Plural Patents (Class 361/729)
  • Patent number: 8300414
    Abstract: A system is provided that is securable to an electronic device. The system includes a module with a connection port that is configured to connect with a corresponding connection port of the electronic device. A securing structure is securable to portions of first ends of the module and electronic device to facilitate attachment of the module alongside the electronic device. When the module is attached to the electronic device with the securing structure, a side surface of the module engages with a corresponding side surface of the electronic device and the connection port of the module connects with the corresponding connection port of the connection device to establish an electrical connection between the module and the electronic device.
    Type: Grant
    Filed: April 6, 2011
    Date of Patent: October 30, 2012
    Assignee: Exelis Inc.
    Inventors: Greg M. Hoff, Dan Leeuw, Ed Poorman
  • Publication number: 20120262035
    Abstract: When a battery pack having an output voltage of 14.4 V that is connectable to an electric tool in a sliding manner is used as a power supply source for the electric tool that is connectable to a battery pack in an insertion manner and has a rated voltage of 12 V, the electric tool and the battery pack are connected to each other with an adaptor interposed therebetween. The adaptor has an FET that is switched at a predetermined duty of a predetermined frequency. The battery pack and the electric tool are connected or disconnected to or from each other by the switching operation, thereby dropping the output voltage of the battery pack. When the detected voltage is out of a predetermined value range, it is judged that the overcurrent or overdischarge has occurred. Then, the FET is turned off to stop the electric tool.
    Type: Application
    Filed: June 22, 2012
    Publication date: October 18, 2012
    Applicant: Hitachi Koki Co., Ltd.
    Inventors: Nobuhiro TAKANO, Yoshikazu Kawano, Kazuhiko Funabashi, Yuuichi Konuma, Masateru Niyada, Chikai Yoshimizu, Eiji Nakayama, Kenro Ishimaru
  • Publication number: 20120257358
    Abstract: Embodiments enable for the creation of microelectronic modules that may be configured in any order within a microelectronic assembly. The microelectronic modules provide for point-to-point interconnects between the modules using a standardized connector that is the same for each module. This, thereby, eliminates the need for a backplane. The modules may be configured in any order within a microelectronic assembly. No prior knowledge regarding the functions of an individual microelectronic module is required if the microelectronic modules conform to the standardized I/O of the standardized connector.
    Type: Application
    Filed: April 5, 2011
    Publication date: October 11, 2012
    Applicant: RAYTHEON COMPANY
    Inventors: Shaun L. Champion, Philip H. Ives, Harry A. Andreas, Norman C. Lee, Karrie D. Dooley
  • Publication number: 20120250265
    Abstract: A method of manufacturing a plurality of circuit modules includes cutting a mother board including a plurality of electronic components mounted on at least a single surface thereof, and cutting out a plurality of circuit boards from the mother board. A plurality of terminal electrode boards, each of which is arranged so as to straddle at least the circuit boards that are adjacent to each other, are mounted onto one surface of the mother board. The mother board including the terminal electrode boards mounted on the one surface, and the electronic components, mounted on the at least single surface, is diced at positions where the circuit boards are to be cut out.
    Type: Application
    Filed: June 18, 2012
    Publication date: October 4, 2012
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventor: Toshiya KAWATE
  • Patent number: 8279606
    Abstract: A component loading system includes a board having a socket. A first base member is secured to the board through a plurality of first heat dissipater coupling posts. A first securing member is moveably coupled to the first base member. A second base member is secured to the board through a plurality of second heat dissipater coupling posts. A second securing member is moveably coupled to the second base member. A loading member is moveably coupled to the first base member and includes a pair of opposing side edges that define a width of the loading member. A heat dissipater is operable to be coupled to the plurality of first heat dissipater coupling posts and the plurality of second heat dissipater coupling posts.
    Type: Grant
    Filed: September 7, 2010
    Date of Patent: October 2, 2012
    Assignee: Dell Products L.P.
    Inventor: Lawrence Alan Kyle
  • Publication number: 20120243181
    Abstract: An electronic assembly has a plurality of functional units each including a board element populated with electronic modules, which board element has in each case a number of contact locations arranged in at least one row, and a contact board, which has for each board element at least one row of contact receptacles that are directly electrically connected to the contact locations of the associated board element. These rows point toward a side of the contact board in their longitudinal direction. A plurality of similar assemblies are produced compactly and cost-effectively by providing a communication unit separate from the contact board and serving for communication with modules of the board elements. The communication unit is connected to the contact board via a plurality of data lines which are contact-connected to the contact board on the side to which the rows point.
