Abstract: A semiconductor memory device includes: first and second bit lines of an open bit-line system; a sense amplifier that amplifies a potential difference between the first and second bit lines; a pair of first and second local data lines corresponding to the first and second bit lines, respectively; and a write amplifier circuit. The write amplifier circuit changes a potential of the second local data line without changing a potential of the first local data line at a time of writing data for the first bit line, and changes a potential of the first local data line without changing a potential of the second local data line at a time of writing data for the second bit line.

Abstract: During first portion of a first read cycle determining that a first input of a sense amplifier is to receive information based upon a state of a storage cell during a first portion of a read cycle, and determining that a conductance at the first input is substantially equal to a conductance at a second input of the sense amplifier during the first portion. A plurality of NAND string modules are connected to a global bit line of a memory device that includes a memory column where a plurality of NAND strings and a buffer are formed.

Abstract: Voltage coupling/decoupling devices are provided within DRAM devices for improving the bias sensing of sense amplifiers and thus the refresh performance. The voltage coupling/decoupling devices couple or decouple bias voltage from corresponding digit lines coupled to the sense amplifiers. By coupling and decoupling voltage from the digit lines, the time interval between refresh operations can be increased.

Abstract: A memory architecture is provided with an array of non-volatile memory cells arranged in rows and columns, and a sense amplifier coupled to at least one column within the array for sensing a data bit stored within one of the non-volatile memory cells. In order to provide accurate sensing, a reference current generator is provided and coupled to the sense amplifier. The reference current generator provides a first reference current having adjustable magnitude and adjustable slope, and a second reference current having adjustable magnitude, but constant slope. The first reference current is supplied to the sense amplifier for sensing the data bit. The second reference current is supplied to a control block for generating clock signals used to control sense amplifier timing.

Abstract: A Dynamic Random Access Memory (DRAM) cell comprising a leakage compensation circuit. The leakage compensation circuit allows a compensation current from a source to flow to the memory cell storage node of the DRAM cell to compensate the leakage current from the memory cell storage node of the DRAM cell to improve retention time.

Abstract: Herein, a voltage sensing circuit, which is capable of controlling a pumping voltage to be stably generated in a low voltage environment, is provided. The voltage sensing circuit includes a current mirror having first and second terminals, a first switching element configured to control current on the first terminal of the current mirror by a reference voltage, a second switching element configured to control current from the second terminal of the current mirror in response to a pumping voltage, and a third switching element configured to control current sources of the first and second switching elements to receive a negative voltage.

Abstract: A semiconductor device includes a first amplifier circuit, a second amplifier circuit, first and second bit lines coupled to the first amplifier circuit, third and fourth bit lines coupled to the second amplifier circuit, a first equalizer circuit being coupled to the first and second bit lines, and a second equalizer circuit being coupled between the second and third bit lines. The second equalizer circuit being closer to the second amplifier circuit than the first equalizer circuit, the first equalizer circuit being closer to the first amplifier circuit than the second equalizer circuit.

Abstract: A non-volatile semiconductor memory device includes: a memory component in which an electric charge discharging rate between two electrodes is different in accordance with logic of stored information; a sense amplifier that detects the logic of the information by comparing a discharge electric potential of a wiring to which one of the electrodes of the memory component is connected with a reference electric potential; and a load capacitance changing unit that changes load capacitance of a sense node of the sense amplifier to which the discharge electric potential is input or both the load capacitance of the sense node and load capacitance of a reference node of the sense amplifier to which the reference electric potential is input in accordance with the logic of the information read out by the memory component.

Abstract: A method for sensing the contents of a memory cell within a static random access memory (SRAM) includes holding a bit line associated with the memory cell at a zero voltage potential when the memory cell is not being accessed; energizing the bit line to a first voltage potential different than the zero voltage potential during an access of the memory cell; and sensing the memory cell contents when the associated bit line has reached the first voltage potential.

