Abstract: An enclosure for outside plant equipment includes a base unit and first Printed Circuit Board (PCB) carried by the base unit and having a circuit side and opposing component side on which electronic components are mounted. A heat sink is connected to the first PCB at the circuit side and configured to dissipate heat from any electronic components mounted on the first PCB at the component side. A cover is attached to the base unit and has an inside surface covering the enclosure. A second PCB has a circuit side and opposing component side on which electronic components are mounted. The second PCB is supported by the inside surface of the cover. A heat sink is connected to the second circuit board at the circuit side and configured to dissipate heat from any electronic components mounted on the second PCB. A PCB finger connector interconnects the first and second PCB's at the component side.

Abstract: This disclosure is directed to apparatuses, systems, and methods associated with a heat-dissipating card connector for use with a card reader connected to an electronic device. The connector has a body configured to receive a card that has circuitry, when the card is inserted into the card reader. The connector body includes a plurality of electronic contacts that engage the card circuitry and operationally link the card to the electronic device. The connector body includes at least one heat conductive spring that includes a card engaging portion. The card engaging portion contacts the card and directs heat from the card when the card is inserted in the card reader. A heat directing element, also part of the heat conductive spring, transfers heat from the card engaging portion to a heat-dissipating structure of the electronic device when the card is inserted in the card reader.

Abstract: The semiconductor device includes a plurality of semiconductor packages stacked on one another. Each semiconductor package includes a main current electrode terminal disposed in a case section of the semiconductor package, the main current electrode terminal being exposed outside the case section to be electrically connected to an external power supply. The main current electrode terminal extends in the stack direction of the semiconductor packages, and embedded in the case section at a surface portion thereof facing an external surface of the case section. Both end surface portions of the main current electrode terminal in the stack direction respectively reach end surface portions of the case section in the stack direction so that the main current electrode terminals of each adjacent two of the semiconductor packages are in contact with each other when the semiconductor packages are stacked on one another in the stack direction.

Abstract: To reduce the impedance of the ground path from a heat sink to a ground pad on a printed circuit board, and thus reduce electromagnetic interference, an electrically conductive collar is arranged around an opening in the heat sink. The electrically conductive collar may include an internal extension, such that the internal extension abuts the conducting member passed through the electrically conductive collar and the opening in the heat sink to electrically ground the heat sink to the ground pad on the printed circuit board.

Abstract: A circuit board unit of an ECU has an upper surface on which semiconductor elements are installed, a lower surface that is on the opposite side of the circuit board unit from the upper surface, and a cutout portion that is formed below the upper surface. A power module includes a conductive protruding piece and an electrically insulating main portion that holds the protruding piece. The conductive protruding piece is inserted in the cutout portion to support the circuit board unit, and is electrically connected to the semiconductor elements.

Abstract: An electro-magnetic device assembly constituted of an electro-magnetic device; a chassis arranged to sink heat; at least one thermally conductive material in thermal communication with the electro-magnetic device and with the chassis; and at least one mechanically isolating material in contact with the thermally conductive material and with the chassis, the at least one mechanically isolating material arranged to dampen the transmission of vibrations experienced by the chassis, in the direction of the magnetic field of the electro-magnetic device, to the electro-magnetic device.

Abstract: Disclosed is a composition, in particular a dispersion, which contains nanofiber material in at least one organic matrix component, said nanofiber material being pre-treated in at least one method step for adjusting the physical properties of the composition.

Abstract: An inverter (1) for supplying electric energy from a DC source to an AC grid includes a housing (2) in which electrical and electronic components (21, 22, 30) are accommodated. A cooling air channel (9) with cooling fins (37) arranged along its longitudinal axis runs across the back of the housing (2) in the middle. Sockets (13) for large electrical components (21, 22) that are closed in on at least three sides by the metal outer walls (14-19) of the housing (2) are provide on both sides of the cooling air channel (9) in the housing (2).

Abstract: An inner-layer heat-dissipating board and a multi-chip stack package structure having the inner-layer heat-dissipating board are disclosed. The inner-layer heat-dissipating board includes a metal board body formed with a plurality of penetrating conductive through holes each comprising a plurality of nano wires and an oxidative block having nano apertures filled with the nano wires. The multi-chip stack package structure includes a first chip and an electronic component respectively disposed on the inner-layer heat-dissipating board to thereby facilitate heat dissipation in the multi-chip stack structure as well as increase the overall package rigidity.

