Abstract: A memory system, including a nonvolatile memory device, a charge recycler configured to discharge charges from the nonvolatile memory device and recycle the discharged charges, and a controller configured to control the nonvolatile memory device and the charge recycler, wherein the controller controls the charge recycler to recycle the discharged charges, wherein during the recycling the charge recycler charges the charges discharged from the nonvolatile memory device.

Abstract: A process for programming non-volatile storage is able to achieve faster programming speeds and/or more accurate programming through synchronized coupling of neighboring word lines. The process for programming includes raising voltages for a set of word lines connected a group of connected non-volatile storage elements. The set of word lines include a selected word line, unselected word lines that are adjacent to the selected word line and other unselected word lines. After raising voltages for the set of word lines, the process includes raising the selected word line to a program voltage and raising the unselected word lines that are adjacent to the selected word line to one or more voltage levels concurrently with the raising the selected word line to the program voltage. The program voltage causes at least one of the non-volatile storage elements to experience programming.

Abstract: A method includes minimizing current leaking through a virtual ground pipe during access of NROM memory cells. The minimizing includes operating two neighboring memory cells generally together, which includes connecting an operation voltage to a shared local bit line of the two neighboring memory cells and connecting the external local bit lines of two neighboring memory cells to a receiving unit, such as a ground supply or two sense amplifiers. Also included is an array performing the method.

Abstract: Some embodiments include a memory device and a method of programming memory cells of the memory device. One such method includes applying different voltages to data lines associated with different memory cells based on threshold voltages of the memory cells in an erased state. Other embodiments including additional memory devices and methods are described.

Abstract: A unit block circuit of a semiconductor device includes a first well, a first pickup unit configured to form a closed loop over the first well, a first transistor including a first gate and a first active region, and formed within the first pickup unit, and a first reservoir capacitor formed in a spare within the first pickup unit and arranged in a major-axis direction of the first gate of the first transistor, wherein the first reservoir capacitor comprises a second active region and a second gate, the second gate being formed over the second active region.

Abstract: Multiple programming processes are performed for a plurality of non-volatile storage elements. Each of the programming process operates to program at least a subset of said non-volatile storage elements to a set of target conditions using program pulses. In one embodiment, a first programming pass includes soft programming and additional programming passes include the programming of data. In another embodiment, all of the programming process includes programming data. For at least a subset of said programming processes, a program pulse associated with achieving a particular result for a respective programming process is identified. The identified program pulse is used to adjust programming for a subsequent programming process.

Abstract: A method includes performing a first programming operation on a plurality of memory cells in a same programming cycle; and performing a verification operation on the plurality of memory cells to find failed memory cells in the plurality of memory cells, wherein the failed memory cells are not successfully programmed in the first programming operation; and performing a second programming operation on the failed memory cells. Passed memory cells successfully programmed in the first programming operation are not programmed in the second programming operation.

Abstract: A method of operating a memory cell is provided. The memory cell has first, second, third and fourth storage regions in a charge-storage layer between a substrate and a word line. The first and second storage regions are respectively adjacent to lower and upper portions at one side of the protruding part of the substrate, and the third and fourth storage regions are respectively adjacent to lower and upper portions at the other side of the same. The second and third storage regions are regarded as a top storage region. When the top storage region is programmed, a first positive voltage is applied to the word line, a second positive voltage is applied to a top bit line in a top portion of the protruding part, and a bottom voltage is applied to first and second bottom bit lines in the substrate beside the protruding part respectively.

Abstract: In a method of operation, a flash memory cell coupled to a bit-line is programmed, a word-line voltage is coupled to the flash memory cell, a first voltage pulse is coupled to a bias transistor coupled between the bit-line and a sense capacitance at a first time to couple the bit-line to the sense capacitance to generate data to indicate the state of the flash memory cell, a second voltage pulse is coupled to the bias transistor at a second time having a second magnitude that is different from a first magnitude of the first voltage pulse, and a third voltage pulse is coupled to the bias transistor at a third time having a third magnitude that is different from the second magnitude of the second voltage pulse. In a method of operation, the second voltage pulse occurs a first delay period after the first voltage pulse and the third voltage pulse occurs a second delay period after the second voltage pulse, the second delay period being different from the first delay period.

