Abstract: An electric equipment includes: an electric component box; a control board accommodated in the electric component box and provided thereon with a heat-generating electric component; a heat sink thermally connected with the electric component; and a sheet material provided between the electric component box and the control board, wherein the sheet material is made of an elastic material and provided with an opening section through which the heat sink projects outward, the opening section is provided with a convex section formed integrally with the sheet material and configured to be elastically deformed to engage the sheet material with the heat sink, and the electric component box is provided with a heat sink hole through which the heat sink and the convex section project outward of the electric component box. An air conditioner is provided with such electric equipment.

Abstract: An air-cooling method is provided which includes providing a heat exchanger door and a catch bracket. The door is hingedly mounted to the air inlet or outlet side of an electronics rack, and includes: a door frame spanning at least a portion of the air inlet or outlet side of the rack, wherein the frame includes an airflow opening which facilitates airflow through the rack; an air-to-coolant heat exchanger supported by the door frame and disposed so that airflow through the airflow opening passes thereacross; and a door latch mechanism to selectively latch the heat exchanger door to the rack. The catch bracket is attached to the rack and sized to extend from the rack into the heat exchanger door through a catch opening, and the door latch mechanism is configured and mounted within the heat exchanger door to physically engage the catch bracket within the heat exchanger door.

Abstract: A system for cooling an electronic image assembly using a heat exchanger with an internal fan assembly. Circulating gas may also be used to cool a front portion of the electronic image assembly or any other internal cavity of the electronic display housing. The circulating gas may be drawn through a heat exchanger so that heat may be transferred to an ambient gas. The heat exchanger may have an internal fan assembly for drawing ambient air through the heat exchanger and exhausting it out of the display housing. The heat exchanger may be divided into two portions so that the fan assembly is placed between the two portions.

Abstract: A server cooling device is described that includes an enclosure defining an interior space and at least one server rack port configured to engage a rack such that one or more rack mounted units installed in the rack interface with the interior space. The server cooling device also includes a mixing chamber including one or more cooling coils that is connected to the interior space defined by the enclosure.

Abstract: An electronic apparatus includes a chassis and a heat dissipation module. The chassis includes a first panel, a second panel substantially parallel to the first panel, and a motherboard attached on the first panel and located between the first panel and the second panel. The heat dissipation module is attached on the motherboard and includes a fan with a cover, a first fin assembly attached to a first side of the fan, and a second fin assembly attached to a second side of the fan. The cover includes a main plate with an opening and a resisting flange extending slantwise from an edge of the opening. A portion of the first fin assembly is exposed by the opening. The resisting flange resists against the second panel to keep the main plate away from the second panel.

Abstract: A drive system for a grid blower of a vehicle is provided. The system includes: an electrical bus, a grid of resistive elements connected to the electrical bus, the grid of resistive elements configured to thermally dissipate electrical power generated from braking of the vehicle, the electrical power being transmitted on the electrical bus to the grid of resistive elements, an electrical power modulation device configured to modify electrical power received from at least one of the electrical bus and the grid of resistive elements, and a grid blower motor coupled to an output of the electrical power modulation device, wherein a speed of the grid blower motor varies based on the electrical power that has been modified by the electrical power modulation device.

Abstract: An improved electronic communications system and process 100 with front to back cooling can be provided in which the flow of influent cooling air can be directed horizontally through an intake cooling plenum chamber 145-146 positioned above or below line cards 127-129 and then passed downwardly through an inlet side cooling plenum 139-141. The cooling air can thereafter be propelled sideways, laterally and horizontally across passageways 138 between the line cards to remove heat generated by the line cards. The effluent heated air can be passed upwardly through an outlet side cooling plenum 142-144 and can be discharged through an exhaust cooling plenum to chamber 147-148 which can be diagonally separated from the intake cooling plenum chamber 145-146 by a fluid-impermeable plate 149-151.