Abstract: A sense amplifier is constructed to reduce the occurrence of malfunctions in a memory read operation, and thus degraded chip yield, due to increased offset of the sense amplifier with further sealing down. The sense amplifier circuit is constructed with a plurality of pull-down circuits and a pull-up circuit, and a transistor in one of the plurality of pull-down circuits has a constant such as a channel length or a channel width larger than that of a transistor in another pull-down circuit. The pull-down circuit with a larger constant of a transistor is first activated, and then, the other pull-down circuit and the pull-up circuit are activated to perform the read operation.

Abstract: Circuits and methods for suppressing integrated circuit leakage currents are described. Many of these circuits and methods are particularly well-suited for use in dynamic memory circuits. Examples describe the use of power, ground, or both and power and ground source transistors used for generating virtual voltages. An aspect of the invention describes lowering refresh current. An aspect describes reducing the standby current. An aspect of the invention describes lowering leakage resulting from duplicated circuits, such as row decoders and word line drivers. An aspect describes methods of performing early wake-up of source transistors. A number of source transistor control mechanisms are taught. Circuit layouts methods are taught for optimizing integrated circuit layouts using the source transistors.

Abstract: A semiconductor memory device includes: a memory cell; a sense line; and a sense amplifier circuit connected to the memory cell via the sense line. The sense amplifier circuit includes a differential sense amplifier, a pull-up section, a read gate transistor, and a threshold correction section.

Abstract: A semiconductor memory device includes a plurality of memory cell array blocks, a bit line sense amplifier, a local sense amplifier that can be controlled to be turned on or off, a data sense amplifier, and a controller. The controller activates a local sense control signal for a predetermined duration in response to first and second signals. The first signal is a bit line sense enable signal that activates the bit line sense amplifier, and the local sense amplifier is activated for a predetermined duration after the bit line sense enable signal is activated. The second signal is activated or deactivated in phase with a column selection line signal that connects a pair of bit lines and a pair of local input/output lines. Accordingly, it is possible to turn on or off the local sense amplifier according to operating conditions, thereby increasing a tRCD parameter and reducing the consumption of current.

Abstract: Voltage coupling/decoupling devices are provided within DRAM devices for improving the bias sensing of sense amplifiers and thus the refresh performance. The voltage coupling/decoupling devices couple or decouple bias voltage from corresponding digit lines coupled to the sense amplifiers. By coupling and decoupling voltage from the digit lines, the time interval between refresh operations can be increased.

Abstract: The present invention provides a semiconductor memory device in which the number of write amplifiers is decreased by increasing the number of bit line pairs connected to one pair of common write data lines. Further, by decreasing the number of bit line pairs connected to one pair of common read data lines, parasitic capacitance connected to the pair of common read data lines is reduced and, accordingly, time in which the potential difference between the pair of common read data lines increases is shortened. Thus, while preventing enlargement of the chip layout area, read time can be shortened.

Abstract: A semiconductor device in the present invention comprises pair transistors composed of a first transistor and a second transistor. The pair transistors are arrayed in a repeating pattern in the row direction. The first transistor and the second transistor are mutually related to each other so that the drain of one transistor is connected to the gate of the other transistor. The gate of the first transistor and the gate of the second transistor are offset in the row direction. The first transistor and the second transistor are in a diagonal positional relationship.

Abstract: A semiconductor device of the invention comprises: a memory cell array including memory cells formed at intersections between word lines and bit lines; first and second input/output ports each defined for inputting/outputting data of the memory cell array; sense amplifiers for amplifying data of the memory cells through the bit lines; a first select circuit which is controlled to be on/off by first select control lines extending in an intersecting direction to bit lines and is connected between the sense amplifiers and the first input/output port; a second select circuit which is controlled to be on/off by second select control lines extending along the bit lines and is connected between the sense amplifiers and the second input/output port; and first and second column decoders for selectively activating the first and second select control lines in response to an input column address.

Abstract: A memory device that includes a sample and hold circuit coupled to a bit line. The sample and hold circuit stores a target threshold voltage for a selected memory cell. The memory cell is programmed and then verified with a ramped read voltage. The read voltage that turns on the memory cell is stored in the sample and hold circuit. The target threshold voltage is compared with the read voltage by a comparator circuit. When the read voltage is at least substantially equal to (i.e., is substantially equal to and/or starts to exceed) the target threshold voltage, the comparator circuit generates an inhibit signal.

