Abstract: IC CHIP MOUNTING STRUCTURE has IC chips having protruding electrodes, a flexible printed circuit board having conductors connected to the protruding electrodes of the IC chips, and a protective plate attached to the flexible printed circuit board. The protective plate has openings to accommodate the driver IC chips. A resin member having a high heat conductivity is arranged in the opening in contact with the surface of the IC chip. The IC chip mounting structure can be attached to a chassis of a plasma display device so that heat generated by the driver IC chip is transferred to the chassis via the heat conductive resin member.

Abstract: The present invention is directed towards a multilayered circuit module and a method for constructing such a module, wherein the module has passive components such as capacitors, inductors, transformers distributed into a ceramic substrate. This module provides an optimally close packing density of these components without wasting large areas of unused substrate. The module of the present invention weaves capacitors, inductors, and transformers into the substrate without the use of printed circuit boards and eliminating discrete components. The substrate of the module becomes a functional component itself, rather than just a block receptacle for discrete components. The module of the present invention provides a very densely packed power supply with good heat conduction properties and which is also less costly to build than HDI modules.

Abstract: A trace array on a print d wiring board for optimally controlling an impedance of differential signal lines is provided.

Abstract: Disclosed in a power semiconductor module which includes a stack of carrier substrates, disposed one above the other in multiple layers and provided with at least one conductor track on at least one main surface, in which at least one electronic semiconductor component is disposed between two adjacent carrier substrates of the stack and is contacted electrically and heat-conductively to at least one conductor track of a carrier substrate disposed in the stack above the semiconductor component and to at least one further conductor track of a carrier substrate disposed in the stack below the semiconductor component. To both improve heat output and provide a compact design, the two outer carrier substrates of the stack are embodied as one upper and one lower housing wall of a closed housing part surrounding the at least one semiconductor component, and the interstices between the stacked carrier substrates are tightly closed by an encompassing wall secured to the carrier substrates.

Abstract: A stacked multi-chip package includes first chip with conductive pads on both front and back sides. The front side may include a polymer layer with interconnect. A first polymer layer formed on the backside of the first chip has a cutout to receive a second chip. The first and second chip may be joined as a flip chip. A second polymer layer formed on the first polymer layer has a cutout to receive a third chip. A third polymer layer formed on the second polymer layer contains interconnect to interconnect the first, second and third chips, including the backside of the first chip. Conductive bumps on the front side of the first chip and on the polymer layers provide external I/O connection.

Abstract: An integrated high-speed package comprising a package housing having a housing lip and connector having a center pin abutting along a bottom surface of the housing lip. For signal registration of a first substrate to the signal lead, the substrate is “floated” up to the housing lip, which provides an alignment reference to ensure that the top surface of the first substrate is aligned and in direct registration with the signal lead. In another embodiment, the center pin to substrate registration is provided at a top surface of a housing base. The housing base preferably comprises a first portion of a first height and a second portion of a second height. Accordingly, the housing base can accommodate substrates of different thickness while allowing a top surface of the first and a second substrate to be coplanar to facilitate signal registration there between.

Abstract: The connecting pin structure for a transformer core includes an insulating main body having a plurality of recesses therein at its bottom; a plurality of connecting pins installed in the plurality of recesses therein at the bottom of the insulating main body; and at least one coil secured on the insulating main body, the coil has terminal wirings respectively being connected to the connecting pins. The occupied laterally expanded dimension on a printed circuit board (PCB) of the connecting pins is reduced. Further, the L-shaped connecting pins are easy to assembly.

Abstract: This disclosure describes use of dielectric islands embedded in metallized regions of a semiconductor device. The islands are formed in a cavity of a dielectric layer, as upright pillars attached at their base to an underlying dielectric. The islands break up the metal-dielectric interface and thus resist delamination of metal at this interface. The top of each island pillar is recessed from the cavity entrance by a selected vertical distance. This distance may be varied within certain ranges, to place the island tops in optimal positions below the top surface plane of the dielectric. Metallization introduced into the cavity containing the islands, submerges the island tops to at least a minimum distance to provide a needed minimum thickness of continuous metal. The continuous metal surface serves favorably as a last metal layer for attaching solder or for bump-bonding package to the IC; and also serves as an intermediate test or probe pad in an interior layer.

