Plural Patents (Class 361/729)
  • Publication number: 20140355219
    Abstract: A semiconductor device composed of a plurality of semiconductor modules exhibiting a large current carrying capacity for a semiconductor device as a whole is disclosed. The connection between the plurality of semiconductor modules is conducted by means of optimum construction suited to the semiconductor device. The device comprises a semiconductor module having externally connecting terminals protruding out of a casing, bus bars electrically connecting the specific externally connecting terminals of the plurality of semiconductor modules arranged in parallel with each other, and a semiconductor module case covering and fastening the plurality of semiconductor modules connected with the bus bars. The bus bars and the externally connecting terminals of the semiconductor modules are joined by means of laser welding.
    Type: Application
    Filed: May 28, 2014
    Publication date: December 4, 2014
    Applicant: Fuji Electric Co., Ltd.
    Inventors: Shinji TADA, Eiji MOCHIZUKI, Hideyo NAKAMURA, Masafumi HORIO
  • Patent number: 8902607
    Abstract: A testing apparatus and method of extending the life of a testing apparatus may comprise a chassis including a case having a testing module receptacle receiving a plurality of testing modules comprising at least one processor module and a plurality of test modules, each having the same physical footprint, including respective racking mechanisms and inter-module interface connectors; and a backplane with connectors connecting with a respective inter-module connector, and bus-work interconnecting the respective modules through the inter-module interface connectors and the backplane connectors. The backplane may comprise a battery and display connector. The chassis may comprise a display mounting receptacle configured to receive a display unit having a display connector configured to interface with the backplane display connector. A battery receptacle may receive a battery unit, such as a rechargeable battery.
    Type: Grant
    Filed: November 3, 2011
    Date of Patent: December 2, 2014
    Assignee: VeEX Inc.
    Inventors: Paul Ker Chin Chang, Cyrille Morelle
  • Publication number: 20140340852
    Abstract: An assembly of subsea equipment (1) and a plurality of subsea devices (2) each of which is individually mountable on and separable from the subsea equipment wherein each device includes a respective stab connector (4) for establishing electrical connection with the equipment and further has a respective terminal connector (5) for a jumper lead, each device having at least dual redundancy whereby connection through the respective jumper terminal can substitute for the connection though the respective stab connector.
    Type: Application
    Filed: May 14, 2014
    Publication date: November 20, 2014
    Applicant: AKER SUBSEA LIMITED
    Inventor: Richard Hope CARTER
  • Publication number: 20140334111
    Abstract: An electronic device includes a receiving bracket and two electronic modules. The receiving bracket includes a partition plate to divide the receiving bracket into a first receiving space and a second receiving space. Each of the first receiving space and second receiving space includes an outlet located at an end of the receiving bracket. The partition plate defines a through slot. A stop plate is pivotably connected to an end of the through slot near the outlets. Two resilient tabs are formed on opposite sides of the stop plate, and respectively face the first receiving space and second receiving space. The electronic modules are received in the first receiving space and second receiving space, and deform the resilient tabs.
    Type: Application
    Filed: August 13, 2013
    Publication date: November 13, 2014
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Jin-Jia HU, Teng-Yuan SHU
  • Publication number: 20140334110
    Abstract: An electrical bridge is provided for electrically connecting first and second electronic modules that include first and second external chassis, respectively. The electrical bridge includes a rigid housing extending along a fixed path from a first end to a second end, and first and second electrical contacts held by the housing. The first and second electrical contacts are positioned at the first and second ends, respectively, of the housing. An electrical pathway is defined within the housing from the first electrical contact to the second electrical contact such that the first and second electrical contacts are electrically connected. The first and second ends of the housing are configured to be mounted to the first and second external chassis, respectively, such that the first and second electrical contacts are configured to mate with, and thereby electrically connect to, the first and second electronic modules, respectively.
    Type: Application
    Filed: May 7, 2013
    Publication date: November 13, 2014
    Applicant: Tyco Electronics Corporation
    Inventors: Robert Paul Nichols, Brian Patrick Costello
  • Publication number: 20140334112
    Abstract: A motherboard includes a first connector, a first signal module, a second signal module, a control module, a power module, and a switch module. The first connector is used to connect external devices to the motherboard. The first signal module and the second signal module are compatible for external devices under different interface standards. The control module outputs different control signals to control the switch module corresponding to the external device connected to the motherboard. The switch module connects the first signal module or the second signal module to the first connector corresponding to the control signals received from the control module.
