Abstract: There is provided a conductive resin composition including 10 to 50 wt % of a gel type silicon rubber such as polydimethylsiloxane (PDMS), and 50 to 90 wt % of conductive metal powder particles.

Abstract: A multilayer ceramic electronic component may include: a ceramic body including a plurality of dielectric layers; and first and second internal electrodes disposed to be alternately exposed to both end surfaces of the ceramic body, having at least one of the dielectric layers interposed therebetween. The second internal electrode may include a space part disposed to be adjacent to a portion thereof exposed to one end surface of the ceramic body so as to be not overlapped with the first internal electrode in the space part.

Abstract: A capacitor includes a dielectric layer, a first external electrode layer, a second external electrode layer, a first internal electrode portion, a second internal electrode portion, and an adsorbing portion. The first internal electrode portion is provided on a first through-hole portion, one end of the first internal electrode portion being connected to the first external electrode layer. The second internal electrode portion is provided on a second through-hole portion, one end of the second internal electrode portion being connected to the second external electrode layer. The adsorbing portion adsorbs the first external electrode layer and the second external electrode layer, the adsorbing portion being provided on a third through-hole portion.

Abstract: An object of the present invention is to provide an electrode sintered body wherein shrinkage is prohibited and conductivity is good. An electrode sintered body including intermetallic compound comprising nickel and aluminum is provided. And then an internal electrode paste, which can inhibit shrinkage of an internal electrode layer, is manufactured by raising sintering temperature of conducting particle materials constituting internal electrode sheet to be internal electrode layers after firing. Further, a high-function multilayer electronic device using electrode paste for internal electrodes is manufactured.

Abstract: There is provided a multilayered ceramic electronic component including: a ceramic body in which a plurality of dielectric layers are stacked; a plurality of first and second internal electrodes formed on at least one of the dielectric layers and alternately exposed through both ends of the ceramic body in a stacking direction of the ceramic body; an a step compensation cover including a ceramic material having a viscosity higher than that of a ceramic material included in the ceramic body and formed on at least one of an upper surface and a lower surface of the ceramic body.

Abstract: A laminated ceramic capacitor includes multiple dielectric layers, internal electrodes having Cu as the primary component and embedded between the dielectric layers, and external electrodes. The dielectric layers contain a primary component comprised of a CaZrO3 compound and auxiliary components that include Mn, B, Si, and Li wherein a primary phase comprised of the primary component, segregation phases containing Ca and at least one of the auxiliary components, and secondary phases containing at last Ca and Zr are formed. The ratio of Ca to Zr in the secondary phases is smaller than the ratio of Ca to Zr in the primary phase, and the number of secondary phases with a diameter of 100 nm or greater in a cross section of the dielectric layers averages 30 or less per 10 square ?m.

Abstract: There are provided a multilayer ceramic electronic component to be embedded in a board and a manufacturing method thereof, and particularly, a multilayer ceramic electronic component to be embedded in a board, in which a thickness of a ceramic body in an entire chip is increased by not allowing for an increase in a thickness of an external electrode while forming a band surface of the external electrode to have a predetermined length or greater for connecting the external electrode to an external wiring through a via hole, such that chip strength may be improved and the occurrence of damage such as breakage, or the like may be prevented, and a manufacturing method thereof, may be provided.

Abstract: An improved passive electronic stacked component is described. The component has a stack of individual electronic capacitors and a first lead attached to a first side of the stack. A second lead is attached to a second side of the stack. A foot is attached to the first lead and extends inward towards the second lead. A stability pin is attached to one of the foot or the first lead.

Abstract: A ceramic electronic component includes a ceramic body and an outer electrode. The outer electrode is disposed on the ceramic body. The outer electrode includes a first conductive layer and a second conductive layer. The first conductive layer includes a resin, a first metal component, and a second metal component having a higher melting point than the first metal component. The second conductive layer is disposed on the first conductive layer. The second conductive layer is includes a plating film. An alloy particle containing the first metal component and the second metal component protrudes to the second conductive layer side from a surface of the first conductive layer.