Abstract: A thermal management component for a Rechargeable Energy Storage Systems (RESS) assembly and a method of managing the temperature of a RESS battery module using the component are disclosed. The thermal management component comprises (i) a frame having a chamber defined therein; and (ii) a heat exchange plate in mechanical communication with at least a portion of the frame. The method comprises (a) providing a thermal management component as described herein; and (b) circulating at least one heat transfer fluid through said component.

Abstract: A heat exchanger includes a plurality of mini-channel tubes. The mini-channel tubes extends for an axial length defined between two manifolds. The mini-channel tubes include a plurality of generally rectangular flow passages. The generally rectangular flow passages are aligned adjacent to each other to define a lateral dimension. A first lateral width of the generally rectangular passages is defined with a ratio of the axial length to the first lateral width being between 201.3 and 215.3. An aircraft system is also disclosed.

Abstract: A system is provided in one example embodiment that includes at least one rack for electronic equipment, each rack including: at least one sensor configured to measure an environmental condition, an air conditioning system, an ingress port configured to allow air to flow into a corresponding rack from an environment surrounding the racks, and an egress port configured to allow air to flow out of a corresponding rack and into the environment surrounding the racks. The system also includes a housing that surrounds the racks and that defines the environment surrounding the racks. The air that flows out through the egress ports of the racks conditions the air in the environment surrounding the racks.

Abstract: A power pole inverter is provided. The power pole inverter includes a housing assembly, a capacitor assembly, a number of arm assemblies, a number of heat sinks, and a support assembly. The housing assembly includes a number of sidewalk. The housing assembly sidewalls defining an enclosed space. The capacitor assembly is coupled to the housing assembly. Each arm assembly includes a plurality of electrical components and a number of electrical buses. Each the electrical bus includes a body with terminals, each the terminal structured to be coupled to, and in electrical communication with, the capacitor assembly, each arm assembly including a neutral terminal. Each arm assembly is coupled to, and in electrical communication with, the capacitor assembly. The support assembly includes a non-conductive frame assembly. The support assembly is structured to support each the heat sink in isolation.

Abstract: Examples disclose a removable air guide assembly with a processor air cooler to direct air over a processor on a circuit board, the processor air cooler is not directly aligned over the processor. Further, the examples provide the removable airflow guide assembly with memory bank coolers to direct air over memory banks also positioned on the circuit board. Additionally, the examples also disclose the removable airflow guide assembly with a connector socket to align with the circuit board and provide power to the processor air cooler and the memory bank coolers.

Abstract: A system for cooling an electronic image assembly using a heat exchanger with an internal fan assembly. Circulating gas may also be used to cool a front portion of the electronic image assembly or any other internal cavity of the electronic display housing. The circulating gas may be drawn through a heat exchanger so that heat may be transferred to an ambient gas. The heat exchanger may have an internal fan assembly for drawing ambient air through the heat exchanger and exhausting it out of the display housing. The heat exchanger may be divided into two portions so that the fan assembly is placed between the two portions.

Abstract: An air-cooling apparatus is provided which includes a securing mechanism for holding two or more separate electronics racks in fixed relation adjacent to each other, and a multi-rack door sized and configured to span the air inlet or air outlet sides of the racks. The securing mechanism holds the electronics racks in fixed relation with their air inlet sides facing a first direction, and air outlet sides facing a second direction. The door includes a door frame with an airflow opening. The airflow opening facilitates the ingress or egress of airflow through the electronics racks, and the door further includes an air-to-liquid heat exchanger supported by the door frame, and disposed so that air flowing through the airflow opening passes across the heat exchanger. In operation, the heat exchanger extracts heat from the air passing through the separate electronics racks.

Abstract: The electronic device enclosure includes a case and a cooling assembly. The case includes a top plate, a bottom plate, a side plate and a mounting plate. The top plate is opposite to the bottom plate, and the side plate is substantially perpendicularly connected to the top plate and the bottom plate. The cooling assembly includes a cooler and a fan secured to the cooler. The mounting plate is secured to the top plate and the bottom plate, the fan is secured to the mounting plate and located between the mounting plate and the cooler.

