Abstract: Settings are provided by a chassis management controller to an expansion card in a multi-slot server chassis. The chassis management controller in a multi-slot server chassis provides an operating parameter to a server management controller in a server, and the server management controller writes the operating parameter to a port expander of an expansion card installed on the server. The operating parameter is written to the port expander prior to expansion card power up, and the expansion card uses the operating parameter after power up to derive one or more SERDES value. The SERDES value is used to program an ASIC chip comprising a SERDES converter on the expansion card. In one example, the operating parameter is determined by the capabilities of a chassis midplane at the slot where the compute node is installed.

Abstract: A fiber channel switching module can include an integrated trace buffer memory, a crossbar switch and a control processor disposed on a single line replaceable module (LRM). The trace buffer memory may be adapted to capture selected data traffic transiting the switch fabric based on pre-selected triggers. The selected data can be read out of the trace buffer memory and used for selected diagnostics.

Abstract: An apparatus for electrical safety is disclosed. A system and an alternate apparatus also perform the functions of the apparatus. The apparatus includes a test point accessible from an exterior of an enclosure while the enclosure is in a closed state. The enclosure houses one or more electrical components and the closed state prevents a user from touching the one or more electrical components. The apparatus includes a test conductor connected to a point on a conductor connected to an electrical component of the one or more electrical components where the test conductor is within the enclosure. The apparatus includes an impedance connecting the test point to the test conductor. The impedance is within the enclosure. The test point meets an Ingress Protection code rating of 20.

Abstract: A semiconductor device component includes a first portion having a first hole usable as a nut insertion hole, and a second portion having a second hole adjacent to the first hole with a wall interposed therebetween. The first hole includes a first surface facing the wall, a second surface adjacent to the first surface, a third surface adjacent to the second surface, a fourth surface adjacent to the third surface and facing the first surface, a fifth surface adjacent to the fourth surface and facing the second surface, and a sixth surface adjacent to the fifth surface and the first surface and facing the third surface. A distance between the first and fourth surfaces is greater than a distance between the second and fifth surfaces, and greater than a distance between the third and sixth surfaces.

Abstract: A semiconductor device includes a package 1, a block-module 2, and a control board 3 for controlling power semiconductor elements 11a. The block-module 2 has embedded power semiconductor elements 11a and second leads 4b and first leads 4a that are drawn from the block-module 2. The package 1 has external connection terminals 6a in contact with the first leads 4a of the block-module 2. The second leads 4b are connected to the control board 3 while the first leads 4a are joined to the external connection terminals 6a.

Abstract: Provided are a power module having a stacked flip-chip and a method of fabricating the power module. The power module includes a lead frame; a control device part including a control device chip; a power device part including a power device chip and being electrically connected to the lead frame; and an interconnecting substrate of which the control and power device parts are respectively disposed at upper and lower portions, and each of the control and power device chips may be attached to one of the lead frame and the interconnecting substrate using a flip-chip bonding method.

Abstract: An intelligent power module includes a power circuit board having a plurality of power devices and fixed on a base plate of a case body able to be closed with a lid to form a protective case of the intelligent power module. The intelligent power module also includes a control circuit board suitable to drive the power devices of the power circuit board. The control circuit board is associated with the lid in such a way that the control circuit board is comprised within the case body. The control circuit board and the lid thus realizing an intelligent lid of the intelligent power module.

Abstract: A reactor 1 of the present invention includes: a combined product 10 provided with a coil 2 and a magnetic core 3 where the coil 2 is disposed; and a case 4 storing the combined product 10. The case 4 includes: a bottom plate portion 40 fixed to a fixation target when the reactor 1 is installed in the fixation target; a side wall portion 41 attached to the bottom plate portion 40 to surround the combined product 10; and a heat dissipation layer 42 formed on the inner face of the bottom plate portion 40 to be interposed between the bottom plate portion 40 and the coil 2. The bottom plate portion 40 is made of aluminum, and the side wall portion 41 is made of an insulating resin. The heat dissipation layer 42 is made of an adhesive agent whose thermal conductivity is high and which exhibits an excellent insulating characteristic.

