Abstract: A heat dissipating apparatus includes a frame, an elastic body, a magnetic member and a coil. The frame has an opening. The elastic body is disposed on the frame, and the frame and the elastic body define a space. The magnetic member is located corresponding to the space and disposed at one side of the elastic body. The coil is located corresponding to the periphery of the space and disposed on the frame. An electronic device with the heat dissipating apparatus is also disclosed.

Abstract: An assembly for cooling an electronic image assembly having a rear channel placed behind the image assembly and a heat exchanger for accepting ambient air. The system contains a first fan placed within the heat exchanger to force ambient air through the heat exchanger and the rear channel. A second fan may be used to force circulating gas through an interior portion of the display housing and through the heat exchanger in order to transfer heat to the ingested ambient air.

Abstract: A display unit and a vending machine having the same. The display unit includes a display panel to display an image, a circuit board to control the display panel, a board bracket installed at a rear of the display panel and formed with a receiving section to receive the circuit board, and a plurality of inlet holes and a plurality of outlet holes formed in opposite surfaces of the board bracket to allow external air to flow through the receiving section. The air travels through the inlet and outlet holes and passes through the receiving section in one direction to cool the display panel and the circuit board. Thus, the display unit is prevented from malfunctioning and the display panel is prevented from being degraded by heat even if tempered glass is installed at a front of the display panel.

Abstract: A method and apparatus for cooling modules in a radio system is disclosed. The apparatus comprises an adaptor module with side walls and integrated heat exchanging elements. The adaptor module adapts the air flow from a chassis in the radio system such that the exiting ducting on the chassis efficiently mate with the air conduits in the modules. The adaptor allows the use of new high power density modules in the existing chassis without changing the module design. The use of adaptor module in chassis provides efficient cooling and use less volume in the chassis.

Abstract: A system for cooling various components of an electronic display. One or more heat-generating components are preferably placed in thermal communication with a plate and ribs. One or more fans are placed to draw cooling air along the ribs to remove the heat removed from the component. Some embodiments may place the electronic image assembly in thermal communication with the ribs to remove heat from the electronic image assembly. Exemplary embodiments have power modules and the electronic image assembly in thermal communication with the ribs. Conductive thermal communication is established between the ribs and the components in the exemplary embodiments.

Abstract: A heat management system may include a generally planar printed circuit board extending in a first plane, heat-generating electrical components mounted on a first side of the PCB, and an air baffle coupled to the PCB and configured to direct air flow across some of the components. The air baffle may include a generally planar air baffle body extending in a second plane parallel to and offset from the first plane of the PCB such that at least one of the components is located in an area between the air baffle body and the PCB, an opening in the generally planar body, and a generally planar wing coupled to the air baffle body at a first side of the opening and extending toward the PCB at an askew angle relative to the first plane of the air baffle body, the wing being configured to facilitate air flow through the opening.

Abstract: A cooling system for an electronics chassis includes a plurality of centrifugal blowers arranged to motivate cooling air through the electronics chassis. The centrifugal blowers are arranged in one or more sets, each having blowers oriented with respective inlets in mutual facing relationship. The orientation, positioning, and alignment of the centrifugal blowers facilitates a compact arrangement of the plurality of blowers that achieves increased aerodynamic efficiencies to reduce noise output and energy consumption.

Abstract: A display apparatus has a liquid crystal display having a display panel, a housing, a circulating fan, and an air conditioner. The housing has a sealing part. The sealing part seals around the display panel and accommodates the display panel therein, while making the display screen viewable from outside. The circulating fan circulates air along a circulation path surrounding the display panel wherein the path includes a space between the display screen and the sealing part. The air conditioner collects heat from the air circulating the circulation path and releases the heat to outside of the housing.

Abstract: A system for cooling an electronic image assembly using ambient gas. The system contains a plurality of channels place behind the electronic image assembly and preferably in conductive thermal communication with the image assembly. Ambient gas is ingested into the display housing and directed to a first manifold which distributes the ambient gas to the plurality of channels. A second manifold preferably collects the ambient gas from the channels after absorbing heat from the electronic image assembly and/or channels. The second manifold then preferably directs the ambient gas towards an exit aperture and out of the display housing. Circulating gas may also be used to cool a front portion of the electronic image assembly. A cross through plate may be used to allow the ambient gas and circulating gas to cross paths without mixing.

