Abstract: A plurality of composite elements are arranged in parallel with each other on a substrate. The composite elements each include a rectangular microstrip line element, an input microstrip line and an output microstrip line. The microstrip line element has one longer side, the other longer side, one end and the other end, and the input microstrip line is connected at the one end to the one longer side while the output microstrip line is connected at the other end to the other longer side. The composite elements are cascaded to constitute a low-pass filter.

Abstract: A circuit board or microelectronic device in which conductive signal lines are suspended or supported by filaments in air, rather than surrounded by a solid dielectric material. Dry air has a low relative permittivity and extremely low loss tangent compared with common dielectric substrates in which signal lines are currently embedded within circuit boards and microelectronic devices. The signal intensity attenuation for filament-suspended or filament-supported signal lines is much lower than signal lines embedded in solid dielectric materials, allowing for transmission of significantly higher frequency signals within filament-suspended and filament-supported signal lines.

Abstract: A circuit assembly suitable for RF signals has an integration plate and an RF distribution layer disposed adjacent to the integration plate. The RF distribution layer has an RF conductive layer between a first dielectric layer and a second dielectric layer. A DC distribution layer is disposed adjacent to the RF distribution layer. An RF input is coupled to the RF conductive layer. A module assembly includes an integrated circuit coupled to the RF conductive layer and the DC distribution layer. An RF output is coupled to the RF conductive layer.

Abstract: A vertical transition device for differential stripline paths, connects differential microstrip paths on a horizontal plane with differential triplate paths on another horizontal plane in a multilayered architecture. The differential microstrip paths include a pair of differential microstrip lines. The differential triplate paths include a pair of triplate lines. The differential microstrip lines are connected with the differential triplate lines by via-holes within the transition device, respectively.

Abstract: A multi-layer substrate comprises a first dielectric layer, a coplanar waveguide line formed on a first surface of the first dielectric layer, the coplanar waveguide line including a signal conductor and a pair of ground conductor layers positioned at opposite sides of the signal conductor, separately from the signal conductor, and a second dielectric layer formed to cover the coplanar waveguide line and the first dielectric layer and having an opening positioned at least on the signal conductor of the coplanar waveguide line. A thickness of the first dielectric layer is smaller than the value of c/{4f·(∈1−1)½}, where c is velocity of light, f is a frequency of a signal propagating in the signal line, and ∈1 is a dielectric constant of the first dielectric layer.

Abstract: A circuit for processing radio frequency signals. The circuit can include a substrate board that has at least one dielectric layer (100) having a first set of substrate properties over a first region (102). The first set of substrate properties can include a first permittivity and a first permeability. A second region (140) can be provided with a set of second substrate properties. The second region can have a second set of substrate properties including a second permittivity and a second permeability. The second permittivity can be different than the first permittivity and/or the second permeability can be different than the first permeability. A first transmission line (102) having at least one discontinuity can be coupled to the second region (108). The discontinuity can include a bend, corner, non-uniformity, break in the transmission line, or a junction between the first transmission line and a second transmission line.

Abstract: A circuit (100) for processing radio frequency signals includes a substrate (50) where the circuit can be placed. The substrate can be a meta-material and can incorporate at least one dielectric layer (20, 30, or 40). The circuit such as a three port circuit and at least one ground can be coupled to the substrate. The dielectric layer can include a first region (40) with a first set of substrate properties and a second region (20) with a second set of substrate properties. Substrate properties can include permittivity and permeability. A portion (32 or 46) of the three port circuit can be selectively coupled to the second region. The permittivity and/or permeability of the second region can be higher than the permittivity and/or permeability of the first region. The increased permittivities and/or permeabilities can reduce a size of the three port circuit and effect a change in a variety of electrical characteristics associated with the three port circuit.

Abstract: A multi-layer stripline assembly interconnection includes a first stripline sub-assembly having a first surface and a first plurality of vias disposed in the first surface adapted to receive a plurality of solid metal balls. The interconnection further includes a second stripline sub-assembly having a second plurality of vias disposed in the first surface of the second sub-assembly adapted to be aligned with the first plurality of vias. Reflowed solder is wetted to the second plurality of vias and to the corresponding plurality of solid metal balls.

