Abstract: To cool a blade type server disposed in an air-conditioned room, the following arrangements are made. The first is at least one shell having a ventilation passage disposed in the air-conditioned room. The second is, the following are disposed in a ventilation passage: racks, in which blade type servers each composed of a case with slim boards housed therein are stacked; cooling coils each having a coolant passage and a cooling fin and cooling a passing air; and at least one fan unit having axial-flow fans placed therein and producing air currents in one direction. The third is the fan unit forces a cooling air to flow in one direction in the ventilation passage thereby to cool the servers in the racks. The cooling coils and racks are disposed alternately so that warmed cooling air after passing through the rack is cooled by the cooling coil and then cools the next rack.

Abstract: A system for attaching liquid cooling apparatus includes a fan, a chassis and a grill. The chassis is configured to house electronic components in an interior volume and has an air flow opening large enough to receive the fan. The grill is configured to be fastened to the fan and to the chassis such that, when the grill is so fastened, the fan is disposed at least partially in the interior volume and the grill substantially covers the air flow opening. At least one recess is formed either in the chassis or the grill such that a coolant conduit may be inserted into the recess when the grill is not fastened to the chassis and the coolant conduit is confined within the recess when the grill is fastened to the chassis.

Abstract: A display device according to the present invention comprises a display panel, a housing sealing around the display panel and making a display screen of the display panel viewable from outside, and a heat exchanger collecting heat, which is arranged on a rear surface side of the display panel. Another display device according to the present invention comprises a housing having a waterproof structure and provided with an accommodation room formed therein, a display panel arranged in the accommodation room and including a display screen viewable from a front surface side of the housing, a heat exchanger collecting heat generated from the display panel and arranged on a rear surface side of the display panel, and a second heat exchanger releasing heat collected by the heat exchanger to outside of the housing and arranged outside the accommodation room.

Abstract: Apparatus and method are provided for facilitating cooling of air passing through an electronics rack. The apparatus includes a heat exchange assembly hingedly mounted above and external to the rack, such that air passing above the rack from an air outlet side to an air inlet side thereof passes through the heat exchange assembly, and is cooled. The heat exchange assembly includes a support structure to support hinged mounting of the assembly above the rack, and an air-to-liquid heat exchanger coupled to the support structure. The heat exchanger has an inlet plenum and an outlet plenum in fluid communication with respective connect couplings which facilitate connection of the plenums to coolant supply and return lines, respectively. The heat exchanger also includes heat exchange tube sections, each of which has a coolant channel with an inlet and an outlet coupled to the inlet and outlet plenums, respectively.

Abstract: Some embodiments discussed relate to a method and apparatus, comprising a power amplifier module, a transceiver module coupled to provide a signal to an input of the power amplifier module. The transceiver module comprising an integrated temperature sensor to sense an instantaneous operating temperature of the transceiver and providing a first sensor output signal dependent upon the operating temperature, and an integrated voltage sensor to sense a transceiver supply voltage and generate a second sensor output signal dependent upon the instantaneous transceiver supply voltage, and a processor configured to receive the first and the second sensor output signals, provide a control signal to the power amplifier module to reduce the output power of the power amplifier responsive to the first and the second sensor output signals.

Abstract: The invention relates to an improved aircraft electronics cooling system for an aircraft having a liquid cooling system (2), the aircraft electronics cooling system providing a thermal coupling between an electronic device (40a, 40b, 40c, 40d, 42, 44) to be cooled and the liquid cooling system (2) of the aircraft. A coolant delivered by the liquid cooling system (2) may flow through a board of the electronic device (40a, 40b, 40c, 40d), through a heat sink on which the electronic device (42) is arranged and/or through a housing in which the electronic device (44) is arranged. The coolant may be permanently in the liquid state in a cooling circuit. The coolant may vaporize at least partially while cooling the electronic device.