Abstract: A car electric equipment case module includes a housing, a covering structure, an electric equipment set, and a fan. The housing has a side wall, a containing space containing the electric equipment set and a first ventilator formed on the side wall. The covering structure includes a casing assembled to the housing and a block wall connected to the casing and extending outside the side wall to cover the first ventilator. An air channel connected the first ventilator is formed between the block wall and the side wall. The fan configured in the housing provides an air flow. The air flow flows into the containing space through the air channel and the first ventilator and flows out through a second ventilator formed on the covering structure, or flows into the containing space through the second ventilator and flows out through the first ventilator and the air channel.

Abstract: In one embodiment, the disclosure includes a telecom utility cabinet including a heat load chamber. The telecom utility cabinet also includes an air introducing duct configured to conduct air from the heat load chamber to a geothermal cooling system. The telecom utility cabinet also includes an air discharging duct configured to conduct air from the geothermal cooling system to the heat load chamber. In another embodiment, the disclosure includes a method for managing temperature in a telecom utility cabinet. The method includes introducing air from a heat load chamber to a geothermal cooling system and discharging air from the geothermal cooling system to the heat load chamber.

Abstract: A system for cooling an electronic image assembly using ambient gas. The system contains a plurality of channels place behind the electronic image assembly and preferably in conductive thermal communication with the image assembly. Ambient gas is ingested into the display housing and directed to a first manifold which distributes the ambient gas to the plurality of channels. A second manifold preferably collects the ambient gas from the channels after absorbing heat from the electronic image assembly and/or channels. The second manifold then preferably directs the ambient gas towards an exhaust aperture and out of the display housing. Circulating gas may also be used to cool a front portion of the electronic image assembly. A cross through plate may be used to allow the ambient gas and circulating gas to cross paths without mixing.

Abstract: An electronic apparatus includes: a case; a support device arranged at the case; a rotating plate articulated to the support device; a driving device; and a heat generating device. The driving device is configured to drive the rotating plate to rotate with respect to the support device; the rotating plate rotates with respect to the support device to generate airflow, the airflow is in a direction parallel to a rotation plane of the rotating plate and away from the support device; and the heat generating device is arranged at a region that the airflow flows through and heat of the heat generating is dissipated by the airflow.

Abstract: An airflow adjustment device is disclosed. The airflow adjustment device is used for a blade server provided for plugging in an interface card, and the interface card includes a bracket. The airflow adjustment device is installed in the blade server, and the airflow adjustment device includes a top cover, a plurality of sidewalls, a bracket plate, and at least one deflector. The bracket plate is used for sheltering the bracket, and air enters the blade server through the at least one deflector and at least one gap area formed by the bracket plate and at least one of the plurality of sidewalls whereby the flow resistance of the blade server is not affected by the type of the bracket.

Abstract: According to one embodiment, a display device includes a housing, a circuit board device, a fan, and a wall portion. The housing includes an exhaust port. The circuit board device is housed in the housing. The fan includes an ejection port and is housed in the housing at a position separated from the exhaust port. The fan sends cooling wind to between the circuit board device and the inner surface of the housing. The wall portion is located between the inner surface of the housing and the circuit board device, and constitutes a ventilation path from the ejection port to the exhaust port. The wall portion includes a first member located in the inner surface of the housing and a second member attached to the first member and abutting on the circuit board device. The second member has a rigidity lower than the rigidity of the first member.

Abstract: A heat dissipation apparatus for effective dissipation of heat comprises an air flow module and a heat sink. The air flow module comprises a casing, a piston module slidably mounted in the casing, an airflow outlet module attached to a first side of the casing, and an electromagnet module attached to a second side of the casing that is opposite to the first side. The airflow outlet module comprises a plurality of airflow outlet grooves. The piston module comprises a magnet. The heat sink is aligned with the plurality of airflow outlet grooves. The electromagnet module is capable of moving the magnet and the piston module back and forth in the casing. The air flow module is capable of blowing air to the heat sink via the plurality of airflow outlet grooves.

Abstract: An electronic device includes a cage and a fan module. The cage includes a mounting plate defining a ventilation hole. A positioning portion is located in the ventilation hole. A restriction is located on an inner surface of the positioning portion. The height of the restriction is such as to strictly require the fan module to be in the correct orientation when it is fitted to the electronic device.

