Abstract: A display apparatus includes an accommodation chamber having a sealed structure, a display panel accommodated in the accommodation chamber, a cooling part which cools the air inside the accommodation chamber, a drain pipe extending from a bottom part of the accommodation chamber, and a check valve provided in the drain pipe.

Abstract: A system for cooling a battery mounted on a vehicle using air within a vehicle, independently of the travelling state of the vehicle. The air within a vehicle compartment is guided to a battery mounted on a vehicle to cool the battery. A controller determines a basic fan speed v of the cooling fan based on a battery temperature and an ambient temperature. Further, the controller calculates an increment ?v of the fan speed in accordance with the vehicle speed and the degree of window opening and determines a final fan speed V according to V=v+?v, to drive the cooling fan. By controlling the fan speed to increase, it is possible to cool the battery even when the base pressure of the inlet-side static pressure of the cooling fan becomes negative pressure compared to when the windows are closed.

Abstract: A system and method for integrating sidecar liquid cooling components in-row with associated computer equipment enclosures is disclosed. It includes a fail-safe baffle to exhaust air, a transition frame and containment plenum. It uses standard hose configurations and includes a thermo-mechanical switch, not requiring power to open the component door.

Abstract: A modular cooling system includes a positive displacement compressor and a microchannel heat exchanger for cooling a heat generating device such as a semiconductor.

Abstract: A space-saving, high-density modular data center and an energy-efficient cooling system for a modular data center are disclosed. The modular data center includes a first cooling circuit including a primary cooling device and a plurality of modular data pods. Each modular data pod includes a plurality of servers, a heat exchange member coupled to the first cooling circuit and a second cooling circuit coupled to the heat exchange member and configured to cool the plurality of servers, the second cooling circuit including a secondary cooling device configured to cool fluid flowing through the second cooling circuit. Each modular data pod also includes an auxiliary enclosure containing at least a portion of a distributed mechanical cooling system, which is configured to trim the cooling performed by a central free-cooling system.

Abstract: A control device accommodating unit (15) is provided in a section (50) accommodating an indoor air blower (7) adjacently to an indoor air flow-in port (16), and an impeller (7c) of the indoor air blower (7) is sequentially opposite to the indoor air flow-in port (16) and the control device accommodating unit (15) by rotation of the impeller (7c), and a space (51) is formed between the indoor air flow-in port (16) and the control device accommodating unit (15). In this configuration, it is possible to obtain a cooling device decreased in drop of air flow rate and drop of cooling performance due to mounting a control device (14).

Abstract: A thermal control system of a 3 U height includes various modules for providing temperature control in a rack environment. The modules may be, for example, a power module, user interface module, various different pump assemblies, various different models of fan assemblies, HTAs, and/or a serial communication interfaces.

Abstract: An electrical control cabinet includes a casing, a plurality of heat elements, a heat exchanger, and two fans. The casing includes a first receiving portion and a second receiving portion. The first receiving portion communicates outside of the casing through the heat exchanger. The fans are received in the second receiving portion. The heat elements include a plurality of first heat members received in first receiving portion and a plurality of second heat members received in the second receiving portion. The first heat members is isolated from airborne contaminants and moisture. The first heat members in the first receiving portion disperse heat by the heat exchanger, and the second heat members in the second receiving portion disperse heat by the fans.

Abstract: A data center includes a housing, a number of server modules arranged in the housing, a number of cooling units arranged in the housing and above the server modules, and a fan mounted in the housing near the cooling units. When the data center is operating, heated air is driven to the cooling units by fans, and then the cooled air is driven to enter the server modules.

Abstract: Thermoelectric-enhanced, liquid-cooling apparatus and method are provided for facilitating cooling of one or more components of an electronics rack. The apparatus includes a liquid-cooled structure in thermal communication with the component(s) to be cooled, and a liquid-to-air heat exchanger coupled in fluid communication with the liquid-cooled structure via a coolant loop for receiving coolant from and supply coolant to the liquid-cooled structure. A thermoelectric array is disposed with first and second coolant loop portions in thermal contact with first and second sides of the array. The thermoelectric array operates to transfer heat from coolant passing through the first loop portion to coolant passing through the second loop portion, and cools coolant passing through the first loop portion before the coolant passes through the liquid-cooled structure. Coolant passing through the first and second loop portions passes through the liquid-to-air heat exchanger for cooling thereof.