Abstract: A tandem fan system with an airflow-straightening heat exchanger removes heat from an airflow while providing optimal airflow pressure. The tandem fan system includes a first fan assembly and a second fan assembly, wherein each fan assembly has an inlet face and an outlet face, and includes at least one fan configured to propel a flow of air from the inlet face to the outlet face. The tandem fan system also includes a heat exchanger coupled between the first and second fan assemblies, wherein the heat exchanger includes at least one fin array and one or more heat pipes. The fin array and heat pipe combination is configured to draw heat from a flow of air that flows through the heat exchanger, and to straighten the flow of air so that the flow is perpendicular to the inlet face of the second fan assembly.

Abstract: A test slot cooling system for a storage device testing system includes a storage device transporter having first and second portions. The first portion of the storage device transporter includes an air director and the second portion of the storage device transporter is configured to receive a storage device. The test slot cooling system includes a test slot housing defining an air entrance and a transporter opening for receiving the storage device transporter. The air entrance is in pneumatic communication with the air director of the received storage device transporter. The test slot cooling system also includes an air mover in pneumatic communication with the air entrance of the test slot housing for delivering air to the air director. The air director directs air substantially simultaneously over at least top and bottom surfaces of the storage device received in the storage device transporter.

Abstract: A vapor-compression heat exchange system for facilitating cooling of an electronics rack. The system includes employing an evaporator coil mounted to an outlet door cover, which is hingedly affixed to an air outlet side of the rack, as well as refrigerant inlet and outlet plenums and an expansion valve also mounted to the outlet door cover and in fluid communication with the evaporator coil. The evaporator coil includes at least one heat exchange tube section and a plurality of fins extending therefrom. Respective connect couplings connect the inlet and outlet plenums in fluid communication with a vapor-compression unit which includes a compressor and a condenser disposed separate from the outlet door cover. The vapor-compression unit exhausts heat from refrigerant circulating therethrough.

Abstract: Use of vortex generators to improve efficacy of heat sinks used to cool telecommunications, electrical and electro-optical components.

Abstract: Apparatuses, methods, and systems directed to efficient cooling of data centers. Some embodiments of the invention allow encapsulation of cold rows through an enclosure and allow server fans to draw cold air from the cold row encapsulation structure to cool servers installed on the server racks. In other particular embodiments, the systems disclosed can be used to mix outside cool air into the cold row encapsulation structure to cool the servers. In some embodiments, the present invention involves using multiple cold row encapsulation structures to cool the servers installed on the racks.

Abstract: An exemplary heat dissipation device includes a fan having a plurality of first fixing cylinders, a heat sink having a plurality of second fixing cylinders, and a plurality of fasteners fixing the fan to the heat sink. Each of the fasteners includes a screwing post, an elastic member encircling the screwing post, and an annular fastening collar engaging with the screwing post. Each of the fasteners extends through a corresponding first fixing cylinder of the fan and a corresponding second fixing cylinder of the heat sink. The elastic member of each fastener is compressed between the corresponding first fixing cylinder and the corresponding second fixing cylinder.

Abstract: The invention discloses a fastening device for fasten a heat sink onto a base board. The fastening device comprises a first fastening member, a second fastening member and a third fastening member. When assembling the fastening device to the base board, the second fastening member has to be pivoted with the third fastening member first. Afterwards, the first fastening member is attached to the base board. Finally, the second and third fastening members, which have been assembled, are engaged with the first fastening member, so as to press the heat sink tightly. Accordingly, the heat sink will be fastened on the base board easily and stably.

Abstract: A cooling system for an outdoor electronic enclosure, with separate compartments for electronics and batteries, includes separate cooling devices for each compartment so that optimal temperatures are provided to each compartment. The batteries are cooled by a thermo-electric type air-conditioner, while the electronics are cooled by direct air cooling device or a heat exchanger.

