    Abstract: A method of fabricating an electronics package includes forming a cavity in a first surface of a semiconductor substrate, forming one or more passive devices on the semiconductor substrate, forming a microelectromechanical device on a piezoelectric substrate, and bonding the semiconductor substrate to the piezoelectric substrate with the microelectromechanical device disposed within the cavity.
    Type: Grant
    Filed: November 14, 2019
    Date of Patent: May 17, 2022
    Assignee: SKYWORKS SOLUTIONS, INC.
    Inventors: Jiro Yota, Hong Shen, Viswanathan Ramanathan
  • Patent number: 11316498
    Abstract: A reconfigurable microacoustic filter is specified which comprises a ladder-type-like filter topology and a suitably placed adjustable capacitive element.
    Type: Grant
    Filed: August 4, 2017
    Date of Patent: April 26, 2022
    Assignee: SnapTrack, Inc.
    Inventor: Edgar Schmidhammer
  • Patent number: 11309868
    Abstract: A multiplexer includes: a first terminal; a second terminal; a third terminal; a first filter connected between the first and second terminals, including a first capacitor, a first inductor, and one or more first acoustic wave resonators, and having a first passband; a second filter connected between the first and third terminals, including a second capacitor, a second inductor, and one or more second acoustic wave resonators, and having a second passband higher than the first passband; a substrate having a surface on which at least one first acoustic wave resonator of the one or more first acoustic wave resonators and at least one second acoustic wave resonator of the one or more second acoustic wave resonators are located; and a metal structure located on the surface and located between the at least one first acoustic wave resonator and the at least one second acoustic wave resonator.
    Type: Grant
    Filed: May 20, 2019
    Date of Patent: April 19, 2022
    Assignee: TAIYO YUDEN CO., LTD.
    Inventor: Eiji Kuwahara
  • Patent number: 11271545
    Abstract: A first filter of a multiplexer has a ladder filter structure including a plurality of series resonators and a plurality of parallel resonators. Each resonator is an acoustic wave resonator that includes an IDT electrode including a pair of comb-shaped electrodes. A portion having a unit area, in a plan view of a substrate on which the resonators are provided, has a larger weight in at least one of the IDT electrode of the series resonator that is closest to the common terminal, among the series resonator, and the IDT electrode of the parallel resonator that is closest to the common terminal than in the IDT electrode of each of the remainder of the plurality of acoustic wave resonators.
    Type: Grant
    Filed: March 27, 2020
    Date of Patent: March 8, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Katsuya Daimon
  • Patent number: 11264966
    Abstract: Resonator devices, filter devices, and methods of fabrication are disclosed. A resonator device includes a substrate and a single-crystal piezoelectric plate having front and back surfaces. An acoustic Bragg reflector is sandwiched between a surface of the substrate and the back surface of the piezoelectric plate. An interdigital transducer (IDT) is formed on the front surface of the piezoelectric plate. The IDT and the piezoelectric plate are configured such that a radio frequency signal applied to the IDT excites a primary acoustic mode within the piezoelectric plate. The acoustic Bragg reflector comprises alternating SiO2 and diamond layers and is configured to reflect the primary acoustic mode.
    Type: Grant
    Filed: June 8, 2020
    Date of Patent: March 1, 2022
    Assignee: Resonant Inc.
    Inventor: Ventsislav Yantchev
  • Patent number: 11251777
    Abstract: An acoustic wave filter device includes a piezoelectric layer, a high-acoustic-velocity member, a low-acoustic-velocity film between the high-acoustic-velocity member and the piezoelectric layer, and first and second IDT electrodes on the piezoelectric layer to define acoustic wave resonators. An acoustic wave resonator of a series-arm resonator portion closest to an antenna end and/or an acoustic wave resonator of a parallel-arm resonator portion closest to the antenna end includes the first IDT electrode including first and second electrode fingers, and the remaining acoustic wave resonators include the second IDT electrode including third and fourth electrode fingers. In the first IDT electrode, a central area, first and second low-acoustic-velocity areas, and first and second high-acoustic-velocity areas extend along a direction perpendicular or substantially perpendicular to an acoustic wave propagating direction.