Abstract: According to one embodiment, a liquid cooling type power conversion apparatus is provided. The liquid cooling type power conversion apparatus has a power conversion apparatus and a cooling apparatus which are provided in an engine room of a railway vehicle, an electric component and a plurality of semiconductor devices which are provided in the power conversion apparatus, a third heat exchanger located between the electric component and an electric blower, a cooling body on which the plurality of the semiconductor devices are mounted, a first heat exchanger provided in the cooling apparatus, a second heat exchanger provided in the cooling apparatus having a size smaller than the first heat exchanger 111b, a piping to connect the third heat exchanger 5 and the second heat exchanger, and a piping to connect the cooling body and the first heat exchanger.

Abstract: Embodiments of the present invention include a cooling system and method for cooling a computer rack by circulating liquid coolant through different sections of a rack heat exchanger under separately controlled flow and temperature conditions. In a method according to one embodiment, a first liquid coolant is supplied to a first section of an air-to-liquid heat exchanger. A second liquid coolant is supplied to a second section of the air-to-liquid heat exchanger at a different temperature than the first liquid coolant. Airflow is generated through rack-mounted computer components to the first and second sections of the air-to-liquid heat exchanger. The flow rates of the first and second liquid coolants are independently controlled to enforce a target cooling parameter. The independent operation of the first and second fin tube sections allows for the increased use of un-chilled water without sacrificing heat removal objectives.

Abstract: An apparatus for controlling grille aperture ratios of a plurality of air transfer grilles which are installed in a room, includes a determining unit for determining target grille air volumes of air blowing to the racks, for determining simulation air volumes of air blowing from the air transfer grilles on the basis of the target grille air volumes so that each of air of the target grille air volumes are blown to the racks, and for determining grille aperture ratios for each of the air transfer grilles on the basis of the plurality of simulation air volumes so that each of the amounts of air blowing from the air transfer grilles is replaced by each of the simulation air volumes, and a controller for controlling each of the grille aperture ratios of the air transfer grilles on the basis of each of the determined grille aperture ratios.

Abstract: A display apparatus has a liquid crystal display having a display panel, a housing, a circulating fan, and an air conditioner. The housing has a sealing part. The sealing part seals around the display panel and accommodates the display panel therein, while making the display screen viewable from outside. The circulating fan circulates air along a circulation path surrounding the display panel wherein the path includes a space between the display screen and the sealing part. The air conditioner collects heat from the air circulating the circulation path and releases the heat to outside of the housing.

Abstract: A container data center is disclosed in the present invention, relating to the field of data centers. The container data center includes: a container box, in which the inside of the box is divided into an equipment compartment, a power supply and distribution compartment and a water chilling set compartment; doors set in the box; a power supply equipment installed in the power supply and distribution compartment; an electronic equipment and a water chilling terminal installed in the equipment compartment; a water chilling set installed in the water chilling set compartment, in which the water chilling set is in communication with the water chilling terminal to provide cold water for the water chilling terminal.

Abstract: Apparatuses, methods, and systems directed to efficient cooling of data centers. Some embodiments of the invention allow encapsulation of cold rows through an enclosure and allow one or more fans to draw cold air from the cold row encapsulation structure to cool servers installed on the server racks. In other particular embodiments, the systems disclosed can be used to mix outside cool air into the cold row encapsulation structure to cool the servers. In some embodiments, the present invention involves fanless servers installed on the server racks and introduces fan units to draw cooling air from the cold row encapsulation structure through the fanless servers on the racks.

