With Multilayer Ceramic Capacitor Patents (Class 361/321.2)
  • Patent number: 11437193
    Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer, and first and second internal electrodes disposed to oppose each other with the dielectric layer therebetween; first and second external electrodes having first electrode layers connected to the first and second internal electrodes, respectively, and second electrode layers disposed on the first electrode layers, respectively; and an auxiliary electrode disposed between an end portion of each of the second electrode layers and an inflection point of the ceramic body, wherein a width of the auxiliary electrode is in a range of 20 to 70% of a width of a margin portion of the first or second internal electrode.
    Type: Grant
    Filed: February 5, 2020
    Date of Patent: September 6, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Je Jung Kim, Do Yeon Kim, Min Hyang Kim
  • Patent number: 11430940
    Abstract: A multilayer piezoelectric element includes a ceramic base body, a pair of external electrodes, multiple internal electrodes, and surface electrodes. The pair of external electrodes cover a pair of end faces and extend from the pair of end faces along a pair of principal faces and a pair of side faces. The multiple internal electrodes are stacked inside the ceramic base body along the thickness direction, and are connected alternately to one or the other of the pair of external electrodes along the thickness direction. The surface electrodes extend from the pair of external electrodes along the pair of principal faces, and are each divided in the longitudinal direction at a position near, of the pair of external electrodes, the external electrode to which the internal electrode adjacent to the principal face is connected.
    Type: Grant
    Filed: July 12, 2018
    Date of Patent: August 30, 2022
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Sumiaki Kishimoto, Hiroshi Hamada, Hiroyuki Shimizu, Yukihiro Matsui, Tomohiro Harada, Yukihiro Konishi
  • Patent number: 11430608
    Abstract: A dielectric material which satisfies X9M characteristics and ensures operations over an extended period of time at 200° C. is provided.
    Type: Grant
    Filed: July 24, 2020
    Date of Patent: August 30, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Toshihiro Doi, Ken Yamaguchi, Kotaro Hata
  • Patent number: 11424074
    Abstract: A multilayer ceramic capacitor that includes a ceramic body including a stack of a plurality of dielectric layers and a plurality of internal electrodes; a first external electrode on a first end surface of the ceramic body and electrically connected to a first set of the plurality of internal electrodes; and a second external electrode on a second end surface of the ceramic body and electrically connected to a second set of the plurality of internal electrodes. The dielectric layer includes a plurality of dielectric grains including Ca, Zr, Ti and a rare earth element, P is present between the plurality of dielectric grains, and where at least a portion of the rare earth element is in a solid solution in the dielectric grains.
    Type: Grant
    Filed: October 23, 2020
    Date of Patent: August 23, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yuya Ogawa, Shinya Isota, Shoichiro Suzuki
  • Patent number: 11398353
    Abstract: In a multilayer ceramic capacitor, when a cross-section obtained by cutting a multilayer body at a position at a central portion in a length direction and defined in a width direction and a layering direction is viewed, a variation in distance in the width direction from a straight line that connects ends of two internal electrodes located outermost in the layering direction to each other to respective ends of internal electrodes is not larger than about 0.2, a first ridgeline portion connecting the straight line that connects the ends of the two internal electrodes to each other to one main surface of the multilayer body has a first curve, a second ridgeline portion that connects one main surface to one side surface of the multilayer body has a second curve, and the first curve is larger in radius of curvature than the second curve.
    Type: Grant
    Filed: January 8, 2021
    Date of Patent: July 26, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Akira Hashimoto
  • Patent number: 11361905
    Abstract: A multilayer ceramic electronic component includes a ceramic body includes: a ceramic body including a capacitance formation portion including a dielectric layer and first and second internal electrodes disposed to be stacked in a third direction with the dielectric layer interposed therebetween, a margin portion disposed on both surfaces of the capacitance formation portion in a second direction, and a cover portion disposed on both surfaces of the capacitance formation portion in the third direction, and; and an auxiliary electrode spaced apart from the capacitance formation portion, and disposed to be in contact with one of the first and second external electrodes. The auxiliary electrode is spaced apart from first surface and the second surface of the ceramic body in a first direction.
    Type: Grant
    Filed: July 17, 2020
    Date of Patent: June 14, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Do Young Jeong, Je Jung Kim
  • Patent number: 11361903
    Abstract: A multi-layer ceramic electronic component, including: a capacitance forming unit that includes internal electrodes and ceramic layers, the internal electrodes being laminated in a first direction via the ceramic layers; and a circumferential unit that is provided on a circumference of the capacitance forming unit and formed of insulating ceramics. The circumferential unit includes a cover that is provided to the capacitance forming unit outward in the first direction, a side margin that is provided to the capacitance forming unit outward in a second direction orthogonal to the first direction, and a grain growth region that is formed at a boundary between the cover and the side margin and includes crystal grains of the insulating ceramics, the crystal grains having a mean grain size larger than a mean grain size of the crystal grains at a center portion of the cover.