Abstract: A nonvolatile memory device using interleaving technology is provided. The nonvolatile memory device includes a first controller configured to allocate one of 2N threshold voltage states to N-bit data where N is 2 or a natural number greater than 2, a second controller configured to set a difference between adjacent threshold voltage states among the 2N threshold voltage states so that the difference increases as a threshold voltage increases, and a programming unit configured to form a threshold voltage distribution state corresponding to the allocated threshold voltage state and to program the N-bit data to a multi-level cell. The second controller controls the difference between the adjacent threshold voltage states to equalize the number of read errors for all intersections among the 2N threshold voltage states at the end of life.

Abstract: A semiconductor memory device includes a control circuit. The control circuit executes control to perform a verify operation with respect to only a lowest threshold voltage level of a memory cell at a time of a data write operation, and to skip the verify operation with respect to the other threshold voltage levels. The control circuit determines whether a verify pass bit number of the lowest threshold voltage level, which is counted by a bit scan circuit, is a prescribed bit number or more, and the control circuit further executes control, if the verify pass bit number is the prescribed bit number or more, to perform the verify operation with respect to only the lowest threshold voltage level and a threshold voltage level that is higher than the lowest threshold voltage level, and to skip the verify operation with respect to the other threshold voltage levels.

Abstract: A non-volatile DRAM cell includes a pass-gate transistor and a cell capacitor. A read operation of the non-volatile cell begins by positively charging the cell capacitor. A cell capacitor of an associated dummy non-volatile DRAM cell is fully charged. The pass-gate transistor is activated and if the pass-gate transistor is erased it does not turn on and if it is programmed, it turns on. Charge is shared on the complementary pair of pre-charged bit lines connected to the non-volatile DRAM cell and its associated Dummy non-volatile DRAM cell. A sense amplifier detects the difference in the data state stored in the pass-gate transistor. The program and erase of the non-volatile DRAM cell is accomplished Gate-induced drain-lowering (GIDL) assisted band-to-band tunneling and Fowler-Nordheim tunneling respectively. Programming or erasing a selected row of cells does not affect the data states of the cells in the unselected rows.

Abstract: A method of programming a nonvolatile memory device is provided. The method includes providing a plurality of memory cells coupled to a wordline, the plurality of memory cells grouped into a plurality of groups, each group including at least two memory cells, such that for each cell of the plurality of memory cells that has memory cells adjacent both sides, the memory cells immediately adjacent either side of the cell belong to different groups from each other. The method further includes selecting one group from the plurality of groups, and performing a program operation including applying a program pulse to the selected group while one or more non-selected groups of the plurality of groups are inhibited from being programmed.

Abstract: In a non-volatile storage system, capacitive coupling effects are reduced by reducing the probability that adjacent storage elements reach the lockout condition at close to the same program pulse. A slow down measure such as an elevated bit line voltage is applied to the storage elements of a word line which are associated with odd-numbered bit lines, but not to the storage elements associated with even-numbered bit lines. The elevated bit line voltage is applied over a range of program pulses, then stepped down to ground over one or more program pulses. The range of programming pulses over which the slow down measure is applied, can be fixed or determined adaptively. A program pulse increment can be dropped, then increased, when the bit line voltage is stepped down. Storage elements which are programmed to a highest target data state can be excluded from the slow down measure.

Abstract: Some embodiments of the present invention provide methods of programming memory devices that include an array of vertical channels passing through a stacked plurality of word plates, wherein respective columns of vertical channels are configured to be coupled to respective bit lines. In some method embodiments, potentials of the vertical channels are boosted, followed by selectively applying respective data to vertical channels via the bit lines to thereby selectively change the potentials of the vertical channels according to the data. A program voltage is subsequently applied to a selected word plate to thereby program a plurality of cells.

Abstract: A memory cell array includes a plurality of memory cells, in which n (n is a natural number equal to 3 or larger) cells are simultaneously written. A control circuit controls the memory cell array. A conversion circuit converts data constituted of k (k is equal to n or smaller, and is a natural number equal to 3 or larger) bits stored in the memory cells into data of h (h is equal to k or larger, and is a natural number equal to 2 or larger) bits on the basis of a conversion rule.