    Type: Application
    Filed: May 7, 2014
    Publication date: November 13, 2014
    Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: BO TIAN, KANG WU
  • Publication number: 20140328028
    Abstract: An arrangement having a first peripheral device and a second peripheral device that each include basic modules that are provided with process connections and that accommodate electronic modules, where a redundancy adapter unit is provided for redundantly connecting a field device to one of the basic modules of each of the two peripheral devices such that the redundancy connection of assemblies, which are arranged in spatially separate peripheral devices, is suitable simplified.
    Type: Application
    Filed: May 2, 2014
    Publication date: November 6, 2014
    Applicant: Siemens Aktiengesellschaft
    Inventors: Willi MAIER, Norbert ROTTMANN
  • Patent number: 8879244
    Abstract: A display device includes: a front plate having a transparent board and a mounting frame, the mounting frame having a bottom attached to a back face of the transparent board and a side perpendicular to the bottom, the front plate having a long hole in the side; a display panel disposed on a back face side of the front plate; and a mounting member having a fixed section fixed to a back face of the display panel and a locking section extending from the fixed section and loosely inserted into the long hole of the mounting frame.
    Type: Grant
    Filed: July 20, 2011
    Date of Patent: November 4, 2014
    Assignee: Sony Corporation
    Inventors: Tomoyuki Yoshimatsu, Yoichiro Eshita, Takuya Toriumi, Tatsuya Sakata
  • Patent number: 8869966
    Abstract: The invention relates to a device (10) for handling notes of value. The device comprises a first module (16a) that in an operating state is electrically conductive connected via a first electrical wire to a power supply unit (26) and electrically conductive connected via a second electrical wire to a second module (16b). In a maintenance state the first module (16a) is neither electrically conductive connected to the first electrical wire nor electrically conductive connected to the second electrical wire.
    Type: Grant
    Filed: December 3, 2010
    Date of Patent: October 28, 2014
    Assignee: Wincor Nixdorf International GmbH
    Inventor: Christian Fehrenbach
  • Patent number: 8867231
    Abstract: An electronic module package that includes an electronic module configured to receive input signals and process the input signals to provide output signals. The module package also includes an interposer having a board substrate with opposite mounting and substrate surfaces. The mounting surface has a mounting array of electrical contacts. The substrate surface has a module array of electrical contacts and a component array of electrical contacts. The electronic module is attached to the substrate surface and electrically coupled to the module array. The interposer includes first conductive pathways that electrically couple the module array and the mounting array and also includes second conductive pathways that electrically couple the module array and the component array.
    Type: Grant
    Filed: January 13, 2012
    Date of Patent: October 21, 2014
    Assignee: Tyco Electronics Corporation
    Inventors: Lee Jacobo Jose Roitberg, Terry R. Billger
  • Patent number: 8864516
    Abstract: A cable assembly including first and second header connectors. The first header connector has mating and loading sides and includes electrical contacts. The mating side is configured to mate with a first module connector. The second header connector has mating and loading sides and includes electrical contacts. The mating side of the second header connector is configured to mate with a second module connector. The cable assembly also has a cable bundle including communication cables that extend between the loading sides of the first and second header connectors and that connect the electrical contacts of the first and second header connectors. The cables are substantially twist-free between the first and second header connectors when the first and second header connectors face in substantially opposite directions and the first and second module connectors have an orthogonal relationship.
    Type: Grant
    Filed: February 24, 2012
    Date of Patent: October 21, 2014
    Assignee: Tyco Electronics Corporation
    Inventors: Michael David Herring, Arash Behziz
  • Patent number: 8842438
    Abstract: Disclosed herein is a 3D power module package, including: a power converting unit packaged to include a heat radiating substrate, a power device connected to the heat radiating substrate, and a lead frame; a controlling unit packaged to include a controlling unit substrate and IC and controlling devices mounted on an upper portion of the controlling unit substrate; and an electrical connecting unit electrically connecting the packaged power converting unit and the packaged controlling unit.
    Type: Grant
    Filed: July 6, 2011
    Date of Patent: September 23, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd
    Inventors: Tae Hoon Kim, Jae Cheon Doh, Seog Moon Choi
  • Publication number: 20140267457
    Abstract: A display device includes a base structure, a plurality of modules coupled to the base structure, where each of the modules include a plurality of actuator assemblies. Each of the actuator assemblies is individually controllable to move the actuator assemblies between a retracted state and a plurality of extended states. A controller is coupled to each of the modules and is programmed to control the actuator assemblies to move the actuator assemblies between the retracted state and the plurality of extended states.
