Abstract: A system comprising modules. Each module includes: a presentation system including one or more of a speaker and a video screen; and a port. In use, if the presentation system includes the speaker, the system produces sounds derived from data obtained via the port. If the presentation system includes the screen, the system displays images derived from data obtained via the port. The module can also include connectors and the system can also include actuators. Each actuator, in use, can be coupled without soldering to a connector, and the presentation system of each module can operate in response to the actuator or actuators coupled to said each module. The system can also include data storage devices, each adapted to be releasably coupled to a respective port, and the port can be selected from: microchip socket and USB port. The system can be used as part of a method.

Abstract: Disclosed is a module type safety bus bar including: a vertical coupling portion (20) which is a vertically-extending rectangular parallelepiped insulating block, has an upper end provided with a first combining means, and a middle portion into which a bus bar (30) penetrates to be combined with the vertical coupling portion in the form of a cross, the bus bar (30) connecting terminals of a distributor (A) to a circuit breaker (B); and a horizontal coupling portion (10) which is a horizontally-extending rectangular parallelepiped insulating block and has a second combining means, to be combined with the first combining means, in a middle portion of a lower end thereof. The horizontal coupling portion (10) covers an exposed metallic portion of the bus bar after the terminals of the distributor and circuit breaker are connected to each other so that the bus bar (30) becomes safe.

Abstract: A semiconductor control device is provided with: a plurality of semiconductor modules each having a cooling member and a semiconductor element; a circuit board mounted with a control element that controls the plurality of semiconductor modules; and a case in which the plurality of semiconductor modules and the circuit board are respectively mounted. The case is provided with a cylindrical sidewall that forms an internal space within the case, and on both ends of the sidewall, a first opening and a second opening are correspondingly formed to be opposite to each other. The plurality of semiconductor modules include a first semiconductor module mounted on the sidewall on a side of the first opening, and a second semiconductor module mounted on the sidewall on a side of the second opening. The circuit board is positioned between the first semiconductor module and the second semiconductor module, in the internal space.

Abstract: A seal structure for an electronic control device having a circuit board housed in a watertight space a housing that is formed by fitting a plurality of fitting members together, has first and second seal portions which are formed at a fitting surface portion between the fitting members that are fitted together. One side of a pair of the fitting members of each of the first and second seal portions is provided with a seal groove, the other side is provided with a protruding line. An auxiliary seal groove and an auxiliary protruding line are formed on opposing surfaces of the seal groove and the protruding line at a merged part where the first and second seal portions meet each other. The auxiliary seal groove and the auxiliary protruding line continuously extend from the seal groove up to an end surface of the protruding line.

Abstract: A computer cart has segregated computer storage areas and adapter/cord management areas. This enables the adapters and cords to be stored in an orderly fashion and also prevents the cords and adapters from being accessed or removed from the cart when the computers are being accessed. In one embodiment, extensions of shelves on which the computers are stored extend through a dividing panel into a rear compartment of the cart to create AC adapter shelves for storage of the AC adapters. In another embodiment, the AC adapters are stored in bins in a separate compartment and cords from the AC adapters extend through a dividing panel to an area designed to hold the computers, to enable the computers to be plugged in to be charted while stored in the cart.

Abstract: A semiconductor unit includes a first conductive layer, a second conductive layer electrically insulated from the first conductive layer, a first semiconductor device mounted on the first conductive layer, a second semiconductor device mounted on the second conductive layer, a first bus bar for electrical connection of the second semiconductor device to the first conductive layer, and a second bus bar for electrical connection of the first semiconductor device to one of the positive and negative terminals of a battery. The first bus bar is disposed in overlapping relation to the second bus bar in such a manner that mold resin fills between the first bus bar and the second bus bar.

Abstract: A combination of an interconnect board and a module board for connecting a plurality of electronic modules to a processing unit is described. The interconnect board comprises a plurality of interconnect data lines connected between a plurality of interconnect board input terminals and interconnect board output terminals. The module board comprises at least one electronic module connected to a module connection input terminal, a plurality of module board data lines connected between a plurality of module board input terminals and a plurality of module board output terminals, and an unconnected module board output terminal. A first one of the interconnect board output terminals is connectable to the module connection input terminal, and the unconnected module board output terminal is connectable to one of the interconnect board input terminals.