    Type: Grant
    Filed: May 24, 2019
    Date of Patent: June 14, 2022
    Assignee: Taiyo Yuden Co., Ltd.
    Inventor: Yoichi Kato
  • Patent number: 11348732
    Abstract: A capacitor component includes a body including a dielectric layer, a first electrode and a second internal electrode, laminated in a first direction, opposing each other, and a first cover portion and a second cover portion, disposed on outermost surfaces of the first and second internal electrodes, each having a thickness of 25 ?m or less, a first electrode layer and a second electrode layer, respectively disposed on both external surfaces of the body in a second direction perpendicular to the first direction and respectively, and plating layers, respectively disposed on the first and second electrode layers. A metal oxide is disposed on a boundary between the first electrode layer and the plating layer and a boundary between the second electrode layer and the plating layer.
    Type: Grant
    Filed: May 21, 2020
    Date of Patent: May 31, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jang Yeol Lee, Ji Hong Jo, Yoo Jeong Lee, Myung Jun Park, Jong Ho Lee, Hye Young Choi, Jae Hyun Lee, Hyun Hee Gu
  • Patent number: 11335503
    Abstract: A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and having first and second surfaces opposing each other, third and fourth surfaces connecting the first and second surfaces to each other, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other; a plurality of internal electrodes disposed in the ceramic body, each exposed to the first and second surfaces and having one ends exposed to the third or fourth surface; and a first side margin portion and a second side margin portion disposed, respectively, on the first and second surfaces of the ceramic body, wherein a metal or a metal oxide is disposed in each of the first and second side margin portions, and a ratio of a diameter of the metal or the metal oxide to a thickness of the dielectric layer is 0.8 or less.
    Type: Grant
    Filed: December 17, 2020
    Date of Patent: May 17, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yong Park, Ji Hong Jo, Ki Pyo Hong
  • Patent number: 11335509
    Abstract: A multilayer ceramic capacitor includes a ceramic body including a stack of dielectric layers and internal electrodes, and an external electrode electrically connected to each of the internal electrodes and provided at each of both end surfaces of the ceramic body. The external electrode includes a metal layer and a plating layer on the metal layer. In a cross section of the metal layer that is obtained by cutting the external electrode along a plane parallel to a side surface at a central position in a width direction, the metal layer includes a dielectric material at an area ratio of about 20% or more, and includes cavities at an area ratio of about 5% or more and about 20% or less, the cavities having an average diameter of about 0.5 ?m or more and about 1.5 ?m or less, and having a maximum diameter of about 5.0 ?m or less.
    Type: Grant
    Filed: February 12, 2020
    Date of Patent: May 17, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Takehisa Sasabayashi, Akitaka Doi, Kotaro Shimizu, Yoko Okabe
  • Patent number: 11302619
    Abstract: A device structure includes a stacked structure, a dielectric material, and an electrode via. The stacked structure includes a first metal oxide layer, a second metal oxide layer and a metal layer. The second metal oxide layer is opposite to the first metal oxide layer. The metal layer is interposed between the first metal oxide layer and the second metal oxide layer. The dielectric material extends through the first metal oxide layer. The electrode via extends through the dielectric material and electrically connected to the metal layer.
    Type: Grant
    Filed: October 1, 2019
    Date of Patent: April 12, 2022
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventor: Wen Hung Huang
  • Patent number: 11295893
    Abstract: A self-aligning capacitor electrode assembly having an improved breakdown voltage is disclosed. The electrode assembly comprises a first electrode having a generally planar shape and a length in a first direction. The electrode assembly also comprises a second electrode having a generally planar shape and a length in a second direction. The second electrode overlaps the first electrode such that an overlapping region is formed. The overlapping region has an area that is insensitive to a relative misalignment in the first direction between the first electrode and the second electrode that is less than a first offset distance. A ratio of the length of the first electrode to the first offset distance is less than about 45.
    Type: Grant
    Filed: February 15, 2019
    Date of Patent: April 5, 2022
    Assignee: KYOCERA AVX Components Corporation
    Inventor: David M. Smith
  • Patent number: 11257627
    Abstract: A multilayer ceramic capacitor includes a laminate including a dielectric ceramic layer and first and second internal electrode layers laminated in a lamination direction, and first and second external electrode connected to the internal electrode layers. The laminate includes a central layer portion, a peripheral layer portion sandwiching the central layer portion, and a side margin sandwiching the central layer portion and the peripheral layer portion. The side margin includes an inner layer and an outer layer. In a cross section including a lamination direction and a width direction obtained by cutting the laminate at the center in a longitudinal direction of the laminate, the ceramic grains in the dielectric ceramic layer between ends of the internal electrode layers in the width direction have a smaller diameter than the ceramic grains in the dielectric ceramic layer at the center of the central layer portion in the width direction.
