Abstract: There is provided a multilayer ceramic capacitor including: a ceramic body; first and second internal electrodes provided within the ceramic body and including respective lead-out portions exposed to a first surface of the ceramic body and a third or fourth surface thereof connected to the first surface and having an overlapping area, the overlapping area being exposed to the first surface of the ceramic body; first and second external electrodes extended from the first surface of the ceramic body to the third or fourth surface thereof connected to the first surface and connected to the respective lead-out portions; and an insulation layer formed on the first surface of the ceramic body and the third and fourth surfaces thereof connected to the first surface.

Abstract: There is provided a multilayer ceramic capacitor including: a ceramic body including dielectric layers and internal electrodes stacked between the dielectric layers; and a pair of external electrodes each fixed to first and second surfaces of the ceramic body, facing each other, and connected to the internal electrodes, wherein the ceramic body has a third surface facing a printed circuit board and each of the pair of external electrodes includes mounting parts extended onto the third surface and having a preset length by which they are mounted on the printed circuit board and wherein connection parts between the pair of external electrodes and the mounting parts have a convexly curved shape having a size equal to or smaller than a preset corner radius.

Abstract: Provided is a ceramic chip assembly configured to economically and reliably insulate an exposed portion of a metal lead wire from an environmental change. The ceramic chip assembly includes a ceramic base having electrical characteristics, a pair of external electrodes that are disposed on a pair of surfaces of the ceramic base, respectively, the surfaces of the ceramic base being opposed to each other, a pair of metal lead wires as single cores having first ends that are electrically and mechanically connected to the external electrodes, respectively, by an electrical conductive adhesive member, an insulation sealant sealing the ceramic base, the external electrodes, and the first ends of the metal lead wires to expose second ends of the metal lead wires, and an insulation polymer coating layer continuously formed on both the insulation sealant and portions of the metal lead wires exposed out of the insulation sealant.

Abstract: In a monolithic ceramic electronic component, where a distance in the height direction between one of outer-layer dummy conductors in an outer layer portion, which is arranged closest to an inner layer portion, and one of inner electrodes in the inner layer portion, which is arranged closest to the outer layer portion, is b, and an opposing distance between an adjacent pair of first inner electrodes and second inner electrodes in the height direction is t, 2t?b is satisfied, such that the outer-layer dummy conductors can be spaced a sufficient distance away from the inner electrodes, and such that the distance between the inner electrodes can be prevented from being reduced when the inner electrodes arranged in overlapping relation to the outer-layer dummy conductors are pressed in a pressing step before firing, and a reduction of BDV can be prevented.

Abstract: A clad capacitor and method of manufacture includes assembling a preform comprising a ductile, electrically conductive fiber; a ductile, electrically insulating cladding positioned on the fiber; and a ductile, electrically conductive sleeve positioned over the cladding. One or more preforms are then bundled, heated and drawn along a longitudinal axis to decrease the diameter of the ductile components of the preform and fuse the preform into a unitized strand.

Abstract: A laminate includes insulating layers laminated to each other. Capacitor conductors are embedded in the laminate and have exposed portions exposed between the insulating layers at respective surfaces of the laminate. The capacitor conductors define a capacitor. External electrodes are provided by plating on the respective surfaces of the laminate so as to directly cover the respective exposed portions. When the laminate is viewed in plan in a y axis direction, the length of each of the exposed portions is approximately 35% to approximately 45% of the length of an outer periphery of the insulating layer.

Abstract: An electrical multilayer component has a monolithic main body that includes a number of alternating ceramic layers disposed one above the other and at least one electrode layer. The main body has two end faces opposite each other and two lateral faces opposite each other. The component also includes a number of outer electrodes and at least three inner electrodes. Each of the inner electrodes is associated with one outer electrode. A first inner electrode protruding from an end face and a second inner electrode protruding from an opposite end face have a first distance to each other. A third inner electrode protrudes from a side face.

