Abstract: An integrated circuit which has a packet router to which a plurality of functional modules are connected by respective ports is described. One of the ports acts as a socket port for an expansion socket. The expansion socket provides a plurality of additional expansion ports to which additional functional modules can optionally be connected. All the ports connected to the packet router, including the expansion socket port, preferably lie in a common address space for the integrated circuit.

Abstract: This apparatus has a printed circuit board 10 and contacts made from carbon tracks. These carbon tracks (52, 44) are disposed on the printed circuit board (10) by means of an insulating layer (54, 42) plated on the printed circuit board.

Abstract: The invention relates to a push-in card with an attachment device (1), which is arranged on a side edge of the printed circuit board (2), with a first and a second attachment element (3, 4), the first attachment element (3) being attached to the printed circuit board and the second attachment element (4) being attachable by an attachment means (6) to a housing (10), in which the push-in card is received. The push-in card according to the invention is characterized in that the first and second attachment elements are connected to each other either movably, pluggably or integrally with an additional predetermined breaking point.

Abstract: A method and apparatus for connecting circuit boards together in a sensor assembly includes a connector that allows the circuit boards to be positioned generally perpendicular to each other. The connector includes a first end that is received within an opening formed at one edge of a main circuit board. A second end of the connector includes a resilient hook or clip that grippingly engages opposing sides of an auxiliary circuit board. The connector comprises an electrical contact between the main and auxiliary circuit boards. The perpendicular orientation of the auxiliary circuit board to the main circuit board allows for more compact packaging.

Abstract: A printed circuit board structure for a scope unit of an electronic endoscope system, which is provided with a first printed circuit board formed with a first circuit section, and a second printed circuit board formed with a second circuit section. The first printed circuit board is piled on the second printed circuit board. The second printed circuit board having an area covered with the first printed circuit board and at least one area which is not covered with the first circuit board. The at least one area is used for electrically connecting the second circuit section with an electrical unit other than the second circuit section.

Abstract: A memory card includes: a main body of the memory card in which a notched section is formed; a semiconductor memory; and a write/nonwrite setting element for setting the write/nonwrite state of data in the semiconductor memory, the write/nonwrite setting element being slidably fitted in the notched section, wherein the main body of the memory card includes an upper main body and ail lower main body; at least one of the upper main body and the lower main body has an elastic guide formed within the notched section the write/nonwrite setting element slides along the elastic guide so as to set the write/nonwrite state of the data in the semiconductor memory; and the elastic guide has an engagement portion for engagedly stopping the write/nonwrite setting element so as to select the position of the write/nonwrite setting element with respect to the elastic guide.

Abstract: A printed circuit board (PCB) has a plurality of electromagnetic interference (EMI) reducing circuits, which reduce electromagnetic waves emitted from the PCB, and a plurality of switching devices, such as MOS transistors, relays and DIP switches, to enable and disable the EMI reducing circuits. The EMI reducing circuits connected between border portions of a voltage and a ground layers in the PCB include at least a capacitor. A combination of the EMI reducing circuits which gives a minimum amount of electromagnetic waves emitted from an apparatus including the PCB is selected as a suitable combination of EMI reducing circuits. An information processing apparatus having the printed circuit boards has means for selecting a combination of the EMI reducing circuits which allow the minimum EMI emitted for the apparatus.

Abstract: A structure for highly precisely and easily mounting an electronic circuit unit on a mother board without defective soldering, comprising a circuit board 3 provided with extending portions 3d having terminal patterns 8 formed thereon, a housing 2 for containing the circuit board 3 while permitting the extending portions 3d to protrude, and a mother board 5 having, formed therein, through holes 5a in which the extending portions 3d are to be inserted, having, formed thereon, wiring pattern (not shown) that is to be electrically connected to the terminal patterns 8, and permitting the extending portions 3d to be inserted in the through holes 5a so that the housing 2 is placed thereon. The circuit board 3 is provided with a protruded portion 3e which extends separately from the extending portions 3d and pushes the terminal patterns 8 onto the wiring pattern of the mother board 5.

Abstract: A display device includes a circuit board having a number of light devices, a plate engaged onto the circuit board and having one or more grooves forming one or more characters or digits, and aligned with the light devices, to receive the light generated by the light devices. A transparent filling or insert is engaged and filled into the grooves of the plate, for allowing the display device to be manufactured by mass production procedures. A number of reflective panels may be engaged into the grooves for reflecting the lights.