    Type: Grant
    Filed: March 18, 2020
    Date of Patent: February 22, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Kazuhisa Uchida
  • Patent number: 11239031
    Abstract: A multilayer ceramic capacitor includes: a multilayer structure in which each of dielectric layers and each of internal electrode layers are alternately stacked, a main component of the dielectric layers being ceramic, wherein: the multilayer structure comprises surface portions and a center portion in a stacking direction of the dielectric layers and the internal electrode layers, the surface portions having a first thickness from a surface of the multilayer structure, the center portion being next to the surface portion in the stacking direction and having a second thickness; and an average length of crystal grains of a main component metal of the internal electrode layers of the surface portions is 0.8 times or less than an average length of crystal grains of a main component metal of the internal electrode layers of the center portion.
    Type: Grant
    Filed: August 6, 2018
    Date of Patent: February 1, 2022
    Assignee: TAIYO YUDEN CO., LTD.
    Inventor: Kotaro Mizuno
  • Patent number: 11201014
    Abstract: A multi-layer ceramic electronic component that satisfies the following: 30 ?m?Ts?100 ?m, 6 ?m?T?18 ?m, and 0.19?(2T+t)/Ts?1.55, where Ts represents a dimension of a ceramic body measured along a first axis, T represents a mean value of thickness dimensions of upper and lower portions of an external electrode measured along the first axis that cover edges of top and bottom surfaces of the ceramic body, and t represents a sum of thickness dimensions of internal electrodes drawn to and in contact with the external electrode.
    Type: Grant
    Filed: December 6, 2019
    Date of Patent: December 14, 2021
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Jun Nishikawa, Yasutomo Suga
  • Patent number: 11161125
    Abstract: A fluid jet dispenser using at least two multilayer piezoelectric actuators is provided. The fluid jet dispenser includes a dispensing head and an electrical driver. The dispensing head includes at least two d31-mode multilayer piezoelectric actuators, a displacement magnifying element mechanically coupled to the d31-mode multilayer piezoelectric actuators, a piston, and a nozzle. More preferably, the two d31-mode multilayer piezoelectric actuators operate in an anti-phase condition. The electrical driver is electrically coupled to the d31-mode multilayer piezoelectric actuators for displacing the actuators in directions substantially perpendicular to polarization of piezoelectric layers in the d31-mode multilayer piezoelectric actuators in response to charging and discharging of the actuators by the electrical driver, to generate a fast movement of the piston to jet a pressurized fluid out of the nozzle of the dispensing head.
    Type: Grant
    Filed: June 22, 2016
    Date of Patent: November 2, 2021
    Assignee: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH
    Inventors: Meysam Sharifzadeh Mirshekarloo, Kui Yao, Szu Cheng Lai, Chee Kiang Ivan Tan, Lei Zhang
  • Patent number: 11152153
    Abstract: A method of manufacturing a multilayer ceramic electronic component includes preparing a ceramic green sheet, forming an internal electrode pattern by coating a paste for an internal electrode including nickel (Ni) powder including a coating layer having a surface including copper (Cu) on the ceramic green sheet, forming a ceramic multilayer structure by stacking the ceramic green sheet with the internal electrode pattern formed thereon, and forming a body including a dielectric layer and an internal electrode by sintering the ceramic multilayer structure. The content of Cu is equal to or greater than 0.2 wt %, based on a total weight of the Ni powder.
    Type: Grant
    Filed: October 10, 2018
    Date of Patent: October 19, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kyoung Jin Cha, Jeong Ryeol Kim, Kyung Ryul Lee, Young Joon Oh, Hyo Min Kang, Jun Oh Kim
  • Patent number: 11101074
    Abstract: A ceramic electronic component includes a body including dielectric layers and a plurality of internal electrodes and an external electrode including a connection portion and a band portion. The external electrode includes an electrode layer, a conductive resin layer, a nickel plating layer, and a tin plating layer. When an electrode layer thickness, a conductive resin layer thickness, a nickel plating layer thickness, a tin plating layer thickness of the band portion are defined as t3, t4, and t5, respectively, t5 is greater than or equal to 0.5 micrometer and less than 7 micrometer, and t5/(t3+t4) satisfies 1?t5/(t3+t4)*100<17.5 in the case in which t3+t4 is less than or equal to 100 micrometers and satisfies 0.3?t5/(t3+t4)*100<4.38 in the case in which t3+t4 is more than 100 micrometers.