Abstract: A method of making an electronic ceramic component. The method includes steps of terminating a ceramic body with a metalized terminal and encompassing a portion of the ceramic body by an insulating resin. The step of encompassing further comprises steps of preparing a liquid resin precursor, applying the liquid resin precursor to a surface of the ceramic body, thereby wetting the surface of the ceramic body while not wetting the metalized terminal, and curing the liquid resin precursor applied to the wetted surface of the ceramic body to form a resin coating covering the surface of the ceramic body after removing extra quantity of the liquid resin precursor from the not wetted metalized terminal. The liquid resin precursor comprises an element selected from a group consisting of resin solution or resin emulsion that has a surface tension adjusted by changing a resin precursor concentration.

Abstract: Provided is a multilayer capacitor that can be manufactured with high yields and whose warpage is suppressed. The multilayer capacitor includes two or more laminated bodies which are bonded together, the two or more laminated bodies each including resin layers and metal layers which are alternately laminated a plurality of times in a thickness direction and each being warped and having front and rear surfaces covered with surface layers containing a resin material, one of the front and rear surfaces being formed of a first surface as a smooth surface having no recess portion, another of the front and rear surfaces being formed of a second surface having a recess portion, in which at least two adjacent laminated bodies are bonded together at the first surfaces or the second surfaces. Also provided are a manufacturing method for the multilayer capacitor, and a circuit board and an electronic device which use the multilayer capacitor.

Abstract: In a laminate type ceramic electronic component, when an external electrode for a laminated ceramic capacitor is formed directly by plating onto a surface of a component main body, the film that is directly plated may have a low fixing strength with respect to the component main body. As the external electrode, a first plating layer composed of a Ni—P plating film with a P content rate of about 9 weight % or more is first formed such that a plating deposition deposited with the exposed ends of respective internal electrodes as starting points is grown on at least an end surface of a component main body. Then, a second plating layer composed of a Ni plating film containing substantially no P is formed on the first plating layer. Preferably, the first plating layer is formed by electroless plating, whereas the second plating layer is formed by electrolytic plating.

Abstract: A ceramic electronic component includes two electronic-component main bodies and two metal terminals. Each of the metal terminals includes a base, ribs on left and right sides of the base, and a mounting portion below the base. The base includes two bonding portions to be bonded to respective external electrodes of the two electronic-component main bodies and cut-out portions each having a closed shape and being disposed below the respective bonding portions. The ribs are bent from the left and right sides of the base in the width direction toward the electronic-component main body. The ribs extend from the top of the base in the height direction to the vicinity of the mounting-side major surface of the mounting-side electronic-component main body and do not reach the mounting portion. The mounting portion is bent from the bottom of the base toward the electronic-component main body.

Abstract: There is provided a multilayered ceramic electronic component including: a ceramic main body having a dielectric layer, the ceramic main body having a length of 1.79 mm or less and a width of 1.09 mm or less; first and second internal electrodes disposed to face each other with the dielectric layer interposed therebetween within the ceramic main body; and a first external electrode electrically connected to the first internal electrode and a second external electrode electrically connected to the second internal electrode, wherein, when it is defined that the shortest length of at least one of the first and second external electrodes, formed in the lengthwise direction from both end portions of the ceramic main body is A, and the longest length thereof is BW, a relational expression of 0.5?A/BW<1.0 may be satisfied.

Abstract: A collective component has a first region that intersects with a conductive film for external terminal electrodes in a break line in which break leading holes are arranged and a second region that does not intersect with the conductive film for external terminal electrodes in the break line. The plurality of break leading holes includes at least one extending break leading hole located so as to extend over the first region and the second region.

Abstract: There is provided multilayered ceramic electronic component having a 0603 size or less, the multilayered ceramic electronic component including: a ceramic body including a plurality of internal electrodes and dielectric layers disposed between the internal electrodes; and external electrodes disposed on outer surfaces of the ceramic body and electrically connected to the internal electrodes, wherein when a region in which the internal electrodes are overlapped is defined as an active region in a cross section of a central portion in a length direction of the ceramic body, taken in width and thickness directions thereof, the entire area of the cross section taken in the width and thickness directions is defined as At, and an area of the active region is defined as Aa, the following equation is satisfied: 65%?Aa/At?90%.

