Abstract: A modular support and casing is provided with a selected circuit breadboard and circuit testing module for circuit construction and testing. Electrical and electronic components may be removably and interchangeably mounted on the circuit breadboard for constructing an electrical or electronic circuit in circuit development. A plurality of selective side plates are slidably and securely mounted on the longitudinal side edge portions of the support base. Auxiliary components such as switches and connectors may be conveniently provided in pre-formed openings on these side plates for ease in the circuit construction. A top cover is provided to maintain the side plates securely in place. The side plates form the side panels of the cover to provide a complete enclosure for protecting the electrical or electronic circuit thus constructed.

Abstract: Assembling structure for portable memory device, including a memory device main body composed of a bottom cover, an upper cover and a circuit board. Two corners of one end of the bottom cover is formed with recessed sections. The other end thereof is formed with a thread hole. The upper cover is formed with hook boards and a through hole corresponding to the recessed sections and thread hole. The upper cover is mated and locked with the bottom cover by a bolt to clamp the circuit board. An adapter of the circuit board outward extends from the main body. A sheath is fitted around the main body. One end of the sheath is formed with a through hole through which the adapter outward protrudes. The sheath and the main body are formed with corresponding stop board and lateral projecting blocks, whereby the main body is slidable within the sheath to extend the adapter out of the sheath or retract the adapter therein.

Abstract: A modular and user configurable PC Card which removably receives one or more add-in modules that provide selected functionality. The user inserts and removes selected modules in the PC Card to configure the PC Card to the desired functionality. The PC Card includes one or more slots for receiving PC Card modules. PC Card slot openings are located on the narrow back end of the PC Card opposite the PCMCIA adapter, or alternatively are located on the wide end of the PC Card. In the preferred embodiment, the PC Card includes an internal module connector having connectors on either side. The PC Card modules are removably inserted into one of the one or more slots and connect to the module connector contacts on the module connector within the PC Card. In one embodiment, the PC Card includes a rotating cam which is turned to connect the module connector contacts on the module connector within the PC Card to the contacts on the removable PC Card module.

Abstract: A prototype development apparatus includes a logic board (LB) including a plurality of integrated circuit (IC) sites each adapted to receive an IC, logic traces coupled to each of the IC sites, and a plurality of logic board connector sites (LBCSs) configured to provide access to a number of the logic traces and each adapted to receive a connector. Additionally, a mezzanine board (MB) has a plurality of mezzanine board connector sites (MBCSs) each adapted to receive a connector and configured to provide access to a number of mezzanine traces interconnecting the LBCSs. The MB board is coupled to the LB and a portion of the logic traces are coupled to a portion of the mezzanine traces. In another embodiment the MB does not have any active components. This is because in this embodiment, the MB is configured to connect the pins of the connector sites according to a predetermined program.

Abstract: An IC card, which can be mass-produced at low cost, is composed of a plane coil formed by means of punching or etching.

Abstract: An enclosure for housing a printed circuit board is disclosed. The enclosure comprises a shell with an open front and back, a front plate and back plate for attachment flush within, respectively, the open front and back. The front plate and back plate are secured to the shell by locking means. The printed circuit board housed within the enclosure is used as a structural element of the enclosure by rigid attachment to the front plate and back plate.

Abstract: A PCMCIA I/O card assembly (1) includes a printed circuit board (PCB) (3), a dielectric supporting member (4), a lower cover (22), an upper cover (20), and a pair of bolts (8). The lower cover has a pair of frames (24), each forming a front head (241). The supporting member encloses and supports high-profile mating connectors (51, 52) mounted on the PCB, and includes upper and lower housings (40, 42). Both the upper and lower housings have rearwardly extending boards (406, 46), and upper and lower casings (41, 43) projecting forwardly from the boards. The lower housing board engages with the front heads, for reliably securing the lower housing to the lower cover. The boards are engageable with each other such that the supporting member is securely attached to the lower cover.

Abstract: A power distribution module utilizes a planar substrate having an array of repeating slots configured to accept two types of relays, one having four terminals and the other having five terminals. Both relays can mate with the slots of the substrate in a variety of orientations, including reverse orientations wherein the relay terminal footprint can be rotated 180 degrees and still mate with a corresponding, yet shifted, slot footprint.

