Abstract: A memory cell array including a data line; a capacitor; and a transistor coupled between the data line and the capacitor. At least one of the capacitor and the transistor includes a material with a mutable electrical characteristic. A memory cell array including a first transistor coupled between a first node, a second node, and a third node; and a second transistor coupled between the second node and a fourth node. The first transistor includes a material with a mutable electrical characteristic.

Abstract: A method of operating a nonvolatile memory device includes performing a reset operation for setting a level of a program voltage to a first level, performing a program operation and a verification operation on memory cells included in a first page of a first memory block while raising the program voltage from the first level, storing a level of the program voltage, supplied to the first page when memory cells programmed to have threshold voltages with at least a verification voltage are detected during the verification operation, as a second level, while raising the program voltage from the second level, performing the program operation and the verification operation on each of second to last pages of the first memory block, and after completing the program operation for the first memory block, performing the reset operation for setting the level of the program voltage to the first level.

Abstract: Flash memory device structures and methods of manufacture thereof are disclosed. The flash memory devices are manufactured on silicon-on-insulator (SOI) substrates. Shallow trench isolation (STI) regions and the buried oxide layer of the SOI substrate are used to isolate adjacent devices from one another. The methods of manufacture require fewer lithography masks and may be implemented in stand-alone flash memory devices, embedded flash memory devices, and system on a chip (SoC) flash memory devices.

Abstract: A nonvolatile trap charge storage cell selects a logic interconnect transistor uses in programmable logic applications, such as FPGA. The nonvolatile trap charge element is an insulator located under a control gate and above an oxide on the surface of a semiconductor substrate. The preferred embodiment is an integrated device comprising a word gate portion sandwiched between two nonvolatile trap charge storage portions, wherein the integrated device is connected between a high bias, a low bias and an output. The output is formed by a diffusion connecting to the channel directly under the word gate portion. The program state of the two storage portions determines whether the high bias or the low bias is coupled to a logic interconnect transistor connected to the output diffusion.

Abstract: One embodiment of a nonvolatile memory device includes a memory cell array including a plurality of multi-level cells, and a control unit configured to determine a characteristic of data to be stored in the memory cell array. The control unit is configured to select one of plural multi-bit programming methods based on the determination. Data is stored in the memory cell array according to the selected multi-bit programming method, and at least one of the plural multi-bit programming methods maintains least significant bit data when there is a program fail of most significant bit data.

Abstract: A method for minimizing program disturb in Flash memories. To reduce program disturb in a NAND Flash memory cell string where no programming from the erased state is desired, a local boosted channel inhibit scheme is used. In the local boosted channel inhibit scheme, the selected memory cell in a NAND string where no programming is desired, is decoupled from the other cells in the NAND string. This allows the channel of the decoupled cell to be locally boosted to a voltage level sufficient for inhibiting F-N tunneling when the corresponding wordline is raised to a programming voltage. Due to the high boosting efficiency, the pass voltage applied to the gates of the remaining memory cells in the NAND string can be reduced relative to prior art schemes, thereby minimizing program disturb while allowing for random page programming.

Abstract: A memory device is disclosed. The memory device includes a charge trapping layer, and a substrate underlying the charge trapping layer. The carriers are introduced into the charge trapping layer to make a first memory state, for example, when a positive voltage is applied to the gate. At least one of the carriers is released from the charge trapping layer to make a second memory state, for example, when a negative voltage is applied to the gate.

Abstract: It is an object of the present invention to provide an involatile memory device, in which additional writing of data is possible other than in manufacturing steps and forgery and the like due to rewriting can be prevented, and a semiconductor device having the memory device. It is also an object of the present invention to provide an inexpensive involatile memory device and a semiconductor device having high reliability. According to the present invention, a memory device includes a first conductive layer, a second conductive layer, and an insulating layer interposed between the first conductive layer and the second conductive layer, where the first conductive layer has a convex portion.