    Type: Application
    Filed: June 8, 2012
    Publication date: September 27, 2012
    Applicant: DIEHL BGT DEFENCE GMBH & CO. KG
    Inventor: HAKAN KISAKUEREK
  • Patent number: 8264842
    Abstract: The present invention discloses a data processing device and a motherboard thereof. The feature of the present invention is separating the motherboard thereof into two daughter boards. The first daughter board is fixed to the data processing device, and the second daughter board is connected to the first daughter board through a connector. The units that frequently be changed, such as a data processing component and data storing component, are disposed on the second daughter board. Besides, a hard disk signal bus of the data processing device, an optical disk drive signal bus, or a screen signal bus may be electrically connected to the first daughter board. As a result, when the data processing device is under maintenance or upgrade, the second daughter board can be removed without removing the casing, and also the plug-in and plug-out frequency of the connectors can be lower.
    Type: Grant
    Filed: March 30, 2010
    Date of Patent: September 11, 2012
    Assignee: Elitegroup Computer Systems Co., Ltd.
    Inventors: Kuang-Liang Chen, Ting-Hao Wang, Ching-Tsai Chang, Yun-Ping Liu, Wen-Bin Tsay
  • Publication number: 20120224332
    Abstract: An integrated circuit packaging system and method of manufacture thereof includes: a substrate; a first module attached to the substrate; a conductive connection built on the first module and conductively connected thereto; an adhesive spacer on the first module with the conductive connection exposed; and a second module on the adhesive spacer in conductive contact with the conductive connection and partially supported thereby.
    Type: Application
    Filed: March 2, 2011
    Publication date: September 6, 2012
    Inventors: JaEun Yun, Jong Wook Ju
  • Patent number: 8243467
    Abstract: A main chip has a signal processing circuit for executing signal processing; a plurality of signal transmitting circuits for transmitting signals between the signal processing circuit and a signal transmitting circuit; and a control circuit for controlling operation/non-operation of the signal transmitting circuits in accordance with signal processing content of the signal processing circuit. Functional chips each have a signal processing circuit for executing auxiliary signal processing different from that of the signal processing circuit; and one or a plurality of signal transmitting circuits for transmitting signals between the signal processing circuit and the signal transmitting circuits. The main chip and the functional chips are stacked. The signal transmitting circuits and the signal transmitting circuit are non-contact-type signal transmitting circuits utilizing inductive coupling and are arranged so as to overlap when viewed from the stacking direction.
    Type: Grant
    Filed: February 5, 2008
    Date of Patent: August 14, 2012
    Assignee: NEC Corporation
    Inventors: Yoshihiro Nakagawa, Masayuki Mizuno
  • Patent number: 8233282
    Abstract: The disclosure describes a frame for mounting a device above a printed circuit board (PCB) in an electronic device. The frame comprises: a frame section formed to be located on the PCB about a surface device on a section of the PCB; and a cover for placement on top of the frame section and for providing a support substrate for the device. In the frame, the frame section is securable to the PCB above at least a part of the surface device; the cover is locatable on the frame section with the device mounted to the cover; and the cover is shaped to allow a feature on the bottom of the device to extend downward towards an interior cavity of the frame.
    Type: Grant
    Filed: March 17, 2008
    Date of Patent: July 31, 2012
    Assignee: Research in Motion Limited
    Inventors: Chao Chen, Tim Kyowski, Jason Griffin
  • Publication number: 20120162931
    Abstract: Disclosed herein is a 3D power module package, including: a power converting unit packaged to include a heat radiating substrate, a power device connected to the heat radiating substrate, and a lead frame; a controlling unit packaged to include a controlling unit substrate and IC and controlling devices mounted on an upper portion of the controlling unit substrate; and an electrical connecting unit electrically connecting the packaged power converting unit and the packaged controlling unit.
    Type: Application
    Filed: July 6, 2011
    Publication date: June 28, 2012
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tae Hoon Kim, Jae Cheon Doh, Seog Moon Choi
  • Publication number: 20120147567
    Abstract: A package structure includes a networking unit including a plurality of switches/routers and a plurality of network interface units coupled to the plurality of switches/routers, and an interposer including a plurality of metal connections. The interposer is substantially free from functional elements built therein. A functional element is outside of, and bonded onto, the interposer, wherein the functional element is electrically coupled to the networking unit through the plurality of metal connections.