    Type: Grant
    Filed: November 19, 2018
    Date of Patent: August 24, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dong Hwi Shin, Dong Yeong Kim, Do Yeon Kim, Woo Chul Shin
  • Patent number: 11094462
    Abstract: A multilayer ceramic electronic component includes a laminate, a first external electrode on a first end surface of the laminate, and a second external electrode on a second end surface of the laminate. The laminate includes a central layer portion in which each first internal electrode layer and each second internal electrode layer oppose each other with a dielectric ceramic layer therebetween, peripheral layer portions sandwiching the central layer portion in a lamination direction, and side margins sandwiching the central layer portion and the peripheral layer portions in a width direction. The side margins each include multiple ceramic layers laminated in the width direction, and the ceramic layers include an inner layer disposed closest to the laminate and an outer layer disposed farthest from the laminate.
    Type: Grant
    Filed: October 18, 2019
    Date of Patent: August 17, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Daiki Fukunaga, Hideaki Tanaka
  • Patent number: 11081276
    Abstract: An electronic component includes: a first frame, including a first support portion and a plurality of first extension portions, extended from the first support portion in a first direction; a second frame, including a second support portion disposed to face the first support portion and a plurality of second extension portions, extended from the second support portion in a second direction opposite to the first direction and disposed to alternate with and be spaced apart from the first extension portions in the first direction; and a plurality of capacitors disposed on first and second extension portions adjacent to each other by a predetermined interval so that first and second external electrodes are adhered thereto, respectively.
    Type: Grant
    Filed: August 28, 2018
    Date of Patent: August 3, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Jae Young Na
  • Patent number: 11056280
    Abstract: The object of the present invention is to provide a multilayer ceramic electronic component having improved highly accelerated lifetime and specific permittivity. A multilayer ceramic electronic component comprising a multilayer body in which an internal electrode layer and a dielectric layer are stacked in alternating manner, wherein the dielectric layer comprises a dielectric ceramic composition having a main component expressed by a general formula ABO3 (A is Ba and the like, and B is Ti and the like) and a rare earth component R, a segregation phase including the rare earth component R exists in the dielectric layer, an area ratio of the segregation phases in a cross section along a stacking direction is 104 ppm to 961 ppm, and 96% or more of a total area of the segregation phases contact with the internal electrode layer.
    Type: Grant
    Filed: July 15, 2019
    Date of Patent: July 6, 2021
    Assignee: TDK CORPORATION
    Inventors: Takuma Ariizumi, Toshihiko Kaneko, Nobuto Morigasaki, Yasuhiro Ito
  • Patent number: 11056283
    Abstract: A multilayer ceramic capacitor includes: a ceramic main body having a structure in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked and are alternately exposed to two end faces of the ceramic multilayer structure, a main component of the dielectric layers being ceramic; and a pair of external electrodes that are formed from the two end faces to at least one of side faces of the ceramic main body, wherein a relationship of y?1+1.48x is satisfied when a temperature of the multilayer ceramic capacitor is increased from 190 degrees C. to 260 degrees C., wherein “y” is a total amount of hydrogen gas, water vapor and carbonic acid gas (number of molecules/1015) released from the multilayer ceramic capacitor, wherein a volume of the multilayer ceramic capacitor is “x” (mm3).
    Type: Grant
    Filed: April 9, 2019
    Date of Patent: July 6, 2021
    Assignee: TAIYO YUDEN CO., LTD.
    Inventor: Yuji Matsushita
  • Patent number: 11049659
    Abstract: Provided are a multilayer ceramic electronic component and a method for manufacturing the same, the multilayer ceramic electronic component including a ceramic body including a dielectric layer and an internal electrode, and an external electrode formed on an outer side of the ceramic body and electrically connected to the internal electrode, wherein the internal electrode includes a conductive metal and an additive, and the number of particles of the additive disposed per ?m2 of the internal electrode is in the range of 7 to 21, both inclusive.
    Type: Grant
    Filed: February 21, 2019
    Date of Patent: June 29, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kyoung Jin Cha, Seung Heui Lee, Beom Seock Oh, Kwang Sic Kim, Dong Hoon Kim, Jong Ho Lee, Seon Jae Mun
  • Patent number: 11043456
    Abstract: A semiconductor device includes a substrate, a first electrode including a first hole, a first dielectric layer on an upper surface of the first electrode and on an inner surface of the first hole, a second electrode on the first dielectric layer, a second dielectric layer on the second electrode, a third electrode on the second dielectric layer and including a second hole, and a first contact plug extending through the second electrode and the second dielectric layer and extending through the first hole and the second hole. A sidewall of the first contact plug is isolated from direct contact with the sidewall of the first hole and a sidewall of the second hole, and has a step portion located adjacent to an upper surface of the second electrode.
    Type: Grant
    Filed: October 22, 2019
    Date of Patent: June 22, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jinho Park, Shaofeng Ding, Yongseung Bang, Jeong Hoon Ahn
  • Patent number: 11004609
    Abstract: A multilayer ceramic capacitor includes: a ceramic multilayer structure having a structure in which each of a plurality of ceramic dielectric layers and each of a plurality of internal electrode layers are alternately stacked and are alternately exposed to two edge faces of the ceramic multilayer structure; and a pair of external electrodes that are formed on the two edge faces, wherein when an average value of insulation resistances of each pair of the internal electrode adjacent to each other in a stacking direction is IRave and a minimum value of the insulation resistances is IRmin, (IRave?IRmin)/IRave<0.50 is satisfied.