Abstract: A method and apparatus for real-time thermal characterization of a fully operating cooling device (1002). A heat source (1004) is applied to one or more areas on a cooling device (1002) to produce non-uniform heating of the cooling device. Infrared (IR) temperature imaging (1006) detects and measures the thermal distribution of the heat source (1004) on the cooling device (1002) to develop a thermal characterization of the cooling device (1002).

Abstract: Systems and methods for a forced-convection heat exchanger are provided. In one embodiment, heat is transferred to or from a thermal load in thermal contact with a heat conducting structure, across a narrow air gap, to a rotating heat transfer structure immersed in a surrounding medium such as air.

Abstract: A measurement indicative of a temperature of a computer is received and a thermal health value for the computer is calculated based on the measurement.

Abstract: A cooling system and method are provided for facilitating cooling of multiple liquid-cooled electronics racks. The cooling system includes a main system coolant supply loop with a plurality of system coolant supply branch lines for facilitating supply of cooled system coolant to the electronics racks, and a main system coolant return loop with a plurality of system coolant return branch lines for facilitating return of exhausted system coolant from the electronics racks. When operational, cooled system coolant circulates through the coolant supply loop and exhausted system coolant circulates through the coolant return loop. A plurality of modular cooling units are coupled to the coolant supply loop and coolant return loop. Each modular cooling unit includes a heat exchanger to facilitate cooling of a portion of the exhausted coolant circulating through the main system coolant return loop for return as cooled system coolant to the main system coolant supply loop.

Abstract: A method, system, and apparatus are disclosed. In one embodiment method includes causing a cooling medium to flow through a hollow cable. The cable couples an external cooling station to a heat exchanging unit. The heat exchanging unit is located within a mobile computing device. The method then transfers heat from within the mobile computing device to the cooling medium at the heat exchanging unit. Then the cooling medium contained the transferred heat is expelled out of the mobile computing device.

Abstract: A container that holds rack mountable electronics equipment includes a plurality of rack enclosures and a corresponding plurality of enclosure cooling units. Each rack enclosure is movably mounted in the container such it can move from a position abutting a front of an enclosure cooling unit to a maintenance and access position spaced apart from the enclosure cooling unit. Each enclosure cooling unit is capable of providing varying amounts of cool air to the rack enclosure it abuts, so that the interior of each rack enclosure can be maintained at a different temperature.

Abstract: A data center includes a housing and a number of server module assemblies received in the housing. Airflow interspaces are formed between neighboring server module assemblies, and between the two outmost server module assemblies and corresponding sidewalls of the housing. The airflow interspaces are alternately used for cold aisles and hot aisles. An inside of each server module is communicated with one of the hot aisles and one of the cold aisles at opposite sides of the server module. A number of cooling units are installed in the housing over the server module assemblies. A number of fans are installed in the housing to draw hot air from the hot aisles to flow through the corresponding cooling units to be cooled, and the cooled air flow into the corresponding cold aisles, thereby creating air differences in air pressure between the cold aisles and the hot aisles.

Abstract: A heat exchanger, a heat dissipation method and a communication apparatus are provided. The heat exchanger includes a first and a second air passage separated from each other. The first air passage has a first fan unit and a first group of heat dissipation tubules. The second air passage has a second fan unit and a second group of heat dissipation tubules. The upper ends of the first and second group of heat dissipation tubules are communicated with each other via a steam manifold. The lower ends of the first and second group of heat dissipation tubules are communicated with each other via a liquid manifold. A closed pipeline filled with liquid vaporized when heated, is formed by the first and second group of dissipation tubules, the steam manifold and the liquid manifold. Heat dissipation fins are set among the first and second group of dissipation tubules.