Abstract: A high frequency receiver is provided with improved insertion loss and noise factor. The receiver uses a low loss input stage and interstage noise matching block. The input stage and interstage noise matching block utilize a suspended substrate matching circuit wherein the substrate is free space. The interstage noise matching block further uses a broadside suspended substrate coupler where the broadside coupler is suspended in a free space substrate. Singly and in combination, when used in a high frequency receiver arrangement, the suspended substrate input matching circuit and the suspended substrate interstage matching circuit with suspended substrate coupler minimize insertion loss and improve the high frequency receiver overall noise factor.

Abstract: A method for decreasing resonance in a printed circuit board (PCB) uses cuts in a ground plane to slow a signal passing through the ground plane. Cuts in the ground plane may be used alone or in conjunction with the lengthening of signal traces. Slowing the signal passing through the ground plane enables a mismatch between the signal transit time of the ground plane and a signal oscillation period of the circuit board to be obtained. The mismatch results in decreased resonance.

Abstract: In a high-frequency module, a setting pattern formed on a circuit board has band-shaped first and second grounding lands, and first and second lands. External conductors of first and second forms of coaxial connectors are solderable to the grounding lands, and central conductors of first and second forms of coaxial connectors are solderable to the first and second lands. Accordingly, the first and second forms of coaxial connectors can be mounted on one circuit board. The circuit board can be manufactured more easily and at a lower cost in comparison with conventional art.

Abstract: A source electrode, a gate electrode, and a drain electrode formed on a front face active region of a semiconductor substrate in a shape of teeth of a comb are covered with an insulating film such as polyimede etc., as well as all of the upper surface and the side surfaces of the insulating film are covered with a metal protective film. Via hole receiving pads connected to the source electrode, the gate electrode, and the drain electrode are respectively connected to bonding pads on a reveres face of the semiconductor substrate through via holes.

Abstract: A printed circuit board (PCB) via, providing a conductor extending vertically between microstrip or stripline conductors formed on separate layers of a PCB, includes a conductive pad surrounding the conductor and embedded within the PCB between those PCB layers. The pad's shunt capacitance and the magnitudes of capacitances of other portions of the via are sized relative to the conductor's inherent inductance to optimize frequency response characteristics of the via.

Abstract: A method of manufacturing a microstrip termination is provided, the microstrip termination containing a transmission line, a tapered edge ground and a thin film resistor connecting a transmission line to the tapered edge ground. Circuits are manufactured by first cutting holes in a substrate forming alignment holes for dicing the substrate into separate circuits. A saw is then used to cut tapered grooves along the alignment holes for forming tapered edges. The substrate is then plated and etched to form the transmission lines, thin film resistors, and ground planes. Finally, the substrate is diced into the separate termination circuits.

Abstract: A microwave monolithic integrated circuit assembly includes a microwave monolithic integrated circuit having an MMIC circuit plane and having a first region of relatively high heat production and a second region of relatively low heat production. A heat-dissipating assembly is in thermal contact with the microwave monolithic integrated circuit. The heat-dissipating assembly has at least two pieces of pyrolytic graphite embedded within a casing. The pieces of pyrolytic graphite include a first piece of pyrolytic graphite underlying the first region and having a high-thermal-conductivity x-direction of the first piece lying within about 20 degrees of a perpendicular to the MMIC circuit plane, and a second piece of pyrolytic graphite underlying the second region and having a high-thermal-conductivity x-direction of the second piece lying within about 20 degrees of the MMIC circuit plane. The heat-dissipating assembly is preferably fabricated by hot isostatic pressing.

Abstract: A stacked radio-frequency module is formed by stacking packages each storing MMICs and mounting another package upside down which stores a control circuit for controlling MMICs. The MMICs and control circuits are each sealed by a metal sealing lid within the cavity of each of the packages which are spatially completely separated from each other. Each of the pads for wiring paths for radio-frequency signals and for power supply/control signals and ground pads are provided within each package and at opposing surfaces of packages to be stacked with corresponding pads joined by a gold bump.