Abstract: A resistance based memory circuit is disclosed. The circuit includes a first transistor load of a data cell and a bit line adapted to detect a first logic state. The bit line is coupled to the first transistor load and coupled to a data cell having a magnetic tunnel junction (MTJ) structure. The bit line is adapted to detect data having a logic one value when the bit line has a first voltage value, and to detect data having a logic zero value when the bit line has a second voltage value. The circuit further includes a second transistor load of a reference cell. The second transistor load is coupled to the first transistor load, and the second transistor load has an associated reference voltage value. A characteristic of the first transistor load, such as transistor width, is adjustable to modify the first voltage value and the second voltage value without substantially changing the reference voltage value.

Abstract: A memory has a pre-amplifier for generating an output signal and a reference signal. The memory includes a comparator for comparing the output signal to the reference signal. The comparator includes a bias stage for generating a bias signal, wherein the bias signal is an average of the output signal and the reference signal. The comparator further includes a first output stage for generating a first comparator output signal by comparing the output signal and the bias signal. The comparator further includes a second output stage for generating a second comparator output signal by comparing the reference signal and the bias signal.

Abstract: Using the voltage across a threshold switching cell to sense the state of the cell, rather than sensing current through the cell, may result in a faster read. In some embodiments, current consumption during reading of conductive states may be reduced by using a capacitor coupled across the cell.

Abstract: A semiconductor device of the present invention comprises a first step-down voltage circuit to generate a first step-down voltage lower than an externally-supplied power supply voltage, and a second step-down voltage circuit to generate a second step-down voltage lower than the first step-down voltage. The first step-down voltage circuit has a withstand voltage no lower than the power supply voltage and the second step-down voltage circuit has a withstand voltage no lower than the first step-down voltage.

Abstract: A semiconductor memory device having high integration, low power consumption and high operation speed. The memory device includes a sense amplifier circuit having plural pull-down circuits and a pull-up circuit. A transistor constituting one of the plural pull-down circuits has a larger constant than that of a transistor constituting the other pull-down circuits, for example, a channel length and a channel width. The pull-down circuit having the larger constant transistor is activated earlier than the other pull-down circuits and the pull-up circuit, which are activated to conduct reading. The data line and the earlier driven pull-down circuit are connected by an NMOS transistor and the NMOS transistor is activated or inactivated to control the activation or inactivation of the pull-down circuit.

Abstract: A method for sensing the contents of a memory cell within a static random access memory (SRAM) includes holding a bit line associated with the memory cell at a zero voltage potential when the memory cell is not being accessed; energizing the bit line to a first voltage potential different than the zero voltage potential during an access of the memory cell; and sensing the memory cell contents when the associated bit line has reached the first voltage potential.

Abstract: A semiconductor memory device includes a plurality of memory cell array blocks, a bit line sense amplifier, a local sense amplifier that can be controlled to be turned on or off, a data sense amplifier, and a controller. The controller activates a local sense control signal for a predetermined duration in response to first and second signals. The first signal is a bit line sense enable signal that activates the bit line sense amplifier, and the local sense amplifier is activated for a predetermined duration after the bit line sense enable signal is activated. The second signal is activated or deactivated in phase with a column selection line signal that connects a pair of bit lines and a pair of local input/output lines. Accordingly, it is possible to turn on or off the local sense amplifier according to operating conditions, thereby increasing a tRCD parameter and reducing the consumption of current.