Abstract: There is provided a multilayer ceramic electronic component including: a ceramic main body including a dielectric layer and internal electrodes disposed to face each other, while having the dielectric layer interposed therebetween; and external electrodes electrically connected to the internal electrodes, wherein the external electrodes include first external electrodes formed on outer surfaces of the ceramic main body and second external electrodes formed outwardly of the first external electrodes, and protective layers including one or more of an oxide layer and a glass layer are formed between the first external electrodes and the second external electrodes.

Abstract: A method of manufacturing a metal paste for an internal electrode according to the present invention includes preparing each of a metal powder and an organic vehicle; preparing a ceramic inhibitor powder in which a nano glass added with a rare-earth element is mixed; manufacturing a primary mixture by mixing the metal powder of 70 to 95 wt % and the ceramic inhibitor powder of 5 to 30 wt % when each of the metal powder, the organic vehicle, and the ceramic inhibitor powder in which the nano glass added with the rare-earth element is mixed is prepared; manufacturing a secondary mixture by mixing the primary mixture of 50 to 70 wt % and the organic vehicle of 30 to 50 wt % when the primary mixture is manufactured; and manufacturing the metal paste for the internal electrode by filtering the secondary mixture when the secondary mixture is manufactured.

Abstract: A monolithic electronic component includes a laminate including a plurality of stacked insulating layers and a plurality of internal electrodes which extend between the insulating layers and which have end portions exposed at predetermined surfaces of the laminate, first plating layers disposed on the predetermined surfaces of the laminate, and second plating layers disposed on the first plating layer. The first plating layers are made of a metal different from that used to make the internal electrodes. The first plating layers are formed by electroless plating. The second plating layers are formed by electroplating.

Abstract: A circuit substrate includes a resin layer; and an inorganic insulating layer including a groove portion penetrating the inorganic insulating layer in a thickness direction thereof. A part of the resin layer is in the groove portion.

Abstract: A multilayer ceramic capacitor includes a ceramic multilayer body including dielectric layers and inner electrodes stacked on top of one another with the dielectric layers interposed between a corresponding pair of the inner electrodes. The dielectric layers each include a perovskite-type compound including Ba and Ti. A boundary layer including Mg and Mn is located at an interface between an outermost inner electrode and an outermost dielectric layer. The outermost inner electrode is located at an outermost position of the inner electrodes in a direction in which the inner electrodes are stacked. The outermost dielectric layer is located outside the outermost inner electrode. A proportion in which the boundary layer is present at the interface is about 69% or more. A continuity of the outermost inner electrode is about 60% or more.

Abstract: A monolithic ceramic capacitor includes an outer electrode arranged on a ceramic element body including inner electrodes, and a dielectric layer present between a pair of the inner electrodes adjacent in a stacking direction and extending to one of a pair of end surfaces of the ceramic element body that defines an inter-electrode dielectric layer. A gap extending in a direction connecting the inner electrodes sandwiching the inter-electrode dielectric layer is present in about 5% to about 90% of inter-electrode dielectric layers in the ceramic element body at a position near or adjacent to at least one of the pair of end surfaces of the ceramic element body.

Abstract: A electronic device is provided. The electronic device includes a first electrode formed in a first layer; a second electrode formed in the first layer, wherein the first electrode and the second electrode are symmetrically disposed with respect to a first point; and a first floating metal ring formed in the first layer and enclosing the first electrode and the second electrode.

Abstract: An electronic component includes a laminate including a plurality of insulating layers that are laminated on each other. A capacitor conductor is embedded in the laminate and includes an exposed portion exposed between the insulating layers at a predetermined surface of the laminate. An external electrode is provided on the predetermined surface by direct plating so as to cover the exposed portion. An outer edge of the external electrode is spaced away from the exposed portion by about 0.8 ?m or more.

Abstract: There are provided a multilayer ceramic capacitor and a manufacturing method thereof, the multilayer ceramic capacitor including: a ceramic body; first and second internal electrodes; first and second external electrodes; and a first insulating layer.