Abstract: Methods for programming and sensing in a memory device, a data cache, and a memory device are disclosed. In one such method, all of the bit lines of a memory block are programmed or sensed during the same program or sense operation by alternately multiplexing the odd or even page bit lines to the dynamic data cache. The dynamic data cache is comprised of dual SDC, PDC, DDC1, and DDC2 circuits such that one set of circuits is coupled to the odd page bit lines and the other set of circuits is coupled to the even page bit lines.

Abstract: When performing a data sensing operation, including a verify operation during programming of non-volatile storage elements (or, in some cases, during a read operation after programming), a first voltage is used for unselected word lines that have been subjected to a programming operation and a second voltage is used for unselected word lines that have not been subjected to a programming operation. In some embodiments, the second voltage is lower than the first voltage.

Abstract: Selection circuitry for use in register files, multiplexers, and so forth is disclosed. The selection circuitry includes a plurality of local bit lines coupled to global bit line circuitry. Groups of cells or data inputs are coupled to each of the local bit lines. When a cell or data input of a given group is selected, a group select signal is provided to the global bit line circuitry. The global bit line circuitry drives a global bit line responsive to the group select signal and the data driven on (or provided to) the local bit line associated with the selected cell/input, thus providing a data output. When no cell of a given group is selected, the group select signal is de-asserted, causing the respective global bit line to be held in a predetermined state.

Abstract: Methods are described for improving the retention of a memory device by execution of a retention improvement procedure. The retention improvement procedure comprises a baking process of the memory device in a high temperature environment, a verifying process of the memory device that checks the logic state of memory cells, and a reprogramming process to program the memory device once again by programming memory cells in a 0-state to a high-Vt state. The baking step of placing the memory device in a high temperature environment causes a charge loss by expelling shallow trapped charges, resulting in the improvement of retention reliability.

Abstract: A method for driving a nonvolatile semiconductor memory device is provided. The nonvolatile semiconductor memory device has source/drain diffusion layers spaced from each other in a surface portion of a semiconductor substrate, a laminated insulating film formed on a channel between the source/drain diffusion layers and including a charge storage layer, and a gate electrode formed on the laminated insulating film, the nonvolatile semiconductor memory device changing its data memory state by injection of charges into the charge storage layer. The method includes, before injecting charges to change the data memory state into the charge storage layer: injecting charges having a polarity identical to that of the charges to be injected; and further injecting charges having a polarity opposite to that of the injected charges.

Abstract: A flash storage device includes flash storage units that are erased in response to a condition or command while allowing the flash storage device to be used subsequent to the erase. A flash controller interface receives a command for erasing the flash storage device and provides an erase command to flash controllers in the flash storage device. Alternatively, the flash storage device detects a condition in response to which the flash controller interface provides an erase command to the flash controllers. Each flash controller independently erases a flash storage unit in response to receiving the purge command such that the flash storage units are erased substantially in parallel with each other and the erase operations overlap. Subsequent to the erase, certain control data is reconstructed to allow subsequent use of the flash storage device.

Abstract: Provided are a semiconductor device and a methods of forming and operating the semiconductor device. The semiconductor device may include active pillars extending from a semiconductor substrate and disposed two dimensionally disposed on the semiconductor substrate, upper interconnections connecting the active pillars along one direction, lower interconnections crossing the upper interconnections and disposed between the active pillars, word lines crossing the upper interconnections and disposed between the active pillars, and data storage patterns disposed between the word lines and the active pillars.

Abstract: A system comprising a program component that programs one or more non-volatile memory (“NVM”) cells of an array of pairs of NVM cells using FN tunneling, an erase component that erases the one or more NVM cells of the array of pairs of NVM cells using FN tunneling, and a read component that reads the one or more NVM cells of the array of pairs of NVM cells.

Abstract: The programming disturb effects in a semiconductor non-volatile memory device are reduced by biasing unselected word lines of a memory block with a negative voltage followed by a positive Vpass voltage. The selected word lines are biased with a programming voltage. In one embodiment, the programming voltage is preceded by a negative voltage.

Abstract: To store a plurality of input bits, the bits are mapped to a corresponding programmed state of one or more memory cells and the cell(s) is/are programmed to that corresponding programmed state. The mapping may be many-to-one or may be an “into” generalized Gray mapping. The cell(s) is/are read to provide a read state value that is transformed into a plurality of output bits, for example by maximum likelihood decoding or by mapping the read state value into a plurality of soft bits and then decoding the soft bits.