Abstract: In one embodiment, a memory includes: an array of memory cells arranged according to word lines and columns, each column corresponding to bit lines; a sense amplifier adapted to couple to the bit lines to sense a binary content of selected cells from the array of memory cells, the sense amplifier sensing the binary content responsive to a sense command; an x-decoder configured to assert a selected one of the word lines in response to decoding an address as triggered by a clock edge, wherein the assertion of the selected word line switches on corresponding access transistors to develop voltages on the bit lines; and a bit line replica circuit adapted to replicate the development of the bit lines, the bit line replica circuit including a replica access transistor coupled between a replica bit line and a replica memory cell wherein the replica access transistor is switched on responsive to the clock edge such that the replica memory cell pulls the replica bit line to ground, the bit line replica circuit also inc

Abstract: A semiconductor storage device includes a plurality of memory cells connected to first and second column trees, and a sensing circuit reading data from the memory cells. The sensing circuit performing a read operation by electrically connecting the column tree, which is connected to a read-selected memory cell, to a sensing node and electrically connecting the column tree, which is connected to a non-selected memory cell, to a reference sensing line.

Abstract: A sense amplifier is constructed to reduce the occurrence of malfunctions in a memory read operation, and thus degraded chip yield, due to increased offset of the sense amplifier with further sealing down. The sense amplifier circuit is constructed with a plurality of pull-down circuits and a pull-up circuit, and a transistor in one of the plurality of pull-down circuits has a constant such as a channel length or a channel width larger than that of a transistor in another pull-down circuit. The pull-down circuit with a larger constant of a transistor is first activated, and then, the other pull-down circuit and the pull-up circuit are activated to perform the read operation.

Abstract: Disclosed is a non-volatile semiconductor memory circuit with an improved resistance spread characteristic distinguishing set data and reset data. The non-volatile semiconductor memory circuit includes a memory cell array, and a read/write circuit block configured to differentiate the current drivability based on the mode of operation, wherein the current drivability is provided in response to a bias signal based on set or reset state of data.

Abstract: This disclosure concerns a semiconductor memory device comprising: a memory cell array having memory cells arrayed two-dimensionally; word lines connected to the memory cells of rows of the memory cell array; bit lines connected to the memory cells of columns of the memory cell array; sense amplifiers connected to the bit lines, and detecting data stored in the memory cells; a test pad passing a predetermined reference current from a power source, and transmitting a reference voltage based on the reference current; and test circuits connected between the power source and the test pad and intervening between the power source and the bit lines, the test circuits passing test currents according to the reference voltage via the bit lines.

Abstract: A semiconductor memory device includes a memory core and an input/output circuit. The memory core amplifies a signal of a memory cell to output the amplified signal through an input/output line pair in a read mode, receives a signal of the input/output line pair to store in the memory cell in a write mode, and electrically separates a bit line pair from the input/output line pair in response to a read column selection signal, a write column selection signal and a first data masking signal. The input/output circuit buffers and provided a signal of the input/output line pair to input/output pins, receives input data from the input/output pins, and buffers the received input data to provide the buffered input data to the input/output line pair. Thus, the semiconductor device can perform a fast data writing operation.

Abstract: A system and method for erasing a block of data in a plurality of memory cells includes clamping one of a digit line and an I/O line in a sensing circuit of a memory device to a fixed logic level. The memory cells of the block of memory cells are selected and refreshed to the fixed logic level. A sense amplifier includes a clamping circuit adapted to connect one of a digit line and an I/O line to a fixed logic level in response to an erase signal during a refresh of the selected block of memory cells.

Abstract: A current sense amplifier can include an active load circuit having a first load device and second load device coupled in parallel to a first power supply node. A first load device and second load device can provide an impedance that varies according to a potential at a load control node. A reference current circuit can be coupled between the first load device and a second power supply node that includes a current reference section that provides an impedance according to a bias voltage. A data current circuit can be coupled between the second load device and a plurality of memory cells. An adaptive bias circuit can be coupled between the first power supply and the second power supply node and can include a bias section coupled to the load control node that provides an impedance according to the bias voltage.

Abstract: A write driving circuit is provided to drive a global input/output line to write same data to memory cells according to a combination of a first test data signal and a second test data signal in a test mode, regardless of input data signals.

Abstract: A memory device comprising a memory cell and an evaluation circuit, the memory cell being coupled with the evaluation circuit via a bit line. The memory device further comprises a reference line coupled with the evaluation circuit, the evaluation circuit being designed for amplifying a difference between electric potentials of the bit line and the reference line. Inputs of the evaluation circuit are directly connected to the bit line. Outputs of the evaluation circuit are coupled to the bit line via a switch.