    Type: Grant
    Filed: January 17, 2019
    Date of Patent: May 11, 2021
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Kunihiko Nagaoka, Noriyuki Chigira, Koichiro Morita
  • Patent number: 11004603
    Abstract: The invention is directed to a multilayer ceramic capacitor comprising a top surface and an opposing bottom surface and four side surfaces that extend between the top and bottom surfaces, a main body formed from a plurality of dielectric layers and a plurality of internal electrode layers alternately arranged, and external terminals electrically connected to the internal electrode layers wherein a first external terminal is disposed along the top surface and a second external terminal is disposed along the bottom surface. The internal electrode layer includes a first electrode electrically connected to the first external terminal and a second counter electrode electrically connected to the second external terminal, wherein the first electrode includes a central portion extending from the first external terminal toward the second external terminal and wherein the central portion extends 40% to less than 100% a distance from the first external terminal to the second external terminal.
    Type: Grant
    Filed: March 19, 2019
    Date of Patent: May 11, 2021
    Assignee: AVX Corporation
    Inventors: Jeffrey A. Horn, Marianne Berolini
  • Patent number: 10950388
    Abstract: A multi-layer ceramic capacitor includes: a ceramic body including first and second end surfaces, first and second side surfaces, first internal electrodes drawn to the first and second end surfaces, second internal electrodes drawn to at least one of the first side surface and the second side surface, and dielectric layers, the first and second internal electrodes being alternately laminated via the dielectric layers; first and second external electrodes that respectively cover the first and second end surfaces, and extend to each of the first and second side surfaces; a third external electrode including a first side-surface region formed on the first side surface and a second side-surface region formed on the second side surface, the first side-surface region and the second side-surface region being formed to be mutually shifted along the first direction and at least partially facing each other in the second direction.
    Type: Grant
    Filed: September 10, 2019
    Date of Patent: March 16, 2021
    Assignee: Taiyo Yuden Co., Ltd.
    Inventor: Takashi Sasaki
  • Patent number: 10930433
    Abstract: A multilayer ceramic electronic component includes a laminated body. External electrodes are provided on both end surfaces of the laminated body. The external electrodes include a base electrode layer, a conductive resin layer disposed on the base electrode layer, and a plating layer disposed on the conductive resin layer. The conductive resin layer includes a first layer located on the base electrode layer, a second layer located on the first layer, and a third layer located on the second layer. A void volume of the first layer and the third layer calculated by a predetermined equation is about 10 vol % or less, and a void volume of the second layer is about 16 vol % or more, and thicknesses of the first layer, the second layer, and the third layer satisfy predetermined conditions.
    Type: Grant
    Filed: November 22, 2019
    Date of Patent: February 23, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Atsushi Nakamoto
  • Patent number: 10867749
    Abstract: A multilayer capacitor includes a capacitor body, a first external electrode, and a second external electrode. The capacitor body includes a plurality of first and second internal electrodes alternately stacked with dielectric layer interposed therebetween. The first and second external electrodes are electrically connected to the first and second internal electrodes, respectively. A first Schottky layer is Schottky-junctioned to an interface between the dielectric layer and the first internal electrode in the capacitor body. A second Schottky layer is Schottky-junctioned to an interface between the dielectric later and the second internal electrode in the capacitor body. The work function values of the first and second Schottky layers is higher than the work function values of the first and second internal electrodes.
    Type: Grant
    Filed: October 26, 2018
    Date of Patent: December 15, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Sung Chun, Hae Suk Chung, Kyeong Jun Kim, Byung Sung Kang
  • Patent number: 10847318
    Abstract: A method of manufacturing a ceramic electronic component includes adding a modifier to a surface of chip containing ceramics and an organic material, applying a conductive paste on the surface of the chip to which the modifier has been added, and firing the chip along with the conductive paste applied on the chip.
    Type: Grant
    Filed: September 1, 2016
    Date of Patent: November 24, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Kotaro Shimizu
  • Patent number: 10840027
    Abstract: A tunable multilayer capacitor is provided. The capacitor comprises a first active electrode in electrical contact with a first active termination and a second active electrode in electrical contact with a second active termination. The capacitor comprises a first DC bias electrode in electrical contact with a first DC bias termination and a second DC bias electrode in electrical contact with a second DC bias termination. A plurality of dielectric layers disposed between the first and second active electrodes and between the first and second bias electrodes. At least a portion of the dielectric layers contain a tunable dielectric material that exhibits a variable dielectric constant upon the application of an applied DC voltage across the first and second DC bias electrodes. A thickness of at least one of the plurality of dielectric layers is greater than about 15 micrometers.