    Type: Application
    Filed: March 14, 2014
    Publication date: September 18, 2014
    Inventors: William Jefferson Jurewicz, James Allen Squires, Barrett David Haroldson, Lawrence Alexander Duarte, Jeremiah Matthew Hueske, Lo Chi Kwong, Shawn Roske, Julio Obelleiro, Mervin Perkins, Ryan West, Peter Revelas, Jonathan Kirschner, Lisa R. Marchbanks, Marjorie Presten, Katherine Marie Brown, Jeremy D. Billig, Gregory Oren Bryant
  • Publication number: 20140254108
    Abstract: A printed circuit board assembly for reducing the impact of heat generated from circuitry within a handheld or non-handheld device is provided. The printed circuit board assembly may include a printed circuit board comprising a plurality of conductive layers and a plurality of dielectric layers where each dielectric layer is disposed between a pair of conductive layers. Each conductive layer may include a first portion and a second portion separated by a gap where the gaps in the alternating conductive layers are misaligned. The first portion of each conductive layer may be substantially thermally isolated from the second portion of each conductive layer.
    Type: Application
    Filed: March 10, 2013
    Publication date: September 11, 2014
    Applicant: QUALCOMM INCORPORATED
    Inventors: Yang ZHANG, Jack B. STEENSTRA
  • Publication number: 20140247563
    Abstract: A driver assembly includes a driver housing and a driver, the driver including at least one first portion and a second portion, the first portion having a lower heat resistance than the second portion, wherein the driver housing includes at least one first cavity for at least partially accommodating the first portion and a second cavity for accommodating the second portion, and a potting material is potted into the first cavity to envelop the first portion.
    Type: Application
    Filed: October 10, 2012
    Publication date: September 4, 2014
    Inventors: MingTao Wang, Guoan He, LiBo Wu
  • Patent number: 8824165
    Abstract: An electronic package structure including at least one first electronic element, a second electronic element and a lead frame is provided. The second electronic element includes a body having a cavity. The first electronic element is disposed in the cavity. The lead frame has a plurality of leads. Each of the leads has a first end and a second end. The first end of at least one of the leads extends to the cavity to electrically connect the first electronic element.
    Type: Grant
    Filed: July 19, 2011
    Date of Patent: September 2, 2014
    Assignee: Cyntec Co. Ltd
    Inventors: Da-Jung Chen, Chau-Chun Wen, Chun-Tiao Liu
  • Patent number: 8819395
    Abstract: A micro grid apparatus and associated method of formation. Multiple tiers are formed. The tiers are distributed and sequenced in a vertical direction such that each tier is at a different vertical level in the vertical direction. Each tier includes a multiplicity of complex shapes interconnected by bridge modules. Each complex shape is a physical structure having an exterior boundary. Each complex shape includes multiple docking bays such that each docking bay is configured to have a module latched therein.
    Type: Grant
    Filed: March 8, 2013
    Date of Patent: August 26, 2014
    Assignee: International Business Machines Corporation
    Inventor: Ian E. Oakenfull
  • Patent number: 8817476
    Abstract: An apparatus (102) comprises a mechanical interface configured to mechanically receive a module (101) into an assembled configuration. Within said mechanical interface, the apparatus comprises a first connector configured to receive a first matching counterpart in a first insertion direction (103), and a second connector configured to receive a second matching counterpart in a second insertion direction (104), which second insertion direction is the direction of a curvilinear motion and different from said first insertion direction (103). The apparatus (102) comprises a hinge joint between said first connector and a body of the apparatus. The hinge joint has an axis of rotation, which is essentially perpendicular against said second insertion direction (104).
    Type: Grant
    Filed: June 27, 2008
    Date of Patent: August 26, 2014
    Assignee: Nokia Corporation
    Inventors: Samu Naukkarinen, Pekka Kilpi
  • Publication number: 20140233191
    Abstract: A module board includes a first board including a first surface and a second surface, a second board where its first surface faces the second surface of the first board, an external electrode formed on the exterior of the second board, and a joining member joining the external electrode and a terminal provided on the second surface of the first board. The external electrode includes a first surface part positioned on the first surface of the second board, a second surface part positioned on a second surface of the second board opposite to the first surface, and a connecting part connecting the first and second surface parts. The joining member includes a joining surface joining to the external electrode. The joining surface covers the first surface part and at least a portion of the connecting part that is closer to the first surface part than to the second surface part.
