Abstract: A method is for operating a memory having a group of non-volatile memory cells. A first programming pulse is applied to a subset of the group of non-volatile memory cells. The subset needs additional programming. A portion of the subset still needing additional programming is identified. A ratio of the number of memory cells in the subset and the number of memory cells in the portion is determined. A size of a second programming pulse based on the ratio is selected. The second programming pulse is applied to the portion.

Abstract: A memory system is provided with a processor, a main memory, and a flash memory. Performance of the memory system is improved through achievement of speed-up and high data reliability. The memory system includes a nonvolatile memory device and a controller configured to drive a control program to control the nonvolatile memory device. The control program executes a second access operation for the nonvolatile memory device even before a first access operation to the nonvolatile memory device is completed.

Abstract: A non-volatile memory device has an array of non-volatile memory cells, a first plurality of non-volatile memory reference cells, with each reference cell capable of being programmed to a reference level different from the other reference cells; and a second plurality of comparators. Each of the comparators is connectable to one of the first plurality of non-volatile memory reference cells and to one of a third plurality of memory cells from among the array of non-volatile memory cells.

Abstract: A method of programming a semiconductor memory device includes a first program step for performing a program by supplying a first program voltage, having a specific amount, to a selected word line of the semiconductor memory device for a set time and a second program step for performing a program by supplying, to the selected word line, a second program voltage which is a step pulse gradually rising from a start voltage lower than the first program voltage.

Abstract: Embodiments of tunneling barriers and methods for same can embed modules exhibiting a monodispersion characteristic into a dielectric layer (e.g., between first and second layers forming a dielectric layer). In one embodiment, by embedding C60 molecules inbetween first and second insulating layers forming a dielectric layer, a field sensitive tunneling barrier can be implemented. In one embodiment, the tunneling barrier can be between a floating gate and a channel in a semiconductor structure. In one embodiment, a tunneling film can be used in nonvolatile memory applications where C60 provides accessible energy levels to prompt resonant tunneling through the dielectric layer upon voltage application.

Abstract: Embodiments of the present disclosure provide methods, devices, modules, and systems for healing non-volatile memory cells. One method includes biasing a first select gate transistor coupled to a string of memory cells at a first voltage, biasing a second select gate transistor coupled to the string at a second voltage, applying a first healing voltage to a first edge word line in order to extract charge accumulated between the first select gate transistor and a first edge memory cell stack of the string, and applying a second healing voltage to a second edge word line in order to extract charge accumulated between the second select gate transistor and a second edge memory cell stack of the string.

Abstract: Methods for accelerating charge equilibrium in a non-volatile memory device using floating gate memory cells are disclosed. Memory devices and storage systems using charge equilibrium acceleration are also disclosed. In one such method, a programming pulse is applied to the word line to change an amount of charge stored on the floating gate of the memory cells being programmed. A reverse field pulse is then applied to the memory cell using only voltages greater than or equal to about 0 volts. The reverse field pulse accelerates charge equilibrium by moving any electrons trapped in the insulating oxide layers to a stable location so that the threshold voltage is stabilized. After the reverse field pulse, a program verify operation is performed and additional programming pulses and reverse field pulses are applied as needed to properly program the memory cell.

Abstract: A method of erasing a semiconductor memory device comprises grouping a plurality of word lines of each memory block into at least two groups based on intensity of disturbance between neighboring word lines; performing an erase operation by applying a ground voltage to all word lines of a selected memory block and by applying an erase voltage to a well of the selected memory block; and first increasing the ground voltage of one group of the groups to a positive voltage during the erase operation.

Abstract: The present invention provides circuits, systems, and methods for programming a floating gate. As described herein, a floating gate tunneling device is used with an analog comparison device in a circuit having a floating reference node and an offset-mitigating feedback loop for iteratively programming a floating gate or multiple floating gates.