Abstract: A power module for a motor traction inverter system of a vehicle includes a body portion configured to be inserted into a cooling device and having circuitry established thereat that generates heat during operation of the power module. The body portion has a surface area that is disposed in the cooling device and provides 360 degree direct cooling of the power module around the body portion for cooling the circuitry during operation of the power module. The power module may be transfer molded into a shape with a head terminal for sealing at the cooling device, and electrical connections of the power module share only one side surface or end of the power module, with all other sides and surfaces of the power module being disposed in the cooling device and used for cooling. The power module may not include thermal grease layers and may or may not be insulated.

Abstract: A semiconductor memory device is included. The semiconductor device includes a semiconductor memory device, comprising: a first substrate including a first semiconductor device mounted on the first substrate and a first connection terminal disposed at an edge of the first substrate; a second substrate including a second semiconductor device mounted on the second substrate and a second connection terminal at an edge of the second substrate; and an interface connector including a first socket portion configured to receive the first connection terminal and a second socket portion configured to receive the second connection terminal. The interface connector further includes: first socket terminals of the first socket portion are connected with the first connection terminals; second socket terminals of the second socket portion are connected with the second connection terminals; and an internal wiring for electrically connecting the first socket terminals with the second socket terminals.

Abstract: A multilayered printed circuit board or a substrate for mounting a semiconductor device includes a semiconductor device, a first resin insulating layer accommodating the semiconductor device, a second resin insulating layer provided on the first resin insulating layer, a conductor circuit provided on the second resin insulating layer, and via holes for electrically connecting the semiconductor device to the conductor circuit, wherein the semiconductor device is accommodated in a recess provided in the first resin insulating layer, and a metal layer for placing the semiconductor device is provided on the bottom face of the recess. A multilayered printed circuit board in which the installed semiconductor device establishes electrical connection through the via holes is provided.

Abstract: A wireless LAN module as a composite module according to the present invention includes a first substrate 26 and a second substrate 28 that is so disposed as opposed to the other principal surface 48b of the first substrate 26. An external connector 66 for the connection with an electronic apparatus is mounted on one principal surface 48a of the first substrate 26. An electronic component device 76a is mounted on one principal surface of the second substrate 28 in a region opposing the external connector 66 sandwiching the first substrate 26 therebetween. A heat dissipation member 78 is disposed on a surface which is an opposite side to the mounting-surface of the electronic component device 76a.

Abstract: A wireless module includes a wireless signal transceiver and a transferring unit. The wireless module is assembled to a connector unit after the wireless signal transceiver is assembled to the transferring unit. Therefore, the connector unit transmits and receives wireless signals through the wireless module.

Abstract: An electrical subsea node for communicating data between at least one sensor at a sea bottom and a topside unit above the sea surface may include: a water tight container; a first electronic module extending in a first area of a first area size in a plane of a maximal spatial extent of the first electronic module; and at least one second electronic module extending in a second area of a second area size in a plane of a maximal spatial extent of the second electronic module, wherein the first and second electronic modules are coupled for data communication and arranged inside the container to form a module arrangement extending in an arrangement area of an arrangement area size in a plane of a maximal spatial extent of the module arrangement, wherein the arrangement area size is smaller than a sum of the first and second area sizes.

Abstract: The invention provides methods to mass laminate and interconnect high density interconnect circuit layers fabricated through parallel processing. Invention methods employ an inside-out interconnection strategy that eliminates plating of vias and provides defect-free outer circuit layers. Conductive paste and via layers are also key features of the invention.

Abstract: A housing for electronic components comprising at least one hardware module and a frame. The hardware module comprises a mounting element, wherein the frame connects the at least one hardware module through the mounting element mechanically stable to the housing. A labeling element is attached to the mounting element and the housing has at least one viewing opening so that at least one part of the labeling element can be seen from the outside of the housing.

Abstract: In a communication device, a heat sink includes a solderable top surface with multiple upward facing swaging protrusions. A spacer is placed on top of the top surface of the heat sink with locating cut-outs on the spacer aligned with the swaging protrusions. A solder pre form is inserted into an opening in the spacer. The solder pre form includes locating features for alignment with the spacer and the swaging protrusions. The spacer is configured to restrict melted flow from the solder pre form to a defined area of the heat sink top surface. A printed circuit board including cut-outs and input and output connections for inserting a radio frequency device and further including locating holes for aligning the printed circuit board with the swaging protrusions is placed on top of the solder pre form and secured to the heat sink prior to a manufacturing process.