Abstract: A microwave monolithic integrated circuit (MMIC) assembly and related method are disclosed. A dielectric substrate has a surface on which radio frequency circuits and microstrip lines are formed. At least one MMIC chip opening is dimensioned for receiving therethrough a MMIC chip. A metallic carrier is mismatched as to coefficient of thermal expansion to the dielectric substrate and includes a component surface adhesively secured to the dielectric substrate on the surface opposing the radio frequency circuits and microstrip lines. At least one raised pedestal is on the component surface that is positioned at the MMIC chip opening. A MMIC chip is secured on the pedestal and extends through the MMIC chip opening for connection to the radio frequency circuits and microstrip lines. Stress relief portions are formed in the metallic carrier that segment the carrier into subcarriers and provide stress relief during expansion and contraction created by temperature changes.

Abstract: The invention relates to a filter arrangement for separating radio frequency energy from signal energy in a signal line. The signal line extends at least partly in a first layer of a multi-layer printed circuit board. A grounded surface is arranged in a second layer of the printed circuit board. The signal line to be filtered is interrupted in the first layer in the filter region and continued in a third layer, the second and the third layers being located on opposite sides of the first layer. Due to the skin effect the radio frequency energy will be concentrated on the side of the signal line facing the grounded surface. The side of the signal line remote from the grounded surface is then to a large extent decoupled from radio frequency energy, such that the actual signal path can be continued without being disturbed by radio frequency energy.

Abstract: A microelectro-mechanical device which includes a fixed electrode formed on a substrate, the fixed electrode including a transparent, high resistance layer, and a moveable electrode formed with an anisotropic stress in a predetermined direction and disposed adjacent the fixed electrode. The device includes first and second electrically conductive regions which are isolated from one another by the fixed electrode. The moveable electrode moves to cover the fixed electrode and to electrically couple to the second conductive region, thus electrically coupling the first and second conductive regions, in response to a potential being applied across the fixed and moveable electrodes. The fixed electrode is transparent to electromagnetic signals or waves and the moveable electrode impedes or allows transmission of electromagnetic signals or waves.

Abstract: A dielectric transmission line bend structure includes an electrically conductive strip that forms a bend (e.g., a right angle bend). The inner edge of the bend includes a plurality of curved and/or straight line segments that result in the inner edge extending along a circuitous path in order to thereby reduce transmission line loss. A T-type junction includes a first or left side inner edge bending to the left and a second or right side inner edge bending to the right, with both inner edges including segments that result in greater inner edge lengths in order to increase current path lengths along the inner edges and thereby help reduce transmission line loss. A method of designing a transmission line bend structure includes the step of providing a preliminary bend structure design having an electrically conductive strip with at least one inner edge extending along a circuitous path between first and second inner edge end points on the strip.

Abstract: In a high frequency apparatus for transmitting or processing a high frequency signal, a substrate having a recessed portion is formed in a surface of the substrate, a first interconnecting conductor is formed on the substrate including at least the recessed portion of the substrate, and a dielectric support film is formed on the substrate above the recessed portion of the substrate with an air space sandwiched between the dielectric support film and the substrate. A second interconnecting conductor is formed on a part of a surface of the dielectric support film. The high frequency apparatus has a simple structure and a reduced transmission loss and capable of being made by a simple manufacturing process.

Abstract: The present invention relates to a four port hybrid comprising a first set (10) of N coupled transmission lines (10A, 10B, 10C, 10D, 10E, 10F, 10G, 10H, 10I) and a second set (20) of N coupled transmission lines (20A, 20B, 20C, 20D, 20E, 20F, 20G, 20H, 20I) where N≧4. Said coupled transmission lines in said first set (10) are electrically connected to said coupled transmission lines in said second set (20) to form a first spiral shaped electrical conductive path, a second spiral shaped electrical conductive path and N−1 electrically isolated transposition portions (30, 40, 50, 60, 70, 80, 90, 110) of said first and second spiral shaped electrical conductive paths. A first end of the first spiral being an input port (P1). A first end of the second spiral being a port (P4) connectable to ground. A second end of the first spiral being a first output port (P3) and a second end of the second spiral being a second output port (P2).

Abstract: Systems, methods, and probe devices for electronic monitoring and characterization using absorbent media confined by a metallic mesh. The mesh allows a stream of liquid or gas to pass through the structure, so that the media will adsorb the material to which it is specific. This changes the permittivity of the media in which the electromagnetic field is propagating. This change in permittivity can be seen through the use of classical microwave methods such as phase shift, amplitude changes, frequency changes in a cavity or the frequency of an unbuffered oscillator. Some embodiments use a two cylinder structure, where an outer cylinder contains a material which selectively removes a chemical which may be in conflict with or would contaminate the sensing of the desired chemical. This outer cylinder does not play a part in the measurement because it is outside the metal shield which contains the measurement adsorbent, and is thus outside the electromagnetic field.