Abstract: An apparatus for processing flexible tape for microelectronic assemblies includes a base having a top surface, a bottom surface and an aperture extending between the top and bottom surfaces, and a platform having a top surface for engaging a flexible tape used for making microelectronic assemblies, such as semiconductor chip packages. The platform is sized to fit within the aperture extending between the top and bottom surfaces of the base. The base is pivotally secured at one end of the platform so that when the base pivots with respect to the platform, the flexible tape engaged by the platform remains on the platform. The assembly also includes a carrier frame having a slot and a clamp sized to pass through the slot and the carrier frame and the aperture in the base for securing the flexible tape to the top surface of the platform as the base pivots with respect to the platform.

Abstract: An apparatus for separating and extracting printed circuit boards in a computer system. More specifically, a basket assembly is provided through which a number of printed circuit boards may be attached to a motherboard. A card divider and extractor assembly including a card divider and card extractor is coupled to the basket assembly between each of the printed circuit boards. The card dividers provide structural and electrical isolation between the printed circuit boards. The card extractors provide a mechanism whereby printed circuit boards can be easily removed from the system while the system is operational.

Abstract: A protected electronic assembly is provided that includes an electronic device, an outer shell, and an inner layer. The outer shell is preferably made from a rigid polymeric material, located over the electronic device, and adapted to protect the electronic device from an environment. The inner layer is preferably made from a resilient polymeric material, located between the electronic device and the outer shell, and adapted to cushion the electronic device from mechanical shock. A method of making the protected electronic assembly is also provided that includes providing an electronic device, disposing a resilient polymeric material as an inner layer around the electronic device to cushion the electronic device, and injection molding a rigid polymeric material as an outer shell around the resilient polymeric material to protect the electronic device.

Abstract: A latching apparatus has a guide member, a circuit board attachment member which is configured to attach to a circuit board, and a control assembly. The control assembly is configured to (i) retain the circuit board attachment member within a retaining range of the guide member when the guide member is unlocked from a receptacle member, and (ii) un-restrict the circuit board attachment member such that the circuit board attachment member is movable outside of the retaining range of the guide member when the guide member is locked with the receptacle member.

Abstract: The specification describes a multi-chip IC package in which IC chips are flip-chip bonded to both sides of a flexible substrate. The upper (or lower) surface of the flexible substrate is bonded to a rigid support substrate with openings in the support substrate to accommodate the IC chips bonded to the upper (or lower) surface of the flexible substrate. In a preferred embodiment a plurality of IC memory chips are mounted on one side of the flexible substrate and one or more logic chips to the other. A very thin flexible substrate is used to optimize the length of through hole interconnections between the memory and logic devices. If logic chips are flip-chip mounted in the cavity formed by the openings, a heat sink plate can be used to both cap the cavity and make effective thermal contact the backside of the logic chips.

Abstract: A method of producing high-frequency modules at a higher efficiency is provided comprising: an electronic components mounting step 62 of fabricating on a master substrate 21 rows of sub substrates 22, each the sub substrate 22 having an identical pattern of circuit developed thereon, and mounting electronic components on the sub substrate 22; a step 64 of, after the step 62, providing slits for electrically isolating signal terminals formed integrally; a laser trimming step 66 of, after the step 64, engaging pins 39 of an inspection tooling in direct contact with the signal terminals to conduct an inspection; and a separating step 72 of, after the step 66, separating the sub substrates 22 from the master substrate 21. Accordingly, the productivity for the high-frequency modules will be improved.

Abstract: A high frequency signal switching unit includes a printed circuit board accommodated in the casing and having a ground layer formed on substantially one entire surface thereof. Input and output terminals are mounted on the casing, and a high frequency relay is mounted on the printed circuit board for switching between the input terminal and the output terminal. The high frequency relay has a plurality of relay contact terminals and a grounding terminal. A plurality of coaxial cables having respective internal and external conductors connect the input and output terminals to the relay contact terminals. The grounding terminal of the high frequency relay and the external conductors of the coaxial cables are connected to the ground layer of the printed circuit board, while each of the internal conductors of the coaxial cables is connected to one of the relay contact terminals of the high frequency relay.

Abstract: A multilayer circuit board includes a base layer, a conductive layer and a soldermask. The soldermask layer has two sets of openings. One of the openings are vent openings, that expose the base layer to provide ventilation so that gases may escape during processing. The second openings expose selective regions of a conductor layer. The multi-layer circuit board provides for less occurrences of delamination.