Abstract: A dielectric ceramic which is suitable for use in a laminated ceramic capacitor under a high-temperature environment, such as encountered in, for example, automobile use has a composition represented by the composition formula: (1?x) (Ba1-yCay)mTiO3+xCaTiO3+aRe2O3+bMgO+cMnO+dV2O3+eSiO2 in which Re is Gd, Dy, Y, Ho, and/or Er), 0.001?x?0.02, 0.08?y?0.20, 0.99?m?1.05, 0.01?a?0.04, 0.005?b?0.035, 0?c?0.01, 0?d?0.01, 0.01?e?0.04 when a, b, c, d, and e are each expressed in terms of parts by mol with respect to 1 mol of (1?x) (Ba,Ca)TiO3+xCaTiO3. This dielectric ceramic can constitute the dielectric ceramic layers of a laminated ceramic capacitor.

Abstract: There are provided a multi-layered ceramic electronic component and a method of manufacturing the same. The multi-layered ceramic electronic component includes: a ceramic body; internal electrodes formed within the ceramic body and including non-electrode regions formed therein; and external electrodes formed on ends of the ceramic body and electrically connected to the internal electrodes, wherein in a cross section of the internal electrode, 70% or more of the non-electrode regions are distributed in a region formed between points inwardly spaced apart from each of the upper and lower boundary surfaces of the internal electrodes by 5%.

Abstract: In a manufacturing method for a monolithic ceramic electronic component, a plurality of green chips arrayed in row and column directions which are obtained after cutting a mother block are spaced apart from each other and then tumbled, thereby uniformly making the side surface of each of the green chips an open surface. Thereafter, an adhesive is applied to the side surface. Then, by placing a side surface ceramic green sheet on an affixation elastic body, and pressing the side surface of the green chips against the side surface ceramic green sheet, the side surface ceramic green sheet is punched and stuck to the side surface.

Abstract: The laminated ceramic capacitor has a laminate block made of alternately laminated ceramic dielectric layers and internal electrodes, a pair of cover layers, laminated on top and bottom of the laminate block, ceramic bodies formed on both side faces of the laminate block, and a pair of external electrodes that are electrically connected to the internal electrodes, wherein the average grain size of the ceramic dielectric grains constituting the ceramic body is smaller than the average grain size of the ceramic dielectric grains constituting the ceramic dielectric layer in the laminate block.

Abstract: There is provided a multilayer ceramic electronic component. The multilayer ceramic electronic component includes a ceramic main body including a dielectric layer, and first and second internal electrodes disposed to face each other within the ceramic main body and having the dielectric layer interposed therebetween. When an average roughness of center lines of the first and second internal electrodes is Ra, a maximum distance from a virtual line corresponding to Ra to a bottom of a pit (d) formed below the virtual line is 0.1 ?m to 13 ?m. The surface roughness of the internal electrode printed surface is improved to decrease the occurrence of electrical shorts.

Abstract: Provided is a laminated ceramic electronic component which has excellent mechanical characteristics, internal electrode corrosion resistance, high degree of freedom in ceramic material design, low cost, low defective rate, and various properties. The laminated ceramic electronic component includes: a laminate which has a plurality of laminated ceramic layers and Al/Si alloy-containing internal electrodes at a plurality of specific interface between ceramic layers; and an external electrode formed on the outer surface of the laminate, wherein the Al/Si ratio of the Al/Si alloy is 85/15 or more.

Abstract: There are provided a multilayer ceramic electronic component and a method of manufacturing the same. The multilayer ceramic electronic component includes: a ceramic body including a dielectric layer; first and second internal electrodes disposed within the ceramic body to face each other, while having the dielectric layer interposed therebetween; and first external electrodes electrically connected to first and second internal electrodes and second external electrodes formed on the first external electrodes, wherein the first and second external electrodes include a conductive metal and a glass, and when the second external electrodes are divided into three equal parts in a thickness direction, an area of the glass in central parts thereof with respect to an area of the central parts is 30 to 80%. Therefore, sealing properties of a chip is improved, whereby a multilayer ceramic electronic component having improved reliability may be implemented.

Abstract: A laminated chip electronic component includes: a ceramic body including internal electrodes and dielectric layers; external electrodes covering end portions of the ceramic body in length direction; an active layer in which the internal electrodes are disposed in opposing manner, while having the dielectric layers interposed therebetween, to form capacitance; and upper and lower cover layers formed on upper and lower portions of the active layer in thickness direction, the lower cover layer thicker than the upper cover layer.