Abstract: A mount shelf for an electronic circuit board, includes a body; a first guide which is supported by the body and has a first guide plane; a second guide which is supported by the body and has a second guide plane; a third guide which is supported by the body and has a third guide plane; and a fourth guide which is supported by the body and has a fourth guide plane. The first guide plane and the second guide plane respectively have first contact planes on which a first end plane portion of one straight first edge region of an electronic circuit board can be contact at a same time. The third guide plane and the fourth guide plane respectively have second contact planes on which a second end plane portion of another straight second edge region of the electronic circuit board can be contact at the same time. The first guide and the second guide are separated to a degree of a width in a direction in which the first edge region or the second edge region of the electronic circuit board is extended.

Abstract: An integrated circuit is provided that contains a coaxial signal line formed at least partially within a silicon-containing substrate. The coaxial signal line comprises an inner conductor having a length, said length axially surrounded by, and insulated from, an outer conductor along said length. A method of preparing such an integrated circuit having said coaxial signal line formed at least partially within a silicon-containing substrate is also disclosed herein.

Abstract: There is disclosed a system and method for providing an improved common control bus for use in the on-line insertion of line replaceable units (such as circuit board cards) into a backplane of a processor shelf, a modem shelf, or a similar type of equipment. The present invention increases the number of device locations that a common control bus can access. The present invention comprises a complex programmable logic device on a circuit board card that is coupled to a common control bus. The complex programmable logic device is capable of selectively coupling to the common control bus each one of a plurality of device locations on the circuit board card. The complex programmable logic device controls data access to and from each device that is coupled to the common control bus.

Abstract: In a power module, an interconnection terminal (10) is inserted into a through hole (30) and a connector (16) of a control circuit substrate (12) from the side of a lower main surface of the control. circuit substrate (12). Then, the interconnection terminal (10) presses a terminal (17) to displace the terminal (17). Thus, electrical and physical connections are provided between the control circuit substrate (12) and the interconnection terminal (10) in such a manner that the interconnection terminal (10) is held between the terminal (17) and an inner peripheral side surface of the connector (16). The interconnection terminal and the control circuit substrate are fixed. to each other without using solder, whereby the power module which is easy to mount and remove is provided.

Abstract: A method for determining a wiring pattern of a signal line for connection of a circuit on a multi-layer printed wiring board includes the steps of providing a constraint of an electrical length which the signal line must satisfy, determining an electrical length change at a discontinuous delay part of the signal line along which a signal propagates, determining a wiring route of the signal line, calculating an electrical length of the signal line with use of a wiring length of the signal line and the determined electrical length change, judging whether or not the calculated electrical length satisfies the electrical length constraint given to the signal line, and determining the wiring route as a wiring pattern when the electrical length constraint is satisfied as the decision result, thereby carrying out a wiring layout to make an electrical length constraint satisfied.

Abstract: An interposer includes two separate sets of pins, and inserts into two sockets on a printed circuit board. One set of pins supplies power to a step down converter (SDC) mounted on the interposer. The second set of pins provide inputs and outputs to an integrated circuit mounted on the interposer. One or more conductive traces in or on the interposer electrically connect an output of the SDC to an input of the integrated circuit, thus supplying regulated power to the integrated circuit through the interposer. The SDC and integrated circuit can be directly mounted on the interposer, or either or both can be mounted on packages that connect to the interposer. The SDC and integrated circuit can be flip chips or can be connected to the interposer or package using wirebonds. The packages can be pinned or connectable by solder bumps.

Abstract: A high density vertical surface mount package and thermal carrier therefor including a heat sink.

Abstract: A method supporting a printed circuit board, including the step of causing a contact portion of at least one board supporting member including a vibration damping portion formed of a vibration damping rubber, to contact at least one portion of a lower surface of the printed circuit board and thereby support the printed circuit board on a side of the lower surface thereof.

Abstract: A card has an electronic device, such as an integrated circuit, a conductive, resistive or capacitive network, or other electronic device, embedded therein. The card, sometimes referred to as a “smart card,” has the electronic device mounted to a substrate, generally by electrical connections formed of solder, electrically-conductive adhesive or flexible electrically-conductive adhesive. The substrate is covered by a layer of melt-flowable adhesive of thickness sufficient to cover the electronic device mounted thereon. The substrate is attached to a card blank to which it is bonded by melt flowing the melt-flowable adhesive. In one embodiment, the card blank has a cavity into which the electronic device and substrate are placed. In another embodiment, the substrate is of the same size and shape as is the card blank and the space therebetween is filled with melt flowable adhesive to bond them together and embed the electronic device therebetween.

