Abstract: A system for cooling a computer data center includes a computer data center building; a plurality of computer racks arranged in a plurality of linear rows inside the computer data center building, with particular ones of the racks housing a plurality of computer systems; a plurality of cooling fluid conduits; and a plurality of cooling plants arranged outside the computer data center building along an exterior wall of the computer data center building. At least one of the cooling plants corresponds to one or more particular ones of the cooling fluid conduits and provides cooling for the corresponding conduit.

Abstract: An electronic assembly includes a workpiece, a through substrate via (TSV) die including a substrate and a plurality of TSVs, a topside and a bottomside having TSV connectors thereon. The TSV die is attached to the workpiece with its topside on the workpiece. A heat spreader having an inner open window is on the bottomside of the TSV die. Bonding features are coupled to the TSV connectors or include the TSV connectors themselves. The bonding features protrude from the inner open window to a height above a height of the top of the heat spreader that allows a top die to be bonded thereto.

Abstract: A chassis comprises a printed circuit board (PCB) and a sub-chassis housing multiple processors that couple to the PCB. The sub-chassis is disposed above and parallel to the PCB. The multiple processors are cooled by a fan disposed on the sub-chassis.

Abstract: An electronic device includes a body portion such as, for example, a laptop chassis, and a deployable support coupled to the bottom surface of the body portion. The deployable support can be moved between a stowed position relative the bottom surface of the body portion and a deployed position in which support is positioned in spaced relationship to the bottom to create an airflow path beneath the body portion.

Abstract: A server rack includes a cabinet, at least one fan, and at least one circuit board, in which the cabinet has a first side surface and a second side surface arranged along a first direction and opposite to each other. The fan is installed on the first side surface of the cabinet and blows an airflow in the first direction, the circuit board is installed in the cabinet along the second direction, and the second direction and the first direction are perpendicular to each other, so the airflow generated by the fan is blown to the circuit board, thereby performing heat dissipation.

Abstract: Systems and methods of controlling a fan in an electronic system are disclosed. One example method includes obtaining a control setting of the fan and current speed of the fan. The example method further includes determining a fan speed threshold associated with the obtained control setting. The example method further includes comparing the fan speed threshold to the current speed. The example method further includes generating an alert based on the comparison.

Abstract: Administering computing system resources in a computing system, the computing system comprising at least one slot adapted to receive an electrical component having a set of pins, the slot configured to couple pins of the electrical component to the computing system, installed within the slot a presence detectable baffle, the presence detectable baffle comprising a passive chassis having a form factor consistent with the electrical component and a presence detectable pin set connected to the passive chassis, the pin set consistent with the electrical component, including: identifying, by a system manager, the presence detectable baffle; and managing, by the system manager, computing system operating attributes in dependence upon presence detectable baffle attributes.

Abstract: Users of portable computers tend to carelessly place their usage of such where damage to their units become inevitable, unintentionally setting them in places which blocks air from circulating through such systems. For most laptops/notebook computers, a circulating blower sucks air from underneath the unit through an intake vent, and blows it past the Central Processing Unit (CPU) before exiting the system, at the side. The present invention is a supporting platform which is affixable to the bottom of any laptop computer. This platform allows the user to place the laptop on virtually any surface, without having to detach it upon disuse transport, and/or storage. It is a continuity clearance utility providing maximum air flow for which the unit was originally designed. This platform is affixable, detachable and fits comfortably with the laptop inside its carrying case.

Abstract: A computer or microchip comprising an outer chamber and at least one inner chamber inside the outer chamber. The outer chamber and the inner chamber being separated at least in part by an internal sipe, and at least a portion of a surface of the outer chamber forming at least a portion of a surface of the internal sipe. The internal sipe has opposing surfaces that are separate from each other and therefore can move relative to each other, and at least a portion of the opposing surfaces are in contact with each other in a unloaded condition. The outer chamber including a Faraday Cage. A computer, comprising an undiced semiconductor wafer having a multitude of microchips. The multitude of microchips on the wafer forming a plurality of independently functioning computers, each computer having independent communication capabilities.