Abstract: One object is to provide a porous capacitor having increased insulation reliability. In accordance with one aspect, the porous capacitor includes: a first conductor layer and a second conductor layer opposed to each other at a predetermined distance; a dielectric layer made of an oxidized valve metal and disposed between the first conductor layer and the second conductor layer; a large number of holes formed through the dielectric layer and oriented substantially orthogonal to the first conductor layer and the second conductor layer; and first electrodes and second electrodes formed of a conductive material filled in the holes; and insulation parts insulating the first electrodes from the second conductor layer and insulating the second electrodes from the first conductor layer. The thicknesses of the first conductor layer and the second conductor layer are equal to or greater than half of the inner diameter of the holes.

Abstract: There is provided a chip type laminated capacitor including: a ceramic body formed by laminating a dielectric layer having a thickness equal to 10 or more times an average particle diameter of a grain included therein and being 3 ?m or less; first and second outer electrodes; a first inner electrode having one end forming a first margin together with one end surface of the ceramic body at which the second outer electrode is formed and the other end leading to the first outer electrode; and a second inner electrode having one end forming a second margin together with the other end surface of the ceramic body at which the first outer electrode is formed and the other end leading to the second outer electrode, wherein the first and second margins have different widths under a condition that they are 200 ?m or less.

Abstract: A method for manufacturing a laminated ceramic electronic component is provided in which a plurality of ceramic green sheets having printed strip inner electrodes patterns, each including a thick portion at a width-direction center and thin portions at respective width-direction sides of the thick portion, are laminated so that the thin portions overlap and the thick portions do not overlap to form an unfired mother laminated body. This unfired mother laminated body is cut along predetermined cut lines that are vertical to each other to obtain a plurality of unfired ceramic element assemblies. By applying ceramic paste to cover exposed portions of inner electrode patterns exposed to lateral surfaces, side gap areas are formed between a first inner electrode pattern and first and second lateral surfaces of the unfired ceramic element assembly and between a second inner electrode pattern and the first and second lateral surfaces.

Abstract: There are provided a conductive paste composition for an internal electrode, a multilayer ceramic electronic component including the same, and a method of manufacturing the same, the conductive paste composition including: a metal powder; and an additive including at least one selected from glutamic acid, amino acids, thiols, and hydrocarbons.

Abstract: There is provided a multilayer ceramic electronic component including a ceramic body including a plurality dielectric layers stacked thereon, a plurality of internal electrodes formed to be exposed to both end surface of the ceramic body, having the dielectric layer interposed therebetween, and external electrodes formed on the end surfaces of the ceramic body and electrically connected to the internal electrodes, respectively, wherein connectivity of the internal electrode is equal to or greater than 87%.

Abstract: In a multilayer ceramic electronic component, when a region of a ceramic body in layers where neither of a first internal electrode and a second internal electrode is provided as viewed in a direction in which a plurality of ceramic layers are stacked on one another is defined as a non-effective layer region, a dummy lead-through conductor is arranged in the non-effective layer region so as to lead to at least two locations on portions of superficies of the ceramic body and be electrically connected to a second external electrode. When a conductive medium is brought into contact with one of a plurality of exposed edges of the dummy lead-through conductor, a current is also applied to the other exposed edges.

Abstract: Electrode protective films 13a and 13b are formed on the surface of the metal layer using imidazole preflux, as terminal electrodes 35a and 35b of an electronic component. The terminal electrodes of an electronic component on which the protective films are formed are fixed by electroconductive adhesives 33a and 33b supplied to mounting lands 40a and 40b. Thereby an electronic component mounting structure without change in resistance caused by electroconductive adhesives is provided.

Abstract: There is provided a multilayer ceramic electronic component, including: a ceramic sintered body having a plurality of dielectric layers laminated therein; first and second capacitance portions being formed on surfaces of the dielectric layers; first and second lead-out portions being respectively extended from both sides of the first and second capacitance portions to be respectively exposed through both side surfaces of the ceramic sintered body and spaced apart from each other; sealing parts enclosing both end portions and corner portions of the ceramic sintered body; and first and second external electrodes enclosing the sealing parts and formed on both end portions of the ceramic sintered body to be electrically connected to the first and second lead-out portions, respectively.