Abstract: A bump used for electric contact with an electric part is formed by arranging on a conductor a conductive material including a substantially same electric characteristic as the bump by fusing, and forming the arranged conductive material into a desired shape by die pressing with a bump forming die in which a recess having a given shape is defined.

Abstract: A first semiconductor chip having a pad electrode on its main surface is disposed on a substrate, and a first wiring film electrically connecting the pad electrode to the substrate is further disposed on the substrate so as to cover the first semiconductor chip. A second semiconductor chip is disposed on the first wiring film. The second semiconductor chip has a pad electrode on its main surface opposite to another surface on which the first wiring film is disposed. A second wiring film electrically connecting the pad electrode to the substrate is disposed on the substrate so as to cover the first semiconductor chip and the second semiconductor chip.

Abstract: A circuit board assembly with multiple cartridge slots adapted for use in a casing of an electronic product includes a circuit board, at least one first cartridge slot and at least one second cartridge slot. The first cartridge slot is located on a first side of the circuit board. The second cartridge slot is located on a second side of the circuit board. Through mounting the cartridge slots to both sides of the circuit board, utilization space for circuit board design can be increased. Also, both sides of the circuit board can function as heat-dissipating space for facilitating steady operation of circuits and elements located on the circuit board.

Abstract: One aspect of the present invention is an optical data link. The optical data link comprises a housing, first and second optical communication subassemblies, first and second substrates, and electronic components. The housing has a base portion which extends along a reference plane. The first and second optical communication subassemblies are contained in the housing. The first and second substrates are contained in the housing. The electronic components are electrically connected with the first optical communication subassembly, and are mounted on the first substrate. The electronic components are also electrically connected with the second optical communication subassembly and are mounted on the second substrate. The first substrate is inclined at a first angle with respect to another reference plane orthogonal to the first reference plane.

Abstract: An emblem that is located within a recess of a cover. The cover may be part of a cartridge which also contains a number of integrated circuit packages that are mounted to a printed circuit board. The emblem is typically attached to the cover by an adhesive. The recess reduces the likelihood of the emblem being removed from the cover. The emblem preferably contains a hologram which can identify a type of cartridge produced by a manufacturer.

Abstract: A system and method for converting alternating current into direct current are disclosed. The system and method allow an electronic device to employ an AC adapter while limiting the sacrificing of valuable component space and minimizing the risk of component harm resulting from the AC adapter's operation. A system incorporating teachings of the present disclosure may include an electronic device containing at least one electronic component designed to operate on direct current. The system may also include a stand coupled to the electronic device and supporting the electronic device in a viewable orientation. Within the stand may be located an alternating current adapter that is conductively coupled to the at least one electronic component.

Abstract: A high frequency signal switching unit includes a printed circuit board accommodated in the casing and having a ground layer formed on substantially one entire surface thereof. Input and output terminals are mounted on the casing, and a high frequency relay is mounted on the printed circuit board for switching between the input terminal and the output terminal. The high frequency relay has a plurality of relay contact terminals and a grounding terminal. A plurality of coaxial cables having respective internal and external conductors connect the input and output terminals to the relay contact terminals. The grounding terminal of the high frequency relay and the external conductors of the coaxial cables are connected to the ground layer of the printed circuit board, while each of the internal conductors of the coaxial cables is connected to one of the relay contact terminals of the high frequency relay.

Abstract: An optoelectronic transceiver module assembly includes an optoelectronic transceiver module, and a metal cage encasing the optoelectronic transceiver module therein. The transceiver module includes a connector housing (1), a PCB (2) and a support base (3). The connector housing is adapted for engaging a complementary electrical or optical connector. The PCB is engaged in guide grooves (151) of the connector housing. Block tags (153) formed in the guide grooves firmly retain the PCB. The support base is attached to the PCB with screws, and accommodates and supports the PCB. The cage comprises a top frame (4) and a bottom plate (5). The bottom plate is fittingly attached to the connector housing and to the support base. Locking tabs (419, 421, 423) of the top frame engagingly retain the connector housing. Engaging tabs (523) of the bottom plate are engaged in sockets (413) of the top frame.

Abstract: An integrated circuit device module comprises a printed circuit board having opposed sides, the printed circuit board comprising a portion carrying an area contact array on one of the sides of the printed circuit board. The module comprises an integrated circuit device having opposed, top and bottom surfaces, the bottom surface of the integrated circuit device comprising an area contact array for electrical communication with the area contact array on the printed circuit board.