Abstract: A semiconductor magnetic memory device has a magnetic tunneling junction formed over a memory cell. The memory cell has a control gate surrounded by a floating gate. The floating gate is coupled to the magnetic tunneling junction through a pinning layer that maintains the magnetic orientation of the lower magnetic layer of the junction. A current through a selected word line, coupled to the control gate, generates a first magnetic field. A current through a cell select line generates a second magnetic field that is orthogonal to the first magnetic field. This changes the magnetic orientation of the upper magnetic layer of the junction to lower its resistance, thus allowing a write/erase voltage on a program/erase line to program/erase the floating gate.

Abstract: In non-volatile memory devices, a write operation typically consists of an alternating set of pulse and verify operations. After a pulse is applied, the device must be biased properly for an accurate verify, with a selected word-line settled at the desired voltage level. The techniques described here address the problem of a relatively large waiting time at the start of a verify phase of a write operation when the selected word line is moving to its first verify level, while at the same time the non-selected word lines of a NAND type array are ramping up to a read pass level. For the non-selected word lines, during the program pulse, these are set at a first voltage above ground and then, during the verify operation, then are set at the read pass level. Rather than take the non-selected word lines to ground in between, they are instead moved directly from their voltage in the pulse phase directly into their read pass level.

Abstract: The present disclosure includes methods, devices, modules, and systems for programming multilevel non-volatile memory cells, each cell having a number of lower pages and an upper page. One method includes programming a first lower page, programming a second lower page, programming a third lower page, programming an upper page, and reprogramming the upper page of a cell.

Abstract: An integrated circuit includes a memory cell structure including a first cell and a second cell. The first cell includes a first storage structure and a first gate over a substrate. The first gate is over the first storage structure. The second cell includes a second storage structure and a second gate over the substrate. The second gate is over the second storage structure. The first gate is separated from the second gate. A first doped region is adjacent to the first cell and is coupled to a first source. A second doped region is configured within the substrate and adjacent to the second cell. The second doped region is coupled to a second source. At least one third doped region is between the first cell and the second cell, wherein the third doped region is floating.

Abstract: Methods for programming memory cells and memory devices are disclosed. One such method for programming includes performing a program verify operation of a group of memory cells. A number of potential CS2 situations are detected. If the number of detected potential CS2 situations is greater than a threshold, programming compensation for a CS2 situation is used in a subsequent programming operation.

Abstract: In a system having a plurality of non-volatile memory cells, a method includes performing hot carrier injection on a first non-volatile memory cell in a first mode of programming. In the first mode, current flows from a first current electrode to a second electrode of the first non-volatile memory cell and charge is transferred from the current to a floating gate of the first non-volatile memory cell at a location nearer the first current electrode than the second current electrode. The method further includes performing hot carrier injection on the first non-volatile memory cell in a second mode of programming. In the second mode, current flows from the second current electrode to the first electrode of the first non-volatile memory cell and charge is transferred from the current to the floating gate of the first non-volatile memory cell at a location nearer the second current electrode than the first current electrode.

Abstract: According to one embodiment, a nonvolatile semiconductor memory device includes a memory cell array connected to word lines and bit lines, and formed by arranging a plurality of memory cells in a matrix, each memory cell storing one of n values (n is a natural number of not less than 2), and a control circuit configured to write data in the memory cells by controlling potentials of the word lines and the bit lines in accordance with input data. The control circuit performs a write verify operation a plurality of number of times by changing a voltage level, stores data of the voltage level at which verify pass occurs, and determines a write voltage based on the stored data of the voltage level.

Abstract: A method and system for adaptively finding reference voltages for reading data from a multi-level cell (MLC) flash memory is disclosed. According to one embodiment, a first total number of cells of the flash memory above a first threshold voltage in a shifted threshold voltage distribution is provided. Search to find a second threshold voltage such that a second total number of the cells above the second threshold voltage is approximate to the first total number. An initial reference voltage or voltages of the initial threshold voltage distribution are shifted with an amount approximate to a voltage difference between the second threshold voltage and the first threshold voltage, thereby resulting in a new reference voltage or voltages for reading the data from the MLC flash memory.