    Type: Application
    Filed: December 9, 2010
    Publication date: June 14, 2012
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yun-Han Lee, Mark Shane Peng, Shyh-An Chi
  • Patent number: 8199510
    Abstract: A multi-layer system-on-chip (SoC) module structure is provided. The multi-layer SoC module structure includes at least two circuit board module layers and at least one connector module layer. Each connector module layer is sandwiched between and thus electrically connects two circuit board module layers such that the SoC module structure is formed by stacking. Each circuit board module layer is composed of at least one circuit board module while each connector module layer is composed of at least one connector module. Hence, the SoC module structure can be manufactured as a three-dimensional structure, thus allowing highly flexible connections within the SoC module structure.
    Type: Grant
    Filed: January 12, 2010
    Date of Patent: June 12, 2012
    Assignees: National Chip Implementation Center, National Applied Research Laboratories
    Inventors: Chun-Ming Huang, Chien-Ming Wu, Chih-Chyau Yang, Shih-Lun Chen, Chin-Long Wey, Chi-Shi Chen, Chi-Sheng Lin
  • Patent number: 8180999
    Abstract: A micro grid apparatus and associated method of formation. At least one tier in a printed circuit board is formed. Each tier includes complex shapes interconnected by bridge modules. Each complex shape includes a central area and at least three radial arms external to and integral with the central area. Each radial arm extends radially outward from the central area. Each pair of adjacent radial arms defines a docking bay. Each complex shape is either a power hub whose central area includes rechargeable batteries or a processor hub whose central area includes processors. A bridge unit of a bridge module is latched in at least one docking bay of each complex shape. Each docking bay not latching a bridge unit of any bridge module latches an irregular shaped module. An irregular shaped module is latched in at least one docking bay in at least two complex shapes.
    Type: Grant
    Filed: March 15, 2011
    Date of Patent: May 15, 2012
    Assignee: International Business Machines Corporation
    Inventor: Ian Edward Oakenfull
  • Patent number: 8169784
    Abstract: To improve reliability of a circuit module by improving heat release performance and minimizing thermal influence on a device to be mounted, a base substrate having a first substrate mounted thereon is fitted into a lower portion of casing member, and a second substrate is installed in the upper portion of the casing member so that a spaced area can be provided. In addition, a drive device to be installed on the second substrate is positioned off the center of the second substrate.
    Type: Grant
    Filed: September 26, 2008
    Date of Patent: May 1, 2012
    Assignees: SANYO Semiconductor Co., Ltd., Semiconductor Components Industries, LLC
    Inventors: Hideyuki Sakamoto, Hidefumi Saito, Yasuhiro Koike, Masao Tsukizawa
  • Patent number: 8164907
    Abstract: A system includes a communications device and power supply units detachably installable thereon. On an outer surface of the communications device there is an aperture arranged to enable the insertion of different power supply units in different sections of the volume inside the communications device. The volume is continuous so that instead of separate power supply units it is possible to insert, through the aperture, in the volume a physically larger power supply unit which, when installed in the volume, extends into more than one section of the volume. The communications device can be flexibly equipped e.g. with power supply units functioning as back-ups for each other, each taking up part of the volume, or with a single power supply unit, larger than the above-mentioned, taking up the volume. Therefore the volume inside the communications device can be utilized in connection with power supply units of various types.
    Type: Grant
    Filed: February 3, 2009
    Date of Patent: April 24, 2012
    Assignee: Tellabs Oy
    Inventors: Mikko Hannula, Petri Kohonen
  • Patent number: 8164906
    Abstract: A modular electronic enclosure having a maximum height of 1 U and a width adapted to fit between the rails of a 19 inch rack is adapted to receive up to ten single-width Advanced Mezzanine Cards (AMCs) installed horizontally in the enclosure. Some modules that are not compliant with AMC standards may be installed in the modular electronic enclosure. A backplane, backplane structural support, combined card guide, chassis cover, and chassis bottom cooperate mechanically to provide a stiff, stable enclosure resistant to mechanical flexure. The modular electronic enclosure includes two hot-swappable cooling units which cooperate to establish push-pull cooling airflow. The modular electronic enclosure is further adapted to receive a Power Unit and an MCH. In another embodiment, the modular electronic enclosure includes a backplane with more than one core and has mounting locations and electrical connectors for up to twenty single-width 4 HP electronic modules.
    Type: Grant
    Filed: May 29, 2007
    Date of Patent: April 24, 2012
    Inventor: Michael John Franco
  • Publication number: 20120081858
    Abstract: An assembly of substrate packages interconnected with flex cables. The assembly allows input/output (I/O) signals to be speedily transmitted between substrate packages via flex cable and without being routed through the motherboard. Embodiments relate to a substrate package providing detachable inter-package flex cable connection. The flex cable comprises a transmission region that includes a plurality of signal traces and a ground plane. A plurality of solder mask strips are disposed on the plurality of signals traces to provide anchoring for the signal traces. The solder mask strips intersect the signals traces. The exposed signal traces and the ground plane are coated with organic solderability preservative material. Hermetically-sealed guiding through holes are provided on the substrate package as a mechanical alignment feature to guide connection between flex cables and high speed I/O contact pads on the substrate package.