Abstract: A power semiconductor module includes an insulating substrate with a conductive circuit layer attached to one side and a baseplate attached to the other side. A power semiconductor device is attached to the conductive circuit layer. The conductive circuit layer and the baseplate are formed of a material with a coefficient of thermal expansion less than about 8.0×10?6/° C. and a density less than about 4 g/cm3.

Abstract: Heat dissipation apparatus for dissipating heat generated by a heat-generating component mounted to a circuit board. In one embodiment, the heat dissipation apparatus includes a thermally-conductive heat sink adapted to be placed in contact with the heat-generating component, a bracket adapted to hold the heat sink in place relative to the heat-generating component, and a single coil spring mounted to the bracket adapted to urge the heat sink into contact with the heat-generating component.

Abstract: A matrix assembly is provided for an electrical system such as, for example, a power distribution unit for an aircraft. The electrical system includes an enclosure and a number of current carrying components such as, for example, electrical bus members, electrical switching apparatus, and/or fuses. The matrix assembly includes a matrix member having a generally planar portion, a plurality of attachment points for attaching the current carrying components to the generally planar portion, and a plurality of mounting points for attaching the generally planar portion to a thermally conductive structure such as, for example, an aluminum airframe structure. The matrix member is a thermally conductive liquid crystalline polymer.

Abstract: A semiconductor apparatus 10 includes a radiator 30 on which plural semiconductor modules 20 that include semiconductor elements 21 are mounted, the semiconductor apparatus 10 characterized by the radiator 30 including a first main surface 30B and a second main surface 30C configured to be located on the opposite side of the first main surface 30B. Semiconductor module mount-surfaces 30B1, 30B2, 30C1, 30C2 are arranged in the first main surface 30B and the second main surface 30C in a zigzag pattern in cross-sectional view; and the semiconductor modules 20 are mounted onto some or all of the semiconductor module mount-surfaces 30B1, 30B2, 30C1, 30C2.

Abstract: Various integrated circuit voltage regulation apparatus and methods of assembling the same are provided. In one aspect, an apparatus is provided that has a stack that includes a heat sink and a semiconductor chip. The semiconductor chip has a conductive heat transfer pathway to the heat sink. A voltage regulator member is electrically coupled to the semiconductor chip and coupled to the heat sink, but is not positioned in the stack.

Abstract: A mounting assembly includes a circuit board, a securing member and a heat dissipating device. A retainer is located on the circuit board. The securing member includes a positioning portion and a claw connected to the positioning portion. The heat dissipating device includes a base attached to the circuit board and a number of fins perpendicularly located on the base. The number of fins defines a number of first air paths and a number of second air paths substantially perpendicular to the number of first air paths. The positioning portion is received in at least one of the number of first air paths and at least one of the number of second air paths, and the claw is engaged with the retainer.

Abstract: According to one embodiment, a pressing member includes: a band-like pressing portion placed on a heat receiving block arranged on an element mounted on a substrate, the pressing portion configured to press the heat receiving block against the element; a first arm, one end of the first arm being connected to one longitudinal end of the pressing portion, other end of the first arm being connected to the substrate; and a second arm, one end of the second arm being connected to other longitudinal end of the pressing portion, other end of the second arm being connected to the substrate, wherein the first arm and the second arm are connected to the pressing portion in a bent shape as seen in a planar view from above a surface of the substrate.

Abstract: An electrical control unit has a printed circuit board substrate, on which an electronic circuit is situated, which circuit includes multiple electrical components which are interconnected via printed conductors of the printed circuit board substrate, as well as housing parts for covering the electrical components on the printed circuit board substrate, and at least one device plug connector part situated on the printed circuit board substrate outside the section of the printed circuit board substrate covered by the housing parts. Outside the section covered by the at least one housing part and outside the section of the printed circuit board substrate provided with the device plug connector part, at least one contact point for an additional electrical component is situated on the printed circuit board substrate.