Abstract: A metallized film capacitor includes a dielectric film and two metal vapor-deposition electrodes facing each other across the dielectric film. At least one of the metal vapor-deposition electrodes is made of substantially only aluminum and magnesium. This metallized film capacitor has superior leak current characteristics and moisture resistant performances, and can be used for forming a case mold type capacitor with a small size.

Abstract: A ceramic electronic component 100 includes a ceramic body 1 in which internal electrodes containing a metal component is buried, and a pair of terminal electrodes 3 provided to cover both end surfaces 11 of the ceramic body to which the internal electrodes are exposed. Each of the terminal electrodes 3 has a first electrode layer and a second electrode layer formed by baking a conductive green sheet from a side close to the ceramic body 1. The second electrode layer contains the metal component diffused from the internal electrodes.

Abstract: In an electronic component, a laminate includes a plurality of laminated ceramic layers and a mounting surface defined by outer edges of the plurality of laminated ceramic layers, the outer edges being continuously located adjacent to each other. Capacitor conductors are disposed on the ceramic layers and include exposed portions that are exposed at the mounting surface between the ceramic layers. An electroconductive layer defining an external electrode is arranged to directly cover the exposed portions and is formed by plating so as to be made of plated material. Another electroconductive layer covers the above-mentioned electroconductive layer and partially covers surfaces of the laminate, and it is made of a material including metal and one of glass and resin.

Abstract: To provide a hexagonal type barium titanate powder having a fine and uniform particle size and contributing to a thinner dielectric layer. A hexagonal type barium titanate powder according to the present invention has the following characteristics that a maximum particle diameter is 1.0 ?m or less, a ratio of 90% accumulated particle diameter and 50% accumulated particle diameter is 3.0 or less, and a hexagonal ratio is 50% or more.

Abstract: There is provided a multilayer ceramic electronic part, including: a ceramic body including dielectric layers each having an average thickness of 0.6 ?m or less; and first and second internal electrodes disposed to face each other within the ceramic body with the dielectric layer interposed therebetween, wherein the ceramic body includes a capacitance forming part and non-capacitance forming parts, and when the capacitance forming part is divided into 2n+1 (n is 1 or more) regions in a thickness direction of the ceramic body, the dielectric layers of the capacitance forming part get thinner in directions from a central region toward upper and lower regions, whereby continuity of the internal electrode may be improved and a high-capacity multilayer ceramic electronic part may be realized.

Abstract: The present invention relates to a multilayer ceramic capacitor and a method of manufacturing the same. The multilayer ceramic capacitor includes a ceramic body having a first side and a second side opposed to each other and having a third side and a fourth side connecting the first side to the second side; a plurality of inner electrodes formed within the ceramic body and having respective one ends exposed to the third side and the fourth side; and outer electrodes formed on the third side and the fourth side and electrically connected to the inner electrodes. A shortest distance from distal edges of an outermost inner electrode among the plurality of inner electrodes to the first side or the second side is smaller than a shortest distance from distal edges of a central inner electrode to the first side or the second side.

Abstract: When a voltage two times a rated voltage is applied between a first external electrode and a second external electrode of a ceramic capacitor, the electric field intensity generated at portion connected between a first internal electrode and an end of a portion of a second external electrode at a side of a first side surface by a shortest distance FS is about 0.34 kV/mm or less.

Abstract: An electronic device includes a plurality of internal electrode layers and dielectric layers alternately laminated. The particle size of the first dielectric particles contacting one laminating direction end face of the internal electrode layer is larger than the particle size of second dielectric particles contacting another laminating direction end face of the internal electrode layer. A thickness of a first ceramic layer formed by the first dielectric particles is smaller than a thickness of a second ceramic layer formed by the second dielectric particles.