    Type: Application
    Filed: October 1, 2010
    Publication date: April 5, 2012
    Inventors: Sanka Ganesan, Mohiuddin Mazumder, Zhichao Zhang, Kemal Aygun
  • Patent number: 8149582
    Abstract: A detachable module system includes a plurality of modules that couple to a corresponding plurality of module mounts on a mounting plate. To install a selected module into the module system, a user translates the selected module to an engage position on its respective module mount to engage the selected module with a immediately preceding adjacent module. Any one of the modules may be identified and removed from its module mount, without requiring removal of the remaining modules. The modules may house various types of electronic devices.
    Type: Grant
    Filed: October 29, 2008
    Date of Patent: April 3, 2012
    Assignee: Ecolab Inc.
    Inventors: Brian Philip Carlson, William Martin Christensen, Chris James Steep, Ryan Jacob Urban
  • Publication number: 20120069529
    Abstract: A power conversion module includes a circuit carrier board, a semiconductor module and an inductor module. The circuit carrier board has plural bonding pads. The semiconductor module is disposed on a first surface of the circuit carrier board. The inductor module has plural pins. The pins are extended from the inductor module along a first direction and connected with corresponding bonding pads on the circuit carrier board, so that a receptacle is defined between the inductor module and the circuit carrier board for accommodating the semiconductor module.
    Type: Application
    Filed: July 11, 2011
    Publication date: March 22, 2012
    Applicant: CYNTEC CO., LTD.
    Inventors: Da-Jung Chen, Kaipeng Chiang, Yu-Chao Fang, Yi-Cheng Lin
  • Patent number: 8127066
    Abstract: A modular computer includes a display with a docking station on its back side. A CPU module connects to the docking station. Peripheral modules connect with the resulting display/CPU assembly so that the peripheral modules contact the back side of the display screen.
    Type: Grant
    Filed: July 22, 2010
    Date of Patent: February 28, 2012
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Benjamin Abraham, Yancy Chen
  • Publication number: 20120039004
    Abstract: A composite electronic circuit assembly comprises two MOS or CMOS circuit dice (100, 200) superimposed inside a package. Different modules of the circuit assembly are distributed between the two dice based on the digital, analog, or hybrid nature of said modules. Such a distribution makes it possible to group together the digital modules of the circuit assembly in one of the die and the analog or hybrid modules in the other die. The production cost, development time, and electrical energy consumption of the circuit assembly may thus be reduced.
    Type: Application
    Filed: April 20, 2010
    Publication date: February 16, 2012
    Applicants: ST-ERICSSON (GRENOBLE) SAS, ST-ERICSSON SA
    Inventor: Alain Artieri
  • Patent number: 8116099
    Abstract: Provided is a circuit board device, wherein degrees of freedom are provided for a GND connecting position among plural printed boards, and noise shield and/or heat sink effects are provided. An electronic device provided with the circuit board device and a GND connecting method are also provided. Circuit board device (100) includes a pair of printed boards (110, 120), noise generating component (112) and/or heat generating component (122), and metal plate (140). Printed boards (110, 120) include mounting surfaces and GND connecting terminals (111, 121) arranged on the respective mounting surfaces, and the mounting surfaces are arranged to face each other. Noise generating component (112) and/or heat generating component (122) is mounted on the mounting surface of at least one of a pair of printed boards (110, 120).
    Type: Grant
    Filed: July 18, 2007
    Date of Patent: February 14, 2012
    Assignee: NEC Corporation
    Inventor: Akihito Kubota
  • Patent number: 8116095
    Abstract: A telecommunications arrangement including a chassis, at least one power supply, and a plurality of conversion modules that provide an electrical-to-optical or optical-to-electrical signal conversion. The chassis includes a separate back plane made up of individual back panels. The back panels are attached to the chassis by a tab and swell latch. The conversion modules include a printed circuit board, an input/output arrangement of connectors, and a radius limiter mounted to the printed circuit board.
    Type: Grant
    Filed: October 6, 2010
    Date of Patent: February 14, 2012
    Assignee: ADC Telecommunications, Inc.