    Type: Application
    Filed: February 20, 2014
    Publication date: August 21, 2014
    Applicant: FUJITSU COMPONENT LIMITED
    Inventors: Tatsuya Kakehashi, Masakazu Muranaga, Shinya Yamamoto
  • Publication number: 20140204538
    Abstract: A mounting structure for mounting a module and an electronic device having the structure are provided. The electronic device includes at least one module, a bracket having an opening configured to contain the at least one module, a support rib extended upwardly along a boundary of the opening to support an outer circumferential surface of the at least one module, and two stopper protrusions formed on the outer circumferential surface of the at least one module in a protrusion manner to support the at least one module being restrained by the bracket and prevent the at least one module from completely passing through the opening, wherein a lower portion of the at least one module is partially inserted into the opening of the bracket.
    Type: Application
    Filed: January 17, 2014
    Publication date: July 24, 2014
    Applicant: Samsung Electronics Co., Ltd.
    Inventor: Jong-Min CHOI
  • Patent number: 8760874
    Abstract: An electrical control system for fixtures, devices and appliances that safety isolates a power source using the features of the safety block, and consolidates multiple control points to remotely activate a combination of fixtures, devices and appliances using the features of the control module, thereby promoting safety and facilitating energy conservation. The system has a safety block where a safety-block AC power supply connector on the rear attaches to a household alternating current (AC) power supply. The safety-block AC power supply connector passes through a cavity to the safety-block AC power transfer connector located on the front. The system also has a control module with a control-module user interface on the front. A control-module AC power connector connects to the control-module user interface and passes through the control-module cavity to connect to the safety-block AC power transfer connector located on the front of the safety block.
    Type: Grant
    Filed: January 13, 2012
    Date of Patent: June 24, 2014
    Inventor: Daniel P. Casey
  • Patent number: 8752269
    Abstract: An interlocking system for connecting a programmable module and an automation controller of an industrial control and automation system is provided. The interlocking system includes a key comprising a shaft with a head and a first attachment feature. The interlocking system also includes a first keyhole in a programmable module cover. The first keyhole is configured to enable the head to pass upwardly there through. The interlocking system also includes a second keyhole in an automation controller cover. The second keyhole is configured to enable the first attachment feature to slide downwardly there through such that disengagement of the key from the second keyhole is resisted. The interlocking system also includes a second attachment feature on a lower surface of the automation controller cover. The second attachment feature is configured to engage with the first attachment feature when the first attachment feature is rotated about an axis of the shaft.
    Type: Grant
    Filed: October 25, 2011
    Date of Patent: June 17, 2014
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Karen Chin, Melvin Wong, Soon Seng Kang
  • Patent number: 8749983
    Abstract: Disclosed is a portable adjunct device that includes a case having a first recess and a second recess. Mounted in the first recess is a docking connector movable between closed and open positions. Detachably mounted in the second recess is a universal serial bus connector operably connected to the docking connector. The case defines a chamber and a battery operably connected to the docking connector is disposed in the chamber.
    Type: Grant
    Filed: April 29, 2011
    Date of Patent: June 10, 2014
    Assignee: Scosche Industries, Inc.
    Inventors: Jesse Vandiver, Christopher McSweyn, Jack Debiasio, Kasidy Alves, Vince Alves
  • Publication number: 20140153197
    Abstract: A power supply device includes a first power conversion unit and a second power conversion unit. The first power conversion unit includes a first interface and a second interface. The second power conversion unit includes a third interface and a fourth interface. The third interface is configured to detachably connect to the second interface. When the third interface is connected to the second interface, the first power conversion unit and the second power conversion unit are electrically connected with each other. When third interface is disconnected from the second interface, the first power conversion unit and the second power conversion unit are detached from each other.
    Type: Application
    Filed: November 19, 2013
    Publication date: June 5, 2014
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: CHIEN-CHUNG YEN
  • Patent number: 8742886
    Abstract: A multi unit controller has a plurality of base units each of which includes a control unit connector, a base unit connector through which the base units juxtaposed to each other are connected to each other, and a plurality of control units connected to the base units respectively through the respective control unit connector, wherein the base units juxtaposed vertically.
    Type: Grant
    Filed: June 22, 2011
    Date of Patent: June 3, 2014
    Assignee: Hitachi, Ltd.
    Inventors: Yuta Sugimoto, Atsushi Nishioka, Eiji Kobayashi, Akihiro Ohashi, Katsumi Yoshida, Satoshi Nakamura, Fumihiko Nemoto
  • Publication number: 20140133106
    Abstract: A multimedia device includes a body, a first electronic module and a second electronic module. The first electronic module and the second electronic module are pivotally connected onto the body, respectively. The first electronic module and the second electronic module are configured to rotate relatively to the body and capture or display a multimedia information, respectively.