Abstract: An integral solar module power conditioning system includes one or more solar module support frames. Each frame includes a plurality of plug-and-play electrical connectors integrated therewith. A microinverter or microinverter connector is also integrated with each frame. Each frame is configured to receive a respective solar electric module and to carry electrical power through a plurality of solar electric modules and corresponding microinverters connected together via a plurality of solar module support frames connected together via the plurality of integrated plug-and-play electrical connectors.

Abstract: A submodule for a modular multilevel converter has at least one unipolar energy storage device, first and second connection terminals and a power semiconductor circuit with power semiconductor switches that are driven with a control signal and freewheeling diodes connected in parallel with an assigned power semiconductor switch in the opposite sense. Depending on the driving of the power semiconductor switches, the voltage across the energy storage device(s) or else a zero voltage can be generated between the first and second connection terminals. The power semiconductor circuit forms a bridging branch between the potential points of the first and second connection terminals. Only the power semiconductor switches in the bridging branch are reverse conductive power semiconductor switches. The submodule has low on-state losses during normal operation and is also cost-effective.

Abstract: A semiconductor device composed of a plurality of semiconductor modules exhibiting a large current carrying capacity for a semiconductor device as a whole is disclosed. The connection between the plurality of semiconductor modules is conducted by means of optimum construction suited to the semiconductor device. The device comprises a semiconductor module having externally connecting terminals protruding out of a casing, bus bars electrically connecting the specific externally connecting terminals of the plurality of semiconductor modules arranged in parallel with each other, and a semiconductor module case covering and fastening the plurality of semiconductor modules connected with the bus bars. The bus bars and the externally connecting terminals of the semiconductor modules are joined by means of laser welding.

Abstract: A testing apparatus and method of extending the life of a testing apparatus may comprise a chassis including a case having a testing module receptacle receiving a plurality of testing modules comprising at least one processor module and a plurality of test modules, each having the same physical footprint, including respective racking mechanisms and inter-module interface connectors; and a backplane with connectors connecting with a respective inter-module connector, and bus-work interconnecting the respective modules through the inter-module interface connectors and the backplane connectors. The backplane may comprise a battery and display connector. The chassis may comprise a display mounting receptacle configured to receive a display unit having a display connector configured to interface with the backplane display connector. A battery receptacle may receive a battery unit, such as a rechargeable battery.

Abstract: An assembly of subsea equipment (1) and a plurality of subsea devices (2) each of which is individually mountable on and separable from the subsea equipment wherein each device includes a respective stab connector (4) for establishing electrical connection with the equipment and further has a respective terminal connector (5) for a jumper lead, each device having at least dual redundancy whereby connection through the respective jumper terminal can substitute for the connection though the respective stab connector.

Abstract: A motherboard includes a first connector, a first signal module, a second signal module, a control module, a power module, and a switch module. The first connector is used to connect external devices to the motherboard. The first signal module and the second signal module are compatible for external devices under different interface standards. The control module outputs different control signals to control the switch module corresponding to the external device connected to the motherboard. The switch module connects the first signal module or the second signal module to the first connector corresponding to the control signals received from the control module.

Abstract: An electronic device includes a receiving bracket and two electronic modules. The receiving bracket includes a partition plate to divide the receiving bracket into a first receiving space and a second receiving space. Each of the first receiving space and second receiving space includes an outlet located at an end of the receiving bracket. The partition plate defines a through slot. A stop plate is pivotably connected to an end of the through slot near the outlets. Two resilient tabs are formed on opposite sides of the stop plate, and respectively face the first receiving space and second receiving space. The electronic modules are received in the first receiving space and second receiving space, and deform the resilient tabs.