Abstract: The invention relates to an improved aircraft electronics cooling system for an aircraft having a liquid cooling system (2), the aircraft electronics cooling system providing a thermal coupling between an electronic device (40a, 40b, 40c, 40d, 42, 44) to be cooled and the liquid cooling system (2) of the aircraft. A coolant delivered by the liquid cooling system (2) may flow through a board of the electronic device (40a, 40b, 40c, 40d), through a heat sink on which the electronic device (42) is arranged and/or through a housing in which the electronic device (44) is arranged. The coolant may be permanently in the liquid state in a cooling circuit. The coolant may vaporize at least partially while cooling the electronic device.

Abstract: According to one embodiment, the electronic device includes a housing, the first to third printed circuit boards, and a fan unit. The first printed circuit board includes the first heat-generating part secured to the first wiring board. The second printed circuit board includes the second and third heat-generating parts, has an amount of heat generation larger than that of the first printed circuit board, and is located between the first printed circuit board and the second wall. The third printed circuit board includes the fourth heat-generating part, has an amount of heat generation smaller than that of the first printed circuit board, and is located between the first printed circuit board and the first wall.

Abstract: A display apparatus has a liquid crystal display having a display panel, a housing, a circulating fan, and an air conditioner. The housing has a sealing part. The sealing part seals around the display panel and accommodates the display panel therein, while making the display screen viewable from outside. The circulating fan circulates air along a circulation path surrounding the display panel wherein the path includes a space between the display screen and the sealing part. The air conditioner collects heat from the air circulating the circulation path and releases the heat to outside of the housing.

Abstract: Apparatus and method are provided for facilitating cooling of air passing through an electronics rack. The apparatus includes a heat exchange assembly hingedly mounted above and external to the rack, such that air passing above the rack from an air outlet side to an air inlet side thereof passes through the heat exchange assembly, and is cooled. The heat exchange assembly includes a support structure to support hinged mounting of the assembly above the rack, and an air-to-liquid heat exchanger coupled to the support structure. The heat exchanger has an inlet plenum and an outlet plenum in fluid communication with respective connect couplings which facilitate connection of the plenums to coolant supply and return lines, respectively. The heat exchanger also includes heat exchange tube sections, each of which has a coolant channel with an inlet and an outlet coupled to the inlet and outlet plenums, respectively.

Abstract: A portable, self-contained liquid submersion cooling system that is suitable for cooling a number of electronic devices, including cooling heat-generating components in computer systems and other systems that use electronic, heat-generating components. The electronic device includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid, and a pump for pumping the liquid into and out of the space, to and from a heat exchanger that is fixed to the housing outside the interior space. The heat exchanger includes a cooling liquid inlet, a cooling liquid outlet, and a flow path for cooling liquid therethrough from the cooling liquid inlet to the cooling liquid outlet. An air-moving device such as a fan can be used to blow air across the heat exchanger to increase heat transfer.

Abstract: According to one embodiment, a data center comprises a first data center section comprising one or more equipment element elements. Each computer element has one or more heat generating sources. A second data center section comprises a heat exchanger, the second data center section being substantially segregated from the first section. A heat transfer element is thermally coupled to at least some of the heat generating sources and is further thermally coupled to the heat exchanger.

Abstract: A plasma display device is provided with a chassis supporting a PDP on its front surface, circuit boards located within a specific region of the back surface of the chassis, a back cover including an edge portion covering the outside of the specific region of the back surface of the chassis and a projecting portion accommodating the plurality of the circuit boards, and a fan arranged inside a space defined by the projecting portion. The peripheral wall of the projecting portion is provided with a plurality of air inlets and a plurality of air outlets.

Abstract: A cooling system for a rotary tablet press with which a rotor is driven by an electrical drive motor and the rotor and drive motor are arranged in a closed housing, and a control cabinet for the drive motor and further units in the housing, wherein arranged within the housing is a cooling machine whose evaporator is part of a first heat exchanger, whose other part is arranged in a coolant circuit for the drive motor, a fan is arranged in a channel in the housing closed relative to the housing interior, where the fan draws cool air in via an air inlet of the housing and gives it off via an air outlet of the housing, wherein the cool air is engaged in heat exchange with a condenser of the cooling machine.