Abstract: A first channel in the substrate underlying a trap gate is biased to cause trapping of holes or electrons in the trap gate and thereby program the memory device to a programmed state. A second channel in the substrate underlying the trap gate and transverse to the first channel is biased to sense the programmed state. For example, biasing a first channel in the substrate underlying the trap gate to cause trapping of holes or electrons in the trap gate and thereby program the memory device to a programmed state may include applying voltages to a first source/drain region and first gate on a first side of the trap gate and to a second source/drain region and a second gate on a second side of the trap gate, and biasing a second channel in the substrate underlying the trap gate and transverse to the first channel to sense the programmed state may include applying voltages to a third source/drain region on a third side of the trap gate and to a fourth source/drain region on a fourth side of the trap gate.

Abstract: A method of charging a floating gate in a nonvolatile memory cell comprises bringing a substrate channel within the memory cell to a first voltage, bringing a control gate to a programming voltage, and floating the substrate channel voltage while the control gate is at the programming voltage. Memory devices include state machines or controllers operable to perform the described method, and operation of such a state machine, memory device, and information handling system are described.

Abstract: A non-volatile VG memory array employing memory semiconductor cells capable of storing two bits of information having a non-conducting charge trapping dielectric, such as silicon nitride, layered in associating with at least one electrical insulating layer, such as an oxide, is disclosed. Bit lines of the memory array are capable of transmitting positive voltage to reach the source/drain regions of the memory cells of the array. A method that includes the hole injection erasure of the memory cells of the array that lowers the voltage threshold of the memory cells to a value lower than the initial voltage threshold of the cells is disclosed. The hole injection induced lower voltage threshold reduces the second bit effect such that the window of operation between the programmed and un-programmed voltage thresholds of the bits is widened. The programming and read steps reduce leakage current of the memory cells in the array.

Abstract: Disclosed is a method of verifying a programmed condition of a flash memory device, being comprised of: determining a level of an additional verifying voltage in response to the number of programming/erasing cycles of memory cells; conducting a verifying operation to programmed memory cells with an initial verifying voltage lower than the additional verifying voltage; and selectively conducting an additional verifying operation with the additional verifying voltage to the program-verified memory cells in response to the number of programming/erasing cycles.

Abstract: An apparatus and method of an electrically programmable and erasable non-volatile memory cell with a deep N-well to isolate the memory cell from the substrate is disclosed. In one embodiment, a non-volatile memory apparatus includes at least one non-volatile memory cell fabricated on a P substrate, with a deep N-well located in the P substrate, while a P-well and an N-well are located in the deep N-well. The memory cell further includes a PMOS transistor located in the N-well, in which the PMOS transistor includes a PMOS gate-oxide, and an NMOS capacitor located in the P-well. The NMOS capacitor includes an N+ coupling region located in the P-well, and an NMOS gate-oxide. The memory cell further includes a floating gate comprised of a poly-silicon gate overlying the PMOS transistor and the NMOS capacitor.

Abstract: Techniques for operating non-volatile storage compensate. The techniques compensate for differences in floating gate coupling effect experienced by non-volatile storage elements on different word lines. An erase of a group of non-volatile storage elements is performed. A set of the non-volatile storage elements are for storing data and at least one of the non-volatile storage elements is a dummy that is not for storing data. The dummy is a neighbor to one of the data non-volatile storage elements. The data non-volatile storage elements are programmed at some point after the erase. Then, a programming voltage is applied to the dummy non-volatile storage element to increase the threshold voltage of the dummy to cause floating gate coupling effect to the neighbor non-volatile storage element to compensate for lesser floating gate coupling effect that the neighbor experienced during programming.

Abstract: The present invention relates to a nonvolatile memory apparatus and a method of using a thin film transistor (TFT) as a nonvolatile memory by storing carriers in a body of the TFT, which operates a general TFT as a memory cell of a nonvolatile memory by manipulating the electrical characteristics of the TFT in order to integrate with other electrical components formed by TFTs, such as logic circuit or TFT-LCD pixel transistor, on the LCD panel without additional semiconductor manufacturing processes.

