Abstract: A system and method for efficiently interconnecting a plurality of ICs, thereby improving the electrical performance of the overall system. In one embodiment of the system of the present invention, a plurality of carriers corresponds to a plurality of ICs, and a board has a plurality of board regions for receiving the plurality of ICs and are arranged so as to be attached to a backplane forming a vertical stack of boards.

Abstract: A PC card includes a circuit board having an electrical component mounted on the face thereof and an I/O connector coupled to an end thereof. The circuit board is enclosed by a metal casing. The casing includes a top cover having a pair of sidewalls projecting from the sides thereof. Each top sidewall has an outside face with an engagement shelf projecting therefrom. The base cover includes a pair of bottom sidewall projecting at opposing sides thereof. Each of the bottom sidewalls has an inside face with an engagement ridge projecting therefrom. The bottom sidewalls are configured such that the locking ridges engage the shelf when the top cover and base cover are pressed together with the circuit board positioned therebetween. Projecting from the inside face of the top cover is a shield wall encircling a heat sink. The shield wall encircles the component on the circuit board when the top and base cover are attached together.

Abstract: A transfer molded PC card standard or small form factor card electronic package includes a substrate that has an integrated circuit package thereon and an electrical connector along a side of the substrate. In addition, an upper cover extends over at least a portion of the substrate and the electrical connector. A lower cover extends over at least a portion of the substrate and the electrical connector and a transfer molded encapsulant covers the substrate and a portion of the upper cover and the lower cover. The portion of the upper cover and the lower cover are covered by the encapsulant and includes a first flange attached to a portion of a periphery of the upper cover and a second flange that is attached to a portion of the periphery of the lower cover.

Abstract: A hybrid module comprising a circuit board, a heat generating circuit component mounted on the circuit board and a mother board on which the circuit board is mounted, wherein the circuit component is mounted on the circuit board opposing the mother board, and the surface of the circuit component is fixed to a thermally conductive member having a shape like a film and formed on the mother board. With such an arrangement, heat generated in the circuit component is transmitted to the mother board via the thermally conductive member.

Abstract: A PCMCIA electronics package adapted to enclose, and provides EMI shielding to, a printed circuit board (PCB). The PCB has an electrical connector adapted for plugging into a computer is at a one end and RF circuitry at the other end. Electronic components are disposed on an inner region of the surfaces of the PCB. The PCB has a ground plane conductor disposed therein. Electrically conductive strips are disposed on the surfaces of the PCB along opposing side edges and the other end of the PCB. A plurality of conductive vias pass through a portion of the PCB electrically connecting the electrical strip conductors to the ground plane conductor. A plurality of resilient, electrically conductive clips is provided. Each one of the clips has: a cup-shaped region disposed over a corresponding one of the PCB edges and the other end of the PCB. Side portions of the cup-shaped regions are in contact with conductive strips. The clips have an arm with a distal end elevated from the PCB.

Abstract: A compact flash card adapter includes a casing, a printed circuit board fitted within the casing, a female compact flash card connector mounted on one side of the printed circuit board, a male PCMCIA card connector mounted on an opposite side of the printed circuit board, an indicator light installed on the printed circuit board and protruding out of the casing, a power switch arranged on the printed circuit board and protruding out of the casing, a power jack disposed on the printed circuit board and protruding out of the casing, and a voltage regulating IC mounted on the printed circuit board, whereby a user may connect a peripheral component with PCMCIA interface with the compact flash card connector of an electronic device.

Abstract: A resin-encapsulated semiconductor package and a packaging structure, make it possible to provide for a high density mounting arrangement. Specifically, outer leads protrude from the two long sides of a rectangular package. The inner leads in the package, connected to the outer leads protruding from one long side, are connected through wires to the bonding pads of a semiconductor chip encapsulated in the package, whereas the inner leads in the package, connected to the outer leads protruding from the other long side, are in an electrically floating state in the package. The semiconductor packages are arranged in a direction on a card-shaped mounting board, and the opposed outer leads of adjoining semiconductor packages are electrically connected by wiring on the mounting board. The wirings are laid below the semiconductor packages so that they extend generally linearly.