Abstract: A heat radiator 1 includes an insulating substrate 3 whose first side serves as a heat-generating-element-mounting side, and a heat sink 5 fixed to a second side of the insulating substrate 3. A metal layer 7 is formed on the second side of the insulating substrate 3 opposite the heat-generating-element-mounting side. A stress relaxation member 4 formed of a high-thermal-conduction material intervenes between the metal layer 7 of the insulating substrate 3 and the heat sink 5 and includes a plate-like body 10 and a plurality of projections 11 formed at intervals on one side of the plate-like body 10. The end faces of the projections 11 of the stress relaxation member 4 are brazed to the metal layer 7, whereas the side of the plate-like body 10 on which the projections 11 are not formed is brazed to the heat sink 5. This heat radiator 1 is low in material cost and exhibits excellent heat radiation performance.

Abstract: An air containment cooling system for containing and cooling air between two rows of equipment racks includes a canopy assembly configured to enclose a hot aisle defined by the two rows of equipment racks, and a cooling system embedded within the canopy assembly. The cooling system is configured to cool air disposed within the hot aisle. Other embodiments and methods for cooling are further disclosed.

Abstract: A drive system for a grid blower of a vehicle is provided. The system includes: an electrical bus, a grid of resistive elements connected to the electrical bus, the grid of resistive elements configured to thermally dissipate electrical power generated from braking of the vehicle, the electrical power being transmitted on the electrical bus to the grid of resistive elements, an electrical power modulation device configured to modify electrical power received from at least one of the electrical bus and the grid of resistive elements, and a grid blower motor coupled to an output of the electrical power modulation device, wherein a speed of the grid blower motor varies based on the electrical power that has been modified by the electrical power modulation device.

Abstract: An electronic apparatus includes a host, a fan module, and a heat-dissipating module. The host includes a first housing, a second housing, and a first housing vent that is located at the edge of the second housing. The fan module includes a fan outlet. The fan module is disposed in the host obliquely, so as to make the fan outlet face the first housing vent. The heat-dissipating module is located between the fan outlet and the first housing vent, and a portion of the first housing vent is located at the bottom of the heat-dissipating module. The airflow generated by the fan module is In exhausted out of the first housing vent via the heat-dissipating module from the fan outlet.

Abstract: To cool racks of electronic devices, the racks are arranged in a plurality of rows to define at least a first aisle and a second aisle, where the second aisle has air cooler than air in the first aisle, and where the fans of the electronic devices cause air to flow from the second aisle to the first aisle. A cooling coil assembly contains a coolant to cool air received from the first aisle, wherein cooled air exits the cooling coil assembly and flows to the second aisle. A temperature of the coolant in the cooling coil assembly is maintained above a dew point of an environment in which the racks are located.

Abstract: A system for cooling an electronic image assembly using a heat exchanger with an internal fan assembly. Circulating gas may also be used to cool a front portion of the electronic image assembly or any other internal cavity of the electronic display housing. The circulating gas may be drawn through a heat exchanger so that heat may be transferred to an ambient gas. The heat exchanger may have an internal fan assembly for drawing ambient air through the heat exchanger and exhausting it out of the display housing. The heat exchanger may be divided into two portions so that the fan assembly is placed between the two portions.

Abstract: A system for cooling an electronic image assembly using ambient gas. The system contains a plurality of channels place behind the electronic image assembly and preferably in conductive thermal communication with the image assembly. Ambient gas is ingested into the display housing and directed to a first manifold which distributes the ambient gas to the plurality of channels. A second manifold preferably collects the ambient gas from the channels after absorbing heat from the electronic image assembly and/or channels. The second manifold then preferably directs the ambient gas towards an exhaust aperture and out of the display housing. Circulating gas may also be used to cool a front portion of the electronic image assembly. A cross through plate may be used to allow the ambient gas and circulating gas to cross paths without mixing.

Abstract: In one example, a heat management system suitable for use in connection with an electronic module is disclosed. In a disclosed embodiment the heat management system includes a module guide configured to receive an electronic module. At least two heat sink elements are configured and arranged for movement independent of each other. At least two retention elements are configured to bias a respective heat sink element against any electronic module that is positioned within the module guide.

