Abstract: A mobile terminal having a detachable sub-module is disclosed. The mobile terminal includes a sub-module having a sub-function configuration unit formed with parts for performing a function and a main terminal having a display unit at a front surface and a connection unit at a rear surface for coupling the sub-module to the main terminal. A magnet is installed at a side surface of the connection unit or the sub-module, and the sub-module is coupled to the main terminal or is detached from the main terminal through the magnet. Enhancement of the portability and function quality of mobile terminals that support various functions is achieved by coupling a sub-module for performing a function to the main terminal having a display unit that allows user interactivity with the mobile terminal.

Abstract: The present invention relates to units or modules for data acquisition that may either be used as stand alone units or be used to form a modular system where a plurality of modules are mounted together in a frame or rack structure as well as combinations of such stand-alone units and frames.

Abstract: Disclosed is a displayed device having a top and bottom elongate rail and a display module for displaying alpha numeric information to passengers on a mass transit vehicle. The display modules may be mounted along a top and bottom edge directly to the top and bottom elongate rails. End caps are mounted to the ends of the elongate rail forming a structurally sound frame about the display module.

Abstract: What is disclosed is a modular visualization display panel. The modular visualization display panel includes a first module having at least one surface and a connection to electrical ground. The modular visualization display panel also includes a second module having at least one surface with a plurality of raised contact nodes arranged on the one surface of the second module such that when in contact with the one surface of the first module electrostatic discharge energy is directed over at least one of the raised contact nodes to the one surface of the first module.

Abstract: A packaging structure is provided which includes: a substrate, at least an electronic module, and an adhesive material. The substrate has two opposing surfaces, at least an opening penetrating the two surfaces, and two metallic frames formed on two opening ends of the at least an opening. The electronic module is disposed in the opening and has electronic elements and an encapsulant encapsulating the electronic elements. Each of the electronic elements has two opposing active surfaces exposed from the encapsulant and electrode pads formed on the two opposing active surfaces. The electrode pads are exposed from the opening. The adhesive material is filled into the opening and a gap between the electronic module and the opening, so as to secure in position the electronic modules in the opening. Compared with the prior art, the embedded electronic elements of the packaging structure according to the present invention is prevented from short circuit, and thus has increased yield rate.

Abstract: An actuator assembly for use in an electronic device is described. The actuator assembly includes a support tray, an actuator supported on the support tray, and a cover over the actuator and coupled to the support tray, a portion of the cover being movable relative to the support tray when the actuator is actuated.

Abstract: A kit for providing front-access cable terminations for rear-access shelf unit mounted in a rack system may comprise a terminal block panel, a terminal block, a set of extension cables, a rear panel, and a baffle. The terminal block panel may be configured to mount to the shelf unit. The terminal block may be mounted to the terminal block panel to provide front-access terminations for the shelf unit. The set of extension cables may provide electrical connection between the terminal block and one or more terminals disposed on a back plane associated with the shelf unit. The rear panel may be configured to attach to the shelf unit and to cover the set of extension cables. The baffle may be configured for installation in the rack system above the shelf unit and removable for access to the front-access terminations. The baffle may be configured to direct air flow rising from the rear-access equipment to the rear of the rack.

Abstract: The invention relates to a device (10) for handling notes of value. The device comprises a first module (16a) that in an operating state is electrically conductive connected via a first electrical wire to a power supply unit (26) and electrically conductive connected via a second electrical wire to a second module (16b). In a maintenance state the first module (16a) is neither electrically conductive connected to the first electrical wire nor electrically conductive connected to the second electrical wire.

Abstract: In one embodiment, a communication system for a multi-blade server system includes a multi-drop serial bus network interconnecting a management module with each of a plurality of servers in a multi-server chassis. A first transceiver subsystem is configured for communicating over the serial bus network between the management module and each server within a first frequency band. A second transceiver subsystem is configured for simultaneously communicating over the serial bus network between the management module and the servers within a second frequency band higher than the first frequency band. A first signal-filtering subsystem substantially filters out signals in the second frequency band from the first transceiver subsystem. A second signal-filtering subsystem substantially filters out the signals in the first frequency band from the second transceiver subsystem.