Abstract: A mounting apparatus for expansion card comprising a chassis, a mounting frame secured to the chassis and located in a first portion of the chassis, a hull secured to the chassis and located in a second portion of the chassis opposite to the first portion, and a mounting member. The mounting member comprises an elastically deformable latching portion. The hull comprises two limiting portions and defines a positioning opening, and the mounting member is engaged in the two limiting portions and is slidable relative to the hull. The mounting member is slid to a side edge of the hull towards to the mounting frame when the elastically deformable latching portion is engaged in the positioning opening.

Abstract: A server rack system includes a rack, servers, and a heat-dissipating wall. The rack has guiding rails, a front end, and a rear end opposite to the front end. The servers slidably configured on the guiding rails and in the rack are adapted for being moved into or out of the rack from the front end. The heat-dissipating wall is pivoted to the rear end and adapted for being folded against or unfolded away from the rear end. The heat-dissipating wall includes a fan wall. Fans lie on the fan wall. The fans are adapted for sucking cool air, such that the cool air enters the rack from the front end and passes through the servers. Heat exchange between the cool air and the servers is carried out to generate hot air that flows out of the rack through the heat-dissipating wall to dissipate heat of the servers.

Abstract: A cooling apparatus for an electronics rack is provided which includes a door assembly coupled to the electronics rack at an inlet or air outlet side of the rack. The door assembly includes: an airflow opening configured to facilitate ingress or egress of airflow through the electronics rack with the door assembly mounted to the rack; an air-to-coolant heat exchanger disposed so that airflow through the airflow opening passes across the air-to-coolant heat exchanger, the air-to-coolant heat exchanger being configured to extract heat from the airflow passing thereacross; and a vapor condenser configured to facilitate condensing of dielectric fluid vapor egressing from at least one immersion-cooled electronic component section of the electronics rack. The cooling apparatus, including the door assembly, facilitates air-cooling and immersion-cooling of different electronic components of the electronics rack.

Abstract: A system and method for evaluating cooling performance of equipment in a data center, the equipment including a plurality of equipment racks and at least one cooling provider.

Abstract: A method of cooling a computer server that includes a plurality of server modules, and is positioned in an enclosed room, includes transferring heat generated by a server module of the plurality of server modules to a hot plate of a liquid cooling system. The liquid cooling system may be positioned within the server module, and the hot plate may have a surface exposed to the enclosed room. The method may also include positioning a cold plate of a room-level cooling system in thermal contact with the hot plate. The method may also include directing a cooling medium through the room-level cooling system to transfer heat from the hot plate to a cooling unit positioned outside the room.

Abstract: A cooling system includes a first group of fans, a second group of fans, and an air conducting cover. The air conducting cover includes a first partition, a second partition, a third partition. The first partition is connected between the second partition and the third partition to define a first space, a second space and a third space. Wherein the first group of fans directs air flow to enter the first space and the second space, the second group of fans directs air flow to enter the third space.

Abstract: A fan module is detachably mounted in a chassis. The chassis includes a sidewall defining a locking slot. The fan module includes a bracket including a base plate defining a first through slot, a fan fixed to the base plate, a fan duct fixed to the base plate beside the fan, and a locking member. The fan duct includes a side plate defining a second through slot. The locking member is fixed to the fan duct. The locking member includes a locking portion extending through the second through slot of the fan duct and the first through slot of the bracket to lock into the locking slot of the chassis.

Abstract: A method for controlling a motor comprises steps of: first, determining whether a switch of a motor control circuit in an electronic system is in a first state; then, operating the motor at a fanless operation mode when a temperature inside an enclosure of the electronic system is higher than zero and lower than a first threshold temperature, wherein the rotation speed of the motor is zero rpm; operating the motor at a silent operation mode when the temperature is higher than the first threshold temperature and lower than a second threshold temperature, wherein the rotation speed of the motor is a constant rotation speed; and operating the motor at a cooling operation mode when the temperature is higher than the second threshold temperature, wherein the rotation speed of the motor is a function of the temperature and varies between the constant rotation speed and a maximum rotation speed.