Abstract: An apparatus is provided for facilitating cooling of an electronics rack of a data center. The apparatus includes: an airflow director mounted to the electronics rack to redirect airflow exhausting from the electronics rack through an airflow return pathway back towards an air inlet side of the rack; an air-to-liquid heat exchanger disposed within the airflow return pathway for cooling redirected airflow before exiting into the data center near the air inlet side of the rack; an air temperature sensor for monitoring air temperature of the redirected airflow; and an automated isolation door associated with the airflow director for automatically blocking airflow exhausting from the air outlet side of the electronics rack from passing through the airflow return pathway back towards the air inlet side of the rack responsive to temperature of the redirected airflow exceeding a defined temperature threshold.

Abstract: A thermal module includes a centrifugal fan and a circuit board. The circuit board defines a through hole therein. The centrifugal fan includes a top plate located above the circuit board and aligned with the through hole, a first sidewall extending from a circumferential edge of the top plate toward the circuit board, a bottom plate located below the circuit board and aligned with the through hole, a second sidewall extending from a circumferential edge of the bottom plate toward the circuit board, and an impeller. The first sidewall abuts a top surface of the circuit board around the through hole. The second sidewall abuts a bottom surface of the circuit board around the through hole. The impeller is smaller than the through hole. The impeller extends through to be located in the through hole.

Abstract: An apparatus and method for cooling electronic components housed in a computer rack while performing maintenance operations is provided. The apparatus, in one embodiment, includes a heat exchange assembly disposed within an outlet door cover of the computer rack, having one or more perforations. One or more air moving device(s) are also disposed on the outlet door and activated by an activator when the door is opened such that the devices when activated force hot air into the heat exchanger. Cool air is then exhausted through a planar containment plate having a plurality of edges. The plate is secured to top of the outlet door along one of its edges.

Abstract: Dehumidifying and re-humidifying cooling apparatus and method are provided for an electronics rack. The apparatus includes a dehumidifying air-to-liquid heat exchanger disposed at an air inlet side of the rack and a re-humidifying structure disposed at an air outlet side of the rack. The dehumidifying air-to-liquid heat exchanger is in fluid communication with a coolant loop for passing chilled coolant through the heat exchanger, and the dehumidifying heat exchanger dehumidifies ingressing air to the electronics rack to reduce a dew point of air flowing through the rack. A condensate collector disposed at the air inlet side collects liquid condensate from the dehumidifying of ingressing air, and a condensate delivery mechanism delivers the condensate to the re-humidifying structure to humidify air egressing from the electronics rack.

Abstract: A container data center includes a movable container, two server systems having a cold aisle and two hot aisles, two fan apparatuses, an exchanger, and an air intake apparatus. The air intake apparatus includes a number of air intake elements each defining an air channel. The fan apparatuses are operable to transfer hot airflow in the hot aisles into the heat exchanger, and then the heat exchanger transforms the hot airflow into cold airflow and transfers the cold airflow into the cold aisle through the air intake apparatus. The air intake elements are connected together and cover the cold aisle. The air intake elements of the air intake apparatus are arranged in a “V” shape along an orientation toward the airflow of the cold aisle.

Abstract: An electronic flight bag computer (EFB) includes a housing defining first and second compartments that are fluidly isolated from and in thermal communication with one another. The first compartment contains electronic components connected to a user interface on an exterior portion of the housing for providing interactive flight related computation functions to a user. The second compartment contains a forced convection cooling component in thermal communication with the electronic components. The forced convection cooling component directs a flow of cooling fluid into the second compartment to convey heat produced by the electronic components out of the housing, such that the cooling fluid in the second compartment remains fluidly isolated from the electronic components in the first compartment of the housing.

Abstract: A container includes first and second long sides parallel to the container's length. Racks are organized in rows parallel to the container's width. Each rack is receptive to installation of equipment along a height of the data rack parallel to the container's height. Openings are defined within the first and/or second long sides of the container. Heat exchangers may be installed, where each exchanger is installed on a rack to cool air exhausted by any equipment installed on this rack. Each row may include as many of the racks positioned side-to-side, length-wise, and parallel to the width of the container as can fit within the container. The racks of each row may be slidable in unison back and forth along the length of the container, between a first position at which the racks block an opening and a second position at which the racks block another opening.