Abstract: A system is provided that is securable to an electronic device. The system includes a module with a connection port that is configured to connect with a corresponding connection port of the electronic device. A securing structure is securable to portions of first ends of the module and electronic device to facilitate attachment of the module alongside the electronic device. When the module is attached to the electronic device with the securing structure, a side surface of the module engages with a corresponding side surface of the electronic device and the connection port of the module connects with the corresponding connection port of the connection device to establish an electrical connection between the module and the electronic device.

Abstract: When a battery pack having an output voltage of 14.4 V that is connectable to an electric tool in a sliding manner is used as a power supply source for the electric tool that is connectable to a battery pack in an insertion manner and has a rated voltage of 12 V, the electric tool and the battery pack are connected to each other with an adaptor interposed therebetween. The adaptor has an FET that is switched at a predetermined duty of a predetermined frequency. The battery pack and the electric tool are connected or disconnected to or from each other by the switching operation, thereby dropping the output voltage of the battery pack. When the detected voltage is out of a predetermined value range, it is judged that the overcurrent or overdischarge has occurred. Then, the FET is turned off to stop the electric tool.

Abstract: Embodiments enable for the creation of microelectronic modules that may be configured in any order within a microelectronic assembly. The microelectronic modules provide for point-to-point interconnects between the modules using a standardized connector that is the same for each module. This, thereby, eliminates the need for a backplane. The modules may be configured in any order within a microelectronic assembly. No prior knowledge regarding the functions of an individual microelectronic module is required if the microelectronic modules conform to the standardized I/O of the standardized connector.

Abstract: A method of manufacturing a plurality of circuit modules includes cutting a mother board including a plurality of electronic components mounted on at least a single surface thereof, and cutting out a plurality of circuit boards from the mother board. A plurality of terminal electrode boards, each of which is arranged so as to straddle at least the circuit boards that are adjacent to each other, are mounted onto one surface of the mother board. The mother board including the terminal electrode boards mounted on the one surface, and the electronic components, mounted on the at least single surface, is diced at positions where the circuit boards are to be cut out.

Abstract: A component loading system includes a board having a socket. A first base member is secured to the board through a plurality of first heat dissipater coupling posts. A first securing member is moveably coupled to the first base member. A second base member is secured to the board through a plurality of second heat dissipater coupling posts. A second securing member is moveably coupled to the second base member. A loading member is moveably coupled to the first base member and includes a pair of opposing side edges that define a width of the loading member. A heat dissipater is operable to be coupled to the plurality of first heat dissipater coupling posts and the plurality of second heat dissipater coupling posts.

Abstract: An electronic assembly has a plurality of functional units each including a board element populated with electronic modules, which board element has in each case a number of contact locations arranged in at least one row, and a contact board, which has for each board element at least one row of contact receptacles that are directly electrically connected to the contact locations of the associated board element. These rows point toward a side of the contact board in their longitudinal direction. A plurality of similar assemblies are produced compactly and cost-effectively by providing a communication unit separate from the contact board and serving for communication with modules of the board elements. The communication unit is connected to the contact board via a plurality of data lines which are contact-connected to the contact board on the side to which the rows point.

Abstract: The present invention discloses a data processing device and a motherboard thereof. The feature of the present invention is separating the motherboard thereof into two daughter boards. The first daughter board is fixed to the data processing device, and the second daughter board is connected to the first daughter board through a connector. The units that frequently be changed, such as a data processing component and data storing component, are disposed on the second daughter board. Besides, a hard disk signal bus of the data processing device, an optical disk drive signal bus, or a screen signal bus may be electrically connected to the first daughter board. As a result, when the data processing device is under maintenance or upgrade, the second daughter board can be removed without removing the casing, and also the plug-in and plug-out frequency of the connectors can be lower.