Abstract: A disaster-proof data safe with multiple, insulated, surrounding solid structural metal walls for housing functioning digital electronic computing, data processing, data storage, communications and high power density blade server systems has one or more coaxial helical coil coolant tubes circulating a coolant liquid encircled around an interior hexahedral, housing space for removing heat generated in the housing space and insulating the housing space from sources of heat external to the safe. Features of the safe include a plurality of longitudinal heat sink bars thermally coupled to the encircling helical coil coolant tubes supported either by the helical coil coolant tubes or the interior structural metal sidewalls of the housing space. The helical coil coolant tubes and the heat sink bars are preferably composed from metals such as copper, aluminum and their alloys that have a high thermal conductivity and that retain structural integrity at temperature ranging up to 500° C.

Abstract: A server cooling device is described that includes an enclosure defining an interior space and at least one server rack port configured to engage a rack such that one or more rack mounted units installed in the rack interface with the interior space. The server cooling device also includes a mixing chamber including one or more cooling coils that is connected to the interior space defined by the enclosure.

Abstract: A method for constructing a thermal management system is provided herein. In accordance with the method, a fan (405) is provided which is adapted to provide a global flow of fluid through the device. A synthetic jet ejector (409) is also provided which is adapted to augment the global flow of fluid over the surfaces of a heat sink (403). The ratio of the flow per unit time of the synthetic jet ejector to the flow per unit time of the fan is selected so as to achieve a desired level of heat dissipation.

Abstract: Efficient heat exhaust is performed in accordance with inclination of a housing of an information terminal apparatus which is caused depending on a way of installing the information terminal apparatus or of an operator's carrying the information terminal apparatus. An information terminal apparatus according to the present invention is characterized by that, in the information terminal apparatus having a heat exhaust system inside its housing, the heat exhaust system performs heat exhaust control by which heat is exhausted from a higher portion in positional difference of the information terminal apparatus which is generated by inclination of the information terminal apparatus.

Abstract: Administering computing system resources in a computing system, the computing system comprising at least one slot adapted to receive an electrical component having a set of pins, the slot configured to couple pins of the electrical component to the computing system, installed within the slot a presence detectable baffle, the presence detectable baffle comprising a passive chassis having a form factor consistent with the electrical component and a presence detectable pin set connected to the passive chassis, the pin set consistent with the electrical component, including: identifying, by a system manager, the presence detectable baffle; and managing, by the system manager, computing system operating attributes in dependence upon presence detectable baffle attributes.

Abstract: The present disclosure is related to a device for cooling the surface of a semiconductor device such as an integrated circuit or the like, the cooling device comprising a plurality of channels (3?) which are non-parallel to the surface to be cooled, each channel comprising a plurality of separate electrodes (5) or equivalent conducting areas arranged along the length of each channel, the device further comprising or being connectable to means for applying a voltage to the electrodes or conducting areas in each channel according to a sequence, the sequence being such that a droplet (6) of cooling liquid in a channel may be moved from one electrode to the next, thereby transporting the droplet from the top of the channel to the bottom, from where the droplet impinges on the surface to be cooled.

Abstract: A semiconductor package includes: a substrate having a first surface and a second surface opposing the first surface, the first surface having a fan placement zone, a hole and a ventilation hole penetrating the substrate formed at the fan placement zone of the substrate; an electronic component disposed on the first surface surrounding the fan placement zone, the electronic component electrically connected to the substrate; an encapsulant formed on the electronic component and the first surface of the substrate, the encapsulant having an encapsulant opening exposing the fan placement zone; and a fan unit disposed in the encapsulant opening and electrically connected to the substrate. Since the electronic component is disposed on the substrate outside the fan placement zone, heat generated by the electronic component can efficiently dissipate while damage problems of over heat will not occur, and the overall height of the fan unit can thus be decreased.