Abstract: Provided is a heat sink clip for fastening a heat sink on a printed circuit board (PCB). The heat sink clip includes two hooks and a wire clip. The two hooks are inversely fixed to the PCB at two opposite sides of the heat sink. The wire clip includes a pressing wire pressing the heat sink, two pairs of deforming wires extending from the lateral of the pressing wire along two radial directions of the pressing wire and away from the PCB, and two engaging wires engaging with the respective hooks such that the deforming wires are bent towards the PCB.

Abstract: An electronic device includes an electronic component and a heat sink mechanism. The electronic component includes at least one heat sink portion defining a plurality of heat sink holes. The heat sink mechanism includes at least one first conducting portion secured to an end of the heat sink holes, for dissipating heat produced by the electronic component away from the electronic device.

Abstract: A thermal connector for use with a printed circuit board assembly is disclosed. The thermal connector includes a top segment configured for thermal engagement with a heat source disposed on a top surface of a printed circuit board and for insertion through an opening of the printed circuit board to thermally engage the heat source. A middle segment of the thermal connector extends from the top segment and includes a flanged portion configured to engage a bottom surface of the printed circuit board when the top segment is inserted through the opening of the printed circuit board. A bottom segment of the thermal connector extends from the middle segment and is configured for thermal engagement to a heat dissipating element.

Abstract: A PCB with improved cooling. Openings are provided below electronic components on the PCB of an electronics device. Raised mounts or bosses on the device housing or base extend into the openings and make contact with the electronic components to act as heat sinks. A thermal pad member can be positioned between the bosses and the components to aid in the contact and heat conduction. Other embodiments include direct contact of the raised mounts or bosses with the PCB and through openings are not provided.

Abstract: An electronic device includes a bottom plate, a circuit board having an electronic component, a fan, and an airflow guide member. The circuit board is fixed to the bottom plate. The fan is arranged at the front of the circuit board. The airflow guide member is arranged between the fan and the circuit board. The airflow guide member includes an airflow guide wall defining a number of spaced slots, and a number of stop plates selectively inserted into the corresponding slots of the airflow guide wall, to leave some of the slots directly in front of the bottom of the electronic component open.

Abstract: A locking device providing thermal management for an electrical assembly board is described and includes a fluid-permeable member saturated with a fluid and disposed between the electrical assembly board and a heat sink; a pair of locking device substrates substantially orthogonal to the electrical assembly board and the heat sink; and an actuator coupled to at least one of the locking device substrates. The fluid-permeable member is disposed between the locking device substrates. The actuator is configured to compress the fluid-permeable member by at least one of the locking device substrates forcing a portion of the fluid out of the fluid-permeable member and forming at least one fluid contact interface with the electrical assembly board and the heat sink in a reversible process. A method for making a locking device is also described.

Abstract: A portable power tool includes a tool housing, a motor unit located in the tool housing, and an electronic module located in the tool housing. The electronic module includes (i) an electronic module housing having at least one housing component, and (ii) at least one printed circuit board. The at least one printed circuit board is at least partially decoupled relative to the at least one housing component of the electronic module housing.

Abstract: A semiconductor device includes a structure in which a semiconductor element (chip) is mounted in a cavity formed in a wiring board with an adhesive interposed between the chip and a bottom surface of the cavity, and electrode terminals of the chip are connected via wires to wiring portions formed on the board around the cavity. The chip is mounted in close contact with a side wall of the cavity, the side wall being near a region where a wiring for higher frequency compared with other wirings within the wiring portion is formed. A recessed portion is provided in a region of the bottom surface of the cavity, and a thermal via extending from the bottom surface of the recessed to the outside of the board is provided, the region being near a portion where the chip is in close contact.

Abstract: A semiconductor device is disclosed that includes an insulation substrate, a metal wiring layer, a semiconductor element, a heat sink, and a stress relaxation member located between the insulation substrate and the heat sink. The heat sink has a plurality of partitioning walls that extend in one direction and are arranged at intervals. The stress relaxation member includes a stress absorbing portion formed by through holes extending through the entire thickness of the stress relaxation member. Each hole is formed such that its dimension along the longitudinal direction of the partitioning walls is greater than its dimension along the arranging direction of the partitioning walls.