    Type: Grant
    Filed: March 10, 2020
    Date of Patent: February 15, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Katsuya Daimon
  • Patent number: 11239826
    Abstract: A filter device includes series and parallel arm resonators provided at a filter chip and inductors electrically connected in series with respective ones of the parallel arm resonators. A first inductor having the highest inductance of the inductors is electrically connected in series with a first parallel arm resonator having the highest anti-resonant frequency of the parallel arm resonators. One end of the first parallel arm resonator and one end of a second parallel arm resonator in other ones of the parallel arm resonators are electrically connected to a same wiring line in wiring lines separated by the series arm resonators on a line electrically connecting an input terminal and an output terminal of the filter chip. The other ends of the first and second parallel arm resonators are respectively electrically connected to first and second ground terminals of the filter chip.
    Type: Grant
    Filed: September 9, 2020
    Date of Patent: February 1, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Seima Kondo
  • Patent number: 11211914
    Abstract: An acoustic wave device includes a piezoelectric substrate in which a reverse-velocity surface is convex and an IDT electrode on the piezoelectric substrate. When an acoustic wave propagation direction is a first direction and a direction perpendicular or substantially perpendicular to the first direction is a second direction, the portion of the IDT electrode where first and second electrode fingers overlap in the first direction is a crossing region. The crossing region includes a center region centrally located in the second direction and a first and second edge regions located on two sides of the center region. Recesses 17 and 18 are respectively provided in portions of the piezoelectric substrate located in the first and second edge regions between the portions where the first and second electrode fingers are provided.
    Type: Grant
    Filed: September 16, 2020
    Date of Patent: December 28, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Katsuya Daimon, Masato Araki
  • Patent number: 11159137
    Abstract: Methods of making packaged surface acoustic wave devices are provided. The method may include forming a photosensitive resin coat over a cavity-defining structure encapsulating a surface acoustic wave device. The photosensitive resin coat may be formed using a spin-coating process, and then patterned to form a desired shape. Portions of the photosensitive resin may be removed from areas near the edge of the die, to facilitate separation of a wafer into individual dies. The method may also include forming a conductive structure using a plating process, where the conductive structure is located between the resin coat and the cavity defining structure. The photosensitive resin can include a phenol resin. The packaged surface acoustic wave devices made using a photosensitive resin coat may be relatively thin, and may have a height of less than 220 micrometers.
    Type: Grant
    Filed: August 29, 2019
    Date of Patent: October 26, 2021
    Assignee: SKYWORKS SOLUTIONS, INC.
    Inventors: Li Ann Koo, Takashi Inoue, Vivian Sing Zhi Lee, Ping Yi Tan
  • Patent number: 11146231
    Abstract: Acoustic resonator devices, filters, and methods are disclosed. An acoustic resonator includes a substrate, a piezoelectric plate having front and back surfaces, and an acoustic Bragg reflector between a surface of the substrate and the back surface of the piezoelectric plate. An interdigital transducer (IDT) is formed on the front surface of the piezoelectric plate. The IDT is configured to excite a shear primary acoustic mode in the piezoelectric plate in response to a radio frequency signal applied to the IDT. At least one finger of the IDT is disposed in a groove in the piezoelectric plate.
    Type: Grant
    Filed: August 17, 2020
    Date of Patent: October 12, 2021
    Assignee: Resonant Inc.
    Inventor: Viktor Plesski
  • Patent number: 11115000
    Abstract: An extractor includes a band elimination filter that is connected between a common terminal and a first input-output terminal and that has a stop band equal or substantially equal to a first frequency band, and a band pass filter that is connected between the common terminal and a second input-output terminal and that has a pass band equal or substantially equal to a second frequency band that overlaps the first frequency band. The band pass filter includes, series arm resonators, three or more parallel arm resonators, and three or more inductors that are connected between the ground and the parallel arm resonators. The L value of a first inductor that is connected and nearest to the common terminal is smaller than the L value of a third inductor, and the L value of a second inductor that is connected and second-nearest to the common terminal is smaller than the L value of the third inductor.