    Inventors: James Dorenkamp, Vern Loch, Jeffrey Peters, Wayne Nelson
  • Patent number: 8107244
    Abstract: Connecting a plurality of chassis using a rigid connection. A first coupling element of a first chassis may be mated with a first rigid connection. The first coupling element may be positioned on an exterior housing of the first chassis. A second coupling element of a second chassis may be mated with the first rigid connection. The second coupling element may be positioned on an exterior housing of the second chassis. Connecting the first chassis and the second chassis may allow the first and second chassis to communicate.
    Type: Grant
    Filed: December 22, 2008
    Date of Patent: January 31, 2012
    Assignee: National Instruments Corporation
    Inventor: James A. Reimund
  • Publication number: 20120020030
    Abstract: An electrical housing includes power components grouped together in power modules and control components grouped together in a control module that is separate from the power modules.
    Type: Application
    Filed: December 21, 2009
    Publication date: January 26, 2012
    Applicant: SAGEM DEFENSE SECURITE
    Inventors: Etienne Merlet, Jean-Eric Besold, Marie-Noëlle Besold-Etchechoury
  • Publication number: 20110317371
    Abstract: An electronic component package is described. The electronic component package includes a first electronic component package module mounted on a surface of a packaging layer. A second electronic component package module laminated on a bottom of the first electronic component package module is mounted on a surface of a packaging layer. The first and second electronic component package modules respectively include at least two semiconductor chips laminated. A first redistribution layer is between the first and the second electronic component package modules, electrically connected to the first and the second electronic component package modules. A conductive bump is mounted on a bottom of the second electronic component package module, electrically connected to the second electronic component package module.
    Type: Application
    Filed: June 29, 2010
    Publication date: December 29, 2011
    Inventor: Chien-Hung LIU
  • Publication number: 20110317372
    Abstract: A device includes: a wiring board having first and second surfaces opposing each other; and a plurality of memory packages on the first surface. The wiring board includes: a first set of terminals on the first surface; a plurality of second sets of terminals on the first surface; and a plurality of first signal lines. The terminals of the first set receive respective ones of a plurality of first signals supplied from a control device. Each of the second sets is provided for a corresponding one of the memory packages. The terminals of each of the second sets contact the corresponding one of the memory packages. The first signal lines extend from respective ones of the terminals of the first set while coupling respective ones of the terminals of each of the second sets. The first signal lines extend on the first surface without extending in the wiring board.
    Type: Application
    Filed: June 20, 2011
    Publication date: December 29, 2011
    Applicant: ELPIDA MEMORY, INC.
    Inventors: Miho NOMOTO, Yukitoshi HIROSE
  • Patent number: 8085543
    Abstract: A functional unit of a consumer electronic device and an adapter. performing a first primary function and mountable to an appliance host performing a second primary function. The adapter includes a main body, a first support component capable of supporting the consumer electronic device, a second support component capable of removably coupling the functional unit to the host, and a third support component capable of alternatively supporting the functional unit on a horizontal surface when the adapter main body is removed from the host. The adapter provides an electromagnetic service to the consumer electronic device selected from a power service and a data service supplied by the adapter.
    Type: Grant
    Filed: September 23, 2008
    Date of Patent: December 27, 2011
    Assignee: Whirlpool Corporation
    Inventor: Richard A. McCoy
  • Patent number: 8081422
    Abstract: A back-wiring board that connects to a main circuit board of a power distribution system. The back-wiring board includes a plurality of connectors configured to mechanically secure to a plurality of bus bars. The connectors of the back-wiring board are further configured to receive a voltage signal from the plurality of bus bars and to transmit the voltage signal to the back-wiring board. The back-wiring board also includes a plurality of wire-wrap pins integrated into a surface of the back-wiring board, wherein the wire-wrap pins are configured to receive data input signals. The back-wiring board includes a right-angle connector configured to couple the back-wiring board to the main circuit board.
    Type: Grant
    Filed: April 6, 2009
    Date of Patent: December 20, 2011
    Assignee: Fujitsu Limited
    Inventors: Paul Shannon, Mahesh Mistry
  • Publication number: 20110304966
    Abstract: A power routing device includes one or more mounting portions and one or more power routing portions. At least one of the mounting portions can be mounted in an expansion slot of a circuit board assembly. The power routing portion can route electrical power to the circuit board assembly. In one embodiment, the expansion slot is a slot for a PCI expansion card.