Abstract: An apparatus is disclosed. In one embodiment, the apparatus includes a semiconductor substrate and a second substrate. The semiconductor substrate has a top side and a bottom side. The semiconductor substrate has an integrated circuit and at least one alignment fiducial formed on the top side. The alignment fudicial is aligned with the integrated circuit and the alignment fiducial is accessible from the bottom side. The semiconductor substrate further includes a first set of bond pads on the integrated circuit, the bond pads on the top side. The second substrate has a second set of bond pads corresponding to the first set of bond pads. The semiconductor substrate is coupled to the second substrate at a plurality of solder interconnections disposed between the first and the second set of bond pads.

Abstract: An RF shield dividing components on a printed circuit board into separate compartments in the form of a divider wall having a lower edge surface soldered onto the printed circuit board and an upper edge surface including along the length thereof a plurality of adjacent upwardly extending metal Y-fold arms as a self-contained or built-in gasket to physically contact and electrically ground a metal cover section enclosing the components.

Abstract: An apparatus and method for producing a wrap-around interconnect substrate (60) comprising a substrate (42) having semi-circular vias (62) having openings (64) created by separating through cylindrical vias (62) that were positioned along cutting lines (46a, 46b) that formed part of an integrated circuit substrate strip (40) prior to separation, is disclosed.

Abstract: A removable card insulator and guide prevents inadvertent shorting during the insertion or removal of an adapter card into a "hot-plug" computer system. The card insulator includes perpendicular first and second planar portions. When installed in a computer system, the first planar portion is positioned perpendicular to the motherboard, and the second planar portion is positioned parallel to the motherboard such that any components on the motherboard are positioned between the second planar portion and the motherboard. The second planar portion includes a slot through which an adapter card connector can be passed to mate with a connector on the motherboard. A step has perpendicular riser and tread portions, wherein the riser is attached perpendicular to the second planar portion, such that the tread is parallel to and offset from the second planar portion.

Abstract: A PCMCIA card structure includes a front connector, a frame, a substrate, and a sheet metal cover having a top cover panel. A ground plate having rearwardly extending ground contacts is carried on the upper surface of the connector. The frame includes an insulative cross beam disposed adjacent to the rear of the connector, the cross beam serving to support the top cover panel of the card, to prevent the top cover panel from contacting the connector ground plate or the contacts extending from the ground plate, and, along with portions of the ground plate, to close off the space between the connector and the front edge of the top cover panel. The ground plate has a transverse length shorter than that of the connector, thereby defining end shoulder surfaces along the upper surface of the connector. The top cover panel includes a pair of laterally spaced, forwardly extending tabs, each tab overlying an end shoulder surface on the connector.

Abstract: A thin electronic card (10) can securely receive and connect to contacts of an RJ or telephone type plug (40). The card has a vertical hole (52) through which the RJ plug can be inserted. The front wall (84) of the hole has downwardly-facing card shoulders (80,82) for abutting the upwardly-facing shoulders (70,72) of the RJ plug latch (62), and the front wall has a rib (96) with an upwardly-facing shoulder(100) that lies below and laterally between the other card shoulders to engage a largely downwardly-facing shoulder (92) on the latch. The hole is formed in an adaptor (50) that can slide forward (F) and rearward (R). The adaptor includes a frame (110) that forms the front wall of the hole and the shoulders thereat, and a separate contact block (112). The contact block slides a shorter distance than the frame when both of them are slid to the fully stowed position within the card frame (32).

Abstract: A cartridge having top and bottom metal covers which enclose a circuit board, the metal of the covers forming a seam which is welded at locations therealong to bond the two covers together. The covers may form a snap-fit, lap, or butting seam where the welds are applied. The cartridge is particularly useful in PCMCIA applications.

Abstract: An electronics casing is formed from interlocking upper, lower and side panels and a pair of end plates. Grooves are formed in the outer surface of the lower panel for mounting the casing on the legs or struts of tripods or other lighting supports. The weight of the casing helps counter-balance lighting elements supported on the tripod and holds the casing in place. Multiple casings may be connected together using dovetail tongue and groove connectors on the sides of the casing.