    Type: Grant
    Filed: September 7, 2018
    Date of Patent: November 17, 2020
    Assignee: AVX Corporation
    Inventors: Craig W. Nies, Andrew P. Ritter, Richard C. VanAlstine
  • Patent number: 10818435
    Abstract: A capacitor component includes a body including an active layer and an upper cover and a lower cover disposed on an upper part and a lower part of the active layer, respectively; first internal electrodes and second internal electrodes disposed inside the active layer; a first active via and a second active via extending in a thickness direction of the active layer to be connected to the first and second internal electrodes, respectively; first and second cover vias extending in a thickness direction of the lower cover to be electrically connected to the first and second active vias and disposed at an interval narrower than an interval between the first and second active vias; and first and second lower electrodes disposed in a lower surface of the lower cover to be connected to the first and second cover vias, respectively.
    Type: Grant
    Filed: April 17, 2018
    Date of Patent: October 27, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Taek Jung Lee, Jin Kyung Joo, Seung Woo Song, Hyo Youn Lee, Sung Kwon An
  • Patent number: 10790094
    Abstract: A method of forming a leadless stack comprising multiple components is provided. The method comprises forming an MLCC comprising a first capacitor external termination and a second capacitor external termination and forming an electronic element is formed comprising a first element external termination and a second element external termination. The MLCC and electronic component are are arranged in a stack with a TLPS bond between the first capacitor external termination and the first element external termination.
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: September 29, 2020
    Assignee: KEMET Electronics Corporation
    Inventors: John E. McConnell, Garry L. Renner, John Bultitude, R. Allen Hill, Galen W. Miller
  • Patent number: 10790091
    Abstract: An element body includes first and second end surfaces opposing each other in a first direction, first and second side surfaces opposing each other in a second direction, and first and second principal surfaces opposing each other in a third direction. The length of the element body in the second direction is shorter than that of the element body in the first direction, and the length of the element body in the third direction is shorter than that of the element body in the second direction. A pair of first external electrodes is disposed at both ends of the element body in the first direction. A second external electrode is disposed on the element body and positioned between the pair of first external electrodes. The second external electrode includes a first conductor part disposed on the first side surface. A depression is formed in the first conductor part.
    Type: Grant
    Filed: September 13, 2017
    Date of Patent: September 29, 2020
    Assignee: TDK CORPORATION
    Inventors: Fumiaki Satoh, Takehisa Tamura, Yuma Hattori, Toru Onoue, Daisuke Himeta, Ken Morita, Takuto Okamoto
  • Patent number: 10755860
    Abstract: A multilayer ceramic electronic component includes: a ceramic body having a dielectric layer, and a plurality of first and second internal electrodes facing each other with the dielectric layer interposed therebetween; and first and second external electrodes disposed on an outer surface of the ceramic body, respectively. The ceramic body includes an active portion including a plurality of internal electrodes facing each other with the dielectric layer interposed therebetween to form capacitance, and cover portions formed on upper and lower portions of the active portion. A buffer region is disposed between at least one pair of first and second internal electrodes among the plurality of first and second internal electrodes disposed inside the active portion, and satisfies the relation 0<tb<150 ?m+td, where td is a thickness of the dielectric layer, and tb is a thickness of the buffer region.
    Type: Grant
    Filed: February 13, 2019
    Date of Patent: August 25, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kyeong Jun Kim, Jang Hyun Lee, Hae Suk Chung, Do Lee, Byung Sung Kang, Ho In Jun
  • Patent number: 10748709
    Abstract: A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and first and second internal electrodes disposed to face each other with each of the dielectric layers interposed therebetween; and first and second external electrodes disposed on external surfaces of the ceramic body and electrically connected to the first and second internal electrode, respectively, wherein the dielectric layer includes dielectric grains having a core-shell structure including a core and a shell, and a domain wall is disposed in the shell.
    Type: Grant
    Filed: February 19, 2019
    Date of Patent: August 18, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Kum Jin Park
  • Patent number: 10707021
    Abstract: A multilayer ceramic electronic component includes a body with a plurality of first and second internal electrodes alternately arranged with dielectric layers interposed therebetween. There may be M each of third and fourth external electrodes on opposing sides of the body, where M is greater than or equal to 3 and all external electrodes have different polarities than the adjacent external electrodes. There may be N via electrodes penetrating through the body, where N is greater than or equal to 3 and the via electrodes are connected to either of the first or second internal electrodes. The multilayer ceramic electronic component may achieve low equivalent series inductance (ESL) characteristics and may reduce the mounting area on the circuit board.