Abstract: An integrated circuit packaging system and method of manufacture thereof includes: a substrate; a first module attached to the substrate; a conductive connection built on the first module and conductively connected thereto; an adhesive spacer on the first module with the conductive connection exposed; and a second module on the adhesive spacer in conductive contact with the conductive connection and partially supported thereby.

Abstract: A main chip has a signal processing circuit for executing signal processing; a plurality of signal transmitting circuits for transmitting signals between the signal processing circuit and a signal transmitting circuit; and a control circuit for controlling operation/non-operation of the signal transmitting circuits in accordance with signal processing content of the signal processing circuit. Functional chips each have a signal processing circuit for executing auxiliary signal processing different from that of the signal processing circuit; and one or a plurality of signal transmitting circuits for transmitting signals between the signal processing circuit and the signal transmitting circuits. The main chip and the functional chips are stacked. The signal transmitting circuits and the signal transmitting circuit are non-contact-type signal transmitting circuits utilizing inductive coupling and are arranged so as to overlap when viewed from the stacking direction.

Abstract: The disclosure describes a frame for mounting a device above a printed circuit board (PCB) in an electronic device. The frame comprises: a frame section formed to be located on the PCB about a surface device on a section of the PCB; and a cover for placement on top of the frame section and for providing a support substrate for the device. In the frame, the frame section is securable to the PCB above at least a part of the surface device; the cover is locatable on the frame section with the device mounted to the cover; and the cover is shaped to allow a feature on the bottom of the device to extend downward towards an interior cavity of the frame.

Abstract: Disclosed herein is a 3D power module package, including: a power converting unit packaged to include a heat radiating substrate, a power device connected to the heat radiating substrate, and a lead frame; a controlling unit packaged to include a controlling unit substrate and IC and controlling devices mounted on an upper portion of the controlling unit substrate; and an electrical connecting unit electrically connecting the packaged power converting unit and the packaged controlling unit.

Abstract: A package structure includes a networking unit including a plurality of switches/routers and a plurality of network interface units coupled to the plurality of switches/routers, and an interposer including a plurality of metal connections. The interposer is substantially free from functional elements built therein. A functional element is outside of, and bonded onto, the interposer, wherein the functional element is electrically coupled to the networking unit through the plurality of metal connections.

Abstract: A multi-layer system-on-chip (SoC) module structure is provided. The multi-layer SoC module structure includes at least two circuit board module layers and at least one connector module layer. Each connector module layer is sandwiched between and thus electrically connects two circuit board module layers such that the SoC module structure is formed by stacking. Each circuit board module layer is composed of at least one circuit board module while each connector module layer is composed of at least one connector module. Hence, the SoC module structure can be manufactured as a three-dimensional structure, thus allowing highly flexible connections within the SoC module structure.

Abstract: A micro grid apparatus and associated method of formation. At least one tier in a printed circuit board is formed. Each tier includes complex shapes interconnected by bridge modules. Each complex shape includes a central area and at least three radial arms external to and integral with the central area. Each radial arm extends radially outward from the central area. Each pair of adjacent radial arms defines a docking bay. Each complex shape is either a power hub whose central area includes rechargeable batteries or a processor hub whose central area includes processors. A bridge unit of a bridge module is latched in at least one docking bay of each complex shape. Each docking bay not latching a bridge unit of any bridge module latches an irregular shaped module. An irregular shaped module is latched in at least one docking bay in at least two complex shapes.

Abstract: To improve reliability of a circuit module by improving heat release performance and minimizing thermal influence on a device to be mounted, a base substrate having a first substrate mounted thereon is fitted into a lower portion of casing member, and a second substrate is installed in the upper portion of the casing member so that a spaced area can be provided. In addition, a drive device to be installed on the second substrate is positioned off the center of the second substrate.