Abstract: A PC card has a sheet metal forward housing part (13) whose rear edge (36) is connected to a plastic molded rear extension part (14) before a sheet metal lower housing element (11) is connected to them, which enables simple coupling of the forward and rearward parts so the two of them can be handled prior to full assembly of the card. The rear edge of the sheet metal forward housing part includes a pair of side tabs (38, 39) at laterally opposite sides and a center tab (44) at the center. The plastic molded part has a front edge portion (110) with a pair of vertical slots (28, 29) at opposite sides for receiving the side tabs, and with a groove (36) at the middle for receiving the center tab. With the plastic molded part lying horizontal, the sheet metal forward part is held in a vertical plane with the side tabs projecting down into the side slots and the center tab lying in the center recess. The sheet metal forward part is then pivoted down, causing the side tabs to bend about 90.degree.

Abstract: The radio frequency module of the present invention includes an insulating substrate having a first metal film on a first principal surface thereof and a second metal film on a second principal surface thereof opposed to the first principal surface and a semiconductor device. The semiconductor device is thermally and electrically coupled to the second metal film, and a thickness of the second metal film is larger than that of the first metal film.

Abstract: A computing device unit includes an upper casing, at least one integrated chip module electrically mounted on an interior side of the upper casing, a lower casing selectively engageable with the upper casing, and a flexible circuity ribbon extending through the upper casing and the lower casing, and being electrically connected to the at least one chip module within the lower and upper casing. Related devices and methods provide similar advantages.

Abstract: A printed circuit card having first and second circuit units mounted thereon in connection to terminal pads adjacent two card edges, with the first and second circuit units being in connection to each other and to select pads of a first edge such that upon insertion of that edge into a given card socket, both circuit units are enabled, and the circuit units also being in connection to the pads of a second edge such that upon insertion of that edge into a second card socket, only the second circuit unit is enabled. In the preferred embodiment, the card is a memory module card having buffer and memory circuit units designed to cooperate with each other and with either of standard, buffered or unbuffered memory card sockets in a system board in accordance with insertion of a first or second pad edge in one of the card sockets to automatically provide, either combined circuit unit operation, or single circuit operation. The invention is also applicable to clocked register circuits and series pass devices.

Abstract: A universal enclosure system in a tower type manner for receiving different type mother boards therein includes the main body generally having at least a top wall, a bottom wall, a first and a second side walls, a front panel. Two kinds of different removable back panels are interchangeably adopted to cooperate with the main body for exclusively receiving a first type mother board, i.e., the ATX type, or a second type mother board, i.e., the NLX type, in the enclosure system wherein the first type mother board is bigger than the second type mother board. The first back panel cooperates with a first metal carrier which is adapted to mount the first type mother board thereon whereby the first type mother board is positioned in the interior of the enclosure system and almost very close to the first side wall.

Abstract: The invention relates to a HF housing comprising an arrangement for electrically interconnecting at least two HF conductor tracks (18, 19) which are formed on adjacent printed circuit boards (13, 15), which are separated from each other by a slit (17), and whose ends are situated opposite each other in the region of the slit. A simple way of interconnecting the conductor tracks (18, 19) situated opposite each other in the slit region is achieved in accordance with the invention by an auxiliary printed circuit board (20) which bridges the slit region and is pressed against the printed circuit boards (13, 15), the lower side of said auxiliary printed circuit board being provided with auxiliary contact bridges (21) in the region of the HF conductor tracks (18, 19) to be interconnected.

Abstract: An electrical device has a printed-circuit board secured to a cover of the electrical-device housing, as well as a heat-dissipation mat arranged on a housing wall. The cover secured to the housing, as well as guideways of the housing, in which guideways the printed-circuit board is received, exert a tension force on the printed-circuit board, because of which electronic components arranged on the printed-circuit board, under conditions of intimate contact with the heat-dissipation mat, are embedded into the heat-dissipation mat. This is achieved by introducing the printed-circuit board in inclined position into the housing and, shortly before it reaches its final position, swivelling the printed-circuit board toward the wall of the housing having the heat-dissipation mat.