Abstract: A packaging and interconnection for connecting a contact structure to an outer component. The packaging and interconnection is formed of a contact structure mounted on a contact substrate, a contact trace formed on the contact substrate and electrically connected to the contact structure at one end and provided with a contact pad at another end, a print circuit board (PBS) pad provided on a PCB board substrate, a conductive lead for electrically connecting an upper surface of the contact pad and the connector, an elastomer provided under contact substrate, and a support structure provided between the contact structure, contact substrate and elastomer. The contact structure is projected from the contact substrate to a free space to allow free movements of at least a horizontal portion and a contact portion thereof.

Abstract: A stackable FBGA package is configured such that conductive elements are placed along the outside perimeter of an integrated circuit (IC) device mounted to the FBGA. The conductive elements also are of sufficient size so that they extend beyond the bottom or top surface of the IC device, including the wiring interconnect and encapsulate material, as the conductive elements make contact with the FBGA positioned below or above to form a stack. The IC device, such as a memory chip, is mounted upon a first surface of a printed circuit board substrate forming part of the FBGA. Lead wires are used to attach the IC device to the printed board substrate and encapsulant is used to contain the IC device and wires within and below the matrix and profile of the conductive elements.

Abstract: A tool used in manufacturing circuit board holders from sheets of material has a working face for forming embossments on the sheets by repetitively striking the sheets therewith. The working face includes an H-shaped formation for forming two separate halves of an embossment on the sheet of material with one strike, of which, of the two separate halves, one is delimited by the upper parallel lines of the H and the other is delimited by the lower parallel lines of the H.

Abstract: An integrated circuit device module comprises a printed circuit board having opposed sides, the printed circuit board comprising a portion carrying an area contact array on one of the sides of the printed circuit board. The module comprises an integrated circuit device having opposed, top and bottom surfaces, the bottom surface of the integrated circuit device comprising an area contact array for electrical communication with the area contact array on the printed circuit board.

Abstract: A surface mount type electronic component includes a substantially rectangular case substrate, an electronic element mounted on the case substrate along the longitudinal direction, and a cap which is fixed onto the case substrate in such a manner as to cover the electronic element. First and second top-surface electrodes and first and second bottom-surface electrodes, which extend along the width direction of the case substrate, are arranged with a spacing on the top surface and the bottom surface of the case substrate, respectively. The first top-surface electrode and the first bottom-surface electrode are connected to each other via a first side electrode disposed on the side surface of the case substrate, and the second top-surface electrode and the second bottom-surface electrode are connected to each other via a second side electrode disposed on the side surface of the case substrate.

Abstract: A packaging and interconnection for connecting a contact structure to an outer peripheral component. The packaging and interconnection is formed of a contact structure mounted on a contact substrate, a contact trace formed on the contact substrate and electrically connected to the contact structure at one end and provided with a contact pad at another end, a connector for establishing electrical connection with the contact pad on the contact trace, a conductive lead for electrically connecting an upper surface of the contact pad and the connector, an elastomer provided under said contact substrate, and a support structure provided between the elastomer and the PCB substrate for supporting the contact structure, contact substrate and elastomer. The contact structure is projected from the contact substrate to a free space to allow free movements of at least a horizontal portion and a contact portion thereof.

Abstract: A memory module preferably includes a printed circuit board (PCB) panel having multiple memory chip pad groups arranged on both sides thereof. Each memory chip pad group preferably includes multiple pads that correspond to lead lines of multiple memory chips arranged on the PCB panel. Connectors are preferably formed along an edge of the PCB panel to electrically connect the memory chip pad groups to an external device. Multiple damping chip pad groups preferably include built-in damping chips. One or more of the damping chip pad groups are preferably arranged adjacent to a lateral edge of one or more of the memory chips. The damping chip pad groups can electrically connect the connectors to the memory chip pad groups and dampen the signal noises.

Abstract: Electronic device including a housing for receiving chipcards having electrical connection elements which are situated on at least one of their lateral faces, said electronic device including: chipcard holding means arranged to keep these cards each in a predetermined position and orientation with respect to one another, means of electrical connection with each of the electrical connection elements of a card, which means of electrical connection are arranged to cooperate with the electrical connection elements of a card positioned in the housing, and means of controlling the functions of the different cards placed in the housing through the expedient of electrical connections established between the means of electrical connection.