Abstract: Methods for programming a memory device, memory devices configured to perform the disclosed programming methods, and memory systems having a memory device configured to perform the disclosed programming methods are provided. According to at least one such method, multiple pages of memory cells are inhibited during a programming operation such that memory cells enabled for programming are separated by two or more inhibited memory cells of the same row of memory cells regardless of the intended pattern of data states to be programmed into that row of memory cells.

Abstract: A method for programming a first memory cell in a memory array. In a specific embodiment, each memory cell has a drain, a source, a channel, and a control gate overlying a charge storage material and the channel. The source of the first memory cell is coupled to the drain of a second memory cell. A voltage is applied to the drain of the first memory cell, and the source of the second memory cell is grounded. The method includes floating the drain of the second memory cell and the source of the first memory cell and turning on the channels of the first and second memory cells, effectively forming an extended channel region. Hot carriers are injected to the charge storage material of the first cell to program the first memory cell. The extended channel lowers electrical fields and reduces punch through leakage in unselected memory cells.

Abstract: An embodiment of a non-volatile memory device integrated in a chip of semiconductor material is proposed. The memory device includes a plurality of memory cells. Each memory cell includes a first well and a second well of a first type of conductivity that are formed in an insulating region of a second type of conductivity. The memory cell further includes a first, a second, and a third region of the second type of conductivity that are formed in the first well; these regions define a selection transistor of MOS type and a storage transistor of floating gate MOS type that are coupled in series. Moreover, the memory device includes a selection gate of the selection transistor, a floating gate of the storage transistor, and a control gate of the storage transistor formed in the second well; the control gate is capacitively coupled with the floating gate.

Abstract: In a nonvolatile semiconductor memory device having n (n is an integer of two or more) electrode films stacked and having charge storage layers provided above and below each of the electrode films, when data “0” is written by injecting electrons into the charge storage layer on a source line side of a memory cell of the number k (k is an integer of 1 to (n?1)) as counted from an end on a bit line side in a selected semiconductor pillar, positive program potential is given to the electrode film of the number 1 to k as counted from the bit line side, and 0 V is given to the electrode film of the number (k+1) to n, therewith positive potential is given to the bit line and 0 V is given to the source line.

Abstract: The present disclosure includes methods, devices, modules, and systems for operating semiconductor memory. One method embodiment includes determining a status of a page of memory cells without using input/output (I/O) circuitry, and outputting the status through the I/O circuitry.

Abstract: Methods, circuits, processes, devices, and/or arrangements for a non-volatile memory (NVM) cell operable at relatively low voltages are disclosed. In one embodiment, an NVM cell can include: (i) a gate over a charge trapping layer, the charge trapping layer being insulated from the gate by a first insulating layer, the charge trapping layer being insulated from a channel by a second insulating layer; and (ii) source and drain on either side of the channel, the channel being under the second insulating layer, where the NVM cell is configured to be erased by channel-induced hot holes (CHH).

Abstract: Data having three values or more is stored in a memory cell in a nonvolatile manner. A data circuit has a plurality of storage circuits. One of the plurality of storage circuits is a latch circuit. Another one of the plurality of storage circuits is a capacitor. The latch circuit and the capacitor function to temporarily store program/read data having two bits or more. Data held by the capacitor is refreshed using the latch circuit if data variation due to leakage causes a program. As a result, the data circuit does not become large in size even if multi-level data is used.

Abstract: The present invention describes systems and methods for improving the programming of floating-gate transistors. An exemplary embodiment of the present invention provides a floating-gate transistor programming system including an array of floating-gate transistors and a measuring circuit comprising a logarithmic transimpedance amplifier and an analog-to-digital converter. Furthermore, the floating-gate transistor programming system includes an injecting circuit comprising a digital-to-analog converter, wherein the pulsing circuit can inject charge into each of the floating-gate transistors and the measuring circuit can measure a present charge value in one of the plurality of floating-gate transistors.