Abstract: A cabinet having a plurality of compartments adapted to have disposed in a corresponding one thereof one of a plurality of processing unit modules. Each one of the modules includes a case. The case has a motherboard mounting surface adapted to have mounted thereto one of a plurality of differently configured motherboards, each one of the differently configured motherboards having a different arrangement of a CPU, main memory and I/O adapted cards. The case also has a bulkhead mounting surface adapted to have mounted thereto one of a plurality of differently configured I/O bulkheads, each one of the differently configured bulkheads being configured for a corresponding one of the differently configured motherboards. The case has a fan mounting surface adapted to have mounted thereto one of a plurality of differently configured fan assemblies, each one of the differently configured fan assemblies being configured for a corresponding one of the differently configured motherboards.

Abstract: Heat is removed from electronic components located within a closed housing by the use of a heat-conducting metal clip mounted on the housing cover so as to be in pressure contact with the electronic components. The metal clip includes a U-shaped mounting portion firmly clamped to a clip-mounting wall projecting from the cover, and a series of spring arms extending through a slot opening in the cover into pressure contact with individual electronic components. The clamp force of the clip on the mounting wall is designed to act independently of the pressure exerted by each spring arm on an associated electronic component.

Abstract: An electronic module or package is disclosed for providing high reliability and high performance operation. The package comprises a hermetically sealed enclosure having a metallic baseplate and a ceramic cover, and containing one or more circuits or devices therein which typically are power rectifiers, bridges or power control circuitry. One or more power terminals are disposed on a terminal block compliantly supported on or above the baseplate, the terminals extending through the cover in hermetically sealed manner. Signal or control terminals may also be disposed on a terminal block compliantly supported on or above the baseplate, these terminals also extending through the cover in hermetically sealed manner. An adapter plate may be mounted on the cover and containing a plurality of terminals connected to the module terminals. The terminals of the adapter plate can be in any configuration to suit user requirements without requiring a change in the terminal configuration of the module itself.

Abstract: A memory adapter having a first cover (50), a circuit board (60), a second cover (70) detachably connected the circuit board (60) to the first cover (50) and a third cover (80) detachably connected with the first cover (50) and abutted the second cover (70) toward the first cover (50) is used by users to adapt to different cassette memory of different sizes. With the adapter, users are able to use cassette memory of different dimensions in different electrical appliance readily.

Abstract: In a modular tower building block system for containing computing system devices, an I/O bus is incorporated into the modular blocks of the building block system by using a printed circuit board to carry the I/O bus in each modular block. The printed circuit board is mounted and positioned in each modular block to electrically connect with a printed circuit board in a next adjacent modular block when two modular blocks are stacked on each other. Also, there are a plurality of I/O buses on the printed circuit boards and only one I/O bus is distributed from each modular block. The printed circuit board is precisely located in each modular block at a predetermined position. Alignment pins and receivers provide alignment between stacked modular blocks to precisely position one modular block to the other modular block. This also aligns electrical connectors on the printed circuit boards of the stacked blocks so that the connectors on the printed circuit boards from two blocks mate when the two blocks are stacked.

Abstract: A conductive ground layer provides a low cost method of reducing, controlling, or tailoring printed circuit board (PCB), for example, a motherboard, trace impedance and/or size, cross-talk, and EMI without having to add additional layers. A thin layer of conductive epoxy is applied over a solder mask high speed signal trace area of the PCB. The conductive epoxy is connected to or coupled to a ground plane or layer of the PCB. The inclusion of a higher number of traces on the PCB is made possible by tailoring the characteristic impedance of the traces, which allows the trace size to be reduced.

Abstract: In an I/O card has a case having metallic top and bottom covers, a printed circuit board mounted in the case, a connector disposed in the case for connecting with a personal computer system, and a card side I/O connector disposed in the case for mating with a cable side I/O connector connected to external device, the card side I/O connector is provided with no shell but is in direct contact with the metallic top and bottom covers, so that the both covers came in direct contact with a metallic shell of the cable side I/O connector when the cable side I/O connector is mated with the card side I/O connector. In an embodiment, the top cover is provided with locking pieces which engages with elastic locks of the cable side I/O connector for locking a mating condition between the card side I/O connector and the cable side I/O connector.