Abstract: A card-type peripheral device including a circuit board having a ground conductor, a conductive frame for supporting the circuit board, and a conductive panel attached to the conductive frame and cooperating with the conductive frame to surround the circuit board. The conductive frame includes a frame section having an exposed surface portion, a first contact section formed integrally with the frame section and making an electrically conductive contact with the ground conductor of the circuit board, and a second contact section formed integrally with the frame section and making an electrically conductive contact with the conductive panel. The first contact section preferably exhibits a spring action so as to establish a good electrically conductive connection between the frame section of the conductive frame and the ground conductor of the circuit board.

Abstract: A modular and user configurable PC Card which removably receives one or more add-in modules that provide selected functionality. The user inserts and removes selected modules in the PC Card to configure the PC Card to the desired functionality. The PC Card includes one or more slots for receiving PC Card modules. PC Card slot openings are located on the narrow back end of the PC Card opposite the PCMCIA adapter, or alternatively are located on the wide end of the PC Card. In the preferred embodiment, the PC Card includes an internal module connector having connectors on either side. The PC Card modules are removably inserted into one of the one or more slots and connect to the module connector contacts on the module connector within the PC Card. In one embodiment, the PC Card includes a rotating cam which is turned to connect the module connector contacts on the module connector within the PC Card to the contacts on the removable PC Card module.

Abstract: The invention relates to a module unit for memory modules and to a method for producing the module unit. A module unit of this type has at least one main module and submodules. The modules are arranged in a star-shaped manner and are arranged radially with their inner contact strips in slots of a central plug connector. The module unit has a substantially cylindrical housing, from which an outer contact strip of the main module protrudes.

Abstract: An assembly for use in providing EMI shielding for a circuit card. The assembly comprises a circuit card; a fastener; and, a shielding apparatus. The shielding apparatus comprises: a body providing EMI shielding and includes an attaching portion extending therefrom, wherein the attaching portion has a segment at a proximal end portion thereof which blocks an opening in the body for controlling EMI leakage and positions the attaching portion so that a fastener can fasten the attaching portion to a circuit card such that a first fastener end portion is engageable in juxtaposed relationship with a first card surface and a second fastener end portion terminates so as not to extend generally beyond a predetermined distance from a second card surface of the card.

Abstract: An electronic controller unit is formed of first and second base plates parallel to one another and spaced apart having a flexible substrate circuit board thereon with an intermediate portion of the circuit board extending between the two base plates. A connector is joined to the intermediate portion of the circuit board between the two base plates and is sealed to an edge of each base plate to form one side of the unit housing. A three-sided frame is joined to the other three sides of the two base plates to completely enclose the circuit board. The two major sides of the unit are formed by separate base plate pieces that are severed from an integral frame after the flexible circuit is bonded thereto. This allows the unit to be manufactured without bending of a rigid plate having the flexible circuit mounted thereto.

Abstract: A power distribution cabinet for containing electrical components and associated circuitry includes a panel adapted to provide an interface for the distribution of power from a high voltage source to low voltage applications. The panel includes several outlet receptacle housings, wherein the housings are each L-shaped and disposed contiguously in a vertical series on the front of the cabinet each at a 45-degree angle. Collateral damage to the power distribution center can be minimized wherein a damaged single housing can be replaced without disturbing the remaining housings or outlet receptacles, thereby maintaining the operability of the power distribution center. The housings each comprise several weep slots disposed at the hydraulically lowest point of each of the housings so that condensation that forms on an inner surface of the housing is collected and drained through the weep slots thereby preventing any moisture damage to the interior circuitry and electrical components.

Abstract: A chip component assembly is provided that includes a plurality of chip components each having respective first and second terminal elements, the first terminal elements being joined to corresponding solder pads on a printed circuit board, the solder pads being in communication with electronic circuitry of the printed circuit board, and the second terminal elements being joined together by an array ground plane of a grounding device. The grounding device additionally includes a ground path structure which physically and electrically connects the array ground plane, and thus the chip components, to a ground pad located on the printed circuit board so as to provide a ground path from the chip components. Preferably, the array ground plane additionally includes a plurality of resilient contact elements which provide for substantial and continuous contact between the array ground plane and an ancillary ground plane, such as the top cover of a PC card.