Abstract: Apparatus and methods for connecting a device to an integrated circuit. The apparatus includes an insulating substrate that has two major sides and a number of sites for housing components. Each site has a first node on one of the two sides of the insulating substrate and a second node on the other of the two sides of the insulating substrate. Each site also has components that are aligned normal to the sides of the insulating substrate and are connected to the nodes at the site. Such apparatus are useful as adapters for testing an integrated circuit, such as connecting a test device to the integrated circuit with the adapter and observing and/or driving signals through the adapter.

Abstract: Electronic device with a housing 1, a rear wall 7 and, accommodated in the housing, at least one printed circuit board 10 which stands essentially perpendicular to the rear wall, wherein the rear wall 7 is a part independent of the housing 1, which closes off the interior of the housing to the rear, and the printed circuit board 10 is connected in a bearing manner to the rear wall by holding means 13, 15 protruding from this and engaging with the printed circuit board.

Abstract: In an information processing apparatus, a transmission distortion of a signal transmitted between a module and a controller is reduced. A plurality of modules and a controller controlling the modules are mounted on a circuit board. A bus line connects the controller to the modules, the bus line including a main line and a plurality of branch lines each of which is branched from the main line and is connected to a respective one of the modules. Impedance matching elements are provided to the main line of the bus line so as to match a characteristic impedance between the controller and each of the modules. Each of the impedance matching elements is located behind a branch point of one of the branch lines connected to the respective one of the modules with respect to the controller.

Abstract: In a computer system two integrated circuit devices are operatively mounted on the main system board using a pair of interstitial circuit boards sandwiched between the integrated circuit devices and the system board and having substantially smaller footprints than the system board. Each interstitial board has a series of terminating components, representatively resistors, interposed in its circuitry which interconnects the associated integrated circuit board with system board circuitry that, in turn, operatively couples the two integrated circuit boards. The incorporation of the terminating components in the interstitial boards instead of in the system board reduces the circuit complexity of the system board and the required number of layers therein, thereby reducing the cost of the system board and substantially simplifying its signal trace routing design.

Abstract: An electronic control unit (ECU) includes a flexible circuit substrate having a first partition interconnected to a third partition by a second, flexible partition. The electronic control unit further includes a rigidizer having a first partition interconnected to a third partition by a second partition. When the ECU is twice folded, the second, flexible partition of the circuit substrate assumes an approximate ‘U’-shape, resulting in a reduced cracking and splitting rate than the prior art. In various embodiments of the present invention, the assumption of a ‘U’-shaped fold in the second, flexible partition of the circuit substrate is facilitated by multiple apertures in a second rigidizer partition, by a depression in a second rigidizer partition, or by non-slidably affixing a first circuit substrate partition to a first rigidizer partition via a first adhesive and non-slidably affixing a third circuit substrate partition to a third rigidizer partition via a second adhesive.

Abstract: A power module that houses components of a circuit for driving a three-phase motor. The power module includes a molded shell. A number of leads are embedded within the body of the power shell and extend from its exterior where they make electrical connection to exterior devices to a chamber within the molded shell where they are connected to respective components of the circuit. The power module includes capacitor leads, which are embedded in the molded shell, for making direct connection to respective bus capacitors, thereby allowing the capacitors to be directly assembled onto the power shell and become part of the power module. The leads embedded within the molded shell are arranged so that they pass over one another within the body of the molded shell. At least one of the leads has a portion within the chamber which acts as bridge to allow the passage of conductors.

Abstract: This improved surface mount power supply can withstand the rigors of the manufacturing process and still create sturdy and robust connection to a user's circuit card. The open frame power module uses a U-shaped or T-shaped interconnect rather than a spherical interconnect. In one embodiment, the U-shaped interconnect can have a hole through one surface to allow the wicking of solder. The wicked solder provides a sturdier connection that is more likely to survive subsequent reflow processes. The power module is also built on a thicker FR4 board. The thicker board is less likely to warp during subsequent heating.

Abstract: A transceiver module which is easily and conveniently assembled, and which is reliable. The transceiver module comprises a housing, an optoelectronic subassembly, a receptacle, a chassis and a PCB. The optoelectronic subassembly is received in the receptacle. Conductive leads of the optoelectronic subassembly are soldered to the PCB. The chassis is attached to the PCB with screws, and accommodates and protects the PCB. The housing comprises a top housing and a bottom housing. The top housing is attached to the chassis and the receptacle. The top housing and bottom housings are attached together, enclosing therein the receptacle, the chassis and the PCB.