Abstract: An electronic card which includes a printed circuit board interposed between card shields having edges. Tabs on an edge of one shield engage recesses on the edge of the other shield. The jointed shields of the card provide high level of rigidity, sufficient to exceed applicable bending and torsional resistance specification. Adequate rigidity is thereby provided. Also included is an I/O connector grounded without a separate ground contact and shielded over its length. The tabs include an arcuate member having a medial oblique projection which engages a ledge of the other shield near the recess.

Abstract: The invention is a method of assembling an integrated computer by successively placing various components into an open-top weldment or "tub." The assembly method is particularly suited to rapidly and cost-effectively assembling an integrated computer module in an automated, assembly line environment.

Abstract: A circuit unit having an insulating substrate (1) on which a conductive, flat coil (3) is located. The coil (3) can consist of a plurality of coil layer sections (9, 17) separated by insulating layers (11). To interconnect the individual coil layer sections (9, 17) into a coil, at least one opening (13) is provided in each of the insulating layers (11). The connection between the first coil ends (15, 19) of the coil (3) and an integrated circuit (7) or a module (23) containing the integrated circuit (7) can be formed solely by the coil ends (15, 19) and the connection points (27) of the integrated circuit (7) or the contacts (25) of the module (23) touching. The individual turns of the coil (3) can be disposed and dimensioned so as to permit embossing of the circuit unit without restriction within an area (37, 38) conforming with the standard.

Abstract: A PC cartridge for computers/game machines, including a bottom shell, an upper shell covered on the bottom shell, a PC board mounted within the bottom shell and the upper shell, and two connection ports connected to two opposite ends of the PC board, wherein the upper shell and bottom shell have a respective pair of locating flanges transversely disposed at two opposite ends and respectively forced into engagement with top and bottom locating grooves of the connection port; the bottom shell has two packing rubbers molded thereon along its two long sides and adapted to hold the connection ports therebetween; the upper shell has two downward front hooks respectively hooked in a respective front hook hole in the packing rubbers, two downward rear hooks respectively hooked in a respective rear mounting groove of the packing rubbers, and two L-shaped coupling flanges raised along its two long sides and respectively forced into engagement with the bottom edges of the packing rubbers.

Abstract: A ballast housing (10) comprising a base (100), a cover (200), an input connector (300), and an output connector (400). Input connector (300) and output connector (400) serve as end-caps of the housing (10), and provide solderless connections between external wires and the ballast circuitry. The base (100) has formed edges (132,142) that are received into corresponding channels (242,252) in the cover (200). Tabs on the connectors (300,400) and corresponding apertures in the base (100) and cover (200) provide a secure ballast housing that accommodates efficient provision of input and output wires.

Abstract: A memory module capable of changing the generation of semiconductor memory devices by changing the design of a unit board without changing the design of a mother board.The mother board has connection terminals having an ability of connecting with first and second generation type unit boards, so that even when a connection terminal location is changed as a result of the generation change of the semiconductor memory devices, the next unit board can be connected to the mother board by selecting an appropriate terminal from connection terminals on the mother board.

Abstract: An electrical interconnection system for electronic modules that are mountable on a support and stackable against other similar modules where the interconnection system allows for pivotable attachment of the modules to the support and electrical contacting with adjacent modules, such that power and data transmissions can occur therebetween, through an interconnection that protects the contacts during pivoting attachment of the module to the support and assures a reliable and easily established interconnection therebetween.

Abstract: In an electronic device comprising a case, a printed circuit board disposed in the case, and an electrical connector mounted on the printed circuit board for connecting the printed circuit board with an external circuit, the printed circuit board is fixed directly to the electrical connector, and the electrical connector is fixed directly to the case, so that the printed circuit board is avoided from deformation when a mating connector is fitted into the electrical connector mounted on the printed circuit board.