Abstract: A method of operating a nonvolatile memory device includes determining whether a program operation is performed on even memory cells coupled to even bit lines of a selected page, setting a coupling resistance value between odd bit lines of the selected page and page buffers depending on whether the program operation for the even memory cells is performed, performing a program operation on the odd memory cells coupled to the odd bit lines, and coupling the odd bit line to the page buffer based on the set coupling resistance value and performing an verification operation for verifying whether threshold voltages of the odd memory cells on which the program operation is performed are a target voltage or more.

Abstract: A non-volatile memory system includes one or more non-volatile memory cells. Each non-volatile memory cell provides a floating gate, a coupling device, a first floating gate transistor, and a second floating gate transistor. The coupling device is located in a first conductivity region. The first floating gate transistor is located in a second conductivity region, and supplies read current sensed during a read operation. The second floating gate transistor is located in a third conductivity region. Such non-volatile memory cell further provides two transistors for injecting negative charge into the floating gate during a programming operation, and removing negative charge from the second floating gate transistor during an erase operation. The floating gate is shared by the first floating gate transistor, the coupling device, and the second floating gate transistor, and extends over active regions of the first floating gate transistor, the coupling device and the second floating gate transistor.

Abstract: Provided is a programming method that increases writing performance of a flash memory device. The programming method for a flash memory device that includes a plurality of banks including a plurality of memory cells for storing multi-bit data includes the following: programming a most significant bit (MSB) page with respect to banks of a first bank group; programming a least significant bit (LSB) page with respect to banks of a second bank group; programming the MSB page with respect to the banks of the second bank group; and programming the LSB page with respect to the banks of the first bank group.

Abstract: p-type wells are provided within an n-type embedded well of a semiconductor substrate lying in an area for forming a flash memory, in a state of being isolated from one another. A capacitance section, a data write/erase charge injection/discharge section and a data read MIS•FET are disposed in each of the p-type wells. The capacitance section is disposed between the data write/erase charge injection/discharge section and the data read MIS•FET. In the data write/erase charge injection/discharge section, writing and erasing of data by an FN tunnel current at a channel entire surface are performed.

Abstract: The present invention relates to a method of programming a nonvolatile memory device. A method of programming a nonvolatile memory device in accordance with an aspect of the present invention can include performing an erase operation, counting an erase pulse application number once the erase operation is completed, comparing the counted erase pulse application number and a reference, defining a program start voltage based on the comparison result, and performing a program operation using the defined program start voltage.

Abstract: One embodiment of the present invention provides an operation method of a memory device. The memory device includes a source, a drain, and a channel region between the source and the drain, a gate dielectric with a charge storage layer on the channel region, and a gate on the gate dielectric, wherein the source, the drain and the channel region are located in a substrate. The operation method includes the following steps: applying a reverse bias between the gate and the drain of the memory device to generate band-to-band hot holes in the substrate near the drain; injecting the band-to-band hot holes to a drain side of the charge storage layer; and performing a program/erase operation upon the memory device. The band-to-band hot holes in the drain side of the charge storage layer are not completely vanished by the program/erase operation.

Abstract: A nonvolatile memory structure with pairs of serially connected threshold voltage adjustable select transistors connected to the top and optionally to the bottom of NAND series strings of groups of the dual-sided charge-trapping nonvolatile memory cells for controlling connection of the NAND series string to an associated bit line. A first of the threshold voltage adjustable select transistors has its threshold voltage level adjusted to a first threshold voltage level and a second of the threshold voltage adjustable select transistors adjusted to a second threshold voltage level. The pair of serially connected threshold voltage adjustable select transistors is connected to a first of two associated bit lines. The NAND nonvolatile memory strings further is connected to a pair of serially connected threshold voltage adjustable bottom select transistors that is connected to the second associated bit line.

Abstract: Subject matter disclosed herein relates to a memory device, and more particularly to flash memory.

Abstract: Control circuitry for memory cells is described. In an embodiment, a breakdown detection circuit is described which is arranged to detect abnormally high currents indicative of a defective cell during programming of a memory cell through monitoring the impedance level at a terminal in the breakdown detection circuit. The breakdown detection circuit is connected between the device being programmed and ground and comprises three transistors, at least one of which is capable of withstanding the programming voltage in case of breakdown. Other embodiments describe a flag bit cell design, a memory array and methods of reading and writing from/to that array, and circuitry for biasing a memory word-line for both read and write operations. The embodiments may be used separately or in a combination.