Abstract: According to one embodiment, an electronic apparatus is provided with a housing, a circuit board in the housing, fan blades configured to rotate and blow air in a centrifugal direction, and a casing which contains the fan blades. The casing includes an exhaust port and a cut portion which opens in a centrifugal direction different from a direction in which the exhaust port opens, from a perspective of a rotation center of the fan blades, and into which a part of the circuit board is inserted.

Abstract: A high-voltage apparatus includes a battery device, a high-voltage control device, a housing, and a cooling structure. The cooling structure includes a first cooling channel to cool the battery device, a second cooling channel to cool the high-voltage control device, a connection channel connecting the first cooling channel to the second cooling channel, and a ventilator. The connection channel has a first opening portion connected to the first cooling channel, a second opening portion connected to the second cooling channel, and an inner flow path to communicate the first opening portion to the second opening portion. A sectional area of the first opening portion and a sectional area of the second opening portion are each set to be smaller than a sectional area of the inner flow path.

Abstract: A device (230, 1330, 1430) includes: a first electrode (232); an electro-statically movable second electrode (234, 1734, 1834); and an electrically insulating layer (233) disposed between the first and second electrodes. The electro-statically movable second electrode is configured to have a first geometric configuration in response to a first electrical potential between the first and second electrodes, and is further configured to have a second geometric configuration in response to a second electrical potential between the first and second electrodes. The device is configured to receive a time-varying voltage and in response thereto the electrostatically movable second electrode is configured to repeatedly transition between the first geometric configuration and the second geometric configuration to influence a flow of a fluid (235) for cooling at least one heat-generating element (310).

Abstract: An electronic device includes a main body, two air guiding plates, and a cover. The main body includes a bottom plate and two side plates extending up from opposite sides of the bottom plate. A number of mounting tabs extend from an inner side of each side plate, arranged in a row. A circuit board is supported on the bottom plate, and includes a number of electronic components located between the two rows of mounting tabs. A cutout is defined in a top of each mounting tab. A number of hooking slots are defined in a bottom of each air guiding plate. Top walls of the hooking slots of each air guiding plate are respectively supported by bottom walls of the cutouts of the corresponding row of mounting tabs. The cover is covered on a top of the main body and abuts tops of the air guiding plates.

Abstract: An electronics module comprising a box including at least one pair of slideways to define a housing for receiving an electronics card, the slideways being fastened to two opposite faces of the box that are provided with ventilation means arranged to establish a flow of a total stream of air between the two faces. According to the invention, the electronics module includes at least one screen arranged in the housing between one of the slideways and the associated electronics card in order to define a passage for an individual stream of air in the housing.

Abstract: A heat generating component (3) is mounted on one surface of a circuit board (2). A heat release member (4) is disposed between the one surface and an opposite wall (12) of a housing (1). The heat release member (4) has a plate (41) that extends in a specified direction and is in contact with the heat generating component (3), and fins (42) that project from the plate (41) toward the opposite wall (12). In a region of the opposite wall (12) of the housing overlapping with the heat release member (4), an air inlet (1c) is provided so as to extend in the specified direction. The heat release member (4) is, at both end portions thereof in the specified direction, in contact with the opposite wall (12) via heat-conductive spacers (9), and a gap (8) is formed between the fins (42) and the opposite wall (12).

Abstract: The invention generally relates to ventilation systems, and more particularly to selectively configurable climate control systems for use in data centers and the like. A system includes a first structural element and a second structural element spaced apart from first structural element to define a space between the first and second structural elements. The system also includes partitions moveable into the space between the first and second structural elements and a controller arranged to control movement of the partitions.

Abstract: A method for cooling an electronic device having first and second flow paths for transmitting a coolant. The method includes assessing a merit of impelling the coolant along the first flow path relative to impelling the coolant along the second flow path. When the relative merit is above a threshold, coolant is impelled along the first flow path. When the relative merit is below the threshold, coolant is impelled along the second flow path.

Abstract: Resistivity to dust and cooling performance are improved by a simple structure. Electronic apparatus (image display apparatus) 1 includes: housing 31 that forms sealed inner space 33; circuit unit 39 that is provided in inner space 33; first partition plate 34 that is provided in inner space 33 and that has upper/lower partition portion 7, wherein upper/lower partition portion 7 at least partially extends in a lateral direction extending above at least a part of circuit unit 39 and that terminates in front of both lateral sides of housing 31; and first fan 5, 6 that is provided through upper/lower partition portion 7.