    Type: Application
    Filed: December 21, 2012
    Publication date: May 15, 2014
    Applicant: ASKEY COMPUTER CORP.
    Inventors: Yi-Hsin Lee, Teh-Shen Lee
  • Patent number: 8724332
    Abstract: Systems and methods are described for maintaining secure and contiguous guide transitions in the context of modular installations. Embodiments of the guides are configured to automatically register and couple with each other during installation of their respective modules to provide relatively high tolerance guide transitions, even in the context of relatively lower tolerance modular installations. In some embodiments, a guide is configured to be biased in a first position when its respective module is not installed. When its module is located in a partial-install location relative to an adjacent module with the guide in the first position, guide features mechanically register with features of the adjacent module's guide. When moved into a full-install position, the guide moves into a second position causing the guide to finally register and couple with the adjacent guide, thereby manifesting a stable and contiguous transition between the guides.
    Type: Grant
    Filed: February 29, 2012
    Date of Patent: May 13, 2014
    Assignee: Oracle International Corporation
    Inventors: Joseph Paul Manes, Donald Robert Manes
  • Publication number: 20140126158
    Abstract: A mating connector assembly for electrically coupling modular electrical devices. A first stationary connector is coupled to a first rigid circuit board positioned within a first housing of a first modular electrical device. The first floating connector is coupled to a flexible circuit element positioned within a second housing of a second modular electrical device, the flexible circuit element coupled to a circuit board positioned within a second housing of a second modular electrical device. The second housing includes a first latch plate adjustable between an unlatched position and a latched position, the first latch plate including a biasing member, such that, when the first modular electronic device is pressed together with the second modular electronic device, the biasing member applies a force to the first floating connector during a latch plate transition position to ensure that the first floating connector has fully mated with the first stationary connector.
    Type: Application
    Filed: November 2, 2012
    Publication date: May 8, 2014
    Inventors: Michael Baran, William Siebert
  • Publication number: 20140111949
    Abstract: Embodiments of the present invention disclose a method for manufacturing a circuit board, and a circuit board. The method includes: separately fixing at least two function modules and a shielding frame on a circuit board, where the shielding frame is located between the at least two function modules; packaging the at least two function modules and the shielding frame by using a plastic package material; cutting the plastic package material corresponding to the top of the shielding frame to a surface of the shielding frame; and covering an outside of the plastic package material and an top part of the shielding frame with a conducting material, and covering a surface of the conducting material with an insulation material. In the embodiments, the cutting height is decreased, the processing time is short, and good manufacturability is provided.
    Type: Application
    Filed: December 23, 2013
    Publication date: April 24, 2014
    Applicant: Huawei Device Co., Ltd.
    Inventor: CHUNYU GAO
  • Publication number: 20140111948
    Abstract: An accessory is provided that includes power supply module, a first functional module, and a second functional module. The power supply module can be configured to be suspended beneath an overhead support, such as a hub of an umbrella. The first functional module is configured to affix to the power supply module and to be powered by the power supply module to provide a user directed function. The second functional module is configured to be detachably coupled to either the power supply module or the first functional module to receive power from the power supply module directly or through the first functional module.
    Type: Application
    Filed: October 22, 2012
    Publication date: April 24, 2014
    Inventor: Oliver Joen-an Ma
  • Patent number: 8681505
    Abstract: Connecting a plurality of chassis using a rigid connection. A first coupling element of a first chassis may be mated with a first rigid connection. The first coupling element may be positioned on an exterior housing of the first chassis and coupled to a first backplane of the first chassis. A second coupling element of a second chassis may be mated with the first rigid connection. The second coupling element may be positioned on an exterior housing of the second chassis and coupled to a second backplane of the second chassis. Connecting the first chassis and the second chassis may allow the first and second backplanes to communicate analog signals.
    Type: Grant
    Filed: September 28, 2011
    Date of Patent: March 25, 2014
    Assignee: National Instruments Corporation
    Inventor: James A. Reimund
  • Patent number: 8675366
    Abstract: The present invention is to provide a cascade data storage device comprising at least an integrated circuit module and a connecting structure wherein the integrated circuit module has a substrate, at least an electronic device, a package body and a USB metal contact and the connecting structure has at least a male connector and at least a female connector; the connecting structure is installed on a lateral edge of the package body and allows the male connector to couple with the female connector and then the integrated circuit modules freely connected, which are stacked high enough and keep the USB metal contact electrically contact with a USB port of a computer.
    Type: Grant
    Filed: May 18, 2011
    Date of Patent: March 18, 2014
    Assignee: Walton Advanced Engineering Inc.