Abstract: A ceramic electronic component includes a first reinforcement layer. The first reinforcement layer is arranged in a first outer layer portion so as to extend in the length direction and in the width direction. Portions of the first reinforcement layer face a first portion of a first external electrode and a first portion of a second external electrode in the thickness direction. The first reinforcement layer is not exposed at a first end surface or a second end surface of the ceramic electronic component. In a portion of a first main surface of the ceramic electronic component in which the first portion of the first or second external electrode is provided, a portion that does not face the first reinforcement layer is closer to the center in the thickness direction than a portion that faces the first reinforcement layer.

Abstract: A laminated ceramic capacitor which provides favorable properties and characteristics such as dielectric characteristics, insulation properties, temperature characteristics, and high temperature load characteristics and provides favorable thermal shock resistance, even when dielectric ceramic layers are reduced in layer thickness to increase the number of layers has dielectric ceramic layers containing, as their main constituent, a barium titanate based compound represented by the general formula ABO3 and internal electrodes containing Ni as their main constituent, which are stacked alternately. A crystalline oxide containing at least Mg and Li is present in at least either one of the internal electrodes and the dielectric ceramic layers. The crystalline oxide is preferably present mostly in contact with Ni in the internal electrodes.

Abstract: A multilayered ceramic electronic component includes: a ceramic element having a plurality of dielectric layers laminated therein; first inner electrodes formed on the dielectric layers disposed in upper and lower portions in the ceramic element, the width of a portion of each of the first inner electrodes exposed from one end face of the ceramic element being less than that of a portion thereof disposed within the ceramic element; and second inner electrodes formed on the dielectric layers disposed in the middle portion in the ceramic element, the width of a portion of each of the second inner electrodes exposed from one end face of the ceramic element being equal to that of a portion thereof disposed within the ceramic element.

Abstract: An object of the present invention is to provide a multi-layer ceramic capacitor that includes a laminated block 4 formed by laminating ceramic dielectric layers 2 and internal electrodes 3 alternately, a pair of cover layers 5 laminated on top and bottom of the laminated block, a ceramic body 6 formed on both side surfaces of the laminated block 4, and a pair of external electrodes 7 electrically connected to the internal electrodes 3 and that can effectively prevent an occurrence of a crack. In the multi-layer ceramic capacitor 1, a silicate crystal made of an oxide including Ba and Si or a silicate crystal made of an oxide including Ti and Si is formed in boundary portions between the laminated block 4 and the ceramic bodies 6.

Abstract: Disclosed are a multilayer ceramic condenser and a method of manufacturing a multilayer ceramic condenser. There is provided a method of manufacturing a multilayer ceramic condenser, including: printing a plurality of stripe-type inner electrode patterns on a ceramic green sheet in parallel; forming a laminate by stacking ceramic green sheets on which a plurality of stripe-type inner electrode patterns are formed; cutting the laminate so that a first inner electrode pattern and a second inner electrode pattern are alternately stacked; and forming a first side part and a second side part by applying ceramic slurry in order to cover the side of the laminate to which both the first inner electrode pattern and the second inner electrode pattern are exposed.

Abstract: A multilayer body includes first and second capacitance conductors and an internal conductor, which define a capacitor, provided therein. First and second external electrodes are respectively connected to the first and second capacitance conductors via first and second led out conductors. The internal conductor faces the first and second capacitance conductors. Third and fourth external electrodes are connected to the first capacitance conductor via third and fourth led out conductors. Fifth and sixth external electrodes are connected to the second capacitance conductor via fifth and sixth led out conductors.

Abstract: A ceramic electronic component includes a first dielectric layer, a second dielectric layer, and an intermediate layer. The first dielectric layer is a layer containing BaO, Nd2O3, and TiO2, the second dielectric layer is a layer containing a different material from the material of the first dielectric layer, and the intermediate layer is a layer formed between the first dielectric layer and the second dielectric layer and containing main components that are not contained in the first dielectric layer and the second dielectric layer in common as the main components.