Abstract: A method of manufacturing is provided that includes placing a thermal management device in thermal contact with a first semiconductor chip of a semiconductor chip device. The semiconductor chip device includes a first substrate coupled to the first semiconductor chip. The first substrate has a first aperture. At least one of the first semiconductor chip and the thermal management device is at least partially positioned in the first aperture.

Abstract: A power module includes a first heat sink, first and second power chips, a thermo-conductive insulating layer, a lead frame and a molding compound. The first heat sink has a first area and a second area. The first power chip is disposed in the first area. The thermo-conductive insulating layer is disposed in the second area. The second power chip is disposed on the heat sink through the thermo-conductive insulating layer. The lead frame is electrically connected to at least one of the first and second power chips. The molding compound covers the first and second power chips, the thermo-conductive insulating layer and a portion of the lead frame. The first heat sink is electrically connected to at least one of the first and second power chips. Because the first power chip is not disposed on the first heat sink through the thermo-conductive insulating layer, the cost can be reduced.

Abstract: An electronic component package includes a support and heat conductor. The heat conductor has a protuberance and the support has a socket arranged to be able to receive the protuberance so that the movement of heat conductor relative to the support during the assembly process is reduced.

Abstract: An electronic device includes a bottom plate, a cover plate, a dust collection box, and a dust cleaning apparatus. A heat sink is mounted in the bottom plate. The cover plate covers on the bottom plate. The cover plate defines a cutout. The dust collection box is placed on the bottom plate via the cutout. The dust cleaning apparatus is slidably mounted on the bottom plate. The dust cleaning apparatus moves relative to the heat sink to sweep dust of the heat sink into the dust collection box.

Abstract: Systems and methods for balanced cooling of electrical systems, including electrical systems containing transceivers used in electrical and optical communication. An electrical system includes a cage, where the cage has a top, front and bottom. The cage contains a plurality of upper bays disposed in the front of the cage. Each of the plurality of upper bays is configured to receive a transceiver. The cage also contains a plurality of lower bays disposed in the front of the cage. Each of the lower bays is configured to receive a transceiver. Additionally, each of the plurality of upper bays is stacked on one of the plurality of lower bays. An upper heat sink extends from the outer surface of the top of the cage and a lower heat sink extends from the outer surface of the bottom of the cage.

Abstract: The present invention relates to a device for transfer of heat energy in a well logging tool, where a variable heat flow from a chamber for electronics via a thermovalve is transmitted into a heat sink consisting of cooled metal, thereby establishing an approximately constant temperature in the chamber for electronics. The device comprises an electronics modular unit and a heat sink modular unit, which modular units are connected via an intermediate section, where a heat-regulating thermovalve provides heat conduction between a conical piston and a conical piston seat, for transferring heat energy.

Abstract: An object is to release heat efficiently to heat-resistance abilities of individual components by enhancing a heat-radiation performance of power circuit components forming a power module (100) and by enhancing a heat generation balance. The power circuit components formed of power switching elements (107 and 108) forming a bridge circuit and a motor relay switching element (109) are mounted on conductive members (102) while a heat generation balance is maintained. Then, the conductive members (102) are disposed on a heat-releasing heat sink (30) by abutment, and the power circuit components and the heat sink (30) are integrally molded using mold resin (101).

Abstract: An exemplary heat dissipation device includes a fin assembly, a heat pipe, and a protective member. The fin assembly includes stacked fins and air passages between fins. Each fin includes a main body, an extending hole defined in the main body, and a flange extending from the main body around the extending hole. The heat pipe is received in the extending holes of the fins and abuts the flanges of the fins. The protective member includes a plurality pairs of elastic arms. Each pair of elastic arms is sandwiched between a free end of the flange of a corresponding fin and the main body of a corresponding adjacent fin to prevent solder associated with the heat pipe from flowing into the corresponding air passage.

Abstract: The purpose of the present invention is to provide a power semiconductor device which has a light weight, high heat dissipation efficiency, and high rigidity. The power semiconductor device including a base 1, semiconductor circuits 2 which are arranged on the base 1, and a cooling fin 3 which cools each of the semiconductor circuits 2, in which one or more protruding portions 1a, 1b are formed on the base 1, widths of the protruding portions 1a, 1b in a direction parallel to the base 1 surface being longer than a thickness of the base 1, thereby providing power semiconductor devices 100, 200, 300, 400 which have a light weight, high heat dissipation efficiency, and high rigidity.