Abstract: A micro-electro mechanical system (MEMS) switch having a single anchor is provided. The MEMS switch includes a substrate; grounding lines installed on the substrate to be distant away from each other; signal transmission lines positioned at predetermined intervals between the grounding lines; an anchor placed between the signal transmission lines; a driving electrode that encircles the anchor while not being in contact with the anchor, the signal transmission lines and the grounding lines; and a moving plate that is positioned on the driving electrode to be overlapped with portions of the signal transmission lines, and connected to the anchor elastically.

Abstract: A surface mount technology (“SMT”) apparatus for use in routing radio frequencies (“RF”) between cavities that require a high level of isolation on a single printed circuit board (“PCB”). The SMT part is attached to the PCB over a stripline-ready trace which transitions to microstrip before and after the SMT stripline part to maintain consistent characteristic impedance. When presented with a high isolation need between two cavities using microstrip transmission lines, the proposed stripline SMT apparatus under the isolation wall will tend to provide the necessary isolation. The present invention provides a repeatable and reliable interconnect while improving the electrical match between the two cavities. Furthermore, the invention removes the costs associated with manually forming and soldering cables between PCBs.

Abstract: The present invention provides a mechanism for supporting high digital bandwidth in a multi-drop bus system. A first device of the system is electrically coupled to a bus. Multiple receiving devices are coupled to the bus through associated electromagnetic couplers having coupling coefficients in a specified range. The geometries of the electromagnetic couplers are selected to reduce variations in the coupling coefficients with changes in the relative positions of the coupler components.

Abstract: A method for fabricating a suspended transmission line includes supporting a first conductive trace on a first side of a dielectric support layer. A second conductive trace is supported on a second side of the support layer. The first and second conductive traces are connected at spaced intervals. A first spacer is formed outwardly of the first side of the support layer A second spacer is formed outwardly of the second side of the support layer. A first plate is disposed outwardly of the first spacer and includes a first ground plane displaced from the first conductive trace. A second plate is disposed outwardly of the second spacer and includes a second ground plane displaced from the second conductive trace.

Abstract: A signal transmission unit includes a first transmission line, a second transmission line, and a tapered transmission line coupling the first transmission line to the second transmission line. The tapered transmission line has a width and a length and the width changes along the length according to one or more functions. The one or more functions include but are not limited to linear functions, non-linear functions, hyperbolic functions, and exponential functions.

Abstract: The present invention relates generally to an apparatus for interconnecting coaxial connectors with stripline circuits. A general coaxial connector housing is by glue fixed adjacent to the stripline circuit and at least one conductive element is placed in between the connector housing and the stripline ground planes.

Abstract: A surface mount package for a microwave circuit is disclosed. The package has a port for transferring a signal from the microwave circuit to a printed circuit board. The package includes a base made from a dielectric material which includes vias which contain a conductive material and are electrically coupled to the ground potential of the printed circuit board. Conductive material is placed on the topside of the base forming a transmission line for carrying the signal in a transmission line mode. To facilitate operation in a transmission line mode, the length of the transmission line is a substantial portion of the wavelength of the signal. The transmission line provides electrical contact with a terminal of the microwave circuit and is electrically coupled to the port. Additionally, the transmission line forms an electromagnetic wave guiding structure.

Abstract: An electronic device package includes a multilayer substrate having an interconnect structure configured to propagate a high frequency signal from one metal layer to another metal layer. The configuration and layout of the interconnect structure, particularly the arrangement of the reference vias associated with the signal via, is selected such that a desired filter response is achieved. The filter response is realized without any additional capacitor or inductor components. Thus, the natural discontinuity created by the vias and the inherent parasitic capacitance and inductance associated with the vias can be utilized to create a desired lowpass or bandpass filter response.