Abstract: A system includes a communications device and power supply units detachably installable thereon. On an outer surface of the communications device there is an aperture arranged to enable the insertion of different power supply units in different sections of the volume inside the communications device. The volume is continuous so that instead of separate power supply units it is possible to insert, through the aperture, in the volume a physically larger power supply unit which, when installed in the volume, extends into more than one section of the volume. The communications device can be flexibly equipped e.g. with power supply units functioning as back-ups for each other, each taking up part of the volume, or with a single power supply unit, larger than the above-mentioned, taking up the volume. Therefore the volume inside the communications device can be utilized in connection with power supply units of various types.

Abstract: A modular electronic enclosure having a maximum height of 1 U and a width adapted to fit between the rails of a 19 inch rack is adapted to receive up to ten single-width Advanced Mezzanine Cards (AMCs) installed horizontally in the enclosure. Some modules that are not compliant with AMC standards may be installed in the modular electronic enclosure. A backplane, backplane structural support, combined card guide, chassis cover, and chassis bottom cooperate mechanically to provide a stiff, stable enclosure resistant to mechanical flexure. The modular electronic enclosure includes two hot-swappable cooling units which cooperate to establish push-pull cooling airflow. The modular electronic enclosure is further adapted to receive a Power Unit and an MCH. In another embodiment, the modular electronic enclosure includes a backplane with more than one core and has mounting locations and electrical connectors for up to twenty single-width 4 HP electronic modules.

Abstract: An assembly of substrate packages interconnected with flex cables. The assembly allows input/output (I/O) signals to be speedily transmitted between substrate packages via flex cable and without being routed through the motherboard. Embodiments relate to a substrate package providing detachable inter-package flex cable connection. The flex cable comprises a transmission region that includes a plurality of signal traces and a ground plane. A plurality of solder mask strips are disposed on the plurality of signals traces to provide anchoring for the signal traces. The solder mask strips intersect the signals traces. The exposed signal traces and the ground plane are coated with organic solderability preservative material. Hermetically-sealed guiding through holes are provided on the substrate package as a mechanical alignment feature to guide connection between flex cables and high speed I/O contact pads on the substrate package.

Abstract: A detachable module system includes a plurality of modules that couple to a corresponding plurality of module mounts on a mounting plate. To install a selected module into the module system, a user translates the selected module to an engage position on its respective module mount to engage the selected module with a immediately preceding adjacent module. Any one of the modules may be identified and removed from its module mount, without requiring removal of the remaining modules. The modules may house various types of electronic devices.

Abstract: A power conversion module includes a circuit carrier board, a semiconductor module and an inductor module. The circuit carrier board has plural bonding pads. The semiconductor module is disposed on a first surface of the circuit carrier board. The inductor module has plural pins. The pins are extended from the inductor module along a first direction and connected with corresponding bonding pads on the circuit carrier board, so that a receptacle is defined between the inductor module and the circuit carrier board for accommodating the semiconductor module.

Abstract: A modular computer includes a display with a docking station on its back side. A CPU module connects to the docking station. Peripheral modules connect with the resulting display/CPU assembly so that the peripheral modules contact the back side of the display screen.

Abstract: A composite electronic circuit assembly comprises two MOS or CMOS circuit dice (100, 200) superimposed inside a package. Different modules of the circuit assembly are distributed between the two dice based on the digital, analog, or hybrid nature of said modules. Such a distribution makes it possible to group together the digital modules of the circuit assembly in one of the die and the analog or hybrid modules in the other die. The production cost, development time, and electrical energy consumption of the circuit assembly may thus be reduced.

Abstract: A telecommunications arrangement including a chassis, at least one power supply, and a plurality of conversion modules that provide an electrical-to-optical or optical-to-electrical signal conversion. The chassis includes a separate back plane made up of individual back panels. The back panels are attached to the chassis by a tab and swell latch. The conversion modules include a printed circuit board, an input/output arrangement of connectors, and a radius limiter mounted to the printed circuit board.