Abstract: In one embodiment, a memory device includes a plurality of unit cell arrays. Each unit cell array includes an array of memory cells arranged in a plurality of columns, and each column is associated with a bit line. The memory device further includes a program control circuit configured to program cells in the plurality of unit cell arrays based on program bits associated with the plurality of unit cell arrays. For example, the program control unit is configured to simultaneously program one memory cell in each unit cell array having at least one associated program bit.

Abstract: Methods, devices, modules, and systems for programming memory cells can include storing charges corresponding to a data state that represents an integer number of bits in a set of memory cells. Programming memory cells can include storing a charge in a cell of the set, where the charge corresponds to a programmed state, where the programmed state represents a fractional number of bits, and where the programmed state denotes a digit of the data state as expressed by a number in base N, where N is equal to 2B, rounded up to an integer, and where B is equal to the fractional number of bits represented by the programmed state.

Abstract: Methods and apparatus are provided for write-side intercell interference mitigation in flash memories. A flash memory device is written by obtaining program data to be written to at least one target cell in the flash memory; obtaining one or more bits of program data for at least one aggressor cell to be programmed later than the target cell: and precompensating for intercell interference for the target cell by generating precompensated program values. The aggressor cells comprise one or more cells adjacent to the target cell, such as adjacent cells in a same wordline as the target cell and/or cells in an upper or lower adjacent wordline to the target cell. The precompensated program values for the target cell are optionally provided to the flash memory.

Abstract: Methods for programming, memory devices, and memory systems are disclosed. In one such method for programming, a target memory cell is partially programmed to a final target programmed state where the partial programming is verified by applying a ramped voltage having a first voltage range (e.g., where the first voltage range is selected in response to program coupling effects from memory cells adjacent to the target memory cell.) A programming operation following the partial programming operation is performed on one or more adjacent memory cells which is then followed by additional programming of the target memory cell to adjust the memory cell from the partially programmed state to the final programmed state. A ramped voltage having a second voltage range different from the first voltage range is utilized to verify the programming of the target memory cell to the final programmed state.

Abstract: A method for programming a memory array is provided. The memory array includes a memory cell string composed of a first transistor, a plurality of memory cells and a second transistor connected in series, and the method for programming the memory array includes following steps. In a setup phase, a switching memory cell in the memory cells is turned off, and a first voltage and a second voltage are applied to a first source/drain and a second source/drain of the switching memory cell. In a programming phase, a bit line connected to the memory cell string is floating, and a ramp signal is provided to a word line electrically connected to the switching memory cell.

Abstract: A semiconductor memory includes a plurality of nonvolatile memory cells arranged in a matrix and coupled to control gate lines, selection gate lines, bit lines, and source lines, and includes a source line control unit. The source line control unit, at a time of program operation, sets one of the source lines coupled to a row of the memory cells including a program memory cell to a high level voltage, and sets at least one of the remaining source lines coupled to a row of a non-program memory cells to be higher than a low level voltage of the selection gate lines and to be lower than the high level voltage of an unselection bit line. Thereby, a leak current lowering a voltage of the source lines at the time of program operation can be blocked off, and a program operation time may be shortened.

Abstract: A method, apparatus, and manufacture for a memory device is provided. The memory device includes memory cells that each store two bits, and a memory controller. During write operations, for each bit in each memory cell that is to be programmed, the memory controller determines whether both bits of the memory cell are being programmed. While controlling an application of programming pulses to the memory cell to program the bit, if both bits of the memory cell are being programmed, the memory controller causes the application of each programming pulse to the bit to occur for a reduced duration. Otherwise, the memory controller causes the application of each programming pulse to the bit to occur for a standard duration. The reduced duration is less than three-fourths of the standard duration.

Abstract: A method in performing an erasure operation of a nonvolatile memory device includes a step of performing a block erasure operation wherein a plurality of memory cells in a selected block are erased at once, a step of selecting an over-programmed memory cell having a threshold voltage higher than an upper bound verification voltage, and a step of erasing selectively the over-programmed memory cell.