Abstract: A configuration for coupling a dielectric resonator to a microstrip transmission line that maintains a relatively high Q value of the dielectric resonator. The dielectric resonator-to-microstrip transmission line coupling configuration includes a dielectric resonator, a metal wall, and a microstrip conductor mounted on a dielectric substrate surface such that the dielectric resonator is near the microstrip conductor. The dielectric resonator is configured to resonate in an intrinsic non-radiating hybrid electromagnetic mode, and the metal wall is configured as a mirror for conceptually forming an image of the resonating dielectric resonator. When an electromagnetic wave is transmitted on the microstrip transmission line, the dielectric resonator is excited to resonate in the hybrid electromagnetic mode, thereby allowing electromagnetic field coupling between the microstrip transmission line and the dielectric resonator, while maintaining a high Q value of the dielectric resonator.

Abstract: An integrated circuit arrangement having a number of structural elements, at least one of which is surrounded by a metallic shielding structure. This structural element is thus protected against interference due to disturbing impulses from its environment. In particular, the structural elements of the circuit arrangement can be arranged next to or on top of one another. To produce the metallic shielding structure of a structural element of the circuit arrangement, at least one depression which surrounds the structural element is created and then lined with metal. The contacts and electrical connections of the structural element are electrically insulated from the metal of the shielding structure.

Abstract: An arrangement for interconnecting RF ports on mutually parallel printed-circuit boards includes an arrangement of a ladder-shaped conductive foil or thin plate rolled to make a cylindrical inner conductor, and another arrangement of a ladder-shaped conductive foil rolled to make an outer conductor, with the ladder “rungs” being parallel to the axis of the interconnection. The rungs are long slender columns, which deflect laterally or “bulge” in response to axial forces. The inner and outer conductors are spaced apart by a dielectric solid material, preferably elastomeric.

Abstract: A stacked radio-frequency module is formed by stacking packages each storing MMICs and mounting another package upside down which stores a control circuit for controlling MMICs. The MMICs and control circuits are each sealed by a metal sealing lid within the cavity of each of the packages which are spatially completely separated from each other. Each of the pads for wiring paths for radio-frequency signals and for power supply/control signals and ground pads are provided within each package and at opposing surfaces of packages to be stacked with corresponding pads joined by a gold bump.

Abstract: Disclosed is an inductor for a radio communication module enabling to be less affected by parasitics of a substrate as well as have a great cross-sectional area. The present invention includes a plurality of first and second conductive pads on a substrate, a plurality of first conductive bonding wires connecting the first and second conductive pads in diagonal directions, respectively, and a plurality of second conductive bonding wires connecting the first and second conductive pads confronting each other, respectively.

Abstract: A microstrip inductor with a high quality factor. The inductor includes a substrate, a ground plane, a microstrip line, and a shielding conductor. The shielding conductor may be a surface conductor or a buried conductor. The substrate has an upper surface and a lower surface. The ground plane is disposed on the lower surface of the substrate and is coupled to a ground potential. The microstrip line is disposed on the upper surface of the substrate. The surface conductor is disposed on the upper surface of the substrate and is located at a gap of a length from the microstrip line and is coupled to the ground potential. The buried conductor is disposed within the substrate and is located at a gap of a length from the microstrip line and is punched through the substrate to couple to the ground potential.

Abstract: A conductor line is formed on the upper side of a dielectric plate, and a ground electrode is formed on the underside. Further, electrode non-formation portions are distributed at intervals a in the propagation direction of a signal and at intervals b in the perpendicular direction to the propagation direction. A band-stop or low-pass filter characteristic is produced by increasing the transmission loss in a frequency band determined by the intervals a, and the attenuation in the stop-band is determined by the intervals b in the width direction.

Abstract: A circuit assembly suitable for RF signals has an integration plate and an RF distribution layer disposed adjacent to the integration plate. The RF distribution layer has an RF conductive layer between a first dielectric layer and a second dielectric layer. A DC distribution layer is disposed adjacent to the RF distribution layer. An RF input is coupled to the RF conductive layer. A module assembly includes an integrated circuit coupled to the RF conductive layer and the DC distribution layer. An RF output is coupled to the RF conductive layer.

Abstract: A wiring board includes a signal transmission circuit designed as a distributed constant circuit. The signal transmission circuit includes a first transmission line connecting a first electric component and a second electric component, and a second transmission line connecting the second electric component to a terminator resistor of the distributed constant circuit. At least the first transmission line includes a plurality of signal lines arranged in parallel, which transmit a signal in parallel.