    Type: Grant
    Filed: August 15, 2019
    Date of Patent: September 7, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Norihiko Nakahashi
  • Patent number: 11115003
    Abstract: In an acoustic wave device, an antenna end resonator electrically closest to a first terminal is a first acoustic wave resonator. In each of the first acoustic wave resonator and a second acoustic wave resonator, a thickness of a piezoelectric layer is equal to or less than about 3.5?. A cut angle of the piezoelectric layer of the first acoustic wave resonator is within a range of ?B±4°. The cut angle of the piezoelectric layer of the second acoustic wave resonator has a larger difference from ?B (°) than the cut angle of the piezoelectric layer of the first acoustic wave resonator.
    Type: Grant
    Filed: July 6, 2020
    Date of Patent: September 7, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Ryo Nakagawa, Hideki Iwamoto, Tsutomu Takai, Yuichi Takamine
  • Patent number: 11115001
    Abstract: A receiving filter includes a reception terminal which outputs reception signals from an antenna terminal, a second DMS filter configured by a longitudinally coupled double-mode type acoustic wave filter which is located in a signal path from the antenna terminal to the reception terminal, a fourth GND terminal given a reference potential, and a fourth GND wiring connected to the fourth GND terminal and to the second DMS filter. A reception terminal conductor configured by the reception terminal and the reception terminal wiring connected to the reception terminal and A fourth GND conductor configured by the fourth GND terminal and the fourth GND wiring are adjacent and are capacity-coupled with respect to each other.
    Type: Grant
    Filed: July 5, 2017
    Date of Patent: September 7, 2021
    Assignee: KYOCERA Corporation
    Inventor: Tomonori Urata
  • Patent number: 11108379
    Abstract: A duplexer includes a surface acoustic wave (SAW) device comprising a transmit filter and a receive filter formed on a piezoelectric substrate. The transmit filter includes a first transmit shunt resonator connected to a first transmit-filter ground terminal. The receive filter includes a first receive shunt resonator connected to a first receive-filter ground terminal. A ground coupling capacitor is connected between the first transmit-filter ground terminal and the first receive-filter ground terminal.
    Type: Grant
    Filed: February 20, 2019
    Date of Patent: August 31, 2021
    Assignee: Resonant Inc.
    Inventor: John Mazotta
  • Patent number: 11082027
    Abstract: An acoustic wave device includes: a first substrate made of a piezoelectric material; an acoustic wave element located on the first substrate; a bump located on the first substrate; a second substrate located on the first substrate through the bump, the second substrate facing the first substrate across an air gap; and a support layer that is located in at least a part of a periphery of the first substrate, is in contact with a side surface of the first substrate, and has a less linear thermal expansion coefficient than the first substrate.
    Type: Grant
    Filed: January 31, 2018
    Date of Patent: August 3, 2021
    Assignee: TAIYO YUDEN CO., LTD.
    Inventor: Motoi Yamauchi
  • Patent number: 11082030
    Abstract: A high-pass filter includes: at least one capacitor located in a first pathway between input and output terminals and connected between the input and output terminals; at least one inductor, a first end of the at least one inductor being coupled to the first pathway, a second end of the at least one inductor being coupled to a ground; at least one first acoustic wave resonator located in a second pathway connected in parallel to the first pathway between the input and output terminals, the at least one first acoustic wave resonator being connected in parallel to the at least one capacitor; and at least one second acoustic wave resonator, a first end of the at least one second acoustic wave resonator being coupled to the second pathway, a second end of the at least one second acoustic wave resonator being coupled to a ground.
    Type: Grant
    Filed: July 23, 2019
    Date of Patent: August 3, 2021
    Assignee: TAIYO YUDEN CO., LTD.
    Inventor: Hideyuki Sekine
  • Patent number: 11038484
    Abstract: An acoustic wave device includes a piezoelectric substrate and an IDT electrode on the piezoelectric substrate. The IDT electrode includes a first busbar and a second busbar that oppose each other, multiple first electrode fingers, multiple second electrode fingers, multiple first offset electrodes, and multiple second offset electrodes. A virtual line connecting the leading ends of the first electrode fingers is referred to as a first envelope. The first envelope is included relative to the acoustic-wave propagation direction. A virtual line connecting the leading ends of the second electrode fingers is referred to as a second envelope. The second envelope is inclined relative to the acoustic-wave propagation direction. The direction in which the first offset electrodes extend and the direction in which the second offset electrodes extend inclined relative to the direction orthogonal or substantially orthogonal to the acoustic-wave propagation direction.