Abstract: A manifold is provided for supporting a power module assembly with a plurality of power modules. The manifold includes a first manifold section. The first face of the first manifold section is configured to receive the first power module, and the second face of the first manifold section defines a first cavity with a first baseplate thermally coupled to the first power module. The first face of the second manifold section is configured to receive the second power module, and the second face of the second manifold section defines a second cavity with a second baseplate thermally coupled to the second power module. The second face of the first manifold section and the second face of the second manifold section are coupled together such that the first cavity and the second cavity form a coolant channel. The first cavity is at least partially staggered with respect to second cavity.

Abstract: A container data center includes a mobile container and a number of servers. The mobile container includes a main room receiving the servers, and an air shower room isolated from the main room. The air shower room includes an outer door, an inner door, a blower, and a dust absorber. The outer door connects the air shower room and is used to separate the air shower room from the outer environment. The inner door connects the air shower room and is used to separate the air shower room from the main room. The blower and the dust absorber are secured on two opposite walls of the air shower room respectively, the blower being configured for blowing air towards the dust absorber.

Abstract: A method and system of cooling a server rack unit is described herein. A server rack for housing certain devices may be configured to receive a first air flow at a server rack front. Each device may form a wall at the back of the device creating a channel between the wall and the server rack back. The camber may collect warm air created by the first air flow as it extends over the at least one server. A first surface of the server may define at least one server rack opening allowing the warm air in the channel to exit the server rack.

Abstract: A DC to AC inverter used in a solar cell power system can include an improved structure for cooling itself and increasing power output.

Abstract: The electronic computer according to the invention comprises: a storage case comprising a housing including an air inlet and an air outlet for the circulation of a flow of cooling air through the housing, an electronic motherboard comprising a first surface and a second surface, the second surface being provided with connectors for receiving electronic daughterboards, and an air channeling system configured so as to channel the air hitting the first surface of the electronic motherboard to bring it to the side of the second surface of the electronic motherboard. According to one aspect of the invention, the air channeling system is configured to spray the electronic daughterboards, so as to cool said electronic daughterboards through convection of the air.

Abstract: A cooling system for a mobile computing device configured to drive two devices, a fan and an alert device. The fan cools components of the mobile computing device by exchanging air between an inner cavity of the mobile computing device and an outer environment surrounding the mobile computing device. The alert device produces an alert, e.g., a vibration, for the mobile computing device. The cooling system includes a motor operably connected to a first device (either the fan or the alert device) and operably connected via a clutch to a second device (either the fan or the alert device). The clutch allows the second device to be selectively activated depending on a speed or rotational direction of a drive shaft of the motor.

Abstract: A container data center system includes a plurality of container data centers and a dissipation system. Each container data center includes a container and a number of servers arranged in the container. The containers of the container data centers communicate with each other. The heat dissipation system includes a refrigerating device configured for generating cooling air to one of the containers.

Abstract: An electronic assembly includes an electronic device and a solar shield coupled to the electronic device. The solar shield has an attachment portion which attaches to the electronic device, and a shield portion coupled to the attachment portion. The shield portion prevents direct sunlight from substantially reaching a section of the electronic device. The shield portion defines (i) at least a portion of an air intake, (ii) at least a portion of an air exhaust, and (iii) at least a portion of an air passageway which extends from the air intake to the air exhaust. The air passageway overlies the section of the electronic device enabling ambient air adjacent the air intake to form natural convective airflow into the air intake and out the air exhaust through the air passageway to carry away heat from the section of the electronic device during electronic operation of the electronic device.

Abstract: Methods are provided for creating and operating data centers. A data center may include an information technology (IT) load and a fuel cell generator configured to provide power to the IT load.

Abstract: Hand-held electronic devices and methods for improving thermal behavior of such devices are provided. In this regard, a representative hand-held electronic device includes: a processor operative to execute instructions; a kinetic energy harvester operative to generate electrical power responsive to movement of the hand-held electronic device; and a Peltier component in thermal communication with the processor, the Peltier component being operative to receive power from the kinetic energy harvester and to remove heat from the processor.