Abstract: An electrical bridge is provided for electrically connecting first and second electronic modules that include first and second external chassis, respectively. The electrical bridge includes a rigid housing extending along a fixed path from a first end to a second end, and first and second electrical contacts held by the housing. The first and second electrical contacts are positioned at the first and second ends, respectively, of the housing. An electrical pathway is defined within the housing from the first electrical contact to the second electrical contact such that the first and second electrical contacts are electrically connected. The first and second ends of the housing are configured to be mounted to the first and second external chassis, respectively, such that the first and second electrical contacts are configured to mate with, and thereby electrically connect to, the first and second electronic modules, respectively.

Abstract: An arrangement having a first peripheral device and a second peripheral device that each include basic modules that are provided with process connections and that accommodate electronic modules, where a redundancy adapter unit is provided for redundantly connecting a field device to one of the basic modules of each of the two peripheral devices such that the redundancy connection of assemblies, which are arranged in spatially separate peripheral devices, is suitable simplified.

Abstract: A display device includes: a front plate having a transparent board and a mounting frame, the mounting frame having a bottom attached to a back face of the transparent board and a side perpendicular to the bottom, the front plate having a long hole in the side; a display panel disposed on a back face side of the front plate; and a mounting member having a fixed section fixed to a back face of the display panel and a locking section extending from the fixed section and loosely inserted into the long hole of the mounting frame.

Abstract: The invention relates to a device (10) for handling notes of value. The device comprises a first module (16a) that in an operating state is electrically conductive connected via a first electrical wire to a power supply unit (26) and electrically conductive connected via a second electrical wire to a second module (16b). In a maintenance state the first module (16a) is neither electrically conductive connected to the first electrical wire nor electrically conductive connected to the second electrical wire.

Abstract: An electronic module package that includes an electronic module configured to receive input signals and process the input signals to provide output signals. The module package also includes an interposer having a board substrate with opposite mounting and substrate surfaces. The mounting surface has a mounting array of electrical contacts. The substrate surface has a module array of electrical contacts and a component array of electrical contacts. The electronic module is attached to the substrate surface and electrically coupled to the module array. The interposer includes first conductive pathways that electrically couple the module array and the mounting array and also includes second conductive pathways that electrically couple the module array and the component array.

Abstract: A cable assembly including first and second header connectors. The first header connector has mating and loading sides and includes electrical contacts. The mating side is configured to mate with a first module connector. The second header connector has mating and loading sides and includes electrical contacts. The mating side of the second header connector is configured to mate with a second module connector. The cable assembly also has a cable bundle including communication cables that extend between the loading sides of the first and second header connectors and that connect the electrical contacts of the first and second header connectors. The cables are substantially twist-free between the first and second header connectors when the first and second header connectors face in substantially opposite directions and the first and second module connectors have an orthogonal relationship.

Abstract: Disclosed herein is a 3D power module package, including: a power converting unit packaged to include a heat radiating substrate, a power device connected to the heat radiating substrate, and a lead frame; a controlling unit packaged to include a controlling unit substrate and IC and controlling devices mounted on an upper portion of the controlling unit substrate; and an electrical connecting unit electrically connecting the packaged power converting unit and the packaged controlling unit.

Abstract: A display device includes a base structure, a plurality of modules coupled to the base structure, where each of the modules include a plurality of actuator assemblies. Each of the actuator assemblies is individually controllable to move the actuator assemblies between a retracted state and a plurality of extended states. A controller is coupled to each of the modules and is programmed to control the actuator assemblies to move the actuator assemblies between the retracted state and the plurality of extended states.

Abstract: A printed circuit board assembly for reducing the impact of heat generated from circuitry within a handheld or non-handheld device is provided. The printed circuit board assembly may include a printed circuit board comprising a plurality of conductive layers and a plurality of dielectric layers where each dielectric layer is disposed between a pair of conductive layers. Each conductive layer may include a first portion and a second portion separated by a gap where the gaps in the alternating conductive layers are misaligned. The first portion of each conductive layer may be substantially thermally isolated from the second portion of each conductive layer.

Abstract: A driver assembly includes a driver housing and a driver, the driver including at least one first portion and a second portion, the first portion having a lower heat resistance than the second portion, wherein the driver housing includes at least one first cavity for at least partially accommodating the first portion and a second cavity for accommodating the second portion, and a potting material is potted into the first cavity to envelop the first portion.