Abstract: A system for cooling an electronic image assembly using ambient gas. The system contains a plurality of channels place behind the electronic image assembly and preferably in conductive thermal communication with the image assembly. Ambient gas is ingested into the display housing and directed to a first manifold which distributes the ambient gas to the plurality of channels. A second manifold preferably collects the ambient gas from the channels after absorbing heat from the electronic image assembly and/or channels. The second manifold then preferably directs the ambient gas towards an exit aperture and out of the display housing. Circulating gas may also be used to cool a front portion of the electronic image assembly. A cross through plate may be used to allow the ambient gas and circulating gas to cross paths without mixing.

Abstract: A system for cooling an electronic image assembly using ambient gas. The system contains a plurality of channels place behind the electronic image assembly and preferably in conductive thermal communication with the image assembly. Ambient gas is ingested into the display housing and directed to a first manifold which distributes the ambient gas to the plurality of channels. A second manifold preferably collects the ambient gas from the channels after absorbing heat from the electronic image assembly and/or channels. The second manifold then preferably directs the ambient gas towards an exhaust aperture and out of the display housing. Circulating gas may also be used to cool a front portion of the electronic image assembly. A cross through plate may be used to allow the ambient gas and circulating gas to cross paths without mixing.

Abstract: In one embodiment, the disclosure includes a telecom utility cabinet including a heat load chamber. The telecom utility cabinet also includes an air introducing duct configured to conduct air from the heat load chamber to a geothermal cooling system. The telecom utility cabinet also includes an air discharging duct configured to conduct air from the geothermal cooling system to the heat load chamber. In another embodiment, the disclosure includes a method for managing temperature in a telecom utility cabinet. The method includes introducing air from a heat load chamber to a geothermal cooling system and discharging air from the geothermal cooling system to the heat load chamber.

Abstract: A method of cooling a computer server that includes a plurality of server modules, and is positioned in an enclosed room, includes transferring heat generated by a server module of the plurality of server modules to a hot plate of a liquid cooling system. The liquid cooling system may be positioned within the server module, and the hot plate may have a surface exposed to the enclosed room. The method may also include positioning a cold plate of a room-level cooling system in thermal contact with the hot plate. The method may also include directing a cooling medium through the room-level cooling system to transfer heat from the hot plate to a cooling unit positioned outside the room.

Abstract: An apparatus for cooling of a substantially closed space, in particular a data center, where continuous or intermittent heat is produced by at least one heat source, with recirculation air, includes a heat exchanger with a first set of ducts and a second set of ducts, each set of ducts having an in- and outlet. The in- and outlet of the first set of ducts are connected to the space to form a first recirculation path, and the in- and outlet of the second set of ducts are connected to an environment of the space to form a second recirculation path. The heat exchanger is a plate heat exchanger.

Abstract: A cooling apparatus for an electronics rack is provided which includes a door assembly configured to couple to an air inlet side of the electronics rack. The door assembly includes: one or more airflow openings facilitating passage of airflow through the door assembly and into the electronics rack; one or more air-to-coolant heat exchangers disposed so that airflow through the airflow opening(s) passes across the heat exchanger(s), which is configured to extract heat from airflow passing thereacross; and one or more airflow redistributors disposed in a direction of airflow through the airflow opening(s) downstream of, and at least partially aligned to, the heat exchanger(s). The airflow redistributor(s) facilitates redistribution of the airflow passing across the air-to-liquid heat exchanger(s) to a desired airflow pattern at the air inlet side of the electronics rack, such as a uniform airflow distribution across the air inlet side of the rack.

Abstract: A display apparatus includes a liquid crystal display having a display panel, a housing, and a plurality of heat pipes. The housing has a sealing part and has aeration paths. The sealing part seals the display panel to box the display panel therein, while making a display screen of the display panel viewable from outside. The aeration paths are arranged outside the sealing part and communicate with the outside of the housing. The heat pipes extend from a rear surface of the display panel to the aeration paths.