Abstract: Systems are provided for creating and operating data centers. A data center may include an information technology (IT) load and a fuel cell generator configured to provide power to the IT load.

Abstract: A chassis-based processing system includes a first set of processing blades mounted in parallel within a card cage and attached to a backplane within a chassis. An air intake plenum allows air to flow into the chassis, and over the first set of processing blades in an optimized manner. A separate processing blade is located in the air intake plenum, and is attached to the backplane. This processing blade may have less restrictive proximity requirements than the first set of processing blades. The processing blade in the plenum is positioned perpendicular to the first set of processing blades. As a result, airflow over the processing blade in the plenum has a different orientation than airflow over the first set of processing blades. An air deflector structure in the plenum deflects some of the air flowing into the plenum onto the processing blade located in the plenum, thereby providing improved cooling.

Abstract: A computer system includes an enclosure, a printed circuit board, and an air duct. The enclosure comprises a bottom panel, a rear panel, and a mounting panel. The printed circuit board is mounted on the bottom panel and is located between the rear panel and the mounting panel. A plurality of expansion cards is inserted in the printed circuit board. The plurality of expansion cards is substantially parallel to each other. The air duct is placed on the rear panel and the mounting panel. The air duct comprises an air duct body and a guiding plate. The guiding plate comprises a securing portion secured to the air duct body and a plurality of bent elastic tabs extending from the securing portion at an angle. The plurality of bent elastic tabs resists the plurality of expansion cards, thereby guiding air to flow to the plurality of the expansion cards.

Abstract: A power module includes a first heat sink, first and second power chips, a thermo-conductive insulating layer, a lead frame and a molding compound. The first heat sink has a first area and a second area. The first power chip is disposed in the first area. The thermo-conductive insulating layer is disposed in the second area. The second power chip is disposed on the heat sink through the thermo-conductive insulating layer. The lead frame is electrically connected to at least one of the first and second power chips. The molding compound covers the first and second power chips, the thermo-conductive insulating layer and a portion of the lead frame. The first heat sink is electrically connected to at least one of the first and second power chips. Because the first power chip is not disposed on the first heat sink through the thermo-conductive insulating layer, the cost can be reduced.

Abstract: An electronic device includes an electronic component mounted on a substrate; a cooling system for cooling the electronic component; and a fastening structure for fastening the cooling system to the substrate. The fastening structure includes a first magnet provided to one of the substrate and the cooling system, a second magnetic material fixed to the other of the substrate and the cooling system and magnetically coupled with the first magnet, and a magnetic shield that covers a part or all of the first magnet except for a coupling face to be coupled with the second magnetic material.

Abstract: An electronic apparatus is disclosed, which comprises: a housing, configured with a plurality of inlets and one outlet; a plurality of electronic elements, disposed inside the housing; and a plurality of gates, arranged at positions corresponding to the plural inlets in an one-by-one manner; wherein, the plural electronic elements are activated while the electronic apparatus is enabled for causing the temperature of the plural electronic elements to be raised to their respective working temperatures, thereby, causing a plurality of heating zones to be formed inside the housing at positions respectively corresponding to the plural inlets; and by enabling each gate to be configured with one thermal expansion element that is enabled to deform with the temperature variation of the corresponding heating zone, each gate is enabled to move between a first position and a second position according to the deformation of the corresponding thermal expansion element.

Abstract: Systems and methods for balanced cooling of electrical systems, including electrical systems containing transceivers used in electrical and optical communication. An electrical system includes a cage, where the cage has a top, front and bottom. The cage contains a plurality of upper bays disposed in the front of the cage. Each of the plurality of upper bays is configured to receive a transceiver. The cage also contains a plurality of lower bays disposed in the front of the cage. Each of the lower bays is configured to receive a transceiver. Additionally, each of the plurality of upper bays is stacked on one of the plurality of lower bays. An upper heat sink extends from the outer surface of the top of the cage and a lower heat sink extends from the outer surface of the bottom of the cage.