Abstract: CXP is a telecommunications connector standard based on cage assemblies originally designed for copper cables. Optical transceivers dissipate more heat than copper cables, however, so cage assemblies designed for copper cables cannot remove heat adequately for proper transceiver operation. One embodiment of the inventive cage assemblies removes heat from an optical transceiver with a heat spreader, which protrudes through an aperture in a cage, and a compressible gap pad in thermal contact with the heat spreader. Inserting the optical transceiver into the cage places the transceiver in thermal contact with a heat spreader and pushes the heat spreader out of the cage, which, in turn, causes the gap pad to come into thermal contact with a heat pipe and/or a heat sink. The embodiment provide a low mechanical profile to support high-density circuit board configurations for high-density optical connectivity systems, such as used in Dense Wavelength Division optical networking.

Abstract: An extruded aluminum electrical circuit component carrier on which at least one electrical circuit component is to be mounted. A first side portion and a second side portion include areas for mounting at least one first electrical circuit component part and at least one second electrical circuit component part. An inlet to which an inlet conduit for a cooling liquid can be connected. An outlet to which an outlet conduit for the cooling liquid can be connected. At least one supply passage for the cooling liquid formed through the first side portion. At least one return passage for the cooling liquid formed through the second side portion. The at least one supply passage is connected to the at least one return passage in series.

Abstract: There is provided an electronic component which comprises an insulating member on which an electronic element is mounted, and a thermal diffusion member on which the insulating member is mounted, wherein a thermal expansion coefficient of the insulating member is lower than a thermal expansion coefficient of the thermal diffusion member, and the insulating member is mounted in an embedded manner in a recess formed on a surface of the thermal diffusion member.

Abstract: A power semiconductor module includes a module housing with a sealing ring on its top side. The sealing ring, in co-operation with the module housing and a printed circuit board attached to the power semiconductor module, hermetically seals feed-through locations at the top side of the module housing for feeding through electric terminals of the power semiconductor module. On the bottom side of the module housing a sealing ring hermetically seals the bottom side of the module housing.

Abstract: The subject of the invention is an electric power switchgear, an insulating radiator, and a method for installing the radiator in an electric power switchgear, and in particular in a medium or high voltage switchgear. The electric power switchgear comprising working elements placed in the housing and connected with busbars and branches, and cooled with air, is characterized in that it contains at least one insulating radiator made of thermoplastic material of increased thermal conductivity ??2 W/mK, which is placed in the electric field of the switchgear and which is connected by a non-permanent fastening to at least one busbar or/and at least one branch. The insulating radiator designed for the switchgear is an injection molding including a base plate to whose top face a system of heat evacuating elements of identical or diverse shape is attached, and to its side surfaces elastic assembly catches are fixed.

Abstract: An electronic assembly includes a heat source having a maximum operating temperature, a heat dissipating device, a thermal interface material sandwiched between the heat source and the heat dissipating device. The thermal interface material includes a base and a plurality of first thermally conductive particles dispersed in the base. The first thermally conductive particles have a size monotonically changing from a first size less than 100 nanometers and a first melting temperature below the maximum operating temperature, to a second size larger than 100 nanometers and a second melting temperature above the maximum operating temperature when the heat source operates at a temperature above the first melting temperature and at or below the maximum operating temperature.

Abstract: At least a part of a heat radiation member (9) connected to a DRAM (11) for radiating heat of the DRAM (11) is exposed from a protection member (4) arranged to surround the DRAM and the heat radiation member (9) so as to protect the DRAM (11). Thus, it is possible to provide a semiconductor device having a preferable heat radiation performance.

Abstract: The invention discloses a hidden pin type high-power LED support, which comprises conductive pins and a base for packing the conductive pins, wherein a cavity is formed on the top of the base; a heat sink is fixedly arranged at the bottom of the cavity; the conductive pins pass through the bottom surface of the base; and the bottom surfaces of the conductive pins are parallel and level to the bottom surfaces of the base and the heat sink. The high-power LED support provided by the invention realizes the subsequent automated production of LEDs through a vibration plate smoothly by successfully hiding the conductive pins extended to both sides of an imitated Lumen lamp bead in the prior art in a frame of the base. Moreover, the invention also discloses high-power LED packaging structure and technology using same.