Abstract: A differential sense amplifier can perform data sensing using a very low supply voltage.

Abstract: A memory device includes a sense amplifier to sense the state of a bitcell. The sense amplifier includes two input terminals connected via a switch. One of the input terminals is connected to a node, whereby a current through the node represents a difference in current drawn by a bitcell and a reference current. During a first phase, the switch between the input terminals of the sense amplifier is closed, so that a common voltage is applied to both input terminals. During a second phase, the switch is opened, and the sense amplifier senses a state of information stored at the bitcell based on the current through the node. By using the switch to connect and disconnect the inputs of the sense amplifier in the two phases, the accuracy and speed with which the state of the information stored at the bitcell can be determined is improved.

Abstract: This disclosure concerns a memory including: word lines extending to a first direction; bit lines extending to a second direction crossing the first direction; a memory cell array including cell blocks each including memory cells respectively provided corresponding to intersection points of the word lines and the bit lines; and sense amplifiers provided corresponding to the bit lines, wherein the sense amplifiers copies existing data stored in a first cell block within the memory cell array to a plurality of memory cells, the memory cells being included in second and third cell blocks different from the first cell block, and alternately arranged in an extension direction of the word lines and also alternately arranged in an extension direction of the bit lines, and the sense amplifiers reads data from the second cell block or the third cell block, at a time of outputting data to outside of the sense amplifiers.

Abstract: A sense amplifier circuit includes a current sense amplifier, a voltage sense amplifier, and an output stabilizing circuit. The current sense amplifier amplifies differential input currents to generate differential output voltages and provides the differential output voltages to a sense amplifier output line pair. The voltage sense amplifier is coupled to the sense amplifier output line pair to amplify the differential output voltages on the sense amplifier output line pair. The voltage sense amplifier is activated at the time later than a time of activation of the current sense amplifier. The output stabilizing circuit is coupled to the sense amplifier output line pair to stabilize the differential output voltages on the sense amplifier output line pair. The output stabilizing circuit has a positive input resistance. Accordingly, the sense amplifier circuit reduces power consumption and an occupied area on a semiconductor chip.

Abstract: A reference current integrator and a sensed current integrator are coupled to form a differential sense amplifier. The differential sense amplifier is coupled to receive a bitline current signal from a flash memory, and the reference current integrator is coupled to receive a current signal from a reference memory cell. The differential current integrating sense amplifier is also used for instrumentation, communication, data storage, sensing, biomedical device, and analog to digital conversion.

Abstract: A semiconductor memory device comprises: a memory cell array including a plurality of word lines, a plurality of bit line pairs containing a first bit line and a second bit line, and a plurality of memory cells; a plurality of replica bit lines formed in the same manner as the first and second bit lines; a write buffer circuit operative to drive the first or second bit line to the ground voltage; a replica write buffer circuit operative to drive the replica bit lines to the ground voltage; and a boot strap circuit operative to drive the first or second bit line currently driven to the ground voltage further to a negative potential at a timing when the potential on the replica bit lines reaches a certain value.

Abstract: A sensing circuit of a phase change memory. The sensing circuit comprises a storage capacitor and a reference capacitor, a storage memory device and a reference memory device, a storage discharge switch and a reference discharge switch, and an arbitrator. First terminals of the storage capacitor and the reference capacitor are respectively coupled to a pre-charge voltage via first switches. First terminals of the storage memory device and the reference memory device are respectively coupled to the first terminals of the storage capacitor and the reference capacitor. The storage discharge switch and the reference discharge switch are respectively coupled to second terminals of the storage memory device and the reference memory device. The arbitrator is coupled to the first terminals of the storage memory device and the reference memory device and provides an output as a read result of the storage memory device.