Abstract: An electronic cooling apparatus has a cabinet which is open at the front and rear sides thereof and accommodates plural electronic devices each having a fan, and a rear door which is provided with an evaporator. Air blown by the fan is cooled by the evaporator and then returned to a room. An expansion valve and control. A drain pan with an extension portion having hole portions through which refrigerant pipes extend is provided. A drain hose discharges drain water from the drain pan. An exhaust heat temperature detecting unit and a control for controlling the refrigerant supply to the evaporator are provided. When the exhaust heat temperature is equal to or less than a set exhaust temperature, the controller stops the refrigerant supply to the evaporator. When the exhaust heat temperature exceeds the set temperature, the controller starts the refrigerant supply.

Abstract: A liquid heat exchange medium (40) is provided in a case (20) together with an electric storage element (11) to exchange heat with the electric storage element. The heat exchange medium is an ester compound of a fatty acid with a carbon number of 6 to 8 and 2-ethyl hexanol. The heat exchange medium contains 90 or more volume % of 2-ethylhexyl caprylate. Selected Drawing: FIG.

Abstract: In a conventional cooling device, a heat pipe or a circulation-type liquid cooler provided with a pump is used and therefore, a large space is needed for the cooling device. There is provided a cooling device which includes a plurality of cooling modules having cooling units for cooling heat-generating elements by coolant and radiation units for radiating heat from the coolant heated in the cooling units, the plurality of cooling modules being bubble-pump-type ones in which the coolant is circulated between the radiation units and the cooling units by the coolant being boiled in the cooling units, the radiation units being arranged side by side, and a cooling fan for generating wind blowing the radiation units.

Abstract: A disk drive test slot thermal control system includes a test slot including a housing having an outer surface, an internal cavity defined by the housing and including a test compartment for receiving and supporting a disk drive transporter carrying a disk drive for testing, and an inlet aperture extending from the outer surface of the housing to the internal cavity. The disk drive test slot thermal control system also includes a cooling conduit, and a thermoelectric device mounted to the cooling conduit. The thermoelectric device is configured to cool or heat an air flow entering the internal cavity through the inlet aperture.

Abstract: According to one embodiment, a housing apparatus for a heat generating device includes a housing being provided with sidewalls arranged sideward to separate from each other, and shelf members placed at a plurality of positions along the sidewalls between the sidewalls. The shelf members support a plurality of devices including a heat generating device, and each sidewall has a plurality of ventilation openings corresponding to the devices held by the shelf members. A duct member is provided on at least outermost sidewall to correspond to at least two adjacent ventilation openings in the outermost sidewall. An airflow producing unit is provided in the duct member and includes at least two airflow producing devices performing one of supplying outside air into the inside of the housing and evacuating the inside air from the housing through the at least two adjacent ventilation openings.

Abstract: An exemplary embodiment of the present invention provides a system for cooling an electronic device. The system includes a plenum disposed adjacent to an interior surface of a housing for the electronic device, wherein the plenum is placed between a heat generating component and the interior surface of the housing, and wherein the plenum reduces heat transfer from the heat generating component to an exterior surface of the housing. The system also includes a fan configured to create an airflow in the plenum.

Abstract: In one embodiment, a fan casing may have a direct thermal connection with a heat spreader. The fan casing might be used in an active cooling system of a mobile computing device such as a notebook computer to reduce and/or eliminate the occurrence of thermal hot spots on the skin of the device. In one example, the heat spreader extends from the enclosure and is disposed between a heat source and the skin of the device.

Abstract: A tandem fan system with an airflow-straightening heat exchanger removes heat from an airflow while providing optimal airflow pressure. The tandem fan system includes a first fan assembly and a second fan assembly, wherein each fan assembly has an inlet face and an outlet face, and includes at least one fan configured to propel a flow of air from the inlet face to the outlet face. The tandem fan system also includes a heat exchanger coupled between the first and second fan assemblies, wherein the heat exchanger includes at least one fin array and one or more heat pipes. The fin array and heat pipe combination is configured to draw heat from a flow of air that flows through the heat exchanger, and to straighten the flow of air so that the flow is perpendicular to the inlet face of the second fan assembly.