    Inventors: Hong-Chi Yu, Mao-Ting Chang
  • Publication number: 20140063753
    Abstract: An electronic module includes: a first substrate having first surface on which a first sensor element is provided and a second surface on which a circuit element is provided; a second substrate having a third surface on which a second sensor element is provided; a third substrate having a fifth surface on which a third sensor element is provided; a first connecting portion connecting the first substrate and the second substrate to each other; and a second connecting portion connecting the first substrate and the third substrate to each other. A shield layer is provided between the first sensor element and the circuit element.
    Type: Application
    Filed: August 29, 2013
    Publication date: March 6, 2014
    Applicant: Seiko Epson Corporation
    Inventor: Taketo CHINO
  • Patent number: 8665598
    Abstract: An substantially planar information device is provided comprising: a memory module including a memory device and an electrical interface to connect the memory device to a complementary interface of a computing device; and a housing including a recess in which the memory module can be removably received, a receptacle to receive the electrical interface when the memory module is received in the recess, wherein the memory module and the housing are substantially planar such that the information device can be affixed to a planar substrate without substantially changing the profile of the planar substrate.
    Type: Grant
    Filed: April 12, 2011
    Date of Patent: March 4, 2014
    Assignee: 2082053 Ontario Limited
    Inventor: Ross John Douglas Seeley
  • Patent number: 8665601
    Abstract: The present invention pertains to a hard disk drive form factor compatible solid-state storage device enclosure assembly that protects circuit boards contained within the enclosure from environmental disruption, such as mechanical stress, vibration, external electronic disruption, or any combination of these, while allowing for a variable number of circuit boards in the SSD enclosure. In another embodiment, the solid-state storage device enclosure assembly, or a similar circuit board assembly, includes an alignment guide that precludes a circuit board from being misaligned within the enclosure.
    Type: Grant
    Filed: September 3, 2010
    Date of Patent: March 4, 2014
    Assignee: BiTMICRO Networks, Inc.
    Inventors: Rogelio Gazmen Mangay-Ayam, Jr., Elbert Castro Esguerra, Jerico Alge Parazo, Christopher Dayego Galvez, Allan Famitanco Cruz
  • Patent number: 8649185
    Abstract: In one embodiment, a transducer apparatus comprises an elastomeric substrate and another elastomeric substrate. A plurality of transducer modules are mounted on the elastomeric substrate. A plurality of additional transducer modules are mounted on the other elastomeric substrate. Each transducer module of the plurality of transducer modules and the plurality of additional transducer modules comprises a transducer array having multiple transducer elements and an electronic circuitry coupled to the transducer array. The plurality of transducer modules and the plurality of additional transducer modules are mounted relative to each other whereby the plurality of additional transducer modules substantially cover any dead zones of the plurality of transducer modules.
    Type: Grant
    Filed: October 27, 2011
    Date of Patent: February 11, 2014
    Assignee: General Electric Company
    Inventors: Robert Gideon Wodnicki, Kaustubh Ravindra Nagarkar, William Hullinger Huber
  • Publication number: 20140039382
    Abstract: Presented herein is a modular analyte measurement system. The analyte measurement system includes an analyte meter and at least one modular attachment. In one embodiment, a modular attachment is provided to communicate with, and transmit/receive data from, one or more medication delivery device. Embodiments of the present invention relate to modular components of the analyte measurement system.
    Type: Application
    Filed: December 21, 2011
    Publication date: February 6, 2014
    Applicant: Abbott Diabetes Care Inc.
    Inventors: Jonathan Fern, Mark P. Jesser, Joel Goldsmith, Ronaldo F. Carreon, Christopher A. Wilson, William J. Evans, Matthew P. Presta
  • Publication number: 20140029209
    Abstract: A power management system includes a main controller, a pair of supporting frames extending from the main controller, and a number of mobile modules removably mounted on the supporting frames. The main controller receives power from an external power source. Each of the mobile modules is connected to a load and electrically connected to the main controller via the supporting frame. The main controller provides power to the load via the corresponding mobile module. Each of the mobile modules presets a power limit according to a rated power of the load connected to the mobile module and cuts off an electrical connection with the load when an operating power of the load is greater than the power limit.
    Type: Application
    Filed: July 30, 2013
    Publication date: January 30, 2014
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: HSIEN-CHUAN LIANG, CHIH-CHUNG SHIH, YUNG-CHIEH CHEN
  • Patent number: 8638562
    Abstract: The present invention provides a combinative power device. In one aspect, the combinative power device of the present invention includes an AC-to-DC module including a first joint portion; and a DC-to-DC module having a second joint portion and coupled to the AC-to-DC module by the second joint portion with the first joint portion electrically, wherein the DC-to-DC module acts as a removable module which can be removable from the AC-to-DC module to enable the AC-to-DC module to cooperate with different types of the DC-to-DC module.