    Type: Grant
    Filed: April 19, 2019
    Date of Patent: July 7, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sang Soo Park, Young Ghyu Ahn, Hwi Dae Kim
  • Patent number: 10699847
    Abstract: A multilayer capacitor includes a capacitor body including a first surface and a second surface opposing each other, a third surface and a fourth surface connected to the first surface and the second surface and opposing each other, and a fifth surface and a sixth surface, a first internal electrode of the first internal electrodes being exposed through the third surface and the fourth surface, a second internal electrode of the second internal electrodes being exposed through the fifth surface and the sixth surface, a first external electrode and a second external electrode disposed in the third surface and the fourth surface of the capacitor body, respectively, the first external electrode and the second external electrode connected to an exposed portion of the first internal electrode, a third external electrode and a fourth external electrode disposed in the fifth surface and the sixth surface of the capacitor body, respectively.
    Type: Grant
    Filed: June 13, 2017
    Date of Patent: June 30, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Heung Kil Park, Jong Hwan Park
  • Patent number: 10667400
    Abstract: An electrical component for embedding into a carrier comprises a ceramic main body, an electrically insulating passivation layer which is applied to the main body, and at least one inner electrode. In addition, the electrical component comprises an outer electrode which is connected to the inner electrode, wherein the outer electrode comprises a first electrode layer comprising a metal and a second electrode layer which is arranged on the latter and comprises copper.
    Type: Grant
    Filed: August 31, 2015
    Date of Patent: May 26, 2020
    Assignee: EPCOS AG
    Inventor: Thomas Feichtinger
  • Patent number: 10658111
    Abstract: A capacitor having a conductive porous substrate with at least two electrostatic capacitance forming sections, each of the at least two electrostatic capacitance forming sections including a porous portion of the conductive porous substrate, a dielectric layer on the porous portion, and an upper electrode on the dielectric layer. The at least two electrostatic capacitance forming sections are electrically connected in series by the conductive porous substrate.
    Type: Grant
    Filed: January 8, 2018
    Date of Patent: May 19, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kazuo Hattori, Noriyuki Inoue, Hiromasa Saeki, Kensuke Aoki, Ken Ito
  • Patent number: 10650974
    Abstract: A multilayer ceramic capacitor includes a laminate with a rectangular or substantially rectangular parallelepiped shape and including dielectric layers, first internal electrode layers, and second internal electrode layers that are laminated; a first external electrode connected with the first internal electrode layers; and a second external electrode connected with the second internal electrode layers. Each of the first internal electrode layers or the second internal electrode layers has a coverage in a central portion in a W direction that is lower than a coverage within about 30.000 ?m from an end portion in the W direction, and has a shifting amount in the W direction of about 0.000 ?m or more and about 10.000 ?m or less.
    Type: Grant
    Filed: March 9, 2018
    Date of Patent: May 12, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kohei Shimada, Akio Masunari, Yuta Saito, Shunsuke Abe, Tomoo Yuguchi
  • Patent number: 10650972
    Abstract: An element body of a rectangular parallelepiped shape has a length in a width direction larger than a length in a height direction and has a length in a longitudinal direction larger than the length in the width direction. A terminal electrode is disposed at an end of the element body in the width direction and extends in the longitudinal direction. The element body includes a pair of principle surfaces opposing each other in the height direction, a pair of end surfaces opposing each other in the longitudinal direction, and a pair of side surfaces opposing each other in the width direction. The terminal electrode includes a conductor disposed on the side surface. The conductor includes a depression having a length in the longitudinal direction larger than a length in the height direction.
    Type: Grant
    Filed: August 29, 2018
    Date of Patent: May 12, 2020
    Assignee: TDK CORPORATION
    Inventors: Toru Onoue, Fumiaki Satoh, Takuto Okamoto
  • Patent number: 10636568
    Abstract: A multilayer ceramic electronic device comprising: a ceramic element body, in which it plurality of dielectric layers and a plurality of internal electrode layers are alternately stacked, and at least a pair of external electrodes which are connected to the internal electrode layers on surfaces of the ceramic element body; a thickness of the dielectric layers is 0.4 ?m or less, a width (W0) of the ceramic element body along a width-direction is 0.59 mm or less, a gap (Wgap) between an outer face of the ceramic element body and an end of the internal electrode layers along width-direction of the ceramic element body is 0.010 to 0.025 mm, and a ratio (Wgap/W0) of the gap with respect to the width is 0.025 or more.
    Type: Grant
    Filed: April 29, 2019
    Date of Patent: April 28, 2020
    Assignee: TDK CORPORATION
    Inventors: Shogo Murosawa, Toshihiko Kaneko
  • Patent number: 10636572
    Abstract: Provided is a multilayer ceramic electronic device which is capable of preventing decrease of the specific permittivity and of showing less drop of capacitance, even when the dielectric grains constituting the dielectric layers become smaller for thinning of the dielectric layers, wherein Dg/Di?1 is satisfied, in case that “Di” is an average grain size of the first dielectric grains constituting the dielectric layer in the capacitance region and “Dg” is an average grain size of the second dielectric grains in an exterior area.