Abstract: Described are methods, systems, and apparatus relating to a modular data center. In some embodiments, a modular data center includes one or more data modules. The modular data center includes a network module connected to the one or more data modules, the network module containing equipment for facilitating data communications by the one or more data modules. The modular data center includes a power module connected to the one or more data modules and the network module, the power module containing electronics equipment for conditioning and distributing power to the one or more data modules and the network module.

Abstract: An air duct includes a top wall and a blocking plate. The top wall includes a limiting block, a resilient arm, and a pair of hooks. A latching slot is defined between the pair of hooks. The blocking plate is rotatably secured to the top panel and includes a body and a shaft connected to the body. The shaft is rotatably engaged in the latching slot. The limiting block and the resilient arm abut two opposite surfaces of the body and block the body preventing the blocking plate from rotating relative to the top wall. The blocking plate is adapted to abut an electronic component and guide airflow towards the electronic component.

Abstract: A cooling system having a enclosure, a plurality of disk drives stored in the enclosure, a first portion of the disk drives having housings with a first form factor and a second portion of the disk drives having housings with a second form factor smaller than the first form factor, and an air baffle system for directing a flow of air internal the enclosure over portions of the housing of the second portion of the disk drives while at the same time creating a wall to maintain the flow of air over neighboring ones of the first portion of the disk drives (the external flow).

Abstract: In a power inverter, a coolant passage is fixed to a chassis to cool the chassis; the chassis is divided into a first region and a second region by providing the coolant passage in the chassis; a power module is provided in the first region as fixed to the coolant passage; a capacitor module is provided in the second region; and the DC terminal of the capacitor module is directly connected to the DC terminal of the power module.

Abstract: A computer system includes a circuit board assembly and a chassis. The circuit board assembly includes a circuit board and one or more heat producing components coupled to the circuit board. At least one of the heat producing components includes an exposed surface. The chassis includes one or more mounting portions that are coupled to the circuit board and support the circuit board. The chassis also includes one or more heat spreading portions. The heat spreading portions couple to exposed surfaces of one or more heat producing components on the circuit board.

Abstract: A keyboard including a case, a first fan, an air deflector and a keycap module is provided. The case includes a first side and a second side. The first side has an opening, the second side is disposed at a side of the first side and has at least one hole. The first fan is disposed at the second side and located between the first side and the second side. The air deflector is disposed between the first side and the second side of the case and corresponding to the hole of the second side and the opening of the first side. The keycap module is disposed at the opening of the first side.

Abstract: An object is to achieve a compact design by using a dead space in an inverter box effectively, to improve cooling properties of heat-generating electrical components disposed on a control circuit board of an inverter, and to increase flexibility of wiring layout. In an inverter box provided at a periphery of a housing, a heat-dissipating flat portion that is parallel to a control circuit board of an inverter is formed, and electrical components are disposed in a space between the heat-dissipating flat portion and the control circuit board. Preferably, the electrical components are installed so that the back faces thereof abut against the heat-dissipating flat portion either directly or via a heat-conducting member. More preferably, faces of the electrical components on the board side abut against the control circuit board.

Abstract: A removable vent (1) for an air ventilation system, the vent comprising: a frame (2) configured to allow the vent to be removably mounted within an opening; a grille (3) configured to allow the passage of air through the vent from a first face to a second opposing face; and a passive air flow diverter (4, 5) extending beyond the first face (7) of the vent and configured to redirect air flowing laterally across the first face to flow through the vent.

Abstract: A mounting device secures a fan module to a chassis. The mounting device includes a bracket and a spring. The bracket includes a bottom plate and a vent plate substantially perpendicular to the bottom plate. The bottom plate defines a through hole. The spring is fixed on the bottom plate adjacent to the vent plate. The spring includes an elastic portion and a securing tab protruding through the through hole. The elastic portion can retract the securing tab into the bracket.