Abstract: When the side of a surface of the board on which the device to be cooled is mounted is defined as the upper side while the side of the other surface is defined as the lower side in a substantially vertical direction to the board, a cooling device includes a heat receiving portion arranged on the upper side the device to be cooled for performing heat exchange with the device to be cooled; a columnar portion standing substantially perpendicularly on the board; a base having a through hole which the columnar portion passes through, and arranged on the upper side of the heat receiving portion; and biasing means for biasing the base along the columnar portion to thereby press the heat receiving portion against the device to be cooled.

Abstract: The exemplary embodiments of the present invention provide a method and system for aligning graphite nanofibers in a thermal interface material to enhance the thermal interface material performance. The method includes preparing the graphite nanofibers in a herringbone configuration, and dispersing the graphite nanofibers in the herringbone configuration into the thermal interface material. The method further includes applying a magnetic field of sufficient intensity to align the graphite nanofibers in the thermal interface material. The system includes the graphite nanofibers configured in a herringbone configuration and a means for dispersing the graphite nanofibers in the herringbone configuration into the thermal interface material. The system further includes a means for applying a magnetic field of sufficient intensity to align the graphite nanofibers in the thermal interface material.

Abstract: A heat sink and method of fabrication are provided for removing heat from an electronic component(s). The heat sink includes a heat sink base and frame. The base has a first coefficient of thermal expansion (CTE), and includes a base surface configured to couple to the electronic component to facilitate removal of heat. The frame has a second CTE, and is configured to constrain the base surface in opposing relation to the electronic component, wherein the first CTE is greater than the second CTE. At least one of the heat sink base or frame is configured so that heating of the heat sink base results in a compressive force at the base surface of the heat sink base towards the electronic component that facilitates heat transfer from the electronic component. A thermal interface material is disposed between the base surface and the electronic component.

Abstract: A new mounting structure is provided in which, when a heat sink is mounted (fixed) on a circuit board using a spring member, an anchor for fixing the spring member is formed in a very small size in plan view. In the present invention, at least one anchor for mounting a heat sink body on a circuit board is set in a projected state on the heat sink body side and both ends of a spring member are each directly or indirectly attached to an anchor, whereby the heat sink body is mounted on the circuit board. In the anchor, a main body section projecting on the circuit board is formed in a substantially circular shape or a polygonal shape. When the spring member is attached to the anchor, the spring member is attached to an attaching section in an externally fit state.

Abstract: The present invention discloses a backplane of a backlight module, a backlight module and an LCD device. The backplane of the backlight module comprises a heatsink plate with good heat dispersion and a low-cost supporting plate connected with the heatsink plate, wherein the heat conductivity of the heatsink plate is larger than that of the supporting plate. In the present invention, metal with good heat dispersion and common material with low cost are respectively adopted and joined according to different radiating areas of the backlight module; then, the heat dispersion is ensured and meanwhile, the cost is reduced.

Abstract: A water-cooled communication chassis includes a chassis body and a water cooling unit. The chassis body includes at least one heat receiving portion, at least one heat dissipation portion, and at least one first water pipe system. The first water pipe system has a front part extended through the heat receiving portion and a rear part arranged on the heat dissipation portion, so that heat absorbed by the heat receiving portion is transferred via the first water pipe system to the heat dissipation portion and dissipated therefrom into ambient air. The water cooling unit communicates with the first water pipe system and drives a cooling fluid stored therein to circulate in between the first water pipe system and the water cooling unit, so that the heat absorbed by the heat receiving portion can be quickly and continuously carried away from the communication chassis by the circulating cooling fluid.

Abstract: A system for controlling temperature of an antenna module including a heat generating module, and a radome and an underbody cover that enclose the heat generating module. The system includes: a heat collecting unit mounted on inner surface of the antenna module; a heat discharging unit mounted on outer surface of the antenna module; and a heat transfer unit for transferring heat from the heat collecting unit to the heat discharging unit.