    Type: Grant
    Filed: October 1, 2019
    Date of Patent: June 15, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Katsuya Daimon
  • Patent number: 11031919
    Abstract: A surface acoustic wave (SAW) device includes a piezoelectric substrate, an interdigital transducer (IDT) electrode located on an upper surface of the piezoelectric substrate, a cover covering the upper surface of the piezoelectric substrate from above the IDT electrode, at least one first via conductor extending through at least part of the cover from the upper surface of the piezoelectric substrate to an upper surface of the cover, at least one second via conductor located, on the piezoelectric substrate, inward from the first via conductor in a plan view, extending through at least part of the cover from the upper surface of the piezoelectric substrate to the upper surface of the cover, and having a smaller diameter than the first via conductor, and a conductive layer located on the upper surface of the cover and extending over an upper end of the second via conductor.
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: June 8, 2021
    Assignee: KYOCERA Corporation
    Inventors: Masaki Nambu, Hiroyuki Tanaka
  • Patent number: 11031921
    Abstract: The acoustic wave filter (10A) includes a parallel-arm resonant circuit (12p). The parallel-arm resonant circuit (12p) includes a parallel-arm resonator (p1) and a frequency variable circuit (72p) that are connected in parallel. The frequency variable circuit (72p) includes a parallel-arm resonator (p2) that has a resonant frequency higher than that of the parallel-arm resonator (p1) and a switch (SW1) element. A frequency difference between a resonant frequency on a higher frequency side of the parallel-arm resonant circuit (12p) in a case where the switch (SW1) is OFF and a resonant frequency on a higher frequency side of the parallel-arm resonant circuit (12p) in a case where the switch (SW1) is ON is equal to or more than a frequency difference between a low frequency end frequency of the second attenuation band and a low frequency end frequency of the first attenuation band.
    Type: Grant
    Filed: October 2, 2019
    Date of Patent: June 8, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Koji Nosaka
  • Patent number: 11025227
    Abstract: A first filter of a multiplexer includes serial resonators and parallel resonators that are acoustic wave resonators. A first of the serial resonators that is closer to a common terminal than the other serial resonators is connected to the common terminal without the parallel resonators interposed therebetween. Each of the elastic wave resonators includes a substrate having piezoelectricity, an IDT electrode provided on the substrate, and a dielectric layer provided on the substrate to cover the IDT electrode. A thickness of the dielectric layer of the first serial resonator is smaller than a thickness of each of the dielectric layers of the remainder of the elastic wave resonators.
    Type: Grant
    Filed: November 26, 2018
    Date of Patent: June 1, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yasuharu Nakai, Katsuya Daimon
  • Patent number: 10972070
    Abstract: An elastic wave device includes a piezoelectric substrate, and elastic wave elements on the piezoelectric substrate and including IDT electrodes, respectively. The IDT electrode of a first of the elastic wave elements includes first and second busbars, and the IDT electrode of a second of the elastic wave elements includes third and fourth busbars. The second busbar and the third busbar extend parallel or substantially parallel to each other, and are spaced by a gap in a direction perpendicular or substantially perpendicular to an elastic-wave propagating direction. Each of the second and third busbars includes first and second electrode layers at least a portion of which is laminated on the first electrode layer. The second electrode layer of the second busbar is cut in at least one location in a direction crossing the elastic-wave propagating direction.
    Type: Grant
    Filed: August 7, 2019
    Date of Patent: April 6, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Yoshinori Kameoka
  • Patent number: 10958242
    Abstract: A filter includes a series arm resonator, a first parallel arm resonance circuit, and a second parallel arm resonance circuit. The first parallel arm resonance circuit includes: a first parallel arm resonator connected to a first node; a first capacitor and a first switch connected together in parallel and connected in series with the first parallel arm resonator; and a first inductor provided on a path connecting the node and ground to each other via the first switch. The second parallel arm resonance circuit includes: a second parallel arm resonator connected to a second node; a second capacitor and a second switch connected together in parallel and connected in series with the second parallel arm resonator; and a second inductor provided on a path connecting the second node and ground to each other via the second switch. The first and second inductor have different inductance values.