    Type: Application
    Filed: June 9, 2010
    Publication date: December 15, 2011
    Inventor: Michael W. Schrempp
  • Patent number: 8072768
    Abstract: The invention relates to a multilayer printed circuit board structure comprising a stack of plurality of electrically insulating and/or electroconductive layers and at least one passive or active electrical component arranged inside the stack of layers, the component extending laterally only in part of the surface extension of the stack of layers. The invention also relates to a passive or active electrical component mounted on the stack, to an associated wiring, and to a corresponding production method. According to the invention, the insert is embedded between two electrically insulating liquid resin layers or prepreg layers extending over the entire surface and covering the insert on both sides, the insert being surrounded by a resin material that is liquefied by compression or lamination of the structure. The invention structure can be used in printed circuit board technology.
    Type: Grant
    Filed: July 4, 2006
    Date of Patent: December 6, 2011
    Assignee: Schweizer Electronic AG
    Inventors: Ulrich Ockenfuss, Thomas Gottwald
  • Publication number: 20110292618
    Abstract: An apparatus (102) comprises a mechanical interface configured to mechanically receive a module (101) into an assembled configuration. Within said mechanical interface, the apparatus comprises a first connector configured to receive a first matching counterpart in a first insertion direction (103), and a second connector configured to receive a second matching counterpart in a second insertion direction (104), which second insertion direction is the direction of a curvilinear motion and different from said first insertion direction (103). The apparatus (102) comprises a hinge joint between said first connector and a body of the apparatus. The hinge joint has an axis of rotation, which is essentially perpendicular against said second insertion direction (104).
    Type: Application
    Filed: June 27, 2008
    Publication date: December 1, 2011
    Applicant: NOKIA CORPORATION
    Inventors: Samu Naukkarinen, Pekka Kilpi
  • Publication number: 20110286186
    Abstract: A first backplane for being electrically coupled to a second backplane, a system monitoring module, and at least one transducer monitoring module includes a system interface bus configured to be coupled to the system monitoring module and the second backplane. The intermediate backplane also includes at least one monitor interface bus configured to be coupled to the at least one transducer monitoring module and the second backplane and an intermediate backplane bus configured to be coupled to the at least one transducer monitoring module and the system monitoring module.
    Type: Application
    Filed: May 18, 2010
    Publication date: November 24, 2011
    Inventors: Michael Alan Tart, Sean Kelly Summers, Bryan James Shadel, Mitchell Dean Cohen, Lysle Rollan Turnbeaugh, Steven Thomas Clemens
  • Patent number: 8059412
    Abstract: An improved power supply and platform for a military radio has been developed. The apparatus includes a base that is adapted and arranged for supporting a HARRIS 117 radio and a power amplifier adapted to amplify radio frequency output of the radio. The connectors include an electrical connector for the radio and a connector for the amplifier. A power supply is housed within the assembly. A power supply for the connector to the amplifier is also housed within the assembly. Also included is a wiring harness for a SINCGARS LS/671 device and a LED indicator to identify which radio is in operation for multiple radio configurations.
    Type: Grant
    Filed: January 26, 2009
    Date of Patent: November 15, 2011
    Assignee: Perkins Technical Services, Inc.
    Inventors: Frank N. Perkins, III, Jeffery K. Taylor, Bruce Weddendorf, Lloyd W. Childs
  • Patent number: 8045336
    Abstract: A storage device backplane and an identification circuit for identifying using situations of the storage device backplane are provided. The storage device backplane possesses a first connection interface and a second connection interface, for being used as a first backplane supporting a motherboard, or a second backplane cascaded to the first backplane, or a first backplane supporting a daughterboard of the motherboard. The first and second backplanes possess the same storage device backplane structure. If the storage device backplane is used as the first backplane, a first connection interface of the first backplane is coupled to the motherboard or the daughterboard thereof; if the storage device backplane is used as the second backplane, a first connection interface of the second backplane is coupled to a second connection interface of the first backplane. The identification circuit identifies using situations of the storage device backplane and display corresponding correct indicator number.
    Type: Grant
    Filed: February 4, 2008
    Date of Patent: October 25, 2011
    Assignee: Inventec Corporation
    Inventors: Lan Huang, Shih-Hao Liu
  • Patent number: 8040685
    Abstract: A wiring board and method of forming the wiring board. The wiring board includes a first substrate, and a second substrate having a smaller mounting area than a mounting area of the first substrate. A base substrate is laminated between the first substrate and the second substrate such that the first substrate extends beyond an edge of the second substrate, and at least one via formed in at least one of the first substrate or the second substrate. A thickness of a portion of the base substrate that is sandwiched between the first substrate and the second substrate is greater than a thickness of a portion of the base substrate that is not sandwiched between the first substrate and the second substrate.
    Type: Grant
    Filed: June 25, 2008
    Date of Patent: October 18, 2011
    Assignee: Ibiden Co., Ltd.