Abstract: Disclosed is a programming method for a nonvolatile memory device. The method includes; charging word-line signal lines to a pass voltage during a pass voltage charge operation, simultaneously executing an initial precharge operation for strings including program-inhibited cells during the pass voltage charge operation, and applying the pass voltage to word lines from the word-line signal lines in response to a block-selection enabling signal.

Abstract: A method for driving a nonvolatile semiconductor memory device is provided. The nonvolatile semiconductor memory device has source/drain diffusion layers spaced from each other in a surface portion of a semiconductor substrate, a laminated insulating film formed on a channel between the source/drain diffusion layers and including a charge storage layer, and a gate electrode formed on the laminated insulating film, the nonvolatile semiconductor memory device changing its data memory state by injection of charges into the charge storage layer. The method includes, before injecting charges to change the data memory state into the charge storage layer: injecting charges having a polarity identical to that of the charges to be injected; and further injecting charges having a polarity opposite to that of the injected charges.

Abstract: A hybrid method of programming a non-volatile memory cell to a final programmed state is described. The method described is a more robust protocol suitable for reliably programming selected memory cells while eliminating programming disturbs. The hybrid method comprises programming the non-volatile memory cell to a first state according to a first coarse programming mechanism, and programming the non-volatile memory cell according to a second different more precise programming mechanism thereby completing the programming of the non-volatile memory cell to the final programmed state. Additionally, the described method is particularly advantageous for programming multilevel chips.

Abstract: A highly-integrated nonvolatile memory. A memory cell array where plural memory cells are arranged in matrix in row and column directions, plural first and second word lines, and plural bit lines are included. Each of the plural memory cells includes a first memory transistor and a second memory transistor which are connected in series. A gate electrode of the first memory transistor is connected to the first word line, a gate electrode of the second memory transistor is connected to the second word line, one of source and drain regions of the first memory transistor is connected to the first bit line, and one of source and drain regions of the second memory transistor is connected to the second bit line. Each of the first bit line and the second bit line is provided in common for memory cells in columns which are adjacent to each other.

Abstract: A method and apparatus for setting trim parameters in a memory device provides multiple trim settings that are assigned to portions of the memory device according to observed or tested programming speed and reliability.

Abstract: A method for programming a MLC memory includes (a) programming the bits of the memory having a Vt level lower than the PV level of a targeted programmed state into programmed bits by using a Vd bias BL; (b) ending this method if each bit of the memory has a Vt level not lower than the PV level of the targeted programmed state, otherwise, continuing the step (c); and (c) setting BL=BL+K1 and repeating the step (a) if each of the programmed bits has a Vt level lower than the PV level, while setting BL=BL?K2, and repeating the step (a) if at least one of the programmed bits has a Vt level not lower than the PV level.

Abstract: A method of operating a flash memory device includes a first operating mode and a second operating mode having different operating speeds. Each one of the first and second operating modes includes a bit line set-up interval and at least one additional interval. The flash memory is divided into first and second mats connected to respective first and second R/W circuits. During the bit line set-up interval of the second operating mode, the flash memory controls operation of both the first and second R/W circuits in a time division approach to stagger respective peak current intervals for the first and second mats.

Abstract: A memory comprising a plurality of P-channel split-gate memory cells are organized in rows and columns. Each of the plurality of P-channel split-gate memory cells comprises a select gate, a control gate, a source region, a drain region, a channel region, and a charge storage layer comprising nanocrystals. Programming a memory cell of the plurality of P-channel split-gate memory cells comprises injecting electrons from a channel region of the memory cell to the charge storage layer. Erasing the memory cell comprises injecting holes from the channel region to the charge storage region.

Abstract: A nonvolatile semiconductor memory device includes a memory cell array having a plurality of cell units each including a preset number of memory cells and select gate transistors on drain and source sides. The nonvolatile semiconductor memory device includes a voltage control circuit to prevent occurrence of an erroneous write operation due to excessively high boost voltage of a channel when “1” is written into the memory cell.