    Type: Grant
    Filed: March 27, 2019
    Date of Patent: March 23, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hideki Tsukamoto, Koji Nosaka
  • Patent number: 10944381
    Abstract: A filter includes a series arm resonator, a first parallel arm resonance circuit and a second parallel arm resonance circuit. The each of the first parallel arm resonance circuit and the second parallel arm resonance circuit includes: a parallel arm resonator that is connected to a node; a pair of elements consisting of a capacitor and a switch, which are connected in parallel with each other, that is connected in series with the parallel arm resonator; and an inductor that is provided on a path that connects the node and ground to each other via the switch. The inductance value of the inductor of the first parallel arm resonance circuit and the inductance value of the inductor of the second parallel arm resonance circuit are substantially equal to each other.
    Type: Grant
    Filed: March 14, 2019
    Date of Patent: March 9, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hideki Tsukamoto, Koji Nosaka
  • Patent number: 10938377
    Abstract: A surface acoustic wave resonator includes first and second surface acoustic wave resonator connected in series, and a third surface acoustic wave resonator connected in series with the second surface acoustic wave resonator. Each of the first to third surface acoustic wave resonators includes a pair of comb-shaped electrodes in which electrode fingers of one of the comb-shaped electrodes and electrode fingers of the other one of the comb-shaped electrodes are alternately arranged. The second surface acoustic wave resonator has a lower ratio of a width of the electrode fingers to a pitch between the electrode fingers than the first and third surface acoustic wave resonators.
    Type: Grant
    Filed: June 10, 2019
    Date of Patent: March 2, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Toru Eihama
  • Patent number: 10931260
    Abstract: A SAW element configured to suppress spurious emissions resulting from non-periodicity of an IDT electrode finger arrangement. In one example, the SAW element is a resonator comprising an IDT electrode including a first plurality of IDT electrode fingers connected to a first busbar and a second plurality of IDT electrode fingers connected to a second busbar, and reflectors having a plurality of reflector fingers. The pluralities of first and second IDT electrode fingers are alternatively connected to each busbar by either normal connections or reversed connections and include regions arranged by at least two different types of pitches. The normal connections are such that either the odd-numbered or even-numbered IDT electrode fingers connect to the first busbar, and the reversed connections are such that the opposite group of IDT electrode fingers connect to the first busbar.
    Type: Grant
    Filed: December 17, 2019
    Date of Patent: February 23, 2021
    Assignee: SKYWORKS SOLUTIONS, INC.
    Inventors: Toru Yamaji, Rei Goto
  • Patent number: 10911022
    Abstract: A duplexer is disclosed. In an embodiment, the duplexer includes a Tx filter and an Rx filter, wherein the Tx filter includes first series-interconnected basic elements, each first basic element having a first electroacoustic resonator and first impedance converters interconnected in series between the first basic elements, wherein the Rx filter comprises second series-interconnected basic elements, each second basic element having a second electroacoustic resonator and second impedance converters interconnected in series between the second basic elements, wherein the first impedance converters in the Tx filter are impedance inverters, wherein the first resonators of the first basic elements in the Tx filter are only series resonators, wherein the second impedance converters in the Rx filter are admittance inverters, and wherein the second resonators of the second basic elements in the Rx filter are only parallel resonators.
    Type: Grant
    Filed: July 6, 2015
    Date of Patent: February 2, 2021
    Assignee: SnapTrack, Inc.
    Inventor: Edgar Schmidhammer
  • Patent number: 10911017
    Abstract: Acoustic resonator devices, filters, and methods are disclosed. An acoustic resonator includes a substrate and a lithium niobate (LN) plate having front and back surfaces. An acoustic Bragg reflector is sandwiched between the surface of the substrate and the back surface of the lithium niobite plate. An interdigital transducer (IDT) is formed on the front surface of the LN plate. The Euler angles of the lithium niobate plate are [0°, ?, 90° ], where ? is greater than or equal to ?15° and less than 0°.
    Type: Grant
    Filed: July 28, 2020
    Date of Patent: February 2, 2021
    Assignee: Resonant Inc.