    Type: Grant
    Filed: December 6, 2011
    Date of Patent: January 28, 2014
    Assignee: Phihong Technology Co., Ltd.
    Inventor: Yung Sung Chen
  • Publication number: 20140022737
    Abstract: A modular power device is used for mounting on a main plate. The modular power system includes a first substrate, a driving module and a converting module. The first substrate having a first axial direction and a second axial direction substantially perpendicular to the first axial direction is inserted into the main plate, such that the second axial direction is substantially perpendicular to the main plate. The driving module is located on one side of the first substrate and electrically connected thereon. The converting module is located on the other side of the first substrate and electrically connected to the driving module. A length of the converting module is substantially equal to that of the first substrate in the first axial direction, and a width of the converting module is smaller than a length of the first substrate in the first axial direction.
    Type: Application
    Filed: October 9, 2012
    Publication date: January 23, 2014
    Inventors: Yung-Hung HSIAO, Ju-Tang LO, Yen-Ming CHEN, Hao-Te HSU, Pei-Li CHANG, Chia-Hsien YEN, Shin-Bin LIN, Yu-Hsuan WU, Chin-Hang LEE, Huei-Fang LIN, Ping-Yu CHEN, Chi-Chang HO
  • Patent number: 8634197
    Abstract: There is provided a board module to be mounted on an electronic apparatus for adding functions to the electronic apparatus. A second board extends perpendicularly from a first board. The second board is locked to the first board at an abutting end which abuts on the first board. A plate-shaped board fixing member pinches and fixes a fixed end of the second board, which is parallel to the abutting end. The board fixing member is arranged parallel to the first board. The board fixing member is formed with a slit-shaped opening into which the fixed end is inserted, a pair of pinching projections protruding from an opening edge of the opening and pinching the fixed end from both front and rear surfaces of the second board, and a pair of slits being located adjacent to the pair of pinching projections, respectively and being parallel to the opening.
    Type: Grant
    Filed: June 14, 2011
    Date of Patent: January 21, 2014
    Assignee: Seiko Epson Corporation
    Inventor: Tomohisa Kano
  • Publication number: 20130343007
    Abstract: A method for mounting connection pins in respective through-holes. Each pin having an anchoring part for insertion into said through-hole, a contact part to extend outside said through-hole and having a contact end for contact with the surface of another module of the electronic assembly, and a flange part to abut against said component carrier and located between said anchoring part and said contact part. A die tool has several similar recesses all adapted to receive a contact end of the contact part of a connection pin. The anchoring part of the pin is inserted in a through-hole of the component carrier, and the pin is anchored in the component carrier by exerting a force on a free end of the anchoring part of the pin while an end surface of the contact end abuts the bottom surface of similar recesses in the die tool.
    Type: Application
    Filed: February 25, 2011
    Publication date: December 26, 2013
    Applicant: TEKEFONAKTIEBOLAGET L M ERICSSON (PUBL)
    Inventors: Igor Perez-Uria, Ola Arvidsson
  • Publication number: 20130335925
    Abstract: A portable electronic device including a first body, a second body, and an assembling structure is provided. The assembling structure includes a first assembling unit and a second assembling unit. The first assembling unit is adapted to hidden in one of the first and the second bodies, and the second assembling unit is disposed and hidden in another one of the first and the second bodies. When the first body is close to the second body, the first assembling unit is protruded out of the first body or the second body, and assembled to the second assembling unit, such that the first and the second bodies are fixed to each other.
    Type: Application
    Filed: December 17, 2012
    Publication date: December 19, 2013
    Applicant: ACER INCORPORATED
    Inventors: Yuan-Hsin Lee, Mei-Jung Chen, Chia-Shang Yuan, Tzeng-Chih Chiou, Wen-Hsien Chiang, Sze-Thai Liew, Ming-Te Huang, Chiao-Ting Cheng
  • Publication number: 20130335926
    Abstract: A guiding mechanism includes a first guiding component, a second guiding component, a push rod, a push rod sheath and a driving component. A distance is between the second guiding component and the first guiding component and increases in a first direction. The push rod includes a rod base slidably connected to the first guiding component. The push rod sheath includes an engaging portion movably engaged with the rod base, and a guiding portion slidably connected to the second guiding component and used for pushing a flexible printed circuit board. The driving component drives the rod base to move relative to the engaging portion, so as to drive the push rod and the push rod sheath to slide relative to the first guiding component and the second guiding component.