Abstract: An enhanced electronic card structure includes a circuit board, a top cover board, and a bottom cover board. The circuit board has multiple front front and rear contact points. At least one fixing hole is defined between any two adjacent front contact points. The top cover board has a front edge defined therein multiple gaps, each aligned with one front contact point and corresponding rear contact point. Any two adjacent gaps are separated by a rib, each rib having a bottom face extended thereform a fixing tip aligned with the fixing hole. The bottom cover board has a surface formed thereon multiple fixing joints, each aligned with one fixing tip at the bottom of the rib, so as to make the fixing tip pass through the corresponding fixing hole to be fixed to the corresponding fixing joint.

Abstract: A multi-layer printed circuit board (PCB) has a plated through hole for receiving a pin of a component. The plated through hole passes through all layers of the PCB and includes a first conductive portion on a first surface of the PCB and a second conductive portion on a second surface of the PCB. At least one layer of the PCB includes a planar conductive material disposed over a planar insulating material. The conductive material surrounds the plated through hole and is separated therefrom by a gap.

Abstract: A method for determining a wiring pattern of a signal line for connection of a circuit on a multi-layer printed wiring board includes the steps of providing a constraint of an electrical length which the signal line must satisfy, determining an electrical length change at a discontinuous delay part of the signal line along which a signal propagates, determining a wiring route of the signal line, calculating an electrical length of the signal line with use of a wiring length of the signal line and the determined electrical length change, judging whether or not the calculated electrical length satisfies the electrical length constraint given to the signal line, and determining the wiring route as a wiring pattern when the electrical length constraint is satisfied as the decision result, thereby carrying out a wiring layout to make an electrical length constraint satisfied.

Abstract: A layout structure of electrode lead wires for organic light-emitting diode (OLED) display is provided for saving materials, simplifying fabrication process, and reducing power consumption so as to lower down the required driving voltage. The display comprises a plurality of cathode and anode electrodes and a plurality of electrode lead wires connected to the cathode electrodes and the anode electrodes respectively. The cathode and the anode lead wires made of a multi-layer metallic material having high conductivity and low impedance are laid on the same side of the transparent substrate.

Abstract: A frame kit for an IC card including a frame for defining an internal space of an IC card, a first panel integrated with the frame and having a first locking member which projects toward the internal space from an inner wall of the frame, and a second panel having a second locking member which is engageable with the first locking member of the first panel inside the frame. The first panel is integrated with the frame by simultaneous molding, for example. The second locking member is preferably composed of an elastic member.

Abstract: A casing for an electronic control unit is composed of an upper case having a bottom opening and a bottom plate closing the bottom opening. The upper case is so formed that plural upper cases are easily stacked up and picked up one by one by an automated vacuum sucker. The sidewalls of the upper case facing each other are slanted, and a fringe portion is formed at a bottom end of each slanted sidewall. A U-shaped portion or a protrusion is formed on the fringe portion to prevent the upper case from sticking to another upper case when plural upper cases are vertically stacked up.

Abstract: A part having a large height contained in a module part is placed in a first cut-off portion formed in a part-mounting substrate to be mounted. Moreover, the module part itself is placed in a second cut-off portion formed in a mother board to be mounted.

Abstract: A housing for a control device in vehicles is provided. The housing satisfies the requirements of acceleration transmission and reliable ground connection with a simple and inexpensive construction. The housing comprises a metallic shell that has parallel top and bottom walls, opposed side walls interconnecting the top and bottom walls and an open front face. A shaped carrier structure has a pair of opposed lateral edges. Both side walls of the shell have an internal groove extending parallel to and spaced from the bottom wall of the shell. The carrier structure is accommodated within the shell and has its lateral edges fitted in the grooves of the side walls.

Abstract: A high-frequency module has a signal electrode provided on a cut side thereof and arranged to produce no burrs. The module includes a substantially four-sided substrate, a recess at the cut side of the substrate, and a signal electrode at the recess. The signal electrode is isolated from the cut side by an absent distance.

Abstract: A power providing device that has a battery, a protective housing a terminal cap, and a fuse on a substrate.

Abstract: Portable memory storage cards can be stacked together in a receiver that also serves as a player, allowing for compact and efficient storage and usage of those cards. The portable memory storage cards have at least one contact on both sides, positioned such that the cards are reversible. A receiver for the cards also serves as the player. A set of contacts is provided at one end of a storage cavity, into which an arbitrarily large number of cards may be stacked together, such that their contacts touch to form a bus. The stacked cards are biased against the set of contacts to establish physical contact between the set of contacts in the storage cavity and contacts on the adjacent card. The cards each include at least one alignment guide to restrict the motion of adjacent cards relative to one another when cards are stored in the cavity of the receiver.