Abstract: New designs for multilayer ceramic capacitors are described with high voltage capability without the need of coating the part to resist surface arc-over. One design combines a high overlap area for higher capacitance while retaining a high voltage capability. A variation of this design has increased voltage capability over this design as well as another described in the prior art although overlap area and subsequently capacitance is lowered in this case. These designs are compared to the prior art in examples below.

Abstract: A capacitor includes a pair of electrodes and a metalized dielectric layer disposed between the pair of electrodes, in which the metalized dielectric layer has a plurality of metal aggregates distributed within a dielectric material. The distribution is such that a volume fraction of metal in the metalized dielectric layer is at least about 30%. Meanwhile, the plurality of metal aggregates are separated from one another by the dielectric material. A method for forming a metal-dielectric composite may include coating a plurality of dielectric particles with a metal to form a plurality of metal-coated dielectric particles and sintering the plurality of metal-coated dielectric particles at a temperature of at least about 750° C. to about 950° C. to transform the metal coatings into discrete, separated metal aggregates.

Abstract: There is provided a multilayered ceramic electronic component including: a multilayered body in which a plurality of dielectric layers are stacked; a plurality of first and second internal electrodes formed on the dielectric layers so as to be alternately exposed through end surfaces; a minimum margin indicating part formed on an L-direction margin part on which the first or second internal electrode is not formed on the dielectric layer and indicating a minimum size of the L-direction margin part, the L-direction minimum margin indicating part being inserted on the ceramic sheet, whereby a multilayered ceramic electronic component having high capacitance while reducing a defect and having excellent reliability may be implemented.

Abstract: Provided is a laminated ceramic electronic component which has excellent mechanical characteristics, internal electrode corrosion resistance, high degree of freedom in ceramic material design, low cost, low defective rate, and various properties. The laminated ceramic electronic component includes a laminate which has a plurality of laminated ceramic layers and internal electrodes formed along at a plurality of specific interface between the ceramic layers and having an Al/Ti alloy as a component; and an external electrode formed on the outer surface of the laminate. The Al/Ti ratio of the Al/Ti alloy is 91/9 or more.

Abstract: There is provided a multilayer ceramic electronic component, including: a ceramic body having dielectric layers and first and second internal electrodes alternately stacked therein; and first and second external electrodes electrically connected to the first and second internal electrodes and formed at both ends of the ceramic body, wherein the ceramic body includes an effective layer contributing to capacitance formation and a protective layer provided on at least one of upper and lower surfaces of the effective layer, the protective layer including one or more step absorbing layers provided at both ends thereof, so that the multilayer ceramic electronic component can have excellent reliability by reducing defects such as electrode spreading, cracks, delamination and the like.

Abstract: There is provided a multilayer ceramic capacitor, and a method of manufacturing the same, the multilayer ceramic capacitor including: a ceramic body; a first internal electrode; a second internal electrode; a first external electrode; a second external electrode; and an insulating layer.

Abstract: Provided is a laminated ceramic electronic component having excellent mechanical characteristics, internal electrode corrosion resistance, high degree of freedom in ceramic material design, low cost, low defective rate, and various properties. The laminated ceramic electronic component includes: a laminate which has a plurality of laminated ceramic layers and internal electrodes at a plurality of specific interfaces between the ceramic layers and having an Al/Ni alloy as a component; and an external electrode formed on the outer surface of the laminate, wherein the Al/Ni ratio of the Al/Ni alloy is 85/15 or more.

Abstract: There is provided a multilayer ceramic capacitor including a ceramic body, first to third capacitor parts, first and second internal connection conductors, and first to fourth external electrodes, wherein the first capacitor part is connected in series with the second internal connection conductor, and the second capacitor part is connected in series with the first internal connection conductor.

Abstract: A multilayer ceramic electronic component includes a ceramic main body including dielectric layers and satisfying T/W>1.0 when W and T are width and thickness, respectively; and first and second internal electrodes stacked in the ceramic main body and facing each other with the dielectric layer interposed therebetween, the ceramic main body including an active layer corresponding to a capacitance forming portion contributing to capacitance formation and a cover layer corresponding to a non-capacitance forming portion provided on at least one of uppermost and lowermost surfaces of the active layer, and when the active layer is divided into three regions in a direction in which the first and second internal electrodes are stacked, an average width of internal electrodes in a central region of the three regions is Wa, and an average width of internal electrodes in upper and lower regions of the three regions is Wb, 0.920?Wb/Wa?0.998 is satisfied.