    Type: Application
    Filed: April 12, 2013
    Publication date: December 19, 2013
    Applicant: Wistron Corporation
    Inventor: Chen-Yi Liang
  • Publication number: 20130329377
    Abstract: A module arrangement including a plurality of functional modules lined up in a stacking direction, which are connected to one another for fluidic and electric communication, wherein a functional module includes a plate-shaped base body having two parallel, opposite joining surfaces which are designed to contact joining surfaces of adjacent base bodies, wherein the base body includes a connecting device designed for transferring electric signals and/or electric supply voltages and/or fluid flows between adjacent functional modules along the stacking direction, and wherein several signal lines selectable by the control module extend along the stacking direction of the functional modules for transmitting control signals provided for the direct selection of individual functional modules wherein at least one storage device for detecting, buffering and transferring at least one electric signal of an external component is electrically looped into at least one signal line.
    Type: Application
    Filed: March 14, 2011
    Publication date: December 12, 2013
    Applicant: FESTO AG & CO. KG
    Inventors: Michael Berner, Ralf Forcht
  • Patent number: 8599564
    Abstract: The present invention provides a server architecture, which comprises a plurality of first middle planes disposed horizontally in the server chassis, and each of the first middle plane electrically coupled to a server board such that the server board is also horizontally disposed in the server chassis. By means of the server architecture in the present invention, in addition to providing a hot-swappable function to the server board, for the whole server system, horizontally arranged first middle plane and server board will not block the route for heat dissipating flow so that the heat dissipating efficiency with respect to the server will not be reduced.
    Type: Grant
    Filed: February 24, 2011
    Date of Patent: December 3, 2013
    Assignee: Inventec Corporation
    Inventor: Hong-Chou Lin
  • Publication number: 20130314865
    Abstract: A power supply apparatus includes a first electronic device, a second electronic device, and plural power modules. The first electronic device includes a first compartment. The first compartment has a first width. The second electronic device includes a second compartment. The second compartment has a second width. Each of the power modules has a third width. The third width is determined according to the first width and the second width, so that a specified number of power modules are selectively accommodated within the first compartment or the second compartment.
    Type: Application
    Filed: June 14, 2012
    Publication date: November 28, 2013
    Applicant: DELTA ELECTRONICS, INC.
    Inventors: Shih-Chang Chuang, Yu-Hung Huang, Hsin-Chung Niu, Wang-Lung Lin
  • Patent number: 8593817
    Abstract: A power semiconductor module is provided in which power semiconductor chips with an aluminum-based chip metallization and power semiconductor chips with a copper-based chip metallization are included in the same module, and operated at different barrier-layer temperatures during use.
    Type: Grant
    Filed: September 30, 2010
    Date of Patent: November 26, 2013
    Assignee: Infineon Technologies AG
    Inventors: Reinhold Bayerer, Thilo Stolze
  • Publication number: 20130308280
    Abstract: A memory module pair includes first and second memory modules. Each of the first and second memory modules includes a circuit board having opposite first and second side edges and a front edge, along which a plurality of pins are arranged. Each circuit board of the first and second memory modules has a key notch formed closer to the first side edge than to the second side edge. The circuit board of the first memory module has a corner notch that is formed on the front edge and the first side edge, while the circuit board of the second memory module has a corner notch that is formed on the front edge and the second side edge.
    Type: Application
    Filed: May 16, 2012
    Publication date: November 21, 2013
    Inventors: Hsin Mao HUANG, Chun Huang YU, Chih Yen HO
  • Publication number: 20130301225
    Abstract: A cable management apparatus includes two mounting brackets respectively fixed to opposite sides of an electronic device. A cable management arm connected between the two mounting brackets, two latch members slidably connected to the cable management arm, two resilient members connected between the cable management arm and the corresponding latch members. In addition, two releasing members rotatably mounted to the cable management arm and engaging with the corresponding latch members. Each of the mounting brackets defines two locking holes respectively adjacent to top and bottom. Each of the latch members includes a positioning pin selectively engaging in one of the locking holes of the corresponding mounting bracket to respectively lock the cable management arm is at upper or lower position. The releasing members can be rotated to drive the latch members to slide away from the corresponding mounting brackets to unlock the cable management arm relative to the mounting brackets.
    Type: Application
    Filed: June 29, 2012
    Publication date: November 14, 2013
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
    Inventors: XIN-HU GONG, JU-WEN DAI