Abstract: An electronic package structure including at least one first electronic element, a second electronic element and a lead frame is provided. The second electronic element includes a body having a cavity. The first electronic element is disposed in the cavity. The lead frame has a plurality of leads. Each of the leads has a first end and a second end. The first end of at least one of the leads extends to the cavity to electrically connect the first electronic element.

Abstract: An apparatus (102) comprises a mechanical interface configured to mechanically receive a module (101) into an assembled configuration. Within said mechanical interface, the apparatus comprises a first connector configured to receive a first matching counterpart in a first insertion direction (103), and a second connector configured to receive a second matching counterpart in a second insertion direction (104), which second insertion direction is the direction of a curvilinear motion and different from said first insertion direction (103). The apparatus (102) comprises a hinge joint between said first connector and a body of the apparatus. The hinge joint has an axis of rotation, which is essentially perpendicular against said second insertion direction (104).

Abstract: A micro grid apparatus and associated method of formation. Multiple tiers are formed. The tiers are distributed and sequenced in a vertical direction such that each tier is at a different vertical level in the vertical direction. Each tier includes a multiplicity of complex shapes interconnected by bridge modules. Each complex shape is a physical structure having an exterior boundary. Each complex shape includes multiple docking bays such that each docking bay is configured to have a module latched therein.

Abstract: A module board includes a first board including a first surface and a second surface, a second board where its first surface faces the second surface of the first board, an external electrode formed on the exterior of the second board, and a joining member joining the external electrode and a terminal provided on the second surface of the first board. The external electrode includes a first surface part positioned on the first surface of the second board, a second surface part positioned on a second surface of the second board opposite to the first surface, and a connecting part connecting the first and second surface parts. The joining member includes a joining surface joining to the external electrode. The joining surface covers the first surface part and at least a portion of the connecting part that is closer to the first surface part than to the second surface part.

Abstract: A mounting structure for mounting a module and an electronic device having the structure are provided. The electronic device includes at least one module, a bracket having an opening configured to contain the at least one module, a support rib extended upwardly along a boundary of the opening to support an outer circumferential surface of the at least one module, and two stopper protrusions formed on the outer circumferential surface of the at least one module in a protrusion manner to support the at least one module being restrained by the bracket and prevent the at least one module from completely passing through the opening, wherein a lower portion of the at least one module is partially inserted into the opening of the bracket.

Abstract: An electrical control system for fixtures, devices and appliances that safety isolates a power source using the features of the safety block, and consolidates multiple control points to remotely activate a combination of fixtures, devices and appliances using the features of the control module, thereby promoting safety and facilitating energy conservation. The system has a safety block where a safety-block AC power supply connector on the rear attaches to a household alternating current (AC) power supply. The safety-block AC power supply connector passes through a cavity to the safety-block AC power transfer connector located on the front. The system also has a control module with a control-module user interface on the front. A control-module AC power connector connects to the control-module user interface and passes through the control-module cavity to connect to the safety-block AC power transfer connector located on the front of the safety block.

Abstract: An interlocking system for connecting a programmable module and an automation controller of an industrial control and automation system is provided. The interlocking system includes a key comprising a shaft with a head and a first attachment feature. The interlocking system also includes a first keyhole in a programmable module cover. The first keyhole is configured to enable the head to pass upwardly there through. The interlocking system also includes a second keyhole in an automation controller cover. The second keyhole is configured to enable the first attachment feature to slide downwardly there through such that disengagement of the key from the second keyhole is resisted. The interlocking system also includes a second attachment feature on a lower surface of the automation controller cover. The second attachment feature is configured to engage with the first attachment feature when the first attachment feature is rotated about an axis of the shaft.

Abstract: Disclosed is a portable adjunct device that includes a case having a first recess and a second recess. Mounted in the first recess is a docking connector movable between closed and open positions. Detachably mounted in the second recess is a universal serial bus connector operably connected to the docking connector. The case defines a chamber and a battery operably connected to the docking connector is disposed in the chamber.