    Inventors: Michimasa Takahashi, Masakazu Aoyama
  • Patent number: 8040682
    Abstract: A semiconductor device comprises: a plurality of semiconductor chip; a socket; and a mounting board equipped with the socket. Each of the semiconductor chips has a major surface, a back surface and a plurality of connection terminals on the major surface. The socket has internal connection terminals inside and external connection terminals outside, and the internal connection terminals are in contact with the connection terminals of the semiconductor chips.
    Type: Grant
    Filed: October 13, 2006
    Date of Patent: October 18, 2011
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Tsuneyuki Shimoda
  • Patent number: 8035983
    Abstract: A wiring board and method of forming a wiring board. The wiring board includes a first substrate and a second substrate having a smaller mounting area than a mounting area of the first substrate. A base substrate is laminated between the first substrate and the second substrate such that the first substrate extends beyond at least one edge of the second substrate. At least one of the base substrate, the first substrate or the second substrate comprises pliable resin, and at least one other of the base substrate, the first substrate or the second substrate comprises an inorganic filler.
    Type: Grant
    Filed: June 24, 2008
    Date of Patent: October 11, 2011
    Assignee: Ibiden Co., Ltd.
    Inventors: Michimasa Takahashi, Masakazu Aoyama
  • Publication number: 20110235282
    Abstract: In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.
    Type: Application
    Filed: June 2, 2011
    Publication date: September 29, 2011
    Applicant: RF MICRO DEVICES, INC.
    Inventors: Donald Joseph Leahy, Waite R. Warren, JR., Stephen Parker
  • Patent number: 8014160
    Abstract: A USB memory device includes a main body, a USB plug, and a circuit. The main body includes a front rigid section, a rear rigid section, and a middle flexible section connected to the front rigid section and the rear rigid section respectively. The USB plug is connected to the front rigid section. The circuit is received in the rear rigid section and electrically connected to the USB plug.
    Type: Grant
    Filed: June 17, 2009
    Date of Patent: September 6, 2011
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Chin-Wen Huang
  • Patent number: 8004844
    Abstract: An enclosure device of a wireless communication apparatus, which has a tubular structure with increased heat dissipation not unknown heretofore. A section of the enclosure device has a polygonal or circular shape, such as a substantially cylindrical structure, and the enclosure, which has a plurality of radiation fins arranged on an outer surface of the enclosure in a vertical direction, is formed integrally with the radiation fins by using a compression method. Various communication devices of the wire communication apparatus are mounted on the interior of the enclosure. The structure is preferably formed by the radiation fins and exhibits an increased radiation effect than that of a structure where radiation fins are arranged side by side on a flat plane.
    Type: Grant
    Filed: March 12, 2009
    Date of Patent: August 23, 2011
    Assignee: KMW, Inc.
    Inventors: Duk-Yong Kim, Jung-Pil Lee, Kyoung-Seuk Kim, Chang-Woo Yoo, Sung-Ho Jang
  • Patent number: 7993776
    Abstract: A connection apparatus of a battery cell module having a battery cell cover with connecting plates formed at opposing ends thereof, a main frame having guide channels that receive the cell cover, and a top cover to secured the cell cover to the main frame, the connection apparatus having holes at opposing sides of a bottom of the main frame, connecting units configured for insertion into the holes and for contacting the connecting plates, and a conductive bridge electrically connecting the connecting units is disclosed.
    Type: Grant
    Filed: March 30, 2007
    Date of Patent: August 9, 2011
    Assignee: Tyco Electronics AMP Korea, Ltd.
    Inventors: Cheol-Sub Lee, Jong-Keun Song, Young-Jun Yun, Keun-Tak Lim
  • Publication number: 20110188209
    Abstract: An enhanced 3D integration structure comprises a logic microprocessor chip bonded to a collection of vertically stacked memory slices and an optional set of outer vertical slices comprising optoelectronic devices. Such a device enables both high memory content in close proximity to the logic circuits and a high bandwidth for logic to memory communication. Additionally, the provision of optoelectronic devices in the outer slices of the vertical slice stack enables high bandwidth direct communication between logic processor chips on adjacent enhanced 3D modules mounted next to each other or on adjacent packaging substrates. A method to fabricate such structures comprises using a template assembly which enables wafer format processing of vertical slice stacks.