Abstract: A method of programming a nonvolatile memory device is disclosed. The method includes providing a plurality of memory cells coupled to a wordline, the plurality of memory cells grouped into a plurality of groups, each group including at least two memory cells, such that for each cell of the plurality of memory cells that has memory cells adjacent both sides, the memory cells immediately adjacent either side of the cell belong to different groups from each other. The method further includes selecting one group from the plurality of groups, and performing a program operation including applying a program pulse to the selected group while one or more non-selected groups of the plurality of groups are inhibited from being programmed.

Abstract: A bandgap engineered SONOS device structure for design with various AND architectures. The BE-SONOS device structure comprises a spacer oxide disposed between a control gate overlaying an oxide-nitride-oxide-nitride-oxide stack and a sub-gate overlaying a gate oxide. In one example, a BE-SONOS sub-gate-AND array architecture has multiple strings of SONONOS devices with sub-gate lines and diffusion bit lines. In another example, a BE-SONOS sub-gate-AND architecture has multiple strings of SONONOS devices with sub-gate lines, relying on the sub-gate lines that create inversions to substitute for the diffusion bit lines.

Abstract: A method for programming a flash memory device includes applying a program bias to a memory cell of a plurality of memory cells within a memory cell string. Each memory cell string comprises a source select line, a plurality of memory cells and a drain select line. A first pass bias is applied to at least one of the memory cells in a source select line direction relative to the memory cell to which the program bias has been applied. A second pass bias is applied to the memory cells in a drain select line direction relative the memory cell(s) to which the first pass bias has been applied.

Abstract: A method for performing a copy-back operation in a non-volatile memory device includes: measuring and recording a maximum program voltage used to program a part of target data to copy-back when a copy-back command is inputted; and performing a copy-back operation using the recorded maximum program voltage.

Abstract: A flash memory array comprises a plurality of memory cells organized in a matrix of rows and columns. Each of the memory cells includes a floating gate memory transistor having a source region and a drain region, and a coupling capacitor electrically connected to the memory transistor. A plurality of word lines are each electrically connected to the capacitor in each of the memory cells in a respective row. A first set of bit lines are each electrically connected to the drain region of the memory transistor in each of the memory cells in a respective column. A plurality of high voltage access transistors are each electrically connected to a bit line in the first set of bit lines. A second set of bit lines are each electrically connected to the source region of the memory transistor in each of the memory cells in a respective column.

Abstract: The present invention discloses a method for inspecting the electrical performance of a flash memory cell, which comprises: performing electron-storage programming on a flash memory cell for a pre-determined period; screening out flash memory cells that reach a specified reference value as a mother batch of flash memory cells that meet the preliminary requirement, by measuring the threshold voltage; then performing a second electron-storage programming on the flash memory cells screened out for a certain time period; baking these flash memory cells; and finally, measuring the threshold voltage of these baked flash memory cells again and determining whether the threshold voltage can still be maintained at or above the reference value, so that it can be determined ultimately whether the flash memory cells meet the electrical performance requirements.

Abstract: One embodiment of the present invention provides an operation method of a memory device. The memory device includes a source, a drain, and a channel region between the source and the drain, a gate dielectric with a charge storage layer on the channel region, and a gate on the gate dielectric, wherein the source, the drain and the channel region are located in a substrate. The operation method includes the following steps: applying a reverse bias between the gate and the drain of the memory device to generate band-to-band hot holes in the substrate near the drain; injecting the band-to-band hot holes to a drain side of the charge storage layer; and performing a program/erase operation upon the memory device. The band-to-band hot holes in the drain side of the charge storage layer are not completely vanished by the program/erase operation.

Abstract: Methods of programming data in a non-volatile memory cell are provided. A memory cell according to some embodiments may include a gate structure that includes a tunnel oxide layer pattern, a floating gate, a dielectric layer and a control gate sequentially stacked on a substrate, impurity regions that are formed in the substrate at both sides of the gate structure, and a conductive layer pattern that is arranged spaced apart from and facing the floating gate. Embodiments of such methods may include applying a programming voltage to the control gate, grounding the impurity regions and applying a fringe voltage to the conductive layer pattern to generate a fringe field in the floating gate.