Abstract: A system and method for sensing a current. The system includes an operational amplifier including a first input terminal, a second input terminal, and a first output terminal. The first input terminal is biased to a predetermined voltage, and the second input terminal and the first output terminal are directly connected. Additionally, the system includes a switch coupled to the first output terminal and a first node. The switch is controlled by at least a first control signal. Moreover, the system includes a comparator including a third input terminal, a fourth input terminal, and at least a second output terminal. The comparator is configured to receive a first input signal at the third input terminal and a second input signal at the fourth input terminal. The first input signal and the second input signal are associated with the first node and the predetermined voltage.

Abstract: A memory device according to an embodiment of the present invention, comprises a common source line current detection unit for detecting current in a common source line of a memory cell array and outputting a control signal; and a control unit for controlling an evaluation time for reading data of a page buffer coupled to the memory cell array according to the control signal output from the common source line current detection unit.

Abstract: One embodiment of the present invention sets forth a sense amplifier flop design that is tolerant of process variation. Specific staging of signal transitions through the sense amplifier flop circuit eliminate operational phases involving short-circuit currents between n-channel field-effect transistors (N-FETs) and p-channel field effect transistors (P-FETs) in a complementary-symmetry metal-oxide semiconductor process. By eliminating short-circuit currents between N-FETs and P-FETs within the sense amplifier flop, a large variation in conductivity ratio between N-FETs and P-FETs may be tolerated by the sense amplifier flop. This tolerance to conductivity ratio translates to a tolerance for process variation by the sense amplifier flop circuit.

Abstract: A sense amplifier for a memory includes a transistor, an operational amplifier, and a compensating circuit. The negative input end of the operational amplifier is coupled to the compensating circuit. The positive input end of the operational amplifier is coupled to the drain of the transistor. The output end of the operational amplifier is coupled to the gate of the transistor. The compensating circuit is coupled between the negative input end and the output end of the operational amplifier. The compensating circuit generates a compensating voltage to the negative input end of the operational amplifier according to the voltage of the gate of the transistor.

Abstract: A multi-bank memory device includes rows and columns of memory cores. Each row includes memory cores from one bank interleaved with memory cores from another bank. Banks in different rows can be simultaneously accessed.

Abstract: A memory having at least one memory array block, the at least one memory array block comprising N wordlines, wherein N is greater than one, is provided. The memory comprises a plurality of sense amplifiers coupled to the at least one memory array block. The memory further comprises at least one dummy bitline, wherein the at least one dummy bitline comprises M dummy bitcells, wherein M is equal to N. The memory further comprises a timing circuit coupled to the at least one dummy bitline, wherein the timing circuit comprises at least one stack of pull-down transistors coupled to a sense circuit for generating a latch control output signal used for timing control of memory accesses. Timing control may include generating a sense trigger signal to enable the plurality of sense amplifiers for read operations and/or generating a local reset signal for terminating memory accesses, such as disabling the plurality of write drivers for write operations.

Abstract: Techniques for use with a fuse-based non-volatile memory circuit include digitally controlling a resistance threshold of the circuit. The circuit includes a fuse circuit and a comparator circuit. The comparator circuit is configured to compare a first signal indicative of the fuse resistance to a second signal indicative of a reference level. At least one of the first and second signals is digitally controllable. The comparator circuit is configured to generate a digital output signal indicative of the comparison. The circuit may include a first digital-to-analog converter circuit configured to generate a first analog signal based on at least a first plurality of digital signals. The first signal is at least partially based on the first analog signal. The circuit may include a control circuit configured to digitally control the digitally controllable ones of the first and second signals at least partially based on the digital output signal.

Abstract: According to an aspect of the present invention, there is provided a nonvolatile semiconductor memory device including: a memory cell array including: memory cell blocks each having series-connected memory cells; wordlines; and a bitline pair connected to the memory cell blocks, one functioning as a readout bitline, the other one functioning as a reference bitline; an amplification circuit connected to the bitline pair to amplify a signal difference therebetween; and a reference voltage generation circuit including: a dummy memory cell block that has the same configuration as the memory cell block, that has one terminal connected to a first dummy plate line and that has the other terminal connected to the reference bitline; and a paraelectric capacitor that has one terminal connected to a second dummy plate line and that has the other terminal connected to the reference bitline.