Abstract: An electronic circuit device 21 consists of a connector 23 provided with guide projections 45, a circuit board 24 on which the connector 23 is mounted, and a case 22 provided with guide recesses 36. Since the guide recesses 36 are broader in width at the end portions of the side walls of the case 22, and the guide projections 45 are narrower in width at the side where the connector 23 is first inserted, no high positional accuracy is required when the connector is received in the case. Both the guide recesses 36 and the guide projections 45 include inclined faces 37, 37, 47, 47 to form a V-shape.

Abstract: The invention relates to an electronic unit having a mounting board (4) and electronic components (1-3) mounted on it, with the mounting board (4) having metal webs (41) which are embedded in an electrically insulating material (40), the metal webs (41) having a first side (411), which is in the form of a contact surface for making contact with the electronic components (1-3) and having a second side (412) facing away from this. According to the invention, cutout(s) are arranged in the electrically insulating material (40), via which the second side (412) of each metal web (41) is accessible for a voltage or current measurement apparatus.

Abstract: A laminate circuit structure assembly is provided that comprises at least two modularized circuitized plane subassemblies; a joining layer located between each of the subassemblies and wherein the subassemblies and joining layer are bonded together with a cured dielectric from a bondable, curable dielectric. The subassemblies and joining layer are electrically interconnected with bondable electrically conductive material. The joining layer comprises dielectric layers disposed about an internal electrically conductive layer. The electrically conductive layer has a via and the dielectric layers each have a via of smaller diameter than the vias in the electrically conductive layer and are aligned with the vias in the electrically conductive layer. The vias are filled with electrically bondable electrically conductive material for providing electrical contact between the subassemblies.

Abstract: This scanner head includes a case member (300b) having a first side wall (300f) and a second side wall (300y), an electric circuit board (105) placed inside the case member (300b), a terminal board (309) including a terminal to be connected to the main apparatus and placed outside the first side wall (300f), a wiring unit (305) for connecting the electric circuit board (105) and the terminal board (309) through a slit opening (300c) formed in the first side wall (300f), and a shield plate (102). This shield plate (102) couples the first side wall (300f) and the second side wall (300y).

Abstract: When a semiconductor integrated circuit having a plurality of electrode pads disposed in an array-like form on the bottom surface thereof is mounted on a printed wiring substrate, a plurality of ground electrode pads and a plurality of power supply electrode pads are concentratedly arranged on the central portion of the semiconductor integrated circuit mounted on the printed wiring substrate so as to constitute groups so as to be opposed to each other, and a decoupling capacitor is mounted on the opposite surface of the printed wiring substrate through a through-hole, whereby the creation of radiation noise is suppressed and the higher density of the printed wiring substrate is achieved.

Abstract: A first metal film 14 made of a Cu plated film is formed on a radiation substrate 13A made of Al, and an island 15 exposed from a back surface of a semiconductor device 10 is adhered thereto. At that time, the back surface of the semiconductor device 10 is brought into contact with contact areas, and a first opening portion OP is opened larger than an arranging area of the semiconductor device 10. Accordingly, the cleaning can be executed via the first opening portion OP exposed from peripheries of the semiconductor device 10. In addition, the heat generated from semiconductor elements 16 can be radiated excellently from the island 15 via a second supporting member 13A.

Abstract: An assembly of communication card in name card style has an upper and a lower metallic lid extended from its two opposite sides downward to form a plurality of protuberant teeth having respective rectangular choke holes. The protuberant teeth are put into through holes in cantilevers on side of a fixing base. A check bar provided with a plurality of choke teeth having jutting hooks and recessed snap portions penetrates through lateral holes in the cantilevers horizontally for being fastened, then the check bar is pushed forward to retain those metallic lids on the fixing base. On the contrary, a user is suggested to push the check bar backward then use a simple tool to dismount the communication card structure.

Abstract: A portable computer having a main computer body and a keyboard unit slidably attached to the main computer body and movable to various positions in front of the main computer body. A display unit is also slidably attached to the main computer body and movable to various positions up and away from the computer main body.