Abstract: Computer systems with air cooling systems and associated methods are disclosed herein. In several embodiments, a computer system can include a computer cabinet holding multiple computer modules, and an air mover positioned in the computer cabinet. The computer system can also include an airflow restrictor positioned proximate to an air outlet of the computer cabinet, and an overhead heat exchanger mated to the computer cabinet proximate to the air outlet.

Abstract: An electrical installation has a container which encloses high-voltage components. The electrical installation can be fitted inexpensively and quickly, and at the same time provide sufficient cooling of the high-voltage components. A control room with control elements and/or display elements of the electrical installation and a cool room with a cooling device for at least one of the high-voltage components are disposed in the interior of the container.

Abstract: In order to provide sound absorbing structure capable of reducing the noise of electronic equipment while maintaining the cooling capability of the electronic equipment, there is provided sound absorbing structure in which a plurality of penetrating openings are provided by arranging a plurality of acoustic materials having a predetermined shape at predetermined intervals in a flow channel of cooling fluid from a blower, and the plurality of acoustic materials are arranged so that the sound vertically incident on a penetrating plane of the penetrating openings from the blower does not directly go out of the electronic equipment.

Abstract: An exemplary heat dissipation device includes first and second heat sinks adapted for being thermally attached to first and second electronic components, respectively; and a heat pipe thermally interconnecting the first heat sink with the second heat sink.

Abstract: The local cooling unit according to an aspect of the present invention includes a housing having a cavity formed in the housing, an air inlet port which is provided in a bottom surface of the housing and which takes in exhaust heat air from the electronic device, an evaporator which is provided in the housing and which evaporates a refrigerant by heat exchange with air sucked in from the air inlet port to cool the air, the refrigerant passing through an inside of the evaporator, an air outlet port which is provided in a side surface of the housing and which exhausts the air cooled by the evaporator, and a fan which is provided on a side of the air inlet port or a side of the air outlet port of the housing and which moves the air from the air inlet port to the air outlet port.

Abstract: Apparatuses, methods, and systems directed to efficient cooling of data centers. Some embodiments of the invention allow encapsulation of cold rows through an enclosure and allow one or more fans to draw cold air from the cold row encapsulation structure to cool servers installed on the server racks. In other particular embodiments, the systems disclosed can be used to mix outside cool air into the cold row encapsulation structure to cool the servers. In some embodiments, the present invention involves fanless servers installed on the server racks and introduces fan units to draw cooling air from the cold row encapsulation structure through the fanless servers on the racks.

Abstract: An electronic apparatus comprises a case configured to house an electronic circuit unit and includes an air intake, through which external air is taken into the case, and an exhausting opening, from which the air is ejected, an circulator provided in the case and configured to take the external air into the case through the air intake and supply the air to the electronic circuit unit, an evaporation unit provided in the case and configured to cool the air by thermal exchange between the air and a working medium and guide the air to the exhausting opening, the working medium being vaporized as a result of the thermal exchange, and a condenser provided out of the case and configured to liquidize the working medium and supply the working medium to the evaporation unit.

Abstract: A cooling unit, which is configured to contain and cool air between two rows of equipment racks defining a hot aisle, includes a housing configured to be secured mounted on the two rows of equipment racks such that the housing spans the hot aisle, a heat exchanger supported by the housing and coupled to and in fluid communication with a coolant supply and a coolant return, and an air movement assembly supported by the housing and configured to move air over the heat exchanger. Other embodiments of the cooling unit and methods of cooling are further disclosed.

Abstract: A blower includes a fan, an inlet through which air is drawn into the fan, and an outlet through which an air flow from the fan is exhausted. The inlet and the outlet have slits with a specific width or an array of through holes with a specific diameter. The relationship A<C, A<B is satisfied, where A represents the width of the slits or the diameter of the through holes of the inlet, B represents a particle size of dust that is allowed to pass through in view of the dust-proof performance of the fan, and C represents the width of the slits or the diameter of the through holes of the outlet. The blowing performance can be improved within the range of dust-proof performance in which damage or functional degradation can be avoided.