Abstract: A nonvolatile semiconductor memory device according to an embodiment of the present invention includes: a memory cell array having a plurality of memory cells arranged therein, each of the memory cells having a charge storage layer and a control electrode; and a control unit configured to execute a write cycle multiple times, the write cycle including a write operation and a write verify operation, the write operation being an operation for applying a write pulse voltage multiple times to the control electrode selected for data write, and the write verify operation being an operation for determining whether data write is completed or not. During one time of the write operation, the control unit makes a voltage value of a finally applied write pulse voltage larger than a voltage value of an initially applied write pulse voltage.

Abstract: Non-volatile memory device channel boosting methods in which at least two strings are connected to one bit line, the channel boosting methods including applying an initial channel voltage to channels of strings in a selected memory block, floating inhibit strings each having an un-programmed cell among the strings, and boosting channels of the floated inhibit strings.

Abstract: A non-volatile memory cell includes first and second regions and a channel region therebetween, a word line gate over a first portion of the channel region, a floating gate over another portion of the channel region and adjacent to the word line gate, a coupling gate over the floating gate, and an erase gate adjacent to the floating gate on an opposite side to the word line gate and over the second region. Programming the memory cell includes applying a first positive voltage to the word line gate, applying a voltage differential between the first and second regions, applying a second positive voltage to the coupling gate (where the voltages and the voltage differential are applied substantially at the same time), and applying a third positive voltage to the erase gate after a period of delay from the application of the first and second positive voltages and the voltage differential.

Abstract: Provided is a method of operating a non-volatile memory device. The method includes applying a turn-on voltage to each of first and second string select transistors of a first NAND string, applying first and second voltages to third and fourth string select transistors of a second NAND string, respectively, and applying a high voltage to word lines connected with memory cells of the first and second NAND strings.

Abstract: A nonvolatile semiconductor memory device having a plurality of electrically rewritable nonvolatile memory cells connected in series together includes a select gate transistor connected in series to the serial combination of memory cells. A certain one of the memory cells which is located adjacent to the select gets transistor is for use as a dummy cell. This dummy cell is not used for data storage. During data erasing, the dummy cell is applied with the same bias voltage as that for the other memory cells.

Abstract: The invention is a new method for operating a flash EEPROM memory device and in particular for programming and erasing the device. The memory device has a first semiconductor region within a second semiconductor region, source and drain regions in the first semiconductor region, a well terminal inside the first semiconductor region, a charge storing layer electrically isolated from the first semiconductor region by a dielectric layer, and a control terminal electrically isolated from the charge storing layer by a inter layer dielectric. The method comprises the steps of: applying a first voltage bias of first polarity to the well terminal; allowing a first time period to elapse; resetting the first voltage bias to zero; while during the either the ramp up or the ramp down phase of said first voltage; applying a second voltage bias of second polarity opposite to the first polarity to the control terminal; allowing a second time period to elapse; and resetting the second voltage bias to zero.

Abstract: An operation scheme for operating stably a semiconductor nonvolatile memory device is provided. When hot-hole injection is conducted in the semiconductor nonvolatile memory device of a split gate structure, the hot-hole injection is verified using a crossing point that does not change with time. Thus, an erased state can be verified without being aware of any time-varying changes. Also, programming or programming/erasure is conducted by repeating pulse voltage or multi-step voltage application to a gate section multiple times.

Abstract: A method of programming a multi-bit per cell non-volatile memory is disclosed. In one embodiment, the non-volatile memory is read to obtain a first data of a most-significant-bit (MSB) page on a current word line that succeeds in data reading, wherein the current word line follows a preceding word line on which data reading fails. At least one reference voltage is set. The MSB page on the current word line is secondly programmed with a second data according to the reference voltage, the second data being different from the first data.