Abstract: A card-type electronic apparatus is provided with a flat card case and a circuit module housed in the card case. The circuit module is provided with a circuit substrate having a first surface and a second surface positioned on the side opposite to the first surface, at least one first electronic part mounted on the first surface of the circuit substrate and at least one second electronic part mounted on the second surface of the circuit substrate. Here, the first electronic part having the greatest height dimension on the first surface and the second electronic part having the greatest height dimension on the second surface are placed in an offset manner from each other without facing each other with the circuit substrate interpolated in between.

Abstract: A flexible wiring board that can bridge wires and also can prevent production of conductive foreign materials in use, to secure good performance of a magnetic head. The flexible wiring board for connecting therethrough a suspension substrate having mounted thereon a magnetic head of a hard disk drive and a control circuit substrate for actuating the magnetic head includes a short-circuit forming portion for forming a shorting portion for bridging wires to prevent electrostatic destruction of the magnetic head; and a cut for removing the shorting portion. When the flexible wiring board is cut along the cut, the shorting portion can be removed without producing conductive foreign material resulting from the cutting off of the shorting portion.

Abstract: The present invention is to provide a surface mounting part, capable of corresponding to high density mounting of a mother board and capable of achieving a small size, to be mounted on a mother board by reflow. Electronic parts are mounted on both sides of a printed board. Terminal electrodes of the electronic parts mounted on the rear side are provided as terminals for connecting with the mother board.

Abstract: A circuit board module comprises a battery case 101 storing a battery of which external terminals 4 have a laminated members 8 made of different metal material for each other, a circuit board 102 for carrying out charge and discharge of the above-mentioned battery and a joint member 103 for connecting the battery case 101 and the circuit board 102 electrically and/or mechanically, wherein the joint body 103 is constructed by clad material that a first metal layer 111 and a second metal layer 112 made of different metal materials each other are laminated.

Abstract: An interposer includes two separate sets of pins, and inserts into two sockets on a printed circuit board. One set of pins supplies power to a step down converter (SDC) mounted on the interposer. The second set of pins provide inputs and outputs to an integrated circuit mounted on the interposer. One or more conductive traces in or on the interposer electrically connect an output of the SDC to an input of the integrated circuit, thus supplying regulated power to the integrated circuit through the interposer. The SDC and integrated circuit can be directly mounted on the interposer, or either or both can be mounted on packages that connect to the interposer. The SDC and integrated circuit can be flip chips or can be connected to the interposer or package using wirebonds. The packages can be pinned or connectable by solder bumps.

Abstract: A multi-layer printed circuit board that includes a first layer and a second layer that have first and second signal traces, respectively. The first signal trace has a relatively thin section and a relatively thick section. The multi-layer printed circuit board also includes a via that couples the first signal trace to the second signal trace. The first signal trace's relatively thin section is located between its relatively thick section and the via.

Abstract: A memory system is disclosed. The memory system comprises a circuit board and at least two memory devices mounted on the circuit board. Each of the at least two memory devices includes a plurality of pins for receiving and providing signals. At least a first portion of the pins of one of the at least two memory devices are coupled to at least a second portion of the pins of the other at least two memory devices such that a pair of the first portion coupled to a pin of the second portion forms a coupled load. The coupled load then appears as one load. Accordingly, in a system in accordance with the present invention, at least two memory devices are provided on a circuit board. Each of the at least two memory devices includes a plurality of pins.

Abstract: A telephone line protection module having a printed circuit board base with conductive paths connected to pins of the module. Overvoltage sensitive semiconductor devices are soldered to the ends of a conductive bridge, and the bridge is spring-biased between a module cover and the conductive bridge. The semiconductor devices are thus forced into electrical contact with the printed circuit paths. In addition, in the event the semiconductor devices are thermally destroyed, the conductive bridge is forced by the spring into direct contact with the printed circuit paths.

Abstract: A multilayer circuit board includes a base layer, a conductive layer and a soldermask. The soldermask layer has two sets of openings. One of the openings are vent openings, that expose the base layer to provide ventilation so that gases may escape during processing. The second openings expose selective regions of a conductor layer. The multi-layer circuit board provides for less occurrences of delamination.