Abstract: In a method of manufacturing a laminate type electronic component, when a heat treatment is carried out after plating films, which at least partially define external electrodes, are formed by growing plated depositions deposited on exposed ends of a plurality of internal electrodes in a component main body, the presence of the plating films may not only interfere with moisture release, but may also cause blisters or bulge defects in the plating films, while moisture such as a plating solution in the component main body is removed by evaporation. To avoid such problems, cuts to divide exposed ends into multiple sections are formed in extending sections of internal electrodes. Thus, plating films include slits extending in the stacking direction at locations corresponding to positions of the cuts.

Abstract: In an electronic component, a first capacitor conductor includes a first exposed portion exposed between insulating layers at a surface of a laminate including a first shorter side and two longer sides. A second capacitor conductor includes a second exposed portion exposed between the insulating layers at a surface of the laminate including a second shorter side and the two longer sides. First and second external electrodes are arranged on the laminate so as to cover the first and the second exposed portions, respectively. A first width of the first capacitor conductor in a region located between the second shorter side and a first straight line obtained by connecting two edges of the second external electrode is greater than a width of the first capacitor conductor in a region located between the first straight line and a straight line obtained by connecting two edges of the first external electrode.

Abstract: A multilayer capacitor which can control ESR in a wide frequency band is provided. In a multilayer capacitor 1, inner electrodes 8a, 8b oppose each other as different polarities through a dielectric layer 7 in a capacitance unit 10, inner electrodes 8c to 8f oppose each other as different polarities through dielectric layers 7 in ESR control units 11A, 11B, and the inner electrodes 8a, 8b of the capacitance unit 10 connected to the outer electrodes 3, 4 and the inner electrodes 8c, 8f of the ESR control units 11A, 11B connected to the outer electrodes 3, 4 are kept from opposing each other as different polarities through the dielectric layer 7 at boundaries between the capacitance unit 10 and the ESR control units 11A, 11B.

Abstract: A dielectric ceramic capacitor that has excellent reliability and particularly excellent life characteristics in a load test even when the thickness of a dielectric ceramic layer is reduced uses a dielectric ceramic as a dielectric ceramic layer in a laminated ceramic capacitor which is a substance containing, as the main component, (Ba, R)(Ti, V)O3 or (Ba, Ca, R)(Ti, V)O3 in which R is at least one selected from La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, and Y, and in which both V and R are present uniformly in the main component particles.

Abstract: A dielectric ceramic composition enabling one to obtain a laminated capacitor which hardly causes degradation of insulation resistance with time under high-humidity even in using a base metal such as Ni as an internal electrode, contains as a main constituent, a constituent represented by (CaxSr1-x)(TiyZr1-y)O3 in which x and y are 0?x?1 and 0?y?0.50, and, as accessory constituents, at least 0.5 parts by mol and at most 15 parts by mol of SiO2, at least 0.1 parts by mol and at most 10 parts by mol of MnO, and at least 0.01 parts by mol and at most 0.079 parts by mol of Al2O3, with respect to 100 parts by mol of the main constituent.

Abstract: According to the present invention, provided is a polyvinyl acetal resin capable of obtaining a ceramic green sheet that has sufficient mechanical strength, in which the dimensional change in the storage of ceramic green sheet is small, and the delamination hardly occurs in the delipidation. The present invention relates to a polyvinyl acetal resin that has a degree of polymerization of 200 or more to 6000 or less, a content percentage of vinylester unit of 0.01 to 30 mol %, a degree of acetalization of 55 to 83 mol %, and a structural unit represented by Chemical formula (1): in a molecule.

Abstract: Disclosed are a multilayer ceramic capacitor and a method of manufacturing the same. The multilayer ceramic capacitor includes a ceramic body having a plurality of dielectric layers stacked on top of each other, at least one internal electrode formed on a corresponding one of the plurality of dielectric layers and having uneven portions formed at an edge thereof, the internal electrode having a connectivity of between 0.7 and 0.9, which is defined by an equation below, and an external electrode formed on an outer surface of the ceramic body and connected with the internal electrode, Z=X?Y/X ??(Equation) where X denotes a length of a cross-section of the internal electrode in one direction, Y denotes a total length of gaps formed by holes in the cross-section, and Z denotes the connectivity of the internal electrode. The multilayer ceramic capacitor achieves a low crack generation rate and a high level of reliability.