Abstract: Some embodiments include a memory device and a method of programming memory cells of the memory device. One such method includes applying voltages to data lines associated with different groups of memory cells during a programming operation. Such a method applies the voltages to the data lines associated with a last group of memory cells being programmed in a different fashion from the other groups of memory cells after the other groups of memory cells have been programmed. Other embodiments including additional memory devices and methods are described.

Abstract: Memory devices, methods, and sample and hold circuits are disclosed, including a memory device that includes a sample and hold circuit coupled to a bit line. One such sample and hold circuit includes a read circuit, a verify circuit, and a reference circuit. The read circuit stores a read threshold voltage that was read from a selected memory cell. The verify circuit stores a target threshold voltage that is compared to the read threshold voltage to generate an inhibit signal when the target and read threshold voltages are substantially equal. The reference circuit stores a reference threshold voltage that can be used to translate the read threshold voltage to compensate for a transistor voltage drop and/or temperature variations.

Abstract: Memory devices and methods are disclosed, such as those facilitating a data conditioning scheme for multilevel memory cells. For example, one such memory device is capable of inverting the lower page bit values of a complete page of MLC memory cells when a count of the lower page data values is equal to or greater than a particular value or a comparison of current levels compared with a reference current level is equal to or exceeds some threshold condition. Memory devices and methods are also disclosed providing a means for determining initial programming pulse conditions for a population of memory cells based on the number of lower page data values being programmed to a logical 0 or a logical 1 data state.

Abstract: Over-erase verification and repair methods for a flash memory. The flash memory is an NOR type stack flash. The disclosed method performs an over-erased column verification test on a sector of the NOR type stack flash column by column. An over-erased column repair process is individually performed on the columns which do not pass the over-erased column verification test. For the columns processed by the over-erased column repair process but still incapable of passing the over-erased column verification test, an over-erased bit verification test is performed on each bit thereof. The bits incapable of passing the over-erased bit verification test are further processed by an over-erased repair process individually.

Abstract: Methods of operating dual-gate memory cells having asymmetric band-gap tunnel insulators using direct tunneling. The asymmetric band-gap tunnel insulators allow for low voltage direct tunneling programming and efficient erase with holes and/or electrons, while maintaining high charge blocking barriers and deep carrier trapping sites for good charge retention.

Abstract: Subject matter disclosed herein relates to a memory device, and more particularly to write performance of a memory device.

Abstract: A method for driving a nonvolatile semiconductor memory device is provided. The nonvolatile semiconductor memory device has source/drain diffusion layers spaced from each other in a surface portion of a semiconductor substrate, a laminated insulating film formed on a channel between the source/drain diffusion layers and including a charge storage layer, and a gate electrode formed on the laminated insulating film, the nonvolatile semiconductor memory device changing its data memory state by injection of charges into the charge storage layer. The method includes, before injecting charges to change the data memory state into the charge storage layer: injecting charges having a polarity identical to that of the charges to be injected; and further injecting charges having a polarity opposite to that of the injected charges.

Abstract: A method for operating a non-volatile memory device includes selecting a word line of a plurality of word lines in response to a program command and an received address, determining whether the selected word line is a word line set among the word lines, performing an erase operation on a second word line group of the word lines in response to a result of the determining, and performing a program operation on the selected word line.

Abstract: Methods of programming memory cells, and memories incorporating such methods, are disclosed. In at least one embodiment, programming is accomplished by applying a set of incrementing program pulses to program a selected cell to a first target threshold voltage, and applying a set of incrementing inhibit pulses to an unselected cell to fine-tune program the selected cell to a second threshold voltage.