Abstract: An oscillator includes a multi-layered base. Circuit patterns are formed on a first main surface and the inside of the multi-layered base. Holes through which wiring patterns of the individual layers of the base are connected are formed within the multi-layered base. Electronic components are mounted on the first main surface of the multi-layered base. First and second reverse electrodes, which serve as external terminals to be connected to an external source, are formed on a second main surface of the multi-layered base. The first reverse electrode serves as a ground electrode, and the second reverse electrodes serve as terminal electrodes. The reverse electrodes are electrically connected to the circuit patterns via the holes. The reverse electrodes are located farther inward than the lateral surfaces of the multi-layered base. A shield cover is placed to tightly cover the first main surface of the multi-layered base.

Abstract: A high-speed memory module defined by first and second elements the first element including a plurality of flexible, interior layers laminated together to form a substrate having opposed exterior surfaces, the substrate having a network of conductive traces and vias forming data paths therein, at least two substantially quadrangular, rigid circuit boards, each of the boards laminarly split into substantially symmetric half-sections, each of the half-sections having solder lands formed on a first face for mounting electronic components thereto and conductive traces and vias incorporated therein forming a continuation of the data paths, each of the half-sections having an opposite second face for bonding to the exterior surfaces of the substrate, the half-sections laminated together on either side of a portion of the substrate with the substrate being sandwiched therebetween, wherein any gap between two parallel spaced-apart edges of any two adjacent boards is wide enough to allow mounting of the boards in a pa

Abstract: A large non-hermetic packaging approach that produces a large multichip module or SuperMCM package. The present invention integrates a plurality of multichip module technologies including removable and/or standard high density multilayer interconnect (HDMI) decal substrates, and a reworkable chip on board coating, housed in a mechanically sound, thermally conductive non-hermetic multichip package. A metal substrate has an HDMI substrate and one or more edge printed wiring boards bonded thereto which are interconnected using wire bonds. The HDMI substrate has one or more electronic chips bonded thereto that are connected thereto using wire bonds or other attachment scheme. Components on the one or more edge printed wiring boards are connected to the using edge printed wiring boards wire bonds. The edge printed wiring boards have external attachment pads exposed at their outside edges. A removable cover is disposed over the package except for the external attachment pads at the edges of the package.

Abstract: A computer card lock-down device is formed from a bowed piece of an insulating plastic, metal coated with an insulating plastic or the like. A first portion of the lock-down device is formed to be flat and has a screw connection. The rest of the lock-down device has an approximately U-shaped cross-section. At a second portion, the U-shaped cross-section forms a slot for engagement with an upper edge of the card. In use, the first portion is held against the face plate of the card with the same screw used to secure the card in the expansion slot, and the second portion engages with the card. The lock-down device can be bowed sufficiently that it contacts the lid of the computer CPU case. The lock-down device exerts a spring force on the card to prevent the card from coming loose from the expansion slot.

Abstract: A conductor pattern is formed on at least one surface of an AlN- or Si.sub.3 N.sub.4 -based ceramic substrate which is such that the ratio between the principal metal component binding with N to form the ceramic mass and the B in the BN remaining on the surface layer is no more than 50.times.10.sup.-6 as either B/Al or B/Si, wherein B/Al represents the ratio of I.sub.B to I.sub.Al where I.sub.B is the X-ray diffraction intensity of boron present on the surface layer and I.sub.Al is the X-ray diffraction intensity of aluminum, and B/Si represents the ratio of I.sub.B to I.sub.Si where I.sub.B is as defined above and I.sub.Si is the X-ray diffraction intensity of silicon. The thus produced circuit board has both a peel strength of at least 30 kg/mm.sup.2 and a capability of withstanding at least 30 heat cycles and, hence, satisfies the performance requirements of the recent models of power module ceramic circuit boards.

Abstract: A grounding clip (130, 132) is provided which mounts on a rear end cap (60) of a PC card, and which connects a rear connector shell (44) of the PC card to a top 5 sheet metal cover portion (90). The clip has a pair of top spring fingers (140, 142) that lie in recesses (150) in the top surface of the top flange (62) of the rear end cap, and has a bottom finger (144) lying against the lower surface of the top flange and against a tine (104) formed in the shell of the rear connector. The clip lies close to an extreme side (124,126) of the PC card, to remain engaged with the top cover portion despite bending of the cover rear portion that results in its middle (126) being raised above its opposite sides.