Abstract: A cooling system comprises an electronics module and a duct. The electronics module produces more heat at a first location than at a second location, and is rated to a safe operating temperature. The duct surrounds the electronics module, and has a shaped baffle with a constricted region near the first location and an open region near the second location. The expanded region has greater cross-sectional flow area than the constricted region. Airflow through the duct cools both the first location and the second location to within an efficiency margin below the safe operating temperature.

Abstract: An electronic display which can be mounted above a paved surface in an outdoor environment. A surface or plate is placed behind the electronic display to define a gap where cooling air can be drawn through said gap in order to cool the electronic display. A plurality of ribs may be placed within the gap and in thermal communication with the electronic display. The density of the ribs may be varied according to the inlet and exhaust openings for the cooling air. The ribs may be placed at a higher density near the exhaust to account for the increase in temperature of the cooling air as it travels through the gap.

Abstract: An electronic apparatus includes a body frame, a rear frame which is pivotably attached to the body frame, a hole which is formed in a front wall of the body frame, a first heat dissipating member which is placed on the front wall to cover the hole, a thermal conductive member which contacts a portion of the first heat dissipating member at a storage space side and is placed in the hole, a semiconductor chip which is placed on the rear frame, and a second heat dissipating member which is placed on the rear frame to be in contact with the semiconductor chip and receive heat from the semiconductor chip. The second heat dissipating member being in contact with the thermal conductive member in the storage space when the rear frame closes an opening at the rear side of the body frame.

Abstract: An apparatus includes a chassis that further includes at least one receiving buttress. The chassis defines an enclosure, and the at least one buttress protrudes a portion of a first electronic device outside the enclosure by preventing further insertion of the first electronic device into the enclosure.

Abstract: An electronic device is provided that includes a base having a top portion and a bottom portion. The bottom portion may include a first bottom part and a second bottom part. The first bottom part may form a first plane, and the second bottom part may form a second plane, the second plane being non-planar with the first plane. The second bottom part may include an input opening. The top portion of the base may include an output opening. The input opening and the output opening may allow air to flow from behind the electronic device to over the base.

Abstract: An electronic device including a fan unit capable of setting an air blowing direction toward any of an interface plate side of a casing and a back plate side opposite to the interface plate; a power supply unit; a first housing portion capable of housing the power supply unit and provided within the casing to be close to the back plate; a second housing portion capable of housing the power supply unit and provided within the casing to be close to the interface plate; a detection portion that detects the air blowing direction of the fan unit and a position where the power supply unit is housed; and a warning portion that operates based on the detection portion to give a warning in a case where the air blowing direction of the fan unit is different from the side where the casing houses the power supply unit.

Abstract: The present application provides for an enclosure for mounting electrical components therein. The enclosure may include a base, a roof, a number of side walls, and one or more support ducts extending from the base to the roof. The supports ducts may include an air channel therein extending from the base to the roof.

Abstract: A cooling apparatus for an electronics rack is provided which includes an air-to-liquid heat exchanger, one or more coolant-cooled structures and a tube. The heat exchanger, which is associated with the electronics rack and disposed to cool air passing through the rack, includes a plurality of distinct, coolant-carrying tube sections, each tube section having a coolant inlet and a coolant outlet, one of which is coupled in fluid communication with a coolant loop to facilitate flow of coolant through the tube section. The coolant-cooled structure(s) is in thermal contact with an electronic component(s) of the rack, and facilitates transfer of heat from the component(s) to the coolant. The tube connects in fluid communication one coolant-cooled structure and the other of the coolant inlet or outlet of the one tube section, and facilitates flow of coolant directly between that coolant-carrying tube section of the heat exchanger and the coolant-cooled structure.

Abstract: A thermally-managed electronic device, such as a heat-generating lamp or microelectronic assembly, takes advantage of the latent heat of phase-change within a heat pipe and functions in cooperation with a plurality of heat-radiating elements to enhance heat removal capacity from a heat source. The device, which may be provided in a natural convection or forced air convection embodiment, improves the heat removal on the cold side of the heat pipe by providing a much larger heat-radiating surface area in the form of a plurality of heat-radiating elements that are each thermally connected by means of one or more thermal connecting elements.