Abstract: A low-current FN channel for Erase, Program, Program-Inhibit and Read operations is disclosed for any non-volatile memory using FN-tunneling scheme for program and erase operation, regardless NAND, NOR, and EEPROM and regardless PMOS or NMOS non-volatile cell type. As a result, all above NMV memories can use the disclosed LV, compact PGM buffer to replace the traditional HV PGM buffer for saving in the silicon area and power consumption. The page buffer is used to store new loaded data for new writing and to convert the stored data into the required BL HV voltage for either Erase or Program operations according to the stored data. In addition, the simpler on-chip State-machine design can be achieved with the superior quality of NVMs of this disclosure.

Abstract: A charge trap flash memory device is capable of preventing a data retention fail by ensuring a data retention margin. A method for operating the charge trap flash memory device is provided. A selected memory cell is programmed using a program voltage. The selected memory cell is verified using a first program verify voltage. Date retention states of selected memory cell having passed the program verify step are verified using a retention verify voltage. A read step of determining a program pass or fail by reading data of the selected memory cell having passed the retention verify step is performed using a read voltage.

Abstract: A non-volatile semiconductor memory device according to one embodiment of the present invention includes a memory cell array and a control unit. The control unit is configured to control a repeat of an erase operation, an erase verify operation, and a step-up operation. The control unit is configured to perform a soft-programming operation of setting the memory cells from an over-erased state to a first threshold voltage distribution state when, in a series of erase operations, the number of erase voltage applications is more than a first number and less than a second number (the first number<the second number). The control unit is configured not to perform the soft-programming operation when the number of erase voltage applications is equal to or less than the first number or equal to or more than the second number.

Abstract: Provided is a method for programming a nonvolatile memory device. The nonvolatile memory device includes a local word line to divide a memory cell string into a first area including a selected word line and a second area not including the selected word line. In the method, word lines of the first area are driven by a first pass voltage and word lines of the second area driven by a second pass voltage higher than the first pass voltage. A cell transistor corresponding to the local word line is turned off after the first pass voltage and the second pass voltage are applied. The selected word line is driven by a program voltage after the cell transistor is turned off.

Abstract: The invention provides methods for programming a floating gate. A floating gate tunneling device is used with an analog comparing device in a circuit having a floating reference node and an offset-mitigating feedback loop for iteratively programming a floating gate, or multiple floating gates.

Abstract: A flash storage system accesses data interleaved among flash storage devices. The flash storage system receives a data block including data portions, stores the data portions in a data buffer, and initiates data transfers for asynchronously writing the data portions into storage blocks interleaved among the flash storage devices. Additionally, the flash storage system may asynchronously read data portions of a data block interleaved among the storage blocks, store the data portions in the data buffer, and access the data portions from the data buffer.

Abstract: Methods of writing data to and reading data from memory devices and systems for writing and reading data are disclosed. In a particular embodiment, a method includes writing data bits a first time into a memory. Auxiliary parity bits are written in the memory, where the auxiliary parity bits are computed based on the data bits. Subsequent to writing the data bits a first time and writing the auxiliary parity bits, the data bits are written a second time into the memory. Writing the data bits the first time and writing the data bits the second time are directed to one or more storage elements at a common physical address in the memory. Subsequent to writing the data bits the second time, the auxiliary parity bits are discarded while maintaining the data bits in the memory.

Abstract: Embodiments may be directed to a method of operating a semiconductor device, the method including receiving a first write training command, receiving a first write data responsive to the first write training command through a first data line, and transmitting the first write data through a second data line. Transmitting the first write data is performed without an additional training command.

Abstract: Techniques for operating non-volatile storage compensate for differences in floating gate coupling effect experienced by non-volatile storage elements on different word lines. An erase of a group of non-volatile storage elements is performed. A set of the non-volatile storage elements are for storing data and at least one of the non-volatile storage elements is a dummy that is not for storing data. The dummy is a neighbor to one of the data non-volatile storage elements. The data non-volatile storage elements are programmed at some point after the erase. Then, a programming voltage is applied to the dummy non-volatile storage element to increase the threshold voltage of the dummy to cause floating gate coupling effect to the neighbor non-volatile storage element to compensate for lesser floating gate coupling effect that the neighbor experienced during programming.