Abstract: A power supply device includes a first power conversion unit and a second power conversion unit. The first power conversion unit includes a first interface and a second interface. The second power conversion unit includes a third interface and a fourth interface. The third interface is configured to detachably connect to the second interface. When the third interface is connected to the second interface, the first power conversion unit and the second power conversion unit are electrically connected with each other. When third interface is disconnected from the second interface, the first power conversion unit and the second power conversion unit are detached from each other.

Abstract: A multi unit controller has a plurality of base units each of which includes a control unit connector, a base unit connector through which the base units juxtaposed to each other are connected to each other, and a plurality of control units connected to the base units respectively through the respective control unit connector, wherein the base units juxtaposed vertically.

Abstract: A multimedia device includes a body, a first electronic module and a second electronic module. The first electronic module and the second electronic module are pivotally connected onto the body, respectively. The first electronic module and the second electronic module are configured to rotate relatively to the body and capture or display a multimedia information, respectively.

Abstract: Systems and methods are described for maintaining secure and contiguous guide transitions in the context of modular installations. Embodiments of the guides are configured to automatically register and couple with each other during installation of their respective modules to provide relatively high tolerance guide transitions, even in the context of relatively lower tolerance modular installations. In some embodiments, a guide is configured to be biased in a first position when its respective module is not installed. When its module is located in a partial-install location relative to an adjacent module with the guide in the first position, guide features mechanically register with features of the adjacent module's guide. When moved into a full-install position, the guide moves into a second position causing the guide to finally register and couple with the adjacent guide, thereby manifesting a stable and contiguous transition between the guides.

Abstract: A mating connector assembly for electrically coupling modular electrical devices. A first stationary connector is coupled to a first rigid circuit board positioned within a first housing of a first modular electrical device. The first floating connector is coupled to a flexible circuit element positioned within a second housing of a second modular electrical device, the flexible circuit element coupled to a circuit board positioned within a second housing of a second modular electrical device. The second housing includes a first latch plate adjustable between an unlatched position and a latched position, the first latch plate including a biasing member, such that, when the first modular electronic device is pressed together with the second modular electronic device, the biasing member applies a force to the first floating connector during a latch plate transition position to ensure that the first floating connector has fully mated with the first stationary connector.

Abstract: Embodiments of the present invention disclose a method for manufacturing a circuit board, and a circuit board. The method includes: separately fixing at least two function modules and a shielding frame on a circuit board, where the shielding frame is located between the at least two function modules; packaging the at least two function modules and the shielding frame by using a plastic package material; cutting the plastic package material corresponding to the top of the shielding frame to a surface of the shielding frame; and covering an outside of the plastic package material and an top part of the shielding frame with a conducting material, and covering a surface of the conducting material with an insulation material. In the embodiments, the cutting height is decreased, the processing time is short, and good manufacturability is provided.

Abstract: An accessory is provided that includes power supply module, a first functional module, and a second functional module. The power supply module can be configured to be suspended beneath an overhead support, such as a hub of an umbrella. The first functional module is configured to affix to the power supply module and to be powered by the power supply module to provide a user directed function. The second functional module is configured to be detachably coupled to either the power supply module or the first functional module to receive power from the power supply module directly or through the first functional module.

Abstract: Connecting a plurality of chassis using a rigid connection. A first coupling element of a first chassis may be mated with a first rigid connection. The first coupling element may be positioned on an exterior housing of the first chassis and coupled to a first backplane of the first chassis. A second coupling element of a second chassis may be mated with the first rigid connection. The second coupling element may be positioned on an exterior housing of the second chassis and coupled to a second backplane of the second chassis. Connecting the first chassis and the second chassis may allow the first and second backplanes to communicate analog signals.

Abstract: The present invention is to provide a cascade data storage device comprising at least an integrated circuit module and a connecting structure wherein the integrated circuit module has a substrate, at least an electronic device, a package body and a USB metal contact and the connecting structure has at least a male connector and at least a female connector; the connecting structure is installed on a lateral edge of the package body and allows the male connector to couple with the female connector and then the integrated circuit modules freely connected, which are stacked high enough and keep the USB metal contact electrically contact with a USB port of a computer.