Abstract: Techniques for providing a semiconductor memory device are disclosed. In one particular embodiment, the techniques may be realized as a semiconductor memory device including a plurality of memory cells arranged in an array of rows and columns. Each memory cell may include a first region coupled to a source line, a second region coupled to a bit line, and a body region capacitively coupled to at least one word line via a tunneling insulating layer and disposed between the first region and the second region.

Abstract: According to one embodiment, a nonvolatile semiconductor memory device includes a memory cell array, threshold voltages of memory cells being set lowest in an erase state and sequentially set higher according to data in a program state, a plurality of bit lines connected to the memory cells, a word line connected to the memory cells, and a control circuit. In a case where a first memory cell is programmed to a first threshold voltage that is lowest among threshold voltages in the program state, the control circuit is configured to charge a first bit line connected to the first memory cell to a third voltage between a first voltage applied to a bit line when a memory cell is programmed to a second threshold voltage higher than the first threshold voltage and a second voltage applied to a bit line when a memory cell is inhibited from being programmed.

Abstract: According to one embodiment, a nonvolatile semiconductor memory includes memory cells storing data of multi-level, a bit scan circuit to scan the number of to-be-written memory cells and the number of memory cells that have passed the verify, a processing unit to perform an operation process based on a scan result of the bit scan circuit, and a control circuit to control an operation of writing data according to a first mode in which a voltage used for an upper-data writing is calculated during a lower-data writing and a second mode used a voltage based on setting information. The bit scan circuit scans the number of to-be-written memory cells before starting writing and the processing unit compares the number of to-be-written memory cells with a criterion and determines one of the first and second modes for the writing based on a result of comparison.

Abstract: A method of programming a memory cell (100), the method comprising applying a first electric potential to a first electric terminal (101) of the memory cell (100) to accelerate first charge carriers of a first type of conductivity to thereby generate second charge carriers of a second type of conductivity by impact ionisation of the accelerated first charge carriers, and applying a second electric potential to a second electric terminal (102) of the memory cell (100) to accelerate the second charge carriers to thereby inject the second charge carriers in a charge trapping structure (103) of the memory cell (100).

Abstract: In an embodiment of the invention, a memory cell arrangement includes a substrate and at least one memory cell including a charge storing memory cell structure and a select structure. The memory cell arrangement further includes a first doping well, a second doping well and a third doping well arranged within the substrate, wherein the charge storing memory cell structure is arranged in or above the first doping well, the first doping well is arranged within the second doping well, and the second doping well is arranged within the third doping well. The memory cell arrangement further includes a control circuit coupled with the memory cell and configured to control the memory cell such that the charge storing memory cell structure is programmed or erased by charging or discharging the charge storing memory cell structure via at least the first doping well.

Abstract: Disclosed herein is a method of remarkably improving the memory characteristics of a non-volatile memory device and the device reliability of the MOSFET using graphene which is a novel material that has a high work function and does not cause the deterioration of a lower insulating film.

Abstract: Multiple select gates in association with non-volatile memory cells are described. Various embodiments include multiple select gate structure, process, and operation and their applicability for memory devices, modules, and systems. In one embodiment a memory array is described. The memory array includes a number of select gates coupled in series to a number of non-volatile memory cells. A first select gate includes a control gate and a floating gate electrically connected together and a second select gate includes a control gate and a floating gate which are electrically separated by a dielectric layer.

Abstract: A method for minimizing program disturb in Flash memories. To reduce program disturb in a NAND Flash memory cell string where no programming from the erased state is desired, a local boosted channel inhibit scheme is used. In the local boosted channel inhibit scheme, the selected memory cell in a NAND string where no programming is desired, is decoupled from the other cells in the NAND string. This allows the channel of the decoupled cell to be locally boosted to a voltage level sufficient for inhibiting F-N tunneling when the corresponding wordline is raised to a programming voltage. Due to the high boosting efficiency, the pass voltage applied to the gates of the remaining memory cells in the NAND string can be reduced relative to prior art schemes, thereby minimizing program disturb while allowing for random page programming.