Abstract: A multi-level non-volatile memory device programs cells in each row in a manner that takes into account the coupling from the programming of cells that are proximate the row to be programmed. In one example of the invention, after the row has been programmed, the proximate cells are verified by read, comparison, and, if necessary, reprogramming operations to compensate for charge added to proximate memory cells resulting from programming the row. In another example of the invention, a row of memory cells is programmed with charge levels that take into account the charge that will be added to the memory cells when proximate memory cells are subsequently programmed.

Abstract: There is a method for enabling a SONOS transistor to be used as both a switch and a memory. FN tunneling is carried out through the source or drain of the transistor, so as to further change the state of electrons stored in an upper charge storage layer adjacent to the drain or source, and the variation in gate-induced drain leakage is used to recognize the memory state of the drain and source. A stable threshold voltage of the transistor is always maintained during this operation. The present invention enables one single transistor having dual features of switch and memory, while being provided with a two-bit memory effect, thus providing a higher memory density in comparison with a general transistor.

Abstract: Memory devices, methods, and sample and hold circuits are disclosed, including a memory device that includes a sample and hold circuit coupled to a bit line. One such sample and hold circuit includes a read circuit, a verify circuit, and a reference circuit. The read circuit stores a read threshold voltage that was read from a selected memory cell. The verify circuit stores a target threshold voltage that is compared to the read threshold voltage to generate an inhibit signal when the target and read threshold voltages are substantially equal. The reference circuit stores a reference threshold voltage that can be used to translate the read threshold voltage to compensate for a transistor voltage drop and/or temperature variations.

Abstract: Memory devices and methods are disclosed to facilitate utilization of a multi level inhibit programming scheme. In one such embodiment, isolated channel regions having boosted channel bias levels are formed across multiple memory cells and are created in part and maintained through capacitive coupling with word lines coupled to the memory cells and biased to predetermined bias levels. Methods of manipulation of isolated channel region bias levels through applied word line bias voltages affecting a program inhibit effect, for example, are also disclosed.

Abstract: Methods of programming data in a non-volatile memory cell are provided. A memory cell according to some embodiments may include a gate structure that includes a tunnel oxide layer pattern, a floating gate, a dielectric layer and a control gate sequentially stacked on a substrate, impurity regions that are formed in the substrate at both sides of the gate structure, and a conductive layer pattern that is arranged spaced apart from and facing the floating gate. Embodiments of such methods may include applying a programming voltage to the control gate, grounding the impurity regions and applying a fringe voltage to the conductive layer pattern to generate a fringe field in the floating gate.

Abstract: A nonvolatile memory cell is constructed using a floating-gate pFET readout transistor having its source tied to a power source (Vdd) and its drain providing a current, which can be sensed to determine the state of the cell. The gate of the pFET readout transistor provides for charge storage, which can be used to represent information such as binary bits. A control capacitor coupled between a first voltage source and the floating gate and a tunneling capacitor between a second voltage source and the floating gate are fabricated so that the control capacitor has much more capacitance than the tunneling capacitor. Manipulation of the voltages applied to the first voltage source and second voltage source controls an electric field across the capacitor structure and pFET dielectrics and thus Fowler-Nordheim tunneling of electrons on and off the floating gate, controlling the charge on the floating gate and the information stored thereon.

Abstract: A memory cell array has a number of memory cells which are connected to word lines and bit lines and are arranged in a matrix form, each of the memory cells storing one of n levels (n is a natural number of 2 or more). A control circuit controls the potentials on the word lines and the bit lines in accordance with input data to write data to the memory cells. The control circuit is adapted to, at the write time, first apply a first potential to a well region or substrate in which the memory cells are formed, then set the well region or substrate to a second potential lower than the first potential, and next apply a predetermined voltage to the word lines to thereby perform a write operation.