Abstract: A field device for use in an industrial process includes a housing having a cavity formed therein. A humidity-sealed electronics module has a first compartment formed therein and is positioned in the cavity. The humidity-sealed electronics module includes a seal board. The seal board separates the first compartment of the humidity sealed electronics module from a second compartment in the housing. A first electrical component in the first compartment is mounted to the seal board and a second electrical component in the second compartment is electrically connected to the first electrical component.

Abstract: Provided is a composite module that includes a plurality of substrates in a housing, prevents deformation of the stated substrates, and has a characteristic with an improved mounting precision of the substrates within the housing. A wireless LAN module as a composite module according to the present invention includes a first substrate 26, a second substrate 28 that is so disposed as opposed to the other principal surface 48b of the first substrate 26, and a housing 12 that has accommodation sections 38 and 54 for accommodating the first substrate 26 and the second substrate 28. Further, substrate-support projections for supporting one principal surface and the other principal surface of each of the first substrate 26 and the second substrate 28, are formed on inner wall surfaces 40 and 56 of the accommodation sections 38 and 54 in the housing 12.

Abstract: A storage device including a circuit board, an electronic device package and a terminal module is provided. The circuit board has a first surface and a second surface opposite to each other, a plurality of via-holes connecting the first surface and the second surface, a plurality of first pads on the first surface, and a plurality of first pads on the second surface. The electronic device package is disposed on the first surface. The terminal module disposed on the first surface has a plurality of first and second contact parts, and each of the first contact parts passes through the corresponding via-hole and is protruded out of the second surface, and each of the second contact parts is electrically connected to the corresponding first pad. An orthogonal projection area of the electronic device package on the first surface is smaller than an area of the first surface.

Abstract: A jumper module mounting circuit board includes: a circuit board; and a jumper module having an insulator main body provided with conductive electrical connection parts for connecting between connection patterns so as to provide electrical continuity therebetween by connecting each of contact parts on both ends of the conductive electrical connection parts to the connection patterns which are formed to be spaced apart from each other on the circuit board. The jumper module is mounted onto the circuit board so as to connect between the contact parts and the connection patterns that are formed to be spaced apart from each other. The circuit board includes a connection pattern concentrated section that is formed by concentrating the connection patterns depending on a plurality of wiring specifications at a mount position of the jumper module.

Abstract: A chip card ejecting mechanism includes a base body, a push member, a rotating member and an elastic member resisting between the base body and the rotating member. The base body includes a guiding member defining a hole and having a number of guiding rails. Each guiding rail includes a resisting surface and a guiding surface. The push member includes a push rod extending through the hole and a number of active gears. Each active gear defines an active cooperative surface. The rotating member includes a number of the passive gears. Each passive gear includes a passive cooperative surface. When the push member is pressed toward the rotating member by a transient external force, the rotating member compresses the elastic member until the active cooperative surface arrives at the guiding surface, the elastic member releases and drives the passive cooperative gears to slide along the first sliding slot.

Abstract: The present invention is a transparent conductive laminate comprising a base, a low-refractive-index layer, an intermediate-refractive-index layer, and a transparent conductive layer, the low-refractive-index layer, the intermediate-refractive-index layer, and the transparent conductive layer being sequentially stacked on at least one side of the base either directly or through one or more layers, the low-refractive-index layer having a refractive index of 1.40 to 1.50, and the intermediate-refractive-index layer having a refractive index of 1.50 to 1.80 and a film density of 2.5 to 4.5 g/cm3. The present invention provides a transparent conductive laminate that exhibits excellent moisture-heat resistance and excellent optical properties, and an electronic device or module.

Abstract: Disclosed is a module type safety bus bar including: a vertical coupling portion (20) which is a vertically-extending rectangular parallelepiped insulating block, has an upper end provided with a first combining means, and a middle portion into which a bus bar (30) penetrates to be combined with the vertical coupling portion in the form of a cross, the bus bar (30) connecting terminals of a distributor (A) to a circuit breaker (B); and a horizontal coupling portion (10) which is a horizontally-extending rectangular parallelepiped insulating block and has a second combining means, to be combined with the first combining means, in a middle portion of a lower end thereof. The horizontal coupling portion (10) covers an exposed metallic portion of the bus bar after the terminals of the distributor and circuit breaker are connected to each other so that the bus bar (30) becomes safe.