Abstract: A cooling assembly for an electronic image assembly having an open and closed gaseous loop. A closed gaseous loop allows circulating gas to travel across the front surface of an image assembly and through a heat exchanger. An open loop allows ambient gas to pass through the heat exchanger and extract heat from the circulating gas. An optional additional open loop may be used to cool the back portion of the image assembly (optionally a backlight). Ribs may be placed within the optional additional open loop to facilitate the heat transfer to the ambient gas. The cooling assembly can be used with any type of electronic assembly for producing an image.

Abstract: Systems and methods for close coupled cooling of electrical system components such as computer systems are disclosed. The system may include a structure defining spaces each having an inlet and an outlet and being otherwise generally enclosed in which the electronic components are mounted, a heat exchanger either adjoining the structure at the inlets of the spaces or disposed within the spaces at the inlets and configured to channel a heat exchange fluid to cool air as air flows therethrough, a fan disposed in each space to pull air through the inlet via the heat exchanger, to direct air past the electronic components mounted therein to cool the electronic components, and to exhaust the air through the outlet, and a cooling module located remote to the spaces and in fluid communication with the heat exchanger for cooling the heat exchange fluid. The system may include rack mount computer system structures.

Abstract: A movable data center or container enclosed data center is disclosed in which a plurality of data processing modules, a plurality of heat exchange modules, and a plurality of fans are operatively arranged. The enclosure defines a continuous closed-loop air passage between a exterior walls and interior walls. The data processing modules, heat exchange modules, and fan units are arranged in an alternating pattern adjacent to the sidewalls of the enclosure.

Abstract: A thermal management system includes an air duct assembly comprising a supply air duct having an air inlet opening, a return air duct having an air exit opening and a plurality of distribution air ducts configured to be in fluid communication with the air inlet opening of the supply air duct and with the air exit opening of the return air duct. A fan is disposed within the air duct assembly to direct air from the air inlet opening of the supply air duct through the supply air duct and out the air exit opening of the return air duct. The fan and supply duct are disposed to direct air over a first surface of a heat sink. A second opposing surface of the heat sink is disposed over and configured to be in thermal contact with a plurality of active circuits disposed on a first surface of a radio frequency (RF) multi-layer printing wiring board (PWB).

Abstract: A cooling device including: a fan configured to rotate and produce airflow; a fan case accommodating the fan, the fan case having an outlet for discharging the airflow produced by the fan; a heat exchanger having an inlet disposed to oppose the outlet of the fan case, the inlet being configured to take in the airflow discharged from the outlet; a wire disposed between the heat exchanger and the fan case to stretch along an end face of the inlet of the heat exchanger, the wire having a first end being fixed to a fulcrum and a second end; and a wire driving mechanism configured to swing the wire about the fulcrum to scrape the end face of the inlet of the heat exchanger by the wire.

Abstract: A disk drive testing system cooling circuit includes a plurality of test racks. Each of the test racks include a test slot compartment and a test electronics compartment. Each of the test slot compartments includes multiple test slots, and one or more cooling conduits configured to convey a cooling liquid toward the test slots. Each of the test electronics compartments includes test electronics configured to communicate with the test slots for executing a test algorithm, and a heat exchanger in fluid communication with the one or more cooling conduits. The heat exchanger is configured to cool an air flow directed toward the test electronics.

Abstract: A cooling device for a circuit breaker which comprises a case having a front wall, a rear wall, an upper wall, a lower wall, two flanks, and a first series of side-by-side terminals and a second series of side-by-side terminals that protrude outside from the case for the connection of the circuit breaker with an electrical circuit. The cooling device includes at least one first body made of a thermal conducting material and which has a central portion suitable for being positioned transversally along and facing the first series of terminals so as to absorb heat generated at the first series of terminals, and a first end portion and a second end portion that protrude from the central portion and are configured so as to receive the heat absorbed by the central portion and to diffuse it outside the cooling device itself.