    Inventor: Viktor Plesski
  • Patent number: 10897377
    Abstract: Provided is a bus network system including: a master node switch; and a plurality of slave node switches, wherein each of the plurality of slave node switches includes at least one band limit switch configured to transmit signals in a given band, and each of the plurality of slave node switches is configured to be physically on/off controlled.
    Type: Grant
    Filed: August 8, 2019
    Date of Patent: January 19, 2021
    Assignee: DAEGU GYEONGBUK INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Ji Woong Choi, Sung Min Han, Kyu Min Kim, Eun Min Choi
  • Patent number: 10886895
    Abstract: Even when frequency characteristics are changed in association with multiple communication bands, an attenuation required for a specific frequency band outside a pass band is obtained. A frequency-variable filter (10) includes multiple series-arm resonators (111, 112, 113), multiple parallel-arm resonators (121, 122, 123), a variable capacitor (21), and an inductor (31) having a fixed inductance. The multiple series-arm resonators (111, 112, 113) and the multiple parallel-arm resonators (121, 122, 123) are connected in a ladder shape. The variable capacitor (21) is connected in series with the parallel-arm resonator (121). The fixed inductor (31) is connected in series with the parallel-arm resonator (123).
    Type: Grant
    Filed: January 10, 2019
    Date of Patent: January 5, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Masakazu Tani
  • Patent number: 10886634
    Abstract: A filter feeding network, including a dielectric substrate, where a surface of the dielectric substrate's one side is provided a microstrip line, and a surface of the dielectric substrate's other side is provided with a metal ground; the microstrip line includes first and second power division circuits, and first and second filter circuits; an input and output end of the first filter circuit are respectively connected to the first power division circuit's input and output end correspondingly, the second filter circuit's input and output end are respectively connected to the second power division circuit's input and output end correspondingly, and the input end of the first filter circuit and second filter circuit are in conduction with the metal ground; and first and second power division circuit's output end feeds at least two array antenna units for ?45° polarization and +45° polarization respectively.
    Type: Grant
    Filed: November 11, 2016
    Date of Patent: January 5, 2021
    Assignee: TONGYU COMMUNICATION INC.
    Inventors: Wei Zhao, Zhuofeng Gao, Xiangxi Yao, Wenlan Wang, Mulin Liu, Samb Doudou, Qingchen Chu, Bin Wang
  • Patent number: 10879871
    Abstract: In an acoustic wave device including a piezoelectric material substrate and supporting body bonded with each other through a bonding layer, it is an object to provide the acoustic wave device having the structure for further improving the propagation loss and temperature characteristics of frequency of an acoustic wave. An acoustic wave device includes a piezoelectric material substrate, an electrode on the piezoelectric material substrate, a supporting body, and a bonding layer for bonding the piezoelectric material substrate and the supporting body. The bonding layer is composed of quartz crystal.
    Type: Grant
    Filed: October 31, 2019
    Date of Patent: December 29, 2020
    Inventors: Tomoyoshi Tai, Masahiko Namerikawa, Takashi Yoshino
  • Patent number: 10879874
    Abstract: A surface elastic wave resonator comprises a piezoelectric material to propagate the surface elastic waves and a transducer inserted between a pair of reflectors comprising combs of interdigitated electrodes and having a number Nc of electrodes connected to a hot spot and an acoustic aperture W wherein the relative permittivity of the piezoelectric material is greater than about 15, a product of Nc·W/fa for the transducer being greater than 100 ?m·MHz?1, where fa is the antiresonance frequency of the resonator. A circuit comprises a load impedance and a resonator according to the invention and having an electrical response manifesting as a peak in the coefficient of reflection S11 at a frequency of a minimum value of the parameter S11 that is lower than ?10 dB, the antiresonance peak of the resonator being matched to the impedance of the load.
    Type: Grant
    Filed: July 28, 2016
    Date of Patent: December 29, 2020
    Assignee: SENSEOR
    Inventors: Sylvain Ballandras, Sébastien Alzuaga
  • Patent number: 10868516
    Abstract: A surface acoustic wave filter includes a longitudinally coupled filter connected between an input terminal and an output terminal on a main surface of a piezoelectric substrate and that includes longitudinally coupled resonators and a parallel arm resonator connected between a node between the input terminal and the longitudinally coupled filter and ground. A line connecting IDT electrodes at an input side of a portion of the longitudinally coupled resonators to the ground and a line connecting the parallel arm resonator to the ground are independently provided and are connected to the same ground terminal.