Abstract: Dielectric ceramic composition includes a hexagonal type barium titanate as a main component shown by a generic formula of (Ba1-?M?)A(Ti1-?Mn?)BO3 and having hexagonal structure wherein an effective ionic radius of 12-coordinated “M” is ?20% or more to +20% or less with respect to an effective ionic radius of 12-coordinated Ba2+ and the A, B, ? and ? satisfy relations of 1.000<(A/B)?1.040, 0??<0.003, 0.03???0.2, and as subcomponents, with respect to the main component, certain contents of alkaline earth oxide such as MgO and the like, Mn3O4 and/or Cr2O3, and CuO and Al2O3 and rare earth element oxide and glass component including SiO2. According to the present invention, it can be provided the hexagonal type barium titanate powder and the dielectric ceramic composition which are preferable for producing electronic components such as a capacitor and the like showing comparatively high specific permittivity, having advantageous insulation property and having sufficient reliability.

Abstract: Disclosed are apparatus and methodology for inexpensive realization of one or more secondary capacitors within a monolithic body that already includes a first, larger capacitor to provide ultra wideband structures. Alternating layers of electrodes are provided with arm portions that embrace portions of adjacent electrode layers so as to create additional coupling effects within the capacitor structure thereby producing multiple additional equivalent capacitor structures within the device.

Abstract: A low loss capacitance and low loss insulating dielectric material consisting of a thermosetting resin, thermoplastic resin, a cross-linker, and containing a quantity of ferroelectric ceramic nano-particles of barium titanate within. The combined low loss insulating dielectric layer and a low loss capacitive layer resulting from the material allows one continuous layer that can form internal capacitors and permit the modifying the dielectric thickness between signal layers for impedance matching within a layer of substrate. More significantly, the applied layer of low loss capacitive materials can simultaneously act as a capacitor as well as a dielectric for separation of signal layers.

Abstract: A ceramic electronic component includes a ceramic body, an inner electrode, an outer electrode, and a connecting portion. The inner electrode is disposed inside the ceramic body. The end portion of the inner electrode extends to a surface of the ceramic body. The outer electrode is disposed on the surface of the ceramic body so as to cover the end portion of the inner electrode. The outer electrode includes a resin and a metal. The connecting portion is disposed so as to extend from an inside of the outer electrode to an inside of the ceramic body. In a portion of the surface of the ceramic body on which the outer electrode is disposed, the length of the connecting portion that extends in a direction in which the inner electrode is extends about 2.4 ?m or more.

Abstract: A ceramic electronic component includes a ceramic body and an outer electrode. The outer electrode is disposed on the ceramic body. The outer electrode includes a first conductive layer and a second conductive layer. The first conductive layer includes a resin, a first metal component, and a second metal component having a higher melting point than the first metal component. The second conductive layer is disposed on the first conductive layer. The second conductive layer is includes a plating film. An alloy particle containing the first metal component and the second metal component protrudes to the second conductive layer side from a surface of the first conductive layer.

Abstract: A ceramic body includes an inner electrode disposed inside the ceramic body and in which an end portion of the inner electrode extends to a surface of the ceramic body. An electrode layer is formed on the surface of the ceramic body so as to cover the end portion of the inner electrode, the electrode layer including a resin, a first metal filler that contains a first metal component, and a second metal filler that contains a second metal component having a higher melting point than the first metal component. A step of heating the electrode layer is performed to form an electrode including a metal layer that is located on the surface of the ceramic body and that includes the first and second metal components and a metal contained in the inner electrode.

Abstract: There is provided a chip type laminated capacitor including: a ceramic body formed by laminating a dielectric layer having a thickness equal to 10 or more times an average particle diameter of a grain included therein and being 3 ?m or less; first and second outer electrodes; a first inner electrode having one end forming a first margin together with one end surface of the ceramic body at which the second outer electrode is formed and the other end leading to the first outer electrode; and a second inner electrode having one end forming a second margin together with the other end surface of the ceramic body at which the first outer electrode is formed and the other end leading to the second outer electrode, wherein the first and second margins have different widths under a condition that they are 200 ?m or less.