    Type: Application
    Filed: February 2, 2010
    Publication date: August 4, 2011
    Applicant: International Business Machines Corporation
    Inventors: Evan G. Colgan, Sampath Purushothaman, Roy R. Yu
  • Publication number: 20110176281
    Abstract: A vehicle control device includes plural functional modules each of which is a minimum part unit that contributes to change in input/output potentials, and has an input and an output of one power line or one set of power lines, except for power lines having a same potential as that on an overhead wire side or that on a ground side. The functional module has an interface surface on one side surface, to which both of a signal line and the power line are connected. Each interface surface is divided into a first interface area in which a signal line terminal connected to the signal line is placed, and a second interface area in which a power line terminal connected to the power line is placed. The plural functional modules are adjacently arranged such that the interface surfaces face in a same direction, the first interface areas are located on one end side in common, and the second interface areas are located on the other end side in common.
    Type: Application
    Filed: October 10, 2008
    Publication date: July 21, 2011
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Minoru Ikemoto, Hideo Okayama, Yasuaki Mamoto, Yoshio Nagatsuka, Tetsuya Takahashi, Hidetoshi Sumita
  • Patent number: 7973332
    Abstract: An LED lamp includes a board, a metal wiring provided on the board, an LED mounted on the metal wiring, and a metal heat dissipation film mainly made of a metal different from a metal for forming the metal wiring. The metal heat dissipation film partially overlaps the metal wiring. The metal heat dissipation film has an irregular surface. The metal heat dissipation film is mainly made of a metal that is softer than the metal wiring. The metal heat dissipation film intervenes between the board and the metal wiring, and part of the metal heat dissipation film that is in contact with the metal wiring has an irregular surface.
    Type: Grant
    Filed: May 26, 2009
    Date of Patent: July 5, 2011
    Assignee: Rohm Co., Ltd.
    Inventor: Hiroyuki Fukui
  • Patent number: 7974058
    Abstract: A group protection module for a switchgear arrangement is provided in order to protect a group of load feeders, each having a contactor for connecting or disconnecting a respective load. The group protection module has a circuit breaker for providing short-circuit protection, said circuit breaker being connected to a supply-side input and to a load-side output of the group protection module for connection to a power supply system and for connecting the group of load feeders. The group protection module has a safety evaluation unit via which the circuit breaker can be tripped if a status signal detectable by the respective load feeders indicates that one of the contactors of the load feeders can no longer be de-energized. The group protection module is implemented as a constructional unit.
    Type: Grant
    Filed: July 10, 2008
    Date of Patent: July 5, 2011
    Assignee: Siemens Aktiengesellschaft
    Inventors: Guillaume Maigret, Martin Moosburger, Andreas Röβler
  • Publication number: 20110157828
    Abstract: According to one embodiment of the invention, a method is provided for cooling heat-generating structure disposed in an environment having an ambient pressure. The heat-generating structure includes electronics. The method includes providing a coolant, reducing a pressure of the coolant to a subambient pressure at which the coolant has a boiling temperature less than a temperature of the heat-generating structure, and bringing the heat-generating structure and the coolant at the subambient pressure into contact with one another, so that the coolant boils and vaporizes to thereby absorb heat from the heat-generating structure. In a more particular embodiment the coolant is either pure water or pure methanol with an electrical resistivity level of greater than one million Ohms-cm. Further, in another particular embodiment the method includes filtering the coolant to maintain its purity above a particular level.
    Type: Application
    Filed: March 9, 2011
    Publication date: June 30, 2011
    Applicant: Raytheon Company
    Inventors: Richard M. Weber, William G. Wyatt, Kerrin A. Rummel
  • Publication number: 20110096506
    Abstract: A multi-layer system-on-chip (SoC) module structure is provided. The multi-layer SoC module structure includes at least two circuit board module layers and at least one connector module layer. Each connector module layer is sandwiched between and thus electrically connects two circuit board module layers such that the SoC module structure is formed by stacking. Each circuit board module layer is composed of at least one circuit board module while each connector module layer is composed of at least one connector module. Hence, the SoC module structure can be manufactured as a three-dimensional structure, thus allowing highly flexible connections within the SoC module structure.
    Type: Application
    Filed: January 12, 2010
    Publication date: April 28, 2011
    Applicant: National Chip Implementation Center National Applied Research Laboratories
    Inventors: Chun-Ming Huang, Chien-Ming Wu, Chih-Chyau Yang, Shih-Lun Chen, Chin-Long Wey, Chi-Shi Chen, Chi-Sheng Lin
  • Patent number: 7929310
    Abstract: According to at least one embodiment, a cell board interconnection architecture comprises an interconnection structure for interconnecting a plurality of cell boards, the interconnection structure configured to allow air to pass therethrough in a direction in which the cell boards couple therewith.
    Type: Grant
    Filed: September 20, 2010
    Date of Patent: April 19, 2011
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Christian L. Belady, Eric Peterson