    Type: Grant
    Filed: November 9, 2017
    Date of Patent: December 15, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Motoki Ozasa
  • Patent number: 10862020
    Abstract: An elastic wave device in which a recess is provided on an upper side of a support, a piezoelectric thin film covers the recess, and an IDT electrode is provided on an upper surface of the piezoelectric thin film. A plate wave of an S0 mode or SH0 mode is used. A plurality of grooves are provided in the upper surface or lower surface of the piezoelectric thin film at a portion of the piezoelectric thin film that is positioned on a hollow section.
    Type: Grant
    Filed: May 10, 2017
    Date of Patent: December 8, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yutaka Kishimoto, Tetsuya Kimura
  • Patent number: 10862456
    Abstract: An acoustic wave filter device includes a ground connection terminal connected to an external ground electrode, a serial arm resonator, a first parallel arm circuit connected to a first node of the serial arm resonator, the first node being positioned closer to an input/output terminal, and to the ground connection terminal, and a second parallel arm circuit connected to a second node of the serial arm resonator, the second node being positioned closer to an input/output terminal, and to the ground connection terminal. The first parallel arm circuit includes a parallel arm resonator having a resonant frequency higher than a center frequency of a filter pass band, and a frequency varying circuit connected to the parallel arm resonator and the ground connection terminal. The second parallel arm circuit includes a parallel arm resonator having a resonant frequency higher than the center frequency of the filter pass band.
    Type: Grant
    Filed: February 20, 2019
    Date of Patent: December 8, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Koji Nosaka
  • Patent number: 10862458
    Abstract: An acoustic wave device includes first to third acoustic wave resonators connected in series, and the first acoustic wave resonator and the third acoustic wave resonator are respectively disposed on one side and another side of the second acoustic wave resonator. In the first to third acoustic wave resonators, a first common busbar is connected to one of reflectors of the first and second acoustic wave resonators, and a second common busbar is connected to one of reflectors of the second and third acoustic wave resonators.
    Type: Grant
    Filed: January 28, 2019
    Date of Patent: December 8, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Yasuaki Shin
  • Patent number: 10840876
    Abstract: Surface acoustic wave (SAW) resonator, SAW filters, and methods of fabricating SAW filters. A first plurality of parallel conductors extending from a first bus bar are formed on a surface of a 128-degree Y-cut lithium niobate substrate. A second plurality of parallel conductors extending from a second bus bar are formed on the surface of the substrate, the second plurality of parallel conductors interleaved with the first plurality of parallel conductors. An SiO2 layer overlays the first and second pluralities of parallel conductors. The first and second pluralities of parallel conductors are substantially copper and have a thickness DCU defined by 0.12P?DCU?0.24P, where P is a center-to-center spacing of adjacent parallel conductors. The SiO2 layer has a thickness DOX defined by 3.1DCU?DOX?4.5DCU.
    Type: Grant
    Filed: August 23, 2018
    Date of Patent: November 17, 2020
    Assignee: Resonant Inc.
    Inventors: Sean McHugh, Patrick Turner, Ventsislav Yantchev, Filip Iliev
  • Patent number: 10840878
    Abstract: An elastic wave device includes an IDT electrode disposed on a piezoelectric substrate and including first and second electrode fingers that are interdigitated. A region where the first and second electrode fingers overlap each other as seen in a direction of propagation of elastic waves is an excitation region. Edge portions where an acoustic velocity is lower than an acoustic velocity in a central portion are disposed on opposite sides of a central portion in the excitation region. A first busbar and second busbar include inner busbar portions, central busbar portions, and outer busbar portions. First and second offset electrode fingers extend from the inner busbar portions toward the leading ends of the second electrode fingers or first electrode fingers.