Abstract: Wire bonding or printed wiring board leads or, alternatively, lead frames or equivalents thereof are used to electrically connect external electrodes of high withstand voltage capacitors formed on a plurality of semiconductor chips. A driver circuit for signal transmission or receiver circuit for signal receipt formed on the semiconductor chips are electrically connected with substrate-side electrodes of said high withstand voltage capacitors, causing the plurality of semiconductor chips to be received within either a single package or a single module. Using this arrangement, a semiconductor device is capable of achieving both dielectricity and size reduction.

Abstract: A motherboard module includes a motherboard, a backboard, and a modular mechanism. The modular mechanism for fast assembly and disassembly of a motherboard includes an upright, an upstanding structure, and a fastener. The upstanding structure is used for positioning the motherboard. Since the upstanding structure is perpendicularly attached to the back edge of the motherboard and the backboard is adhered to one surface of the upstanding structure, the fastener presses and engages the backboard so that the upright clinches the slit in the motherboard and the motherboard is thus secured.

Abstract: The invention to a distribution connection module (1) for telecommunications and data technology, comprising a housing (3) in which input and output contacts (4, 5) for the connection of cables or wires are arranged such that they are externally accessible, the housing (3) being designed with a cavity in which functional elements are arranged between the input and output contacts (4, 5).

Abstract: Via holes are formed in an electrically conductive power plane. Photo-imageable dielectric (PID) material is applied to one side of the power plane filling the via holes. The power plane side with no PID material is exposed to light energy to cure the PID material in the via holes. A developer is used to remove any uncured PID material. Signal plane assemblies comprising a conductive signal plane and a dielectric layer are laminated onto the filled power plane forming a two signal and one power plane (2S1P) structure. In another embodiment, the power plane has PID material applied from both sides. A photo-mask is applied to the power plane and the PID material in the via holes is cured with light energy. A developer is used to remove uncured PID material. Signal plane assemblies, as described above, are laminated onto the filled power plane forming a 2S1P structure.

Abstract: A circuit board includes an antenna having an extension extended from one end and secured to the circuit board and having a free end. A supporting member may be secured on the circuit board and disposed below the antenna for supporting the free end of the antenna. The extension of the antenna is preferably higher than the supporting member, for supporting the antenna member in an inclined position relative to the circuit board. The antenna preferably includes two or more legs engaged into and secured to the circuit board for solidly securing to the circuit board.

Abstract: A module connection assembly connects modules in a torus configuration that can be changed remotely. In particular, a single module can be added to or deleted from the configuration by remotely switching from conducting paths that provide end-around electrical paths to conducting paths that provide pass-through electrical paths. The assembly includes two backplanes, a first set of module connectors for electrically connecting modules to one of the backplanes, and a second set of module connectors for electrically connecting modules to the other backplane. The assembly further includes configuration controllers. Each configuration controller selects between end-around electrical paths that electrically connect multiple module connectors of the first set to each other, and pass-through electrical paths that electrically connect module connectors of the first set to module connectors of the second set.

Abstract: Circuit board having a plurality of bus lines (6), which run on the circuit board (1) essentially parallel to a preferred direction of the circuit board (1), and having at least one integrated circuit (3) for the high-speed data processing of data, which integrated circuit is arranged on the circuit board (1), is integrated in a housing (4) having a plurality of housing sides (5) and has a plurality of parallel interfaces for connection to the bus lines (6), in which case the housing sides (5) of the integrated circuits (3) are oriented at an inclination with respect to the preferred direction of the circuit board (2).

Abstract: A circuit assembly for vehicle power and electronic circuits in a printed circuit board bussed electrical center. The circuit assembly includes a stamped metal circuit with both power level terminals and solder tabs dispersed selectively along the longitudinal length of the stamped metal circuit. The solder tabs are press-fit and soldered to individual circuit board traces of a printed circuit board of the bussed electrical center. High current protective devices are directly connected to the stamped metal circuit.