Abstract: Enclosing arrangements of racks of computing devices fully encloses a space, either solely by the racks themselves, or in conjunction with structural features, such as walls and doors. The enclosed space can be either a hot aisle, whose hot air is vented out by fans positioned in at least one vertical extremity of the enclosed space, such as the floor, or ceiling, or it can be a cold aisle, whose cold air is pumped in by those fans. To maintain proper pressurization across a vertical cross-section of the enclosed space, specific ones of the computing devices have their fans adjusted based on their vertical position within the racks or have passive airflow adjustments, such as impedance screens. Computing devices can draw or vent air from their sides, taking advantage of the interstitial space between the racks provided by the enclosing arrangement.

Abstract: A server cooling system includes: a flex-switch with one or more flexible building bridges; one or more utility farms coupled with the flex-switch; a power distribution unit operably connected to the flex-switch; and a server POD including one or more racks operably connected to the power distribution unit. The flex-switch is configurable to include additional utility farms, one or more generator farms, and one or more UPS farms.

Abstract: A server including a rack, chassis, a power module, first copper columns, and second copper columns is provided. The rack has a front end and an opposite back end. The chassis are disposed in the rack and suitable for being pulled out from the front end. Each chassis contains a motherboard module. The power module is disposed in the rack. The first copper columns are fixed on the rack, electrically connected to the power module, and are suitable for electrically connecting an external power supply. The second copper columns are fixed on the rack and electrically connected to the power module and the motherboard modules. A high voltage from the external power supply is transmitted to the power module via the first copper columns. The power module converts the high voltage into a low voltage and transmits the low voltage to the motherboard modules via the second copper columns.

Abstract: A liquid cooling system for an electronic system includes a plurality of cooling modules that are adapted to circulate a liquid coolant therethrough. Each cooling module is configured to be coupled to a circuit board of the electronic system and placed in thermal contact with one of a plurality of heat-generating electronic components on the circuit board. The cooling system also includes a plurality of heat exchangers that are configured to dissipate heat from the liquid coolant to air. Each heat exchanger of the plurality of heat exchangers is fluidly coupled between two cooling modules of the plurality of cooling modules in a flow path of the liquid. The cooling system also includes a plurality of conduits that fluidly couple the plurality of cooling modules to the plurality of heat exchangers.

Abstract: A system for restricting mixing of air in a data center includes a plurality of racks, each of the racks having a front face and a back face. The system includes an enclosure for collecting air released from the back faces of the plurality of racks, the enclosure configured to substantially contain the air in an area between the first row and the second row and having a roof panel coupled to the first row of racks and the second row of racks configured to span a distance between the first row of racks and the second row of racks. The enclosure is configured to maintain a first air pressure inside of the enclosure that is substantially equal to a second air pressure outside the enclosure.

Abstract: A casing for sheltering electronic components (52, 83) is disclosed, comprising:—an air inlet (110) at a first position of the casing (11) and,—an air outlet at a second position of the casing (11). The air inlet (110) comprises a first plate (112) with at least one first aperture (190) therein. The inlet (110) also comprises a second plate (114) that is arranged between the first plate (112) and an inner part of the casing (11). The second plate comprises at least one second aperture (192).

Abstract: The disclosed embodiments relate to techniques for facilitating thermal transfer in a portable electronic device. This portable electronic device may include a battery pack, which includes a battery cell and enclosure material for enclosing the battery cell. This enclosure material extends beyond the enclosure for the battery cell to facilitate thermal transfer within the portable electronic device.

Abstract: The present invention generally relates to an impact and temperature resistant housing that also resists being removed from its fixed mounting position. Additionally, the present invention resists being fashioned into a weapon if it is removed from its mounted position. In general, the present invention comprises a base section, conical section, terminal support section, and corresponding center terminal.