Abstract: There is provided a circuit board to which a solder ball composed of a lead (Pb)-free solder is to be connected, a semiconductor device including an electrode and a solder ball composed of a lead (Pb)-free solder disposed on the electrode, and a method of manufacturing the semiconductor device, in which mounting reliability can be improved by enhancing the bonding strength (adhesion strength) between the solder ball composed of a lead (Pb)-free solder and the electrode.

Abstract: A device includes a printed circuit assembly (PCA) including a printed circuit board and at least one electronic component integrated with the printed circuit board, and a support to which the PCA is securable. At least one of the PCA and the support includes engaging structure elements, and some engaging structure elements are configured to secure the PCA to the support while other engaging structure elements are configured to secure the support to a securing structure within a housing of an electronic device.

Abstract: An electronic module for a vehicle includes a covering element, a component-carrier printed circuit board element, a carrier element having a first side and a second side, a printed circuit board element, and at least one contact-connection element. The contact-connection element is configured to provide a conductive contact-connection between the component-carrier printed circuit board element and the printed circuit board element. The covering element and component-carrier printed circuit board element are positioned on the first side of the carrier element, and the printed circuit board element is positioned on the second side of the carrier element. The carrier element has at least one opening, and the contact-connection element is led through the opening.

Abstract: The metallic case of a power conversion apparatus includes a casing having a side wall, as well as an upper case and a lower case, a first area being formed between a cooling jacket provided at the inner periphery of the side wall and the lower case, the metal base plate dividing the first area between the cooling jacket and the upper case into a lower side second area and an upper side third area, first and second power modules being fastened to a top surface and a capacitor module being provided in the first area, driving circuits that drive inverter circuits of the power modules respectively being provided in the second area, and a control circuit that controls the driver circuits being provided in the third area.

Abstract: A high frequency (HF) module and a manufacturing method thereof. The HF module has a single airtight box-like structure formed by a first PCB, a second PCB, and a third PCB. On a lower surface of the third PCB facing the first PCB, a second electronic component is mounted at a position corresponding to a first electronic component relatively low in height, among first electronic components mounted on the first PCB. Upper and lower ends of a plurality of vias formed within the second PCB are connected to a copper layer existing within a body of the third PCB and a copper layer existing within a body of the first PCB to constitute a single electromagnetic wave shielding unit overall.

Abstract: In some embodiments, an apparatus includes a first substrate, a second substrate, a first coupler, and a second coupler. The first substrate is formed from a first material and includes an electrical pad. The second substrate is formed from a second material and includes an electrical pad. The first coupler is configured to mechanically couple the first substrate to the second substrate without a soldered connection. The second coupler includes a first end portion, configured to be soldered to the electrical pad of the first substrate, and a second end portion, configured to be soldered to the electrical pad of the second substrate. The second coupler configured to electrically couple the first substrate to the second substrate.

Abstract: One exemplary object of the present invention is to provide a card device which can be shared in main body devices employing different power supply systems, and a power supply method of the card device. The card device according to the present invention includes a flat rectangular card base body (101), an internal circuit (301), an external connector (102), and a main body connector (103). The external connector (102) is provided on an edge (202) positioned on an opening side (201) of a card slot (21) in a state in which the card device is inserted into the card slot (21), and is adapted to be supplied with power from an external power supply. The main body connector (103) is provided on the innermost side of a card slot (200) in a state in which the card device is inserted into the card slot (200), and is supplied with power from a main body device.

Abstract: A compact radio core engine (CE) module uniquely small in size and power consumption, in which only two circuit boards provide all the modem and transceiver functions needed for modern military radios. A modem circuit board has modem devices and a first connector mounted on the board, and a radio frequency (RF) circuit board has RF devices and a second connector mounted on the board. A module frame has an interior wall, and a side wall about the periphery of the interior wall. The modem and the RF circuit boards are positioned on opposite sides of the interior wall, and the connectors on the two boards mate with one another through an opening in the interior wall to exchange operating data and signals between the devices on the boards. The modem circuit board is seated entirely within a recess formed by the interior and the side walls of the frame.