Abstract: The invention relates to an electronic unit having a mounting board (4) and electronic components (1-3) mounted on it, with the mounting board (4) having metal webs (41) which are embedded in an electrically insulating material (40), the metal webs (41) having a first side (411), which is in the form of a contact surface for making contact with the electronic components (1-3) and having a second side (412) facing away from this. According to the invention, cutout(s) are arranged in the electrically insulating material (40), via which the second side (412) of each metal web (41) is accessible for a voltage or current measurement apparatus.

Abstract: The electrical junction box has a case, which accommodates a printed circuit board provided in a lower side of the case. The case also receives an electrical wiring circuit and a busbar circuit disposed in an upper side of the case so as to be parallel to the printed circuit board. Wiring harness connectors are mounted on a side wall of the case, and relay connectors are positioned on the side wall or another side wall of the case. The side walls are perpendicular to the printed circuit board. The wiring harness connectors are connected to inner circuits including the printed circuit, the busbar circuit, and the electrical wiring circuit. The case has a top cover, a bottom cover, and a horizontal intermediate partition. The intermediate partition is provided with the electrical wire circuit on an under surface of the partition so as to be opposed to the printed circuit. The upper surface of the intermediate partition is provided with the busbar circuit.

Abstract: Even after a module is assembled, each circuit element of the module can be evaluated. In addition, the whole module mounted on a substrate can be evaluated. There provided is a module including a module substrate; and a plurality of circuit elements formed on the module substrate and insulated from one another, the each circuit element being equipped with an independent function. The module achieves a function by operating the each circuit element, and the each circuit element has a terminal insulated from terminals of other circuit elements on a surface of the module substrate. A surface-mounted module further including a base substrate that has a connection wiring to electrically connect two terminals on the module surface and supplies electric power to the module, and achieving the predetermined functions by operating each circuit element connected via the wiring according to the electric power supplied from the base substrate.

Abstract: A first printed circuit board has a contact area, and a second printed circuit board has a contact area. An electrically conductive band is to couple the contact area of the first printed circuit board to the contact area of the second printed circuit board. The conductive band may be selected from the group consisting essentially of a band formed from solder, a band coupled by a weld, a band coupled by a wire bond, a band comprising conductive adhesive, a band comprising conductive film, a band comprising conductive tape, and a band comprising conductive rope. The conductive band may couple the first printed circuit board and the second printed circuit board in a substantially coplanar position.

Abstract: A multilayer ceramic electronic component includes a laminated ceramic body provided with terminal electrodes on side surfaces thereof and a cover for covering the laminated ceramic body. Ground terminal electrodes are provided in notches provided in opposed side surfaces opposing of the laminated ceramic body, a plurality of terminal electrodes is arranged in parallel in each of notches provided in the other side surfaces opposing each other. These terminal electrodes are formed by dividing terminal via hole conductors. The cover is disposed so as to cover elements mounted on the laminated ceramic body, and foot portions of the cover are disposed in the notches and are bonded to the ground terminal electrodes.

Abstract: A control unit incorporating a pressure sensor has a case body with an upper opening, incorporating a printed circuit board on which a pressure sensor and a plurality of control circuit components are mounted, and a lid to close the case body. A connector box extending outward is attached to one sidewall of the case body. The pressure sensor is disposed in the vicinity of the connector box. A first pressure passage is integrally formed with the lid, being opposed to the pressure sensor. A second pressure passage communicating with the first pressure passage is integrally formed with the lid, extending in the same direction as the connector box.

Abstract: An operating mechanism (1) includes a housing and a printed circuit board (6) having an electronic switch part disposed in the housing. A punched grid (7) has at least one punched grid plane (8) running parallel to the circuit board (6). The punched grid is electrically connected to the circuit board (6) by means of contact sections (18) bent off from the punched grid plane (8) and connected to electric components (10, 11) that are connected to the circuit board and/or punched grid. The housing has a first housing part (2) with a housing wall (21) running parallel to the circuit board (6) and the punched grid plane (8). First connecting elements (12) are electrically connectable with second contact sections (19) of the punched grid (7), and the second connecting elements (14) are electrically connectable with discrete contact elements arranged on the circuit board (6).

Abstract: An integrated circuit which has a packet router to which a plurality of functional modules are connected by respective ports is described. One of the ports acts as a socket port for an expansion socket. The expansion socket provides a plurality of additional expansion ports to which additional functional modules can optionally be connected. All the ports connected to the packet router, including the expansion socket port, preferably lie in a common address space for the integrated circuit.