Abstract: Provided is a circuit board device, wherein degrees of freedom are provided for a GND connecting position among plural printed boards, and noise shield and/or heat sink effects are provided. An electronic device provided with the circuit board device and a GND connecting method are also provided. Circuit board device (100) includes a pair of printed boards (110, 120), noise generating component (112) and/or heat generating component (122), and metal plate (140). Printed boards (110, 120) include mounting surfaces and GND connecting terminals (111, 121) arranged on the respective mounting surfaces, and the mounting surfaces are arranged to face each other. Noise generating component (112) and/or heat generating component (122) is mounted on the mounting surface of at least one of a pair of printed boards (110, 120).

Abstract: Connecting a plurality of chassis using a rigid connection. A first coupling element of a first chassis may be mated with a first rigid connection. The first coupling element may be positioned on an exterior housing of the first chassis. A second coupling element of a second chassis may be mated with the first rigid connection. The second coupling element may be positioned on an exterior housing of the second chassis. Connecting the first chassis and the second chassis may allow the first and second chassis to communicate.

Abstract: An electrical housing includes power components grouped together in power modules and control components grouped together in a control module that is separate from the power modules.

Abstract: A device includes: a wiring board having first and second surfaces opposing each other; and a plurality of memory packages on the first surface. The wiring board includes: a first set of terminals on the first surface; a plurality of second sets of terminals on the first surface; and a plurality of first signal lines. The terminals of the first set receive respective ones of a plurality of first signals supplied from a control device. Each of the second sets is provided for a corresponding one of the memory packages. The terminals of each of the second sets contact the corresponding one of the memory packages. The first signal lines extend from respective ones of the terminals of the first set while coupling respective ones of the terminals of each of the second sets. The first signal lines extend on the first surface without extending in the wiring board.

Abstract: An electronic component package is described. The electronic component package includes a first electronic component package module mounted on a surface of a packaging layer. A second electronic component package module laminated on a bottom of the first electronic component package module is mounted on a surface of a packaging layer. The first and second electronic component package modules respectively include at least two semiconductor chips laminated. A first redistribution layer is between the first and the second electronic component package modules, electrically connected to the first and the second electronic component package modules. A conductive bump is mounted on a bottom of the second electronic component package module, electrically connected to the second electronic component package module.

Abstract: A functional unit of a consumer electronic device and an adapter. performing a first primary function and mountable to an appliance host performing a second primary function. The adapter includes a main body, a first support component capable of supporting the consumer electronic device, a second support component capable of removably coupling the functional unit to the host, and a third support component capable of alternatively supporting the functional unit on a horizontal surface when the adapter main body is removed from the host. The adapter provides an electromagnetic service to the consumer electronic device selected from a power service and a data service supplied by the adapter.

Abstract: A back-wiring board that connects to a main circuit board of a power distribution system. The back-wiring board includes a plurality of connectors configured to mechanically secure to a plurality of bus bars. The connectors of the back-wiring board are further configured to receive a voltage signal from the plurality of bus bars and to transmit the voltage signal to the back-wiring board. The back-wiring board also includes a plurality of wire-wrap pins integrated into a surface of the back-wiring board, wherein the wire-wrap pins are configured to receive data input signals. The back-wiring board includes a right-angle connector configured to couple the back-wiring board to the main circuit board.

Abstract: A power routing device includes one or more mounting portions and one or more power routing portions. At least one of the mounting portions can be mounted in an expansion slot of a circuit board assembly. The power routing portion can route electrical power to the circuit board assembly. In one embodiment, the expansion slot is a slot for a PCI expansion card.

Abstract: The invention relates to a multilayer printed circuit board structure comprising a stack of plurality of electrically insulating and/or electroconductive layers and at least one passive or active electrical component arranged inside the stack of layers, the component extending laterally only in part of the surface extension of the stack of layers. The invention also relates to a passive or active electrical component mounted on the stack, to an associated wiring, and to a corresponding production method. According to the invention, the insert is embedded between two electrically insulating liquid resin layers or prepreg layers extending over the entire surface and covering the insert on both sides, the insert being surrounded by a resin material that is liquefied by compression or lamination of the structure. The invention structure can be used in printed circuit board technology.