Abstract: An electronic module includes: a first substrate having first surface on which a first sensor element is provided and a second surface on which a circuit element is provided; a second substrate having a third surface on which a second sensor element is provided; a third substrate having a fifth surface on which a third sensor element is provided; a first connecting portion connecting the first substrate and the second substrate to each other; and a second connecting portion connecting the first substrate and the third substrate to each other. A shield layer is provided between the first sensor element and the circuit element.

Abstract: An substantially planar information device is provided comprising: a memory module including a memory device and an electrical interface to connect the memory device to a complementary interface of a computing device; and a housing including a recess in which the memory module can be removably received, a receptacle to receive the electrical interface when the memory module is received in the recess, wherein the memory module and the housing are substantially planar such that the information device can be affixed to a planar substrate without substantially changing the profile of the planar substrate.

Abstract: The present invention pertains to a hard disk drive form factor compatible solid-state storage device enclosure assembly that protects circuit boards contained within the enclosure from environmental disruption, such as mechanical stress, vibration, external electronic disruption, or any combination of these, while allowing for a variable number of circuit boards in the SSD enclosure. In another embodiment, the solid-state storage device enclosure assembly, or a similar circuit board assembly, includes an alignment guide that precludes a circuit board from being misaligned within the enclosure.

Abstract: In one embodiment, a transducer apparatus comprises an elastomeric substrate and another elastomeric substrate. A plurality of transducer modules are mounted on the elastomeric substrate. A plurality of additional transducer modules are mounted on the other elastomeric substrate. Each transducer module of the plurality of transducer modules and the plurality of additional transducer modules comprises a transducer array having multiple transducer elements and an electronic circuitry coupled to the transducer array. The plurality of transducer modules and the plurality of additional transducer modules are mounted relative to each other whereby the plurality of additional transducer modules substantially cover any dead zones of the plurality of transducer modules.

Abstract: Presented herein is a modular analyte measurement system. The analyte measurement system includes an analyte meter and at least one modular attachment. In one embodiment, a modular attachment is provided to communicate with, and transmit/receive data from, one or more medication delivery device. Embodiments of the present invention relate to modular components of the analyte measurement system.

Abstract: A power management system includes a main controller, a pair of supporting frames extending from the main controller, and a number of mobile modules removably mounted on the supporting frames. The main controller receives power from an external power source. Each of the mobile modules is connected to a load and electrically connected to the main controller via the supporting frame. The main controller provides power to the load via the corresponding mobile module. Each of the mobile modules presets a power limit according to a rated power of the load connected to the mobile module and cuts off an electrical connection with the load when an operating power of the load is greater than the power limit.

Abstract: The present invention provides a combinative power device. In one aspect, the combinative power device of the present invention includes an AC-to-DC module including a first joint portion; and a DC-to-DC module having a second joint portion and coupled to the AC-to-DC module by the second joint portion with the first joint portion electrically, wherein the DC-to-DC module acts as a removable module which can be removable from the AC-to-DC module to enable the AC-to-DC module to cooperate with different types of the DC-to-DC module.

Abstract: A modular power device is used for mounting on a main plate. The modular power system includes a first substrate, a driving module and a converting module. The first substrate having a first axial direction and a second axial direction substantially perpendicular to the first axial direction is inserted into the main plate, such that the second axial direction is substantially perpendicular to the main plate. The driving module is located on one side of the first substrate and electrically connected thereon. The converting module is located on the other side of the first substrate and electrically connected to the driving module. A length of the converting module is substantially equal to that of the first substrate in the first axial direction, and a width of the converting module is smaller than a length of the first substrate in the first axial direction.

Abstract: There is provided a board module to be mounted on an electronic apparatus for adding functions to the electronic apparatus. A second board extends perpendicularly from a first board. The second board is locked to the first board at an abutting end which abuts on the first board. A plate-shaped board fixing member pinches and fixes a fixed end of the second board, which is parallel to the abutting end. The board fixing member is arranged parallel to the first board. The board fixing member is formed with a slit-shaped opening into which the fixed end is inserted, a pair of pinching projections protruding from an opening edge of the opening and pinching the fixed end from both front and rear surfaces of the second board, and a pair of slits being located adjacent to the pair of pinching projections, respectively and being parallel to the opening.