Abstract: The present invention is an interposer for electrically coupling a microcard with a mother board. The interposer includes a frame which is interposed between the microcard and the motherboard, electrically connecting the microcard and the motherboard by means of plated via-holes. The substrate is organic and a plurality of chips are mounted on both sides of the substrate. On the opposite sides of the interposer are pluralities of metal pads which are coupled by metallized via holes, the pads in turn connected to the chips, thereby coupling chips or cards on one side of the interposer to chips or boards on the other side. Electrical connection between the chips on the top side of the substrate and the metal pads on the lower side of the substrate is provided by the metallized via holes.

Abstract: A method and assembly for mounting printed circuit boards (PCBs) to a chassis. In one embodiment, a plurality of internally-threaded mounting posts are secured (e.g., press-fit) to the chassis and the PCB includes a plurality of holes into which the mounting posts extend. Each hole includes a pair of keepout pads to isolate internal PCB circuitry (other than ground planes) from electric contact with the assembly components. A threaded faster is used to secure the assembly. In another embodiment, a collar is added to the assembly and the extending portion of the post is elongated such that it extends into the collar, providing additional thread engagement for thinner PCBs. In a third embodiment, hat-section components are secured (e.g., via wave soldering) over respective holes in the PCB. The hat-section component includes a counterbore through which the threaded fastener passes and is sized to receive a portion of a threaded standoff.

Abstract: A module (10) for use with a smart card (50) is disclosed. The module (10) includes a substrate (14) having a first side (16) and a second side (18). The first and second sides each have deposited thereon a metallic layer (19, 21), with the substrate (14) having a thickness of about 125 microns. A die (22) is mounted adjacent the substrate first side (16), with the die (22) being coupled to the substrate first side (16) by a plurality of wire leads (24). A protective coating (26) covers the die (22), with the module having a total thickness of about 525 microns.

Abstract: Disclosed is a novel deformation-resistant structure of a portable device, capable of reducing an electric failure by decreasing a distortion which occurs in a soldered portion between a printed circuit board of the portable device and an electric part mounted on the board due to a mechanical stress such as drop or pressure. Through slits are formed in positions in a printed wiring plate, which correspond to bosses having prepared holes disposed at the corners of a casing. By inserting screws into the prepared holes through the through slits, the printed circuit board is mounted in the casing. Although the casing is deformed when an external mechanical stress is applied to the casing, the screw and the boss can slide along each of the through slits. Thus, a deformation amount of the printed circuit board is not caused or becomes smaller than that of the casing.

Abstract: A high density vertical surface mount package and thermal carrier therefor including a heat sink.

Abstract: A communication device which is constructed so as to permit efficient mounting of cards such as printed boards, thereby enhancing convenience and economy and ensuring high-quality communications. A basic unit is constituted by a basic board having a common control section packaged thereon, and a basic back wiring board on which are arranged a basic card connector for mounting a detachable card unit for processing signals and a basic link connector for additionally connecting such a card unit and which has wiring formed on a substrate thereof. An extension unit is connected to the basic link connector to permit additional connection of the card unit.

Abstract: An optical interface arrangement includes a tile carrying an optical component which is mounted substantially at right angles to a closely adjacent circuit board which carries an electrical circuit. The circuit board has an electrically conductive track extending to an edge of the board adjacent to an edge of the tile. The edge surface of the tile has a localized recess carrying an electrically conductive material which extends across the thickness of the tile and along a major surface of the tile to connect with the optical component. A short bondwire is provided which links the electrically conductive material in the recess to the adjacent electrically conductive track on the circuit board.

Abstract: An electrical jack system is operable with an electrical plug, such as an RJ-type plug. In one embodiment, the electrical plug is at least partially translucent. The jack system includes a housing bounding a socket. The socket is configured to receive the electrical plug. A light source is coupled with the housing so as to selectively illuminate the socket and/or the translucent electrical plug when the translucent electrical plug is received within the socket of the housing. In one embodiment, the light source is a light emitter, such as an LED, mounted on the housing so as to be at least partially exposed to the socket of the housing. In an alternative embodiment, an opening is formed on the housing in communication with the socket. A light emitter is disposed a distance from the opening on the housing. A conduit extends between the light emitter and the opening. The conduit, such as a light pipe, is configured to channel light from the light emitter to the opening on the housing.