Abstract: An apparatus (102) comprises a mechanical interface configured to mechanically receive a module (101) into an assembled configuration. Within said mechanical interface, the apparatus comprises a first connector configured to receive a first matching counterpart in a first insertion direction (103), and a second connector configured to receive a second matching counterpart in a second insertion direction (104), which second insertion direction is the direction of a curvilinear motion and different from said first insertion direction (103). The apparatus (102) comprises a hinge joint between said first connector and a body of the apparatus. The hinge joint has an axis of rotation, which is essentially perpendicular against said second insertion direction (104).

Abstract: A first backplane for being electrically coupled to a second backplane, a system monitoring module, and at least one transducer monitoring module includes a system interface bus configured to be coupled to the system monitoring module and the second backplane. The intermediate backplane also includes at least one monitor interface bus configured to be coupled to the at least one transducer monitoring module and the second backplane and an intermediate backplane bus configured to be coupled to the at least one transducer monitoring module and the system monitoring module.

Abstract: An improved power supply and platform for a military radio has been developed. The apparatus includes a base that is adapted and arranged for supporting a HARRIS 117 radio and a power amplifier adapted to amplify radio frequency output of the radio. The connectors include an electrical connector for the radio and a connector for the amplifier. A power supply is housed within the assembly. A power supply for the connector to the amplifier is also housed within the assembly. Also included is a wiring harness for a SINCGARS LS/671 device and a LED indicator to identify which radio is in operation for multiple radio configurations.

Abstract: A storage device backplane and an identification circuit for identifying using situations of the storage device backplane are provided. The storage device backplane possesses a first connection interface and a second connection interface, for being used as a first backplane supporting a motherboard, or a second backplane cascaded to the first backplane, or a first backplane supporting a daughterboard of the motherboard. The first and second backplanes possess the same storage device backplane structure. If the storage device backplane is used as the first backplane, a first connection interface of the first backplane is coupled to the motherboard or the daughterboard thereof; if the storage device backplane is used as the second backplane, a first connection interface of the second backplane is coupled to a second connection interface of the first backplane. The identification circuit identifies using situations of the storage device backplane and display corresponding correct indicator number.

Abstract: A semiconductor device comprises: a plurality of semiconductor chip; a socket; and a mounting board equipped with the socket. Each of the semiconductor chips has a major surface, a back surface and a plurality of connection terminals on the major surface. The socket has internal connection terminals inside and external connection terminals outside, and the internal connection terminals are in contact with the connection terminals of the semiconductor chips.

Abstract: A wiring board and method of forming the wiring board. The wiring board includes a first substrate, and a second substrate having a smaller mounting area than a mounting area of the first substrate. A base substrate is laminated between the first substrate and the second substrate such that the first substrate extends beyond an edge of the second substrate, and at least one via formed in at least one of the first substrate or the second substrate. A thickness of a portion of the base substrate that is sandwiched between the first substrate and the second substrate is greater than a thickness of a portion of the base substrate that is not sandwiched between the first substrate and the second substrate.

Abstract: A wiring board and method of forming a wiring board. The wiring board includes a first substrate and a second substrate having a smaller mounting area than a mounting area of the first substrate. A base substrate is laminated between the first substrate and the second substrate such that the first substrate extends beyond at least one edge of the second substrate. At least one of the base substrate, the first substrate or the second substrate comprises pliable resin, and at least one other of the base substrate, the first substrate or the second substrate comprises an inorganic filler.

Abstract: In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.

Abstract: A USB memory device includes a main body, a USB plug, and a circuit. The main body includes a front rigid section, a rear rigid section, and a middle flexible section connected to the front rigid section and the rear rigid section respectively. The USB plug is connected to the front rigid section. The circuit is received in the rear rigid section and electrically connected to the USB plug.