Abstract: A printed circuit board includes a first component mounted on a first side of the printed circuit board. A second component has an identical pin-out as the first component. The second component is mounted on a second side of the printed circuit board. A first signal line connects a first landpad coupled to a first contact on the first component with a second landpad coupled to a corresponding first contact on the second component. A second signal line connects a third landpad coupled to a second contact on the first component with a fourth land pad coupled to a corresponding second contact on the second component. The first signal line has is equal in length to the second signal line.

Abstract: A network interface card (NIC) frame contains a plastic frame, an upper cover, two metal plates and two lateral metal bars. A PC board is mounted into the plastic frame first and then the two metal plates are covered on the top and bottom of the PC board respectively. Afterwards, the lateral metal bar is arranged on the groove of the two lateral sides of the plastic frame and then the fingers on the lateral metal bar are inserted into the corresponding buckle holes on the fasten teeth of the metal plates respectively. The NIC frame can be taken apart and reused repetitively for the purpose of adjustment or repairing the PC board inside.

Abstract: An apparatus for mounting a system component in a chassis includes an electrically conductive chassis having a grounding frame mounted therein and electrically connected thereto. An access opening extends through the grounding frame. The access opening is defined by opposed longitudinal edges. An elongated contact member is attached to the grounding frame adjacent to each longitudinal edge of the access opening. Each one of the contact members is resiliently deflectable about a pivot axis adjacent the corresponding longitudinal edge. Discontinuities and obstructions along the edge portions of the expansion device do not engage and damage the contact members. Furthermore, a substantially continuous EMI gasket is provided along substantially the entire edge of the expansion card, improving the reliability of the ground between the chassis and the expansion device and reducing electromagnetic emissions.

Abstract: A printed circuit board top side mounting system is presented and includes a printed circuit board having a primary side and a secondary side. The printed circuit board top side mounting system also has a surface member that has a point with a generally constant distance in relation to the primary side. The printed circuit board top side mounting system further includes a standoff with a elongated shape which has a predetermined set dimension that includes the constant distance disposed in going through a slot in the printed circuit board. The standoff further includes a first end disposed to fixing the first end rigidly on the printed circuit board and a second end disposed in connecting rigidly to the surface member.

Abstract: In a system comprising two printed circuit boards, each printed circuit board is provided with at least one electrical contact element for electrically interconnecting the printed circuit boards. One of the electrical contact elements comprises at least one electroconductive pin formed from one of the printed circuit boards, while the other electrical contact element is formed by at least one hole in the other printed circuit board, a wall of said hole being covered with an electrically conducting layer.

Abstract: An electrically conductive wire wound into a conical coil 1 with leads from the small and large ends of the coil. The coil is filled with fine-grained magnetic material 11, and is mounted in a thin-walled, electrically non-conductive carrier 21 designed for precise automated assembly onto a circuit board 15. The wire leads are plastic-welded onto the carrier, and no metallic pads are used, greatly increasing the effective bandwidth of the choke. The small end 4 of the coil is positioned precisely on a micro-strip 17 on the circuit board. Attachment of the wire lead from the small end of the coil to the microstrip is done with minimum lead length and minimum conductive material for the highest possible frequency response. Precise coil positioning, minimal lead length, and a totally non-conductive carrier virtually eliminates electrical reflections and resonances to yield a broadband choke with exceptional frequency range.

Abstract: A foldaway electronic device includes a base unit having opposing lateral surfaces and an end portion, a cover unit having opposing lateral surfaces, each of which corresponds to one of the lateral surfaces of the base unit, and an end portion that is rotatably attached to the end portion of the base unit, whereby the cover unit may be rotated between a folded position relative to the base unit and an unfolded position relative to the base unit, a locking mechanism in the base unit and cover unit that locks the cover unit in the folded position, a lock release mechanism in the base unit that releases the locking mechanism when the cover unit is in the folded position, and impelling means in the base unit for impelling the cover unit from the folded position to an unfolded position after the lock release mechanism has been actuated, wherein either lateral surface of the base unit has a guard portion that extends over and prevents contact by a user's thumb and fingers with a portion of the corresponding la

Abstract: When a semiconductor integrated circuit having a plurality of electrode pads disposed in an array-like form on the bottom surface thereof is mounted on a printed wiring substrate, a plurality of ground electrode pads and a plurality of power supply electrode pads are concentratedly arranged on the central portion of the semiconductor integrated circuit mounted on the printed wiring substrate so as to constitute groups so as to be opposed to each other, and a decoupling capacitor is mounted on the opposite surface of the printed wiring substrate through a through-hole, whereby the creation of radiation noise is suppressed and the higher density of the printed wiring substrate is achieved.