Abstract: According to one embodiment of a capacitor module, the capacitor module includes a substrate having a metallization on a first side of the substrate, a plurality of connectors electrically coupled to the metallization and a plurality of capacitors disposed on the metallization. The plurality of capacitors includes a first set of capacitors electrically connected in parallel between a first set of the connectors and a second set of the connectors. The capacitor module further includes a housing enclosing the plurality of capacitors within the capacitor module.

Abstract: When an external terminal electrode of a ceramic electronic component such as a laminated ceramic capacitor is formed by plating, plating growth may be also caused even in an undesired location. The ceramic surface provided by a component main body is configured to include a high plating growth region of, for example, a barium titanate based ceramic, which exhibits relatively high plating growth, and a low plating growth region of, for example, a calcium zirconate based ceramic, which exhibits relatively low plating growth. The plating film constituting a first layer to define a base for an external terminal electrode is formed in such a way that the growth of a plated deposit deposited with conductive surfaces provided by exposed ends of internal electrodes as starting points is limited so as not to cross over a boundary between the high plating growth region and the low plating growth region toward the low plating growth region.

Abstract: A method for producing a laminated ceramic capacitor allows a surface of at least a portion of a ceramic element body chip to be brought into contact with a plated layer formed in advance in a mold member, and performs heat processing on the ceramic element body chip in that contact state, thereby to form an external conductor layer made of the plated layer on the surface of at least the portion of the ceramic element body chip. Thus, a method and an apparatus for producing a ceramic electronic component accurately and precisely controls the thickness of the external conductor layer to be small, and easily controls the length of the external conductor layer.

Abstract: The present invention is a method for producing a capacitor. The method includes applying a dielectric substance (ex.—silicon nitride) to a first gold seed layer, the first gold seed layer being formed on a wafer. A second gold seed layer is formed upon the dielectric substance and first gold seed layer. Gold is electroplated into a photoresist to form a first set of 3-D capacitor elements on the second gold seed layer. A first copper layer is electroplated onto the second gold seed layer. Gold is electroplated into a photoresist to form a second set of 3-D capacitor elements, the second set of 3-D elements being formed at least partially within the first copper layer and being connected to the first set of 3-D elements. A second copper layer is electroplated onto the first copper layer. Then, both copper layers are removed to provide (ex.—form) the capacitor.

Abstract: The disclosed is a capacitor substrate structure to reduce the high leakage current and low insulation resistance issue of organic/inorganic hybrid materials with ultra-high dielectric constant. The insulation layer, disposed between two conductive layers, includes multi-layered dielectric layers. At least one of the dielectric layers has high dielectric constant, including high dielectric constant ceramic powder and conductive powder evenly dispersed in organic resin. The other dielectric layers can be organic resin, or further include high dielectric constant ceramic powder dispersed in the organic resin. The substrate has an insulation resistance of about 50K? and leakage current of below 100 ?Amp under operational voltage.

Abstract: There are provided a ceramic electronic component and a method of manufacturing the same. The ceramic electronic component includes: a ceramic element; and an internal electrode layer formed within the ceramic element, having a thickness of 0.5 ?m or less, and including anon-electrode region formed therein, wherein an area ratio of the non-electrode region to an electrode region of the internal electrode layer, in a cross section of the internal electrode layer is between 0.1% and 10%, and the non-electrode region includes a ceramic component.

Abstract: There are provided a multilayer ceramic electronic component, and a method of fabricating the same. The multilayer ceramic electronic component includes: a ceramic main body including a dielectric layer; first and second internal electrodes disposed to face each other within the ceramic main body; and a first external electrode and a second external electrode, wherein the first and second external electrodes include a conductive metal and glass, and when at least one of the first and second external electrodes is divided into three equal parts in a thickness direction, an area of the glass in a central part thereof is 35% to 80% of the total area of the central part. A multilayer ceramic electronic component having improved reliability may be implemented by enhancing chip air-tightness.