Abstract: A module carrier unit comprises a plurality of passenger interface modules that perform different functions, the functions including at least one of inputting and outputting information, the modules having a common size, shape, and interface; an outer case portion comprising a plurality of receptacles, each having a common size, shape, and interface designed to receive one of the modules, the plurality of receptacles being such that a first module having a first function is operable in a first receptacle, and a second module having a second function is operable in the first receptacle, the modules being removably connected to the receptacles; and a communications interface that performs at least one of transmitting and receiving data to and from a processor located near a seat of a passenger in the vehicle.

Abstract: A wireless terminal device includes: a conduction and connection module, and a first Printed Circuit Board, PCB, connected to the conduction and connection module, and the wireless terminal device further includes a first conductor, where one of the conduction and connection module and the first PCB is connected to one end of the first conductor through a first capacitance coupling module, and the other one of the conduction and connection module and the first PCB is connected to the other end of the first conductor. Through the foregoing processing, capacitance coupling and grounding between the conduction and connection module and the PCB can be implemented through the first capacitance coupling module.

Abstract: An electronic device may contain components such as flexible printed circuits and rigid printed circuits. Electrical contact pads on a flexible printed circuit may be coupled electrical contact pads on a rigid printed circuit using a coupling member. The coupling member may be configured to electrically couple contact pads on a top surface of the flexible circuit to contact pads on a top surface of the rigid circuit. The coupling member may be configured to bear against a top surface of the flexible circuit so that pads on a bottom surface of the flexible circuit rest against pads on a top surface of the rigid circuit. The coupling member may bear against the top surface of the flexible circuit. The coupling member may include protrusions that extend into openings in the rigid printed circuit. The protrusions may be engaged with engagement members in the openings.

Abstract: An integral solar module power conditioning system includes one or more solar module support frames. Each frame includes a plurality of plug-and-play electrical connectors integrated therewith. A microinverter or microinverter connector is also integrated with each frame. Each frame is configured to receive a respective solar electric module and to carry electrical power through a plurality of solar electric modules and corresponding microinverters connected together via a plurality of solar module support frames connected together via the plurality of integrated plug-and-play electrical connectors.

Abstract: A combination of an interconnect board and a module board for connecting a plurality of electronic modules to a processing unit is described. The interconnect board comprises a plurality of interconnect data lines connected between a plurality of interconnect board input terminals and interconnect board output terminals. The module board comprises at least one electronic module connected to a module connection input terminal, a plurality of module board data lines connected between a plurality of module board input terminals and a plurality of module board output terminals, and an unconnected module board output terminal. A first one of the interconnect board output terminals is connectable to the module connection input terminal, and the unconnected module board output terminal is connectable to one of the interconnect board input terminals.

Abstract: An assembly with a conductor held by a resilient housing in which a PCB and/or a battery is held by an interference fit in a cavity of the resilient housing wherein insertion of the item so held forms an interference fit that forces the conductor into an electrical contact with a conductive member of the PCB and causes the resilient housing to bias the conductor against the conductive member of the PCB. The conductor does not need to be resilient. A switch can also be held by an interference fit with the resilient housing and unique channels in the resilient housing, formed by at least one rib connected to a top and a bottom of the housing, can be independently resilient.

Abstract: There is provided an electronic component module capable of increasing a degree of integration by mounting electronic component on both surfaces of a substrate, the module including: a first substrate having mounted electrodes formed on both surfaces thereof; a plurality of electronic components mounted on both surfaces of the first substrate; at least one second substrate bonded to a lower surface of the first substrate; and an insulating part formed in at least one position in a gap between the first substrate and the second substrate and bonding the first substrate to the second bonding substrate.

Abstract: A solid state drive is disclosed. The solid state drive includes a circuit board having opposing first and second surfaces. A plurality of semiconductor chips are attached to the first surface of the circuit board of the solid state drive, and the plurality of semiconductor chips of the solid state drive include at least one memory chip that is at least substantially encapsulated in a resin. An in-line memory module-type form factor circuit board is also disclosed. The in-line memory module-type form factor circuit board has opposing first and second surfaces. A plurality of semiconductor chips are attached to the first surface of the in-line memory module-type form factor circuit board, and these semiconductor chips include at least one memory chip that is at least substantially encapsulated in a resin.

Abstract: A wiring board has a first rigid wiring board having an accommodation portion, a second rigid wiring board accommodated in the accommodation portion, an insulation layer formed over the first rigid wiring board and the second rigid wiring board, and a joint conductor extending in a direction from a first surface of the first rigid wiring board to a second surface of the first rigid wiring board on the opposite side of the first surface of the first rigid wiring board such that the joint conductor is penetrating through the boundary between the first rigid wiring board and the second rigid wiring board and joining the first rigid wiring board and the second rigid wiring board.