Abstract: Cooling apparatuses, electronic device assemblies, and cooling assemblies having a magnetic shape memory member are disclosed. In one embodiment, a cooling apparatus includes a first compliant member, a magnetic shape memory member, a magnetic field generating device, a second compliant member and a fan member. A first end of the magnetic shape memory member is coupled to the first compliant member. The magnetic field generating device is positioned proximate the magnetic shape memory member, and generates a magnetic field toward the magnetic shape memory member to cause the magnetic shape memory member to expand along a linear translation axis. Expansion of the magnetic shape memory member causes an actuated portion of the second compliant member to translate about an axis. The fan member is coupled to the actuated portion of the compliant member such that translation of the actuated portion translates the fan member.

Abstract: An embodiment includes a transparent sash mounted integral to the perforated doors on racks which hold computer servers typically installed in data centers. The racks are arrayed in rows forming cold aisles and hot aisles. Cooled air introduced into the cold aisle flows through the racks and cools the servers, and subsequently is removed from the hot aisle. Embodiment sashes slide vertically and extend above the tops of the racks and form a sealing relationship with the data center ceiling and adjacent sashes, thereby preventing wasteful mixing and recirculation of cooled and heated air over the tops of the racks. Embodiments are raised and lowered manually or automatically. The controls for the movement of the sashes are tied to the building automation and fire alarm systems and the sashes are lowered automatically upon activation of the data center fire suppression system, thereby complying with code requirements and avoiding interference with the fire sprinkler and suppression systems.

Abstract: An apparatus includes a thermally conductive section with a side facing approximately parallel to an axis and adapted to be thermally coupled to a circuit component, and includes a fluid supply section which directs a fluid flow along the axis toward an opposite side of the thermally conductive section. The thermally conductive section splits the fluid flow into a plurality of flow portions which each flow through the thermally conductive section in a direction approximately parallel to a plane perpendicular to the axis, the flow portions exiting the thermally conductive section at a plurality of respective locations disposed along a substantial portion of the periphery of the thermally conductive section.

Abstract: A system for an electronic device includes a housing having one or more walls that define an internal region. An outlet port is fluidically coupled to the internal region of the housing, which allows emission of a fluid from the internal region of the housing as a first flow at a first temperature. A merging element, fluidically coupled to the outlet port, merges the first flow with a second flow, which has a second temperature that is less than the first temperature.

Abstract: A computer data center system includes stacks of computers, each of the stacks computer motherboard assemblies arranged vertically with respect to one another, a first row of stacks, the row defined by stacks arranged adjacent to each other in a horizontal line of stacks, and a cool air supply plenum adjacent to the first row of stacks. The cool air supply plenum supplies cool air to a first side of the first row of stacks for cooling computers placed in the stacks, and has a longitudinal axis substantially parallel with an average air flow of cooling air in the plenum. Computer assemblies in the first row of stacks include portions that are closer to the longitudinal axis of the cool air supply plenum than other portions of the same assemblies, or portions of adjacent computer assemblies that are closest to the longitudinal axis for the adjacent assemblies.

Abstract: An electronic device includes a first housing with a first air inlet and outlet, a heat dissipation assembly, and a filter structure between the first housing and the heat dissipation assembly. The heat dissipation assembly defines a second air inlet and outlet. The first air inlet, the second air inlet, the second air outlet and the first air outlet communicate with each other. The heat dissipation assembly draws air across itself from the two air inlets, and expels the air from the two air outlets. The filter structure covers the second air inlet and defines a plurality of very small holes which function to filter dust out from the incoming air.

Abstract: An electric connection box according to the present invention can include a circuit board having a first surface capable of mounting an electronic component, and a second surface defining a non-mounting surface, a case housing the circuit board, the circuit board oriented in a substantially vertical direction, a vertical inner wall surface of the case formed opposite the non-mounting surface of said circuit board, the vertical inner wall and the non-mounting surface of said circuit board defining a substantially vertical air ventilation path, a suction port positioned in the case and in communication with the ventilation path, an exhaust port positioned in the case above said suction port and in communication with the ventilation path, and a heat generating component in communication with the ventilation path.