Abstract: A housing for electronic equipment comprises a heat exchanger for exchanging heat between a liquid-containing medium and a gas. This heat exchanger comprises a medium inlet and a medium outlet and a flat heat exchanger mat. The mat comprises a number of parallel, equidistant capillaries of heat-conducting material and wires of heat-conducting material which are attached in heat-conducting contact to the capillaries, extend in transverse direction relative thereto and have a mutual distance in the order of magnitude of the diameter of the wires, wherein air can flow along the wires for heat exchange between this air and the medium flowing through the capillaries. The heat exchanger is embodied such that the air flows along the mat and at least a substantial part of the air is prevented from flowing through the mat, and that it is ensured that the air flows along the wires in longitudinal direction of these wires.

Abstract: A cooling manifold and a method for manufacturing the cooling manifold are provided. The cooling manifold includes a housing that defines an interior region having a serpentine flow path therein. The housing has a first plurality of grooves extending from a first surface of the housing into the housing. The grooves do not fluidly communicate with the interior region. The first plurality of grooves receive a portion of a thermally conductive member therein to conduct heat energy from the thermally conductive member to the housing. The cooling manifold further includes a top cap configured to seal a first end of the housing and a bottom cap configured to seal a second end of the housing.

Abstract: A temperature isolation duct in a computer system comprising a chassis securing a circuit board and a fan system that draws air through the chassis, and a heat-generating component is mounted on the circuit board and exposed to the air flow. The hot air duct passively directs air heated by the heat-generating component from a single hot air duct inlet in direct downstream alignment with the heat-generating component to a single hot air duct outlet. A thermal sensor is secured within, or in direct alignment with, the hot air duct near the duct outlet for sensing the temperature of air flowing through the hot air duct and generating a temperature signal. A controller is in electronic communication with the thermal sensor for receiving the temperature signal and in electronic communication with the fan system for sending a fan speed control signal.

Abstract: An energy storage pack cooling system including upper and lower respective terminal heat sinks thermally connected to respective upper and lower terminals of energy storage cells above and below upper and lower ends of an enclosure of an energy storage cell pack; and a blower and cooling assembly that circulates a heat transfer fluid past the upper and lower respective terminal heat sinks outside of the enclosure to cool the energy storage cells without circulating the heat transfer fluid past energy storage cell bodies of the energy storage cells enclosed within the enclosure.

Abstract: A motor controller capable of relaxing the temperature of a heat source which generates heat by driving the motor controller, and capable of realizing miniaturization and low price is provided. In a motor controller in which a power semiconductor module (2) which closely contact a heat sink (1) is mounted on a substrate (4), and a fan (6) is attached to the heat sink (1) by a fan case (8), portions of fins (1g) of the heat sink (1) are formed with a bell mouth (1c) and a circular-arc-shaped guide (1h), and the radiating capability of the fins (1g) is improved by effectively using the wind of the fan (6).

Abstract: Taught herein is a controller for a DC brushless motor comprising a control board (3) and a housing (4); wherein the control board (3) is disposed in the housing (4), and the housing (4) is made of metal materials with good thermal conductivity; a plurality of heat sinks (5) are disposed at the bottom of the housing (4), thereby heat generated by the control board (3) will be dissipated fast, and the operating temperature and failure rates are reduced; an integrated power module chip (7) disposed at the bottom of the control board (3) transfers heat to the housing (4) via an insulating heat sink (8), and in doing so prevents electric leakage; the purpose of a plurality of gaps (9) disposed at the top of the housing (4) is to provide ventilation, and to dissipate heat fast; all of these design characteristics make the invention simple in structure, and convenient for mass assembly.