Abstract: The present invention relates a printed circuit board having jumper lines, and a method for making the printed circuit board. An isolation layer made of a dielectric material is coated on the line layer of the printed circuit board, and multiple pads are formed in the isolation layer, thereby exposing part of the line layer without covered by the isolation layer. A high conductive material is coated on the isolation layer to connect the multiple pads, thereby forming a planar jumper layer that is connected to the line layer through the circular pads. Thus, the planar jumper layer may be made simultaneously during fabrication of the printed circuit board, without having to perform the wire-bonding work.

Abstract: A printed circuit board (PCB) via, providing a conductor extending vertically between microstrip or stripline conductors formed on separate layers of a PCB, includes a conductive pad surrounding the conductor and embedded within the PCB between those PCB layers. The pad's shunt capacitance and the magnitudes of capacitances of other portions of the via are sized relative to the conductor's inherent inductance to optimize frequency response characteristics of the via.

Abstract: An apparatus and method which maintains plasma discharges (for instance 25) in containers (for instance 20) which have an internal section of 1 cm or less in width are described. The very small cross-section plasma discharges are useful in MEMS devices, in spectrometers and in spectroscopy.

Abstract: The present invention relates to a method of shortening a microwave circuit and a printed circuit board made by using the method. The effective dielectric constant of the dielectric material of the microwave circuit may be increased, thereby efficiently achieving the purpose of shortening the size of the microwave circuit, thereby increasing the usage of the area of the circuit board, and thereby reducing production of noise.

Abstract: A multilayer ceramic device (100) includes a plurality of dielectric layers (104A-G) separated by ground planes (114) and includes a plurality transmission line segments (118) in generally folded configuration for defining a tapered transmission line (102). The profile of the transmission line may vary and includes such profiles as embodied in the depicted lines (200, 206, 212).

Abstract: A suspended transmission line includes a dielectric support layer having a first side and a second side. The conductor is supported between first and second ground planes and includes a first part supported on the first side of the support layer and a second part supported on the second side of the support layer. A third part of the conductor connects the first and second parts at spaced intervals along the conductor. A propagation structure is disposed between the ground planes and operable to substantially contain an electric field generated by a signal transmitted on the conductor.

Abstract: A coplanar coupler for use with microstrip input and output ports includes a printed circuit substrate in which first and second metal input ports are formed on a top surface and cooperate with a metal layer on the bottom surface as microstrip lines, and first and second metal output ports formed on the top surface which cooperate with the metal layer on the bottom surface as microstrip lines. The metal layer on the bottom surface functions as a ground plane for the input ports and the output ports, the metal layer being removed in a coupler region underlying at least portions of the metal input and output ports and extending therebetween. First and second metal lines are formed on the bottom surface in the coupler region and function as a coplanar coupler for the input and output ports. Electrical vias in the substrate interconnect the ports and the coplanar coupler.

Abstract: This triplate line interfacial connector electrically connects a first triplate line comprised of a first grounding conductor, first dielectric, first power feeding substrate, second dielectric and second grounding conductor, and a second triplate line comprised of a second grounding conductor, third dielectric, second power feeding substrate, fourth dielectric, and third grounding conductor. A patch pattern is formed at a connecting terminal portion of each power feeding line. Two shield spacers each having a through portion around the patch pattern are provided. A first slot is formed at a connecting position between the two triplate lines in the second grounding conductor.

Abstract: A suspended transmission line with an embedded signal channeling device includes a support layer and a conductor supported by the support layer between first and second plates each having a ground plane. The conductor includes a combined signal line and a plurality of discrete signal lines extending from the combined signal line. The discrete signal lines each transmit a portion of a signal transmitted on the combined signal line. A propagation structure is disposed between the first and second plates to substantially contain an electromagnetic field generated by the propagating signal.

Abstract: A printed circuit board (PCB) via, providing a conductor extending vertically between microstrip or stripline conductors formed on separate layers of a PCB, includes a conductive pad surrounding the conductor and embedded within the PCB between those PCB layers. The pad's shunt capacitance and the magnitudes of capacitances of other portions of the via are sized relative to the conductor's inherent inductance to optimize frequency response characteristics of the via.