Abstract: A method of programming a nonvolatile memory device comprises receiving program data, detecting logic states of the received program data, identifying adjusted margins to be applied to programmed memory cells based on the absence of one or more logic states in the detected logic states, and programming the program data in selected memory cells using the adjusted margins.

Abstract: A method of programming a differential flash memory cell having a first and a second memory cell is disclosed. The first memory cell includes a first transistor associated with a first threshold voltage and the second memory cell includes a second transistor associated with a second threshold voltage. The method includes reading the first and second memory cells to determine a current associated with the first and second threshold voltages. The first threshold voltage is equal to a first value and the second threshold voltage is equal to a second value. The method further includes determining if the first current corresponds to a predetermined logic state. If the current does not correspond to the predetermined logic state, the first and second memory cells are programmed. The programming includes changing the first threshold voltage from the first value to a third value and the second threshold voltage from the second value to a fourth value.

Abstract: A nonvolatile memory device includes an array of EEPROM configured nonvolatile memory cells each having a floating gate memory transistor for storing a digital datum and a floating gate select transistor for activating the floating gate memory transistor for reading, programming, and erasing. The nonvolatile memory device has a row decoder to transfer the operational biasing voltage levels to word lines connected to the floating gate memory transistors for reading, programming, verifying, and erasing the selected nonvolatile memory cells. The nonvolatile memory device has a select gate decoder circuit transfers select gate control biasing voltages to the select gate control lines connected to the control gate of the floating gate select transistor for reading, programming, verifying, and erasing the floating gate memory transistor of the selected nonvolatile memory cells.

Abstract: A channel pre-charge method of a nonvolatile memory device including a cell string includes pre-charging a channel of the cell string according to a first word line bias condition and pre-charging the channel of the cell string according to a second word line bias condition, different than the first word line bias condition.

Abstract: A memory cell array includes a plurality of memory cells, in which n (n is a natural number equal to 3 or larger) cells are simultaneously written. A control circuit controls the memory cell array. A conversion circuit converts data constituted of k (k is equal to n or smaller, and is a natural number equal to 3 or larger) bits stored in the memory cells into data of h (h is equal to k or larger, and is a natural number equal to 2 or larger) bits on the basis of a conversion rule.

Abstract: A semiconductor memory device according to an embodiment of the present invention includes a substrate, a gate insulator formed on the substrate and serving as an F-N (Fowler-Nordheim) tunneling film, a first floating gate formed on the gate insulator, a first intergate insulator formed on the first floating gate and serving as an F-N tunneling film, a second floating gate formed on the first intergate insulator, a second intergate insulator formed on the second floating gate and serving as a charge blocking film, and a control gate formed on the second intergate insulator.

Abstract: An electronic device can include a nonvolatile memory cell. In a particular embodiment, during an erase pulse, all unselected lines are at substantially the same voltage, and a row or segment of a row, such as a word, is erased during the erase pulse. In another embodiment, selected control gate and erase lines are at substantially the same voltage during a programming pulse. In a further embodiment, charge carriers tunnel through a dielectric layer of a component during a program pulse, and charge carriers tunnel through a different dielectric layer of a different component during an erase pulse.

Abstract: Threshold voltage distributions in a non-volatile memory device are narrowed, and/or programming time is reduced, using a programming technique in which the bit line voltage for storage elements having a target data state is stepped up, in lock step with a step up in the program voltage. The step up in the bit line voltage is performed at different times in the programming pass, for different subsets of storage elements, according to their target data state. The start and stop of the step up in the bit line voltage can be set based on a fixed program pulse number, or adaptive based on a programming progress. Variations include using a fixed bit line step, a varying bit line step, a data state-dependent bit line step, an option to not step up the bit line for one or more data states and an option to add an additional bit line bias.

Abstract: A process for programming non-volatile storage is able to achieve faster programming speeds and/or more accurate programming through synchronized coupling of neighboring word lines. The process for programming includes raising voltages for a set of word lines connected a group of connected non-volatile storage elements. The set of word lines include a selected word line, unselected word lines that are adjacent to the selected word line and other unselected word lines. After raising voltages for the set of word lines, the process includes raising the selected word line to a program voltage and raising the unselected word lines that are adjacent to the selected word line to one or more voltage levels concurrently with the raising the selected word line to the program voltage. The program voltage causes at least one of the non-volatile storage elements to experience programming.