Abstract: A thermal control system of a 3U height includes various modules for providing temperature control in a rack environment. The modules may be, for example, a power module, user interface module, various different pump assemblies, various different models of fan assemblies, HTAs, and/or a serial communication interfaces.

Abstract: A circuit board (1) has a top face (2) for positioning an electronic component and a bottom face (4) used as a support on a heat-dissipating base. A plurality of heat transfer holes (12) provide heat transfer from the top face (2) to the bottom face (4). The heat transfer holes (12) are unevenly or non-uniformly distributed on the top face (2) in such a way that the top face (2) is provided with several free sectors (14) which are free of heat transfer holes (12) in order to connect the electronic component to the circuit board (1). The free sectors (14) are configured as columns or lines. A plurality of heat transfer holes (12) are placed at least along the long sides of the free sectors (14). The circuit board has a low thermal resistance between the electronic component and the heat-dissipating base.

Abstract: An electronic device and a heat dissipation unit thereof are provided. The electronic device includes a housing, a circuit board, a heat source, a heat dissipation system and a heat dissipation unit. The circuit board is disposed in the housing and the heat source is disposed on the circuit board. The heat dissipation abuts the heat source, and the heat dissipation unit, disposed on the housing, abuts the heat dissipation system, wherein a portion of the heat dissipation unit is exposed outside of the housing. The heat dissipation unit includes a connecting portion, a heat exchanger, and a heat pipe. The connecting portion, disposed in the housing, abuts the heat dissipation system. The heat exchanger is disposed in the housing, and a portion of the heat exchanger is exposed outside of the housing. The heat pipe connects the connecting portion with the heat exchanger.

Abstract: Apparatuses, methods, and systems directed to efficient cooling of data centers. Some embodiments of the invention allow encapsulation of cold rows through an enclosure and allow server fans to draw cold air from the cold row encapsulation structure to cool servers installed on the server racks. In other particular embodiments, the systems disclosed can be used to mix outside cool air into the cold row encapsulation structure to cool the servers. In some embodiments, the present invention involves using a hookup clip to secure the top or bottom crossbar of the cold row encapsulation structure with the top or bottom crossbar of the server rack.

Abstract: A method of operating a power delivery system that has at least one power cell includes directing air into the power cells to cool them, receiving the air from the cells, directing the air to a cooling system, and recirculating the cooled air to the power cells. Each cell may include an air intake, an air output, a water-cooled heat sink, and optionally a plurality of capacitor connectors and/or a circuit board. The air may be directed through the air intake to the air output so that air passes over the capacitor connectors and/or the circuit board before passing over the heat sink.

Abstract: Apparatus and method are provided for cooling an electronics rack in an energy efficient, dynamic manner. The apparatus includes one or more extraction mechanisms for facilitating cooling of the electronics rack, an enclosure, a heat removal unit, and a control unit. The enclosure has an outer wall, a cover coupled to the outer wall and a central opening sized to surround the electronics rack and the heat extraction mechanism. A liquid coolant loop couples the heat removal unit in fluid communication with the heat extraction mechanism, which removes heat from liquid coolant passing therethrough. The control unit is coupled to the heat removal unit for dynamically adjusting energy consumption of the heat removal unit to limit its energy consumption, while providing a required cooling to the electronics rack employing the liquid coolant passing through the heat extraction mechanism.

Abstract: The invention relates to an improved aircraft electronics cooling system for an aircraft having a liquid cooling system (2), the aircraft electronics cooling system providing a thermal coupling between an electronic device (40a, 40b, 40c, 40d, 42, 44) to be cooled and the liquid cooling system (2) of the aircraft. A coolant delivered by the liquid cooling system (2) may flow through a board of the electronic device (40a, 40b, 40c, 40d), through a heat sink on which the electronic device (42) is arranged and/or through a housing in which the electronic device (44) is arranged. The coolant may be permanently in the liquid state in a cooling circuit. The coolant may vaporize at least partially while cooling the electronic device.