Abstract: A method of cooling a computer server that includes a plurality of server modules, and is positioned in an enclosed room, includes transferring heat generated by a server module of the plurality of server modules to a hot plate of a liquid cooling system. The liquid cooling system may be positioned within the server module, and the hot plate may have a surface exposed to the enclosed room. The method may also include positioning a cold plate of a room-level cooling system in thermal contact with the hot plate. The method may also include directing a cooling medium through the room-level cooling system to transfer heat from the hot plate to a cooling unit positioned outside the room.

Abstract: A cooling unit is provided to facilitate cooling of coolant passing through a coolant loop. The cooling unit includes one or more heat rejection units and an elevated coolant tank. The heat rejection unit(s) rejects heat from coolant passing through the coolant loop to air passing across the heat rejection unit. The heat rejection unit(s) includes one or more heat exchange assemblies coupled to the coolant loop for at least a portion of coolant to pass through the one or more heat exchange assemblies. The elevated coolant tank, which is elevated above at least a portion of the coolant loop, is coupled in fluid communication with the one or more heat exchange assemblies of the heat rejection unit(s), and facilitates return of coolant to the coolant loop at a substantially constant pressure.

Abstract: A cooling assembly for an electronic image assembly having an open and closed gaseous loop. A closed gaseous loop allows circulating gas to travel across the front surface of an image assembly and through a heat exchanger. An open loop allows ambient gas to pass through the heat exchanger and extract heat from the circulating gas. An optional additional open loop may be used to cool the back portion of the image assembly (optionally a backlight). Ribs may be placed within the optional additional open loop to facilitate the heat transfer to the ambient gas. The cooling assembly can be used with any type of electronic assembly for producing an image.

Abstract: An electronic apparatus includes a housing, a fan module, a heat-dissipating module, and a channel. The housing includes a first heat-dissipating vent and a second heat-dissipating vent. The fan module is disposed in the housing and includes a first outlet and a second outlet. The first outlet is substantially aligned with the first heat-dissipating vent and has a first airflow. The second outlet has a second airflow. The heat-dissipating module is disposed in the housing between the first outlet and the first heat-dissipating vent. The channel is located between the second outlet and the second heat-dissipating vent for guiding the second airflow out of the housing from the second heat-dissipating vent. The temperature of the first heat-dissipating vent is higher than that of the second heat-dissipating vent.

Abstract: An electronics enclosure has a blower and diffuser received within an enclosure. Electronic components are also received within the enclosure. The blower diffuser is positioned in contact with at least one of the electronic components. A shroud surrounds the blower diffuser and the at least one electronic component, and is spaced from an outer surface of the at least one electronic component. An opening is formed through the shroud, such that air can be driven within the shroud from the blower diffuser, and across at least one electronic component, and then outwardly of the opening. A heat exchanger is positioned in the path of air leaving the opening.

Abstract: A storage device testing system that includes at least one rack, test slots housed by each rack, and at least one air mover in pneumatic communication with the test slots. Each test slot includes a test slot housing having an entrance and an exit, with the entrance configured to receive a storage device. The at least one air mover is configured to move air exterior to the racks into the entrance of each test slot housing, over the received storage device, and out of the exit of each test slot housing.

Abstract: Heat exchanger. The heat exchanger includes a thermal contact plate defining a cavity in fluid communication with a first pipe and a plurality of stationary elements substantially perpendicular to the first pipe each defining a cavity wherein each cavity is in fluid communication with the first pipe and at least one cavity includes a wick. A plurality of movable elements are provided wherein the movable elements and the stationary elements are substantially parallel, alternatingly arranged and a portion of the movable elements overlaps a portion of the stationary elements. A working fluid is provided in the first pipe and cavities or stationary elements and thermal contact plate.