Abstract: A transceiver module which is easily and conveniently assembled, and which is reliable. The transceiver module comprises a housing, an optoelectronic subassembly, a receptacle, a chassis and a PCB. The optoelectronic subassembly is received in the receptacle. Conductive leads of the optoelectronic subassembly are soldered to the PCB. The chassis is attached to the PCB with screws, and accommodates and protects the PCB. The housing comprises a top housing and a bottom housing. The top housing is attached to the chassis and the receptacle. The top housing and bottom housings are attached together, enclosing therein the receptacle, the chassis and the PCB.

Abstract: A card-type peripheral device with a connector element, the device comprising the function of shielding contacts when the device is not in use. The device comprises a circuit board, a connector element including a plurality of contacts for connecting a circuit board to an intended apparatus, and a hollow card-type housing having openings for exposing an contact portion on the intended apparatus side of each contact. The housing contains the circuit board fixedly, and the connector element movably, therein. The connector element has a slide knob, and by moving the slide knob within a slide knob opening, can assume two states including an open state in which the contact portions are exposed from the openings and connectable with the terminals of the intended apparatus and a closed state in which the contact portions are contained in the housing and protected from external dust and dirt, etc.

Abstract: A printed circuit board (PCB) includes a first layer having first and second surfaces, with an above-board device mounted thereon. The PCB includes a second layer having third and fourth surfaces. One of the surfaces can include a recessed portion for securedly holding an interstitial component. A via, electrically connecting the PCB layers, is also coupled to a lead of the interstitial component.

Abstract: In an electronic device, a board connection structure of the present invention is provided, that electrically connects conductive parts of multiple circuit boards arranged in layers. The board connection structure reduces the positional displacement of the two circuit boards without considering the positioning precision of connectors provided on each circuit board. The board connection structure of the present invention is a board connection structure 1 which connects electrically conductive parts (13, 23) of two circuit boards (11, 21) arranged in layers. The board connection structure has a pair of connectors (31, 41) which have electrical continuity with the conductive parts (13, 23) of the two circuit boards (11, 21) arranged facing each other, and a flexible wiring board 51 which is electrically connected with each of the pair of connectors (31, 41) and ensures electrical continuity between the connectors (31, 41).

Abstract: A low cost radio frequency interference filter assembly comprises a multiple layer structure including a middle trace layer disposed between an upper ground layer and lower ground layer. Non-conductive insulation layers are disposed between the middle trace layer and the upper and lower ground layers. The upper layer includes input contacts, signal contacts, and capacitors which are coupled to the signal contacts and an upper grounded substrate. The middle trace layer includes a grounded substrate and trace lines which are coupled to the signal contacts of the upper layer by signal vias. The lower layer includes a grounded substrate. Ground vias are formed through the insulation layers to couple the middle grounded substrate to the upper and lower grounded substrates. The filter assembly may be formed as an integral projection of a printed circuit board assembly.

Abstract: In an electronic control unit for controlling operation of various devices, a circuit board carrying electronic components thereon and a connector for connecting the control unit to outside devices are electrically connected through a flexible printed-circuit sheet. A casing of the control unit is designed to contain therein a circuit board selected from variously sized circuit boards. The circuit board may be functionally divided into a certain number of circuit boards. Some varieties of each functionally divided circuit board are prepared, and circuit boards meeting a particular requirement are selected from the varieties and used in a control unit. Thus, the electronic control units meeting various requirements are efficiently and economically manufactured.

Abstract: A connector of a modular machine board disposed on an inner edge of a back board of a display apparatus of an electronic device contacts with joint points of the electronic device, such that metal resilient pieces of said connector are assured to tightly contact with said joint points by means of the resilience of resilient component. As a result, even under vibration, the resilient component can regulate the up-and-down position of said connector along with vibration force to enable the metal resilient pieces to maintain a tight contact at the joint points of the electronic device.

Abstract: An improved electrical interconnection between a first circuit board and a second circuit board is provided. In one embodiment, the first circuit board has a substantially rigid circuit portion having a plurality of circuit layers, including a first signal layer, and a first interconnection portion, including the first signal layer, for mating with a second interconnection portion of the second circuit board. The first circuit board also includes a flexible portion, including the first signal layer, for connecting the substantially rigid circuit portion to the first interconnection portion. The flexible portion allows the first interconnection portion to be oriented substantially perpendicular to the substantially rigid circuit portion such that a mating of the first interconnection portion with the second interconnection portion results in a substantially orthogonal electrical interconnection arrangement between the first circuit board and the second circuit board.