Abstract: A heat-dissipation module and an electronic device including a first heat source and the heat-dissipation module are provided. The heat-dissipation module includes a first heat pipe, a second heat pipe, a first set of heat fins, a second set of heat fins and a fan. One end of the first heat pipe and one end of the second heat pipe are respectively in contact with the first heat source. The first set of heat fins and the second set of heat fins are, respectively, in contact with the other end of the first heat pipe and the other end of the second heat pipe. Heat generated by the first heat source is transferred to the two sets of heat fins through the first and the second heat pipes. The fan is used for providing an air-flow blowing toward the two sets of heat fins to dissipate heat.

Abstract: An air containment cooling system for containing and cooling air between two rows of equipment racks includes a canopy assembly configured to enclose a hot aisle defined by the two rows of equipment racks, and a cooling system embedded within the canopy assembly. The cooling system is configured to cool air disposed within the hot aisle. Other embodiments and methods for cooling are further disclosed.

Abstract: In some embodiments, a cooling device may be mounted to a portion of a chassis of an electronic system, wherein the cooling device may be releasably and pivotably attached to the chassis in at least an open position to permit access to components within the electronic system and a closed position to permit installation of a cover on the chassis. Other embodiments are disclosed and claimed.

Abstract: A heat dissipation apparatus includes a heat sink (30) and a fan (50) mounted on the heat sink. The heat sink includes a plurality of radial fins (311, 331). An air channel (312, 332) is defined between every two adjacent fins. Each of the fins includes a main body (331, 331) and an airflow guiding flange (314, 334) extending upwardly and outwardly from a top side of the main body. The airflow guiding flange is twisted in a radial direction, such that an included angle between the airflow guiding flange and the main body is gradually increased from an outer side (318, 338) towards an inner side (317, 337) of the main body. The fan is used to generate airflow towards the heat sink. The airflow is guided into the air channels between the fins via the airflow guiding flanges.

Abstract: An exhaust air removal system and method for use with a rack or enclosure containing equipment is provided. The system and method are configured for removal of exhaust air vented from equipment during operation to thereby remove heat from the equipment. In one respect, the system includes a fan unit preferably configured to serve as a back door of an equipment rack or enclosure and configured to provide access to an interior of the rack or enclosure. The fan unit provides multiple fans coupled to internal exhaust ducts that are arranged to draw and to remove exhaust air vented from rack-mounted equipment. The fan unit is further configured to vent exhaust air to an area external to a rack or enclosure, such as an external exhaust duct or plenum. Removal of hot and warm exhaust air vented from rack-mounted equipment enables the equipment to operate effectively, drawing sufficient amounts of cooling air to meet its cooling requirements.

Abstract: A data center comprising an air humidity- and temperature-conditioned space where heat producing ICT and/or telecom equipment is arranged, a heat wheel and means for supplying recirculation of air heated by the equipment as a first air stream to the heat wheel and the heat wheel being configured to cool the first air stream using a separate second air stream.

Abstract: An electronic apparatus includes: a housing; a motherboard that is accommodated in the housing; a first daughterboard that is accommodated in the housing; a second daughterboard that is accommodated in the housing; a host controller that is mounted on the motherboard; a bridge controller that is mounted on the first daughterboard and electrically connected to the host controller; a first chip that is mounted on the first daughterboard and electrically connected to the bridge controller; and a second chip that is mounted on the second daughterboard and electrically connected to the bridge controller.

Abstract: A high-velocity low-pressure cooling system (100), especially suited for data center applications, includes an air coolant loop (102), a non-air coolant loop (104) and a cooler unit (126) for heat transfer between the loops (102 and 104). The air loop (102) is used to chill ambient air that is blown across heat transfer surfaces of equipment mounted in data center racks (110). In this manner, effective cooling is provided using a coolant that is benign in data center environments.