    Type: Grant
    Filed: October 19, 2017
    Date of Patent: November 17, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Katsuya Daimon, Masato Araki
  • Patent number: 10840885
    Abstract: A filter and a method for forming a filter are disclosed. In an embodiment a filter includes a first port, a second port and a signal path between the first port and the second port. The filter further includes a plurality of series resonators electrically connected in series in the signal path, a plurality of shunt paths, each electrically connecting the signal path to ground and one parallel resonator electrically connected in each shunt path, wherein at least one series resonator is an electroacoustic resonator, and wherein at least one parallel resonator comprises one acoustically inactive capacitor or an electrical connection of an acoustically active resonator and a de-tuning coil.
    Type: Grant
    Filed: October 24, 2018
    Date of Patent: November 17, 2020
    Assignee: QUALCOMM Incorporated
    Inventors: Oleksandr Gavryliuk, Mykola Shevelov, Petro Komakha, Georgiy Sevskiy, Alexander Chernyakov, Wai San Wong
  • Patent number: 10819310
    Abstract: A filter (11) includes a series-arm circuit (10) connected between an input/output terminal (11m) and an input/output terminal (11n); and a parallel-arm circuit (20) connected between a ground and a path that connects the input/output terminal (11m) and the input/output terminal (11n). One circuit among the series-arm circuit (10) and the parallel-arm circuit (20) is constituted by a parallel-arm resonator (p1) and a parallel-arm resonator (p2) that are connected in parallel to each other and that are connected to a node (x1) on the path. The parallel-arm resonators (p1) and (p2) form a pass band, together with another circuit among the series-arm circuit (10) and the parallel-arm circuit (20). The parallel-arm resonator (p2) has a resonant frequency lower than a resonant frequency of the parallel-arm resonator (p1) and has an impedance higher than an impedance of the parallel-arm resonator (p1).
    Type: Grant
    Filed: January 18, 2019
    Date of Patent: October 27, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Atsushi Horita, Koji Nosaka
  • Patent number: 10812041
    Abstract: An elastic wave device includes an IDT electrode on a piezoelectric substrate to define a longitudinally coupled resonator elastic wave filter, a three-dimensional wiring portion on the piezoelectric substrate and connected to the longitudinally coupled resonator elastic wave filter, and a cover surrounding the longitudinally coupled resonator elastic wave filter on the piezoelectric substrate. The three-dimensional wiring portion includes a lower layer wiring line, an upper layer wiring line, and an insulating layer stacked between the lower layer wiring line and the upper layer wiring line. The cover includes a portion on the three-dimensional wiring portion.
    Type: Grant
    Filed: November 21, 2018
    Date of Patent: October 20, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Takuya Koyanagi
  • Patent number: 10784839
    Abstract: A high pass filter includes: a first resonant circuit including an inductor and a capacitor in parallel between first and second terminals; a second resonant circuit including an inductor and a capacitor in series between a first end of the first resonant circuit and a ground; a third resonant circuit including an inductor and a capacitor in series between a second end of the first resonant circuit and the ground; a fourth resonant circuit disposed between the first end of the first resonant circuit and the first terminal, and including a first acoustic resonator; and a fifth resonant circuit disposed between the second end of the first resonant circuit and the second terminal, and including a second acoustic resonator. Attenuation regions respectively formed by the first, second, and third resonant circuits are arranged in lower frequency regions than attenuation regions respectively formed by the fourth and fifth resonant circuits.
    Type: Grant
    Filed: November 5, 2018
    Date of Patent: September 22, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jeong Hae Kim, Seong Jong Cheon, Hyung Jin Lee
  • Patent number: 10756254
    Abstract: An object of the present invention is to provide a method of manufacturing a composite substrate including a piezoelectric layer with less Li amount variation and a support substrate. A method of manufacturing a composite substrate of the present invention includes a step of performing ion implantation into a piezoelectric substrate, a step of bonding the piezoelectric substrate and the support substrate, a step of separating the bonded substrate, at an ion-implanted portion of the piezoelectric substrate, into the piezoelectric layer bonded to the support substrate and the remaining piezoelectric substrate after the step of bonding the piezoelectric substrate and the support substrate, and a step of diffusing Li into the piezoelectric layer after the separating step.
    Type: Grant
    Filed: October 5, 2017
    Date of Patent: August 25, 2020
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Masayuki Tanno, Kazutoshi Nagata, Shoji Akiyama, Koji Kato