Abstract: There is provided a multilayer ceramic capacitor including a ceramic body, first and second capacitor parts, first and second internal connection conductors, and first to fourth external electrodes, wherein the first capacitor part is connected to the first connection conductor in series, and the second capacitor part is connected to the second connection conductor in series, the second connection conductor being connected to the first connection conductor in series.

Abstract: A multilayer ceramic electronic component includes a ceramic body including dielectric layers stacked in a thickness direction and satisfying T/W>1.0 when a width thereof is W and a thickness thereof is T; first and second internal electrodes; and first and second external electrodes, wherein when the ceramic body is divided into five regions in a width direction and a central region among the five regions is CW1 and regions adjacent to the central region CW1 are CW2 and CW3, a difference between electrode connectivity of the central region CW1 and electrode connectivity of the region CW2 or CW3 satisfies 0.02?(CW2 or CW3)?CW1?0.10.

Abstract: There is provided a multilayer ceramic electronic component, including: a ceramic main body including a dielectric layer; and inner electrodes disposed to face each other within the ceramic main body, with the dielectric layer interposed therebetween, wherein, when an average thickness of the dielectric layer is td and an average thickness of the inner electrodes is te, 0.1 ?m?te?0.5 ?m and (td+te)/te?2.5 are satisfied, and when an average surface roughness on a virtual surface roughness center line of the inner electrode is Ra and an average roughness of ten points of the inner electrode is Rz, 5 nm?Ra?30 nm, 150 nm?Rz?td/2, and 8?Rz/Ra?20 are satisfied. The multilayer ceramic electronic component has excellent reliability by improving adhesion strength between the dielectric layer and the inner electrodes and withstand voltage characteristics.

Abstract: There is provided a multilayer ceramic electronic component, including: a ceramic main body having internal electrodes laminated therein; and external electrodes formed on both ends of the ceramic main body in a length direction thereof, wherein each of the external electrodes includes a first layer formed on the ceramic main body and including a conductive metal, and a second layer formed on the first layer and including a conductive resin, and when Tc is a thickness of a cover layer of the ceramic main body, L1 is a length from either end of the ceramic main body in the length direction thereof to an end of the first layer formed on an upper surface or a lower surface of the ceramic main body, T1 is a thickness of the first layer, and T2 is a thickness of the second layer, Tc?70 ?m, T2?(1.5)T1, and L1<(1.5)Tc are satisfied, thus providing excellent reliability.

Abstract: A multilayer ceramic electronic component includes a ceramic main body having internal electrodes laminated therein; and external electrodes formed on ends of the ceramic main body in a length direction, wherein each external electrode includes a first layer formed on the ceramic main body and including a conductive metal, and a second layer formed on the first layer and including a conductive resin, and when Tc is thickness of a cover layer, Te is thickness of the internal electrode, Td is distance between neighboring internal electrodes, L1 is length from either end of the ceramic main body in the length direction in a region in which the cover layer adjoins a margin part of the ceramic main body to an end of the first layer formed on an upper or lower surface of the ceramic main body, and Lm is length of the margin part, Tc?70 ?m and L1<Lm+Tc×cot 50° are satisfied.

Abstract: There are provided a conductive paste composition for an internal electrode, a multilayer ceramic capacitor having the same, and a fabrication method thereof. The conductive paste composition for an internal electrode includes a binder, a solvent, and metal powder for an internal electrode, including a nickel particle coated with a nickel nitride.

Abstract: A crystalline perovskite crystalline composite paraelectric material includes nano-regions containing rich N3? anions dispersed in a nano-grain sized matrix of crystalline oxide perovskite material, wherein (ABO3-?)?-(ABO3-?-?N?)1-?. A represents a divalent element, B represents a tetravalent element, ? satisfies 0.005???1.0, 1-? satisfies 0.05?1-??0.9, and 1-? is an area ratio between the regions containing rich N3? anions and the matrix of remaining oxide perovskite material.