Abstract: A printing apparatus comprises a paper path adjacent a media supply. The paper path moves printing media from the media supply through the printing apparatus. Also, a marking engine is positioned adjacent the paper path, and the paper path supplies the printing media to said marking engine. The marking engine prints marking material on the printing media in a printing process, and the printing process generates vapors and ultrafine particles. The printing apparatus includes ducting adjacent the paper path and the marking engine. A fan is positioned within the ducting. The fan moves the vapors and ultrafine particles from around the paper path and the marking engine into the ducting. Further, at least one condensation unit is located within the ducting. The condensation unit is maintained at a temperature sufficient to condense and collect the vapors and ultrafine particles.

Abstract: A cooling system is used for cooling an electronic apparatus in an electronic device. The electronic device includes a top wall, a bottom wall, a first sidewall, and a second sidewall. The electronic apparatus is supported on a middle of the bottom plate. The cooling system includes an evaporator, a fan, a condenser, a heat sink attached to the condenser, and a refrigerant pipe connected between the condenser and the evaporator. The heat sink and the condenser are set on an inner surface of the first sidewall. The fan is set on the first sidewall and aligns with the heat sink. The condenser operates to cool refrigerant and transfers the cooled refrigerant to the evaporator. A first airflow cooled by and coming from the evaporator flows through the electronic apparatus and the condenser to cool the electronic apparatus and the condenser, and is then vented through the fan.

Abstract: A cooling assembly for an electronic image assembly having an open and closed gaseous loop. A closed gaseous loop allows circulating gas to travel across the front surface of an image assembly and through a heat exchanger. An open loop allows ambient gas to pass through the heat exchanger and extract heat from the circulating gas. An optional additional open loop may be used to cool the back portion of the image assembly (optionally a backlight). Ribs may be placed within the optional additional open loop to facilitate the heat transfer to the ambient gas. The cooling assembly can be used with any type of electronic assembly for producing an image.

Abstract: A cooling system for a server includes at least one radiator and at least one cooling plate that are installed in a server cabinet, a cooling assembly, a storage tank, and a heat exchanger. The cooling assembly is connected to the radiator, and is carried with a first cooling fluid therein. The storage tank is connected to the cooling plate, and is carried with a second cooling fluid therein. The first cooling fluid enters the heat exchanger through the radiator, and the second cooling fluid enters the heat exchanger through the cooling plate. The first cooling fluid and the second cooling fluid perform heat exchange in the heat exchanger, so as to reduce the temperature of the second cooling fluid, thus reducing the required energy enabling the second cooling fluid to return to a set temperature.

Abstract: An information handling system (IHS) cooling system includes an IHS chassis defining an IHS chassis air inlet. A cooling chassis supports the IHS chassis on a support base. An air supply duct extends from the cooling chassis such that an air supply duct outlet on the air supply duct is immediately adjacent the IHS chassis air inlet. An air cooling subsystem is located in the cooling chassis and is operable to cool air that is drawn into the cooling chassis and supply the cooled air to the IHS chassis air inlet through the air supply duct. The IHS chassis may be a conventional IHS chassis that is designed for sub-35 degree Celsius ambient temperatures, and the cooling chassis may be provided for the conventional IHS chassis when used in extreme environments with high ambient temperatures above 35 degrees Celsius.

Abstract: An exemplary electronic device includes an electronic component, a heat dissipation device, a casing, and a heat insulation layer. The heat dissipation device is positioned on the electronic component for dissipating heat generated by the electronic component. The electronic component and the heat dissipation device are located at an inner side of the casing. The heat insulation layer is located on the heat dissipation device and is close to the casing. The heat insulation layer is made of aerogel material.

Abstract: A system for transferring heat from an electrical enclosure is provided. An electrical enclosure defines a housing area in which one or more electrical devices are housed. A heat pump extends through the electrical enclosure, the heat pump defining a channel configured to communicate fluid for transferring heat from the one or more electrical devices. The electrical enclosure is substantially sealed from the heat pump channel and from other areas outside the electrical enclosure.