Abstract: This invention relates to a circuit board mounting apparatus with inverted U-shaped mounting arms for mounting a circuit board. The circuit board mounting apparatus comprises a base for loading the circuit board above it, two front end latching mechanisms installed on the base for removably and horizontally latching the front end of the circuit board, a supporting mechanism installed on the base for supporting the approximately center portion of the circuit board upward, and at least one inverted U-shaped mounting arm installed on the base having one open end facing downward. The open end of the mounting arm comprises an engaging means for engaging the rear end of the circuit board to prevent it from moving upward.

Abstract: An integrated BEDC and PCB provided through a low cost, highly reliable interconnect system. The upper and/or lower half of the main insulation assembly of a BEDC is provided with a recess for accommodating at least an edge portion of the substrate of a PCB. The PCB is provided with apertures such as holes for receiving therethrough a buss wire and/or terminal slots through which terminals having wire slots are fixedly staked. The apertures on the PCB are arranged in a predetermined pattern so as to align with corresponding respective apertures in the form of corresponding holes and/or terminal slots on the BEDC at the recess thereof. Accordingly, with the PCB seated in the recess, as the buss wires are laid, they will pass through the holes in the PCB and/or pass through the wire slot of the terminals and thereby provide interconnection therebetween when the two halves of the main insulation assembly are united and the PCB is sandwiched therebetween.

Abstract: An semiconductor device and a method for manufacturing semiconductor devices which are easily made compact. A plurality of semiconductor chips having protrusion electrodes respectively provided on a plurality of electrodes formed on circuit surfaces are integrally sealed by an insulating material so as to cover the circuit surfaces while the circuit surfaces are nearly directed to the same direction and arranged in prescribed conditions, and to expose the respective protrusion electrodes; and insulating layers and wiring layers respectively electrically connected to the corresponding protrusion electrodes are alternately laminated on the insulating material so as to have the desired number of layers in the direction of thickness.

Abstract: An apparatus for adjustably mounting a cooling device, such as a fan, to a computer enclosure comprises a saddle and a bracket. The saddle for mounting the fan thereto has opposite longitudinal skirts with locating slots defined therein. The bracket has a first portion attached to a wall of the computer enclosure and a second portion for mounting an assembly of the saddle and the fan thereto. The assembly of the saddle and the fan is slidably mounted to the second portion of the bracket for adjustably locating at a position corresponding to a CPU of a mother board.

Abstract: An interface adapter enables a replacement controller to be mechanically received in a housing configured for an older model controller having a larger volume. Moreover, the interface adapter enables terminals of the replacement controller having a first configuration to be connected to the contacts of a housing connecter having a second configuration configured to couple with contacts of the older model controller. The interface adapter includes a faceplate having a central aperture for receiving the replacement controller and a pair of sideboard printed circuit boards (PCBs) positioned perpendicular to a surface of the faceplate in spaced parallel relation on opposite sides of the central receiving aperture. A main PCB is electrically and mechanically connected between the sideboard PCBs. The main PCB and the sideboard PCBs have contacts adjacent their ends opposite the faceplate.

Abstract: A substrate unit is constituted by a printed substrate on which electronic parts such as a relay block is mounted, and at least printed circuit conductors and terminals in the printed substrate and relay block are buried in a sealing resin material hardened in a bag-like body of a thin resin film set in an injection mold, and the hardened sealing resin material is then released from the injection mold together with the bag-like body.

Abstract: An electrical junction box has a first insulating polymeric portion and a second polymeric portion defining multiple electrically conductive circuits. The circuits are at least partially separated by the first insulating polymeric portion and at least some of the circuits electrically connect together wire harness connector portions. A further aspect of the present invention junction box causes a section of the first insulating polymeric portion to concurrently act as a segment of an outer protective cover for the junction box.