Abstract: A frame sheet comprises a core sheet, and oversheets. A recess is formed in the sheet frame. The oversheet is left in the recess in the sheet frame, and an IC carrier is mounted in the recess. The IC carrier is held, adhered to the oversheet left in the recess.

Abstract: A radio modem for fitting to equipment such as a portable computer, in particular, the modem being deigned to be inserted in a slot provided in the equipment, and the modem including two elements which are disposed relative to each other and which are fitted so as to form a memory card reader, and wherein, for the slot having dimensions adapted for receiving a modem in the form of an “equipment” card of determined thickness, each of the two elements is implemented by means of an equipment card of thickness that is smaller than the determined thickness.

Abstract: A storage card module for supporting more than one SCSI storage device on a printed circuit board to be coupled to a CPCI backplane. The storage devices are positioned on the board with a predetermined spacing disposed therebetween. One or more low profile connectors are disposed in the predetermined spacing for each storage device depending on the number of pins needed. For an 8-bit fast tape drive, a 50-pin low profile connector is utilized. A pair of 34-pin low profile connectors are utilized for connecting to a 16-bit fast-wide SCSI disk drive. Electrical traces are buried in the board substrate which couple the low profile connectors to a card connector on the printed circuit board. The card connector is mated to the CPCI backplane via a backplane connector. A SCSI I/O interface is in an electrical conductive relationship with at least a portion of the backplane connector. Power is provided to the drives via a pair of 4-pin low profile power connectors disposed in the predetermined spacing.

Abstract: A high-frequency multilayer circuit substrate having a plurality of circuit layers includes a via hole for connection between the circuit layers, a metal pad, an impedance matching transmission line, rectangular stubs and a signal transmission line. A via hole connecting portion is constructed of the via hole, the rectangular stubs and the impedance matching transmission line. A characteristic impedance of the via hole connecting portion is matched to a characteristic impedance of the signal transmission line by adjusting widths and lengths of the impedance matching transmission line and the rectangular stubs. Thereby, the reflection of the signal wave in the via hole connecting portion is reduced to decrease a transmission loss.

Abstract: A memory card including a circuit board and a card-shaped hollow casing for accommodating the circuit board. The hollow casing includes an envelope-shaped support member having an integrally molded structure, an opening being defined at a longitudinal end of the support member for insertion of the circuit board into the support member, and a lid member fixed onto the longitudinal end of the support member to close the opening. The support member cooperates with the lid member to securely support the circuit board in the casing. The support member includes an envelope-shaped receptacle defined inside the support member for receiving a major part of the circuit board. The support member also includes a guide portion for directing the circuit board to a proper position within the support member.

Abstract: An intentional radiator includes an antenna and a ground plane. The ground plane is to be coupled to shielding that includes an opening for the antenna wherein the intentional radiator is to be positioned such that the antenna radiates through the opening. The shielding and the ground plane together act to reduce emissions through the opening.

Abstract: An IC card of the type having a CardBus shield is disclosed in which the dielectric CardBus bridge behind the shield is provided with an upward projection that is positioned behind a front angular part of the top cover of the sheet metal enclosure for the card to support the cover. Preferably, the projection has a front angular surface that conforms to the configuration of the front angular part of the cover. The projection restricts flexural stresses applied to the card and improves environmental sealing of the card.

Abstract: A support member 1 is previously molded, a hybrid integrated circuit substrate 45 is placed thereon, and the support member 1 on which the hybrid integrated circuit substrate 45 is placed is placed in a metal mold, then again molded of a thermoplastic resin 2. The poured high-temperature thermoplastic resin 2 strikes on the support member 1 whose bottom surface is directly contacted on the metal mold and the surface of the striking portion is melted and integrated without being deformed . Therefore, full mold substantially covering an entire surface of the substrate is enabled. Epoxy potting is applied to a semiconductor chip and a coil derivation part.