    Type: Grant
    Filed: March 31, 2016
    Date of Patent: April 28, 2020
    Assignee: TDK CORPORATION
    Inventors: Toshihiko Kaneko, Shogo Murosawa
  • Patent number: 10622153
    Abstract: A multilayer capacitor includes a body including an active region including a plurality of first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween and upper and lower cover regions, and having first and second surfaces opposing each other and third and fourth surfaces opposing each other, the first and second internal electrodes being exposed to the third and fourth surfaces, respectively, first and second external electrodes disposed on the third and fourth surfaces, respectively, and connected to the first and second internal electrodes, respectively, and a plurality of dummy electrodes disposed in the lower cover region. A total thickness of the dummy electrodes disposed in the lower cover region is less than 20% of a sum of a thickness of the lower cover region and a thickness of one of the first and second external electrodes disposed on a mounting surface of the body.
    Type: Grant
    Filed: May 10, 2018
    Date of Patent: April 14, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hwi Dae Kim, Sang Soo Park, Young Ghyu Ahn
  • Patent number: 10622152
    Abstract: A multi-layer ceramic capacitor includes a multi-layer unit and a side margin. The multi-layer unit includes ceramic layers laminated in a first direction and internal electrodes disposed between the ceramic layers. The side margin covers the multi-layer unit from a second direction orthogonal to the first direction and has a porosity of 1% or less.
    Type: Grant
    Filed: October 12, 2017
    Date of Patent: April 14, 2020
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Toshimitsu Kogure, Joji Kobayashi, Yasunari Kato, Yosuke Sato, Tetsuhiko Fukuoka, Ryo Ono
  • Patent number: 10614954
    Abstract: A ceramic electronic component includes an electronic component body and portions of first and second metal terminals covered with an outer resin material. The first metal terminal includes, connected in order, a first terminal joint portion, a first extension portion extending in a direction toward a mounting surface, and a first mount portion extending toward a side opposite to the electronic component body. The second metal terminal includes, connected in order, a second terminal joint portion, a second extension portion extending in the direction toward the mounting surface, and a second mount portion extending toward a side opposite to the electronic component body. The first and second mount portions respectively include first and second protrusions protruding toward the mounting surface. The outer resin material includes a protruding portion protruding toward the mounting surface.
    Type: Grant
    Filed: June 25, 2018
    Date of Patent: April 7, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Teppei Akiyoshi
  • Patent number: 10593478
    Abstract: A multilayer ceramic capacitor includes a multilayer structure wherein [t12×L1]/N?10, when a distance between a first edge that is an outermost edge of internal electrodes that is not connected to a first or second external electrode and a second edge that is an innermost edge of the internal electrodes that is not connected to the first or second external electrode is L1, each thickness of dielectric layers is t1, and a stack number of dielectric layers is N, wherein [t12×W1]/N?10, when a distance between a first edge that is positioned at outermost of the internal electrodes and a second edge that is positioned at innermost of the internal electrodes is W1, and wherein R is larger than W1, when a curvature radius of a corner of an edge of the internal electrodes is R.
    Type: Grant
    Filed: June 13, 2018
    Date of Patent: March 17, 2020
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Yasuyuki Inomata, Masaki Mochigi
  • Patent number: 10580580
    Abstract: A method of manufacturing a ceramic electronic component including a main body including a first principal surface and a second principal surface opposite to each other, and a first external electrode and a second external electrode provided on a portion of a surface of the main body, includes providing a plurality of recesses in a first principal surface of a laminated block including a ceramic material and an organic substance by relatively moving the laminated block and a protrusion surface including a protrusion, in a direction along the first principal surface of the laminated block with the protrusion surface being in contact with a first principal surface of the laminated block, obtaining a chip by cutting the laminated block including the recesses, and obtaining the main body by firing the chip.
    Type: Grant
    Filed: August 5, 2016
    Date of Patent: March 3, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Junya Tanaka, Shinsuke Uchida
  • Patent number: RE47950
    Abstract: A laminated inductor includes a component body that provides a mounting surface on one of its faces, and at least a pair of external electrodes are formed on the mounting surface, wherein the component body has a laminate constituted by multiple insulator layers, a spiral coil conductor formed in the laminate, and leader parts that electrically connect the coil conductor and external electrodes; the coil conductor comprises conductor patterns formed in the insulator layers and via hole conductors that penetrate through the insulator layers and electrically connect the multiple conductor patterns, and also has a coil axis running roughly in parallel with the mounting surface and a turn unit having one or more sides running roughly in parallel with the mounting surface; and the via hole conductors are formed only on the side farthest away from the mounting surface among the one or more sides.
    Type: Grant
    Filed: November 13, 2017
    Date of Patent: April 14, 2020
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Koji Ishii, Akihisa Matsuda, Yo Fujitsuna, Kazuhiko Oyama, Yasuyuki Taki