Abstract: The present disclosure is related to electronic modules for electronic components and methods for manufacturing the same. In one embodiment, an electronic module is formed using a first substrate having a first component area and a second substrate having a second component area. One or more electronic components may be attached to both the first component area and the second component area. The second substrate is mounted over the first substrate such that the second component area faces the first component area. An overmold covers the first component area and the second component area so as to cover the electronic components on both the first component area and the second component area. In this manner, the number of electronic components within the electronic module that can be mounted on an area of a printed circuit board (PCB) is increased.

Abstract: An electrical module and a device using the same are provided. The electrical module comprises a base, a composite component and a pressing sheet. The composite component is disposed on the base and comprises a pad and a conductive sheet. The conductive sheet is embedded in the pad, and the pressing sheet presses on the pad. The pad comprises a main body and a protrusion. The main body has a surface. The protrusion is disposed on the surface of the main body and is compressed between the surface of the main body and the base.

Abstract: An external structure of an outdoor electronic apparatus for packaging a circuit board having a power line is provided. The external structure includes a housing having an opening and a waterproof gasket. The waterproof gasket includes a main body, a platform portion, a first protrusion, and a bushing portion. The main body covers the opening. The platform portion, located at the inner side of the main body, extends into the housing from the opening. The platform portion seals the opening and tightly fits with the housing. The first protrusion is located on the platform portion for abutting against the circuit board. The bushing portion, located at the outer side of the main body, has a channel. The channel passes through the main body and the platform portion and can be passed through by the power line. The bushing portion and the power line tightly fit to each other.

Abstract: A thermally deformable assembly is formed in an integrated-circuit metallization level. The physical behavior of the metal forming the assembly brings the assembly into contact with a stop-forming body when subjected to a temperature change caused by a current flow. A natural rollback to the initial configuration in which the assembly is a certain distance away from the body is prevented. The state or configuration of the assembly is determined by a capacitive reader.

Abstract: A data storage device includes a printed circuit board (PCB), a connection tab, a dummy tab and a guiding member. A memory chip is mounted on the PCB. The connection tab is formed on a first surface of the PCB to electrically connect the PCB with a first cable. The dummy tab is formed on the first surface of the PCB. The guiding member is formed on the dummy tab to guide an insertion direction of the first cable. Thus, the data storage device without a separate connector may be manufactured by a relatively simple process at a lower cost.

Abstract: A testing apparatus and method of extending the life of a testing apparatus may comprise a chassis including a case having a testing module receptacle receiving a plurality of testing modules comprising at least one processor module and a plurality of test modules, each having the same physical footprint, including respective racking mechanisms and inter-module interface connectors; and a backplane with connectors connecting with a respective inter-module connector, and bus-work interconnecting the respective modules through the inter-module interface connectors and the backplane connectors. The backplane may comprise a battery and display connector. The chassis may comprise a display mounting receptacle configured to receive a display unit having a display connector configured to interface with the backplane display connector. A battery receptacle may receive a battery unit, such as a rechargeable battery.

Abstract: A locking assembly includes a guiding post and a hollow locking member. The guiding post includes a locking portion. A clamp hook is formed on a flange of the locking portion. The locking member includes an opening end. The locking member sleeves on the locking portion of the locking member, in which at least one clamping depression is formed on an inner wall of the locking member corresponding to the clamp hook, and the clamp hook is clamped in one clamping depression.

Abstract: Disclosed herein are electric vehicle control device which can distribute the heat generated by the semiconductor devices in the DC/AC converter efficiently. Also disclosed herein are methods of converting DC to AC while keeping the heat value of the semiconductor devices stable.

Abstract: An electrical assembly for a motor vehicle is configured to contact a connector. Contact surfaces are provided on a circuit board of the assembly. The connector has contact elements for contacting the contact surfaces. A housing of the assembly has an inner chamber and a contacting chamber directed toward the connector area, with the inner wall therebetween to separate the chambers. The circuit board including the electrical components is arranged in the inner chamber and only a contacting area with the contact surfaces protrudes through the inner wall into the contacting chamber.