Abstract: To cool a blade type server disposed in an air-conditioned room, the following arrangements are made. The first is at least one shell having a ventilation passage disposed in the air-conditioned room. The second is, the following are disposed in a ventilation passage: racks, in which blade type servers each composed of a case with slim boards housed therein are stacked; cooling coils each having a coolant passage and a cooling fin and cooling a passing air; and at least one fan unit having axial-flow fans placed therein and producing air currents in one direction. The third is the fan unit forces a cooling air to flow in one direction in the ventilation passage thereby to cool the servers in the racks. The cooling coils and racks are disposed alternately so that warmed cooling air after passing through the rack is cooled by the cooling coil and then cools the next rack.

Abstract: The disclosed embodiments provide a component for a portable electronic device. The component includes a gasket containing a rigid portion disposed around a bottom of a heat pipe, wherein the rigid portion forms a duct between a fan and an exhaust vent of the electronic device. The gasket also includes a first flexible portion bonded to the rigid portion, wherein the first flexible portion comprises a flap that is open during assembly of the heat pipe in the electronic device and closed over the heat pipe and the rigid portion to seal the duct around the heat pipe after the assembly.

Abstract: The present invention provides a cooling device for rack-type electronic equipment. The rack-type electronic equipment is provided with electronic circuit devices having different heating quantities inside an enclosure, and the cooling device has multiple heat pipes for cooling the rack-type electronic equipment. A condenser unit is provided on the upper surface of the enclosure, an evaporator is provided on the back surface of the enclosure, and each electronic circuit device having a different heating quantity is cooled by means of the heat pipes.

Abstract: A cooling assembly for a dual electronic image assembly having an open and closed gaseous loop. A closed gaseous loop allows circulating gas to travel across the front surface of a pair of electronic image assemblies and through a heat exchanger. An open loop allows ambient gas to pass through the heat exchanger and extract heat from the circulating gas. An optional additional open loop may be used to cool the back portion of the electronic image assembly (optionally a backlight). The cooling assembly can be used with any type of electronic assembly for producing an image. Some embodiments use cross-flow heat exchangers comprised of corrugated plastic.

Abstract: An electronic apparatus includes a fan, a circuit board which is positioned downstream in an airflow to which the fan generates, at least one processer mounted on the circuit board, a radiator which is positioned downstream in the airflow which the fan generates, the radiator cooling a liquid coolant, a pipe unit which includes a heat receiving member in which the coolant flows and coolant piping, the heat receiving member being mounted on the processer, and the coolant piping circulating the liquid coolant between the radiator and the heat receiving member, and at least one memory board on which memory package is mounted, the memory board being mounted on the circuit board, and the memory board and the pipe unit being arranged along a direction perpendicular to a direction to which the fan blows the airflow.

Abstract: A heat exchanger system having an IT container having an inner chamber containing the media from which heat is to be pulled, and further having an outer surface to which is attached corrugated columns of thermally conducting material, cooling water pipes through the corrugated columns supplied with cooling water, at least the outer surface of the container and the corrugated columns is composed of metal and the outer surface of the container is separated from the inner surface by insulator material. It also contains a temperature monitor and controller for controlling the cooling system based upon the environment temperature to save energy.

Abstract: Electronic equipment includes a body case, a control unit, a partition board, and a heat exchanger attached to the partition board. The heat exchanger includes a hot-air passage for carrying hot air heated in the body case; a first blower for blowing the hot air into the hot-air passage; a cool-air passage for carrying cooling air from outside the body case, the cooling air being lower in temperature than the hot air; and a second blower for blowing the cooling air into the cool-air passage.

Abstract: Computer systems with air cooling systems and associated methods are disclosed herein. In several embodiments, a computer system can include a computer cabinet holding multiple computer modules, and an air mover positioned in the computer cabinet. The computer system can also include an airflow restrictor positioned proximate to an air outlet of the computer cabinet, and an overhead heat exchanger mated to the computer cabinet proximate to the air outlet.