Abstract: A memory module having different types of memory mounted together on a double-sided substrate has a first edge and opposite second edge and includes a plurality of memory controllers, a plurality of flash memories, and a plurality of second memories having a higher signal transmission rate than the flash memories. A socket terminal for connecting the double-sided substrate to a motherboard is formed on the front surface and the back surface of the double-sided substrate on the first edge side; the memory controllers are disposed on the second edge side; the second memories are disposed on the second edge side at positions opposite the positions at which the memory controllers are disposed; and the flash memories are disposed on at least the back surface thereof at positions that are closer to the first edge than are the positions at which the memory controllers and the second memories are disposed.

Abstract: An operating method of a storage device which includes a nonvolatile memory and a memory controller configured to control the nonvolatile memory, may include tracking a clock signal; entering a vendor mode of the storage device when the clock signal corresponds to a vendor pattern; and maintaining a normal mode of the storage device when the clock signal does not correspond to the vendor pattern, wherein, in the normal mode, a command received from an external host device is executed according to a first rule, and wherein, in the vendor mode, the command received from the external host device is executed according to a second rule different from the first rule.

Abstract: A power-up signal generation circuit including a pre-power-up signal generation block operates by using a first power supply voltage, and generates a pre-power-up signal when the first power supply voltage becomes higher than a first level, and a second power supply voltage becomes higher than a second level; a level shifting block suitable for pull-down driving a first node when the pre-power-up signal is not in an activated state, and pull-up driving the first node with the second power supply voltage when the pre-power-up signal is in the activated state; a driving block suitable for pull-down driving the first node when the second power supply voltage is lower than the second level; and a power-up signal driving block operates by using the second power supply voltage, and generates a power-up signal through a second node by driving the second node based on a voltage level of the first node.

Abstract: A communication method according to the present embodiment is a communication method between a first side and a second side operating with a clock provided by the first side, and includes a phase calibration step, a step of transmitting a command packet to the second side by the first side, and a data transmission and reception step of transceiving data packets according to the command packet between the first side and the second side. The phase calibration step is performed to calibrate phases of a transmit sampling clock of the first side and a receive sampling clock of the first side.

Abstract: A memory device may include: at least one memory bank; and a control circuit suitable for: refreshing the at least one memory bank through a first refresh operation in response to a refresh command; and refreshing the at least one memory bank through a second refresh operation when an active operation is performed between a current refresh command and a previous refresh command.

Abstract: A semiconductor device may be provided. The semiconductor device may include an input signal generator configured to enable an input signal although a reset signal is disabled after a clock enable signal is enabled. The semiconductor device may include a self-refresh enable signal generator configured to generate a self-refresh enable signal based on the input signal.

Abstract: In an embodiment, a system includes a power management unit (PMU), a non-volatile memory, a volatile memory, and a processor. The PMU may be configured to generate a power supply voltage, change a state of a status signal responsive to an event, and reduce a voltage level of the power supply voltage responsive to a predetermined period of time elapsing from detecting the event. The system may be configured to transition from a first to a second operating mode responsive to the change of the state of the status signal, and cancel pending commands to the non-volatile memory responsive to the transition to the second operating mode. The non-volatile memory may be configured to complete active commands prior the predetermined period of time elapsing.

Abstract: Provided is a refresh control device including: an arbitration operating unit configured to arbitrate (i) a memory access request for accessing a volatile memory that requires a refresh operation for holding data and (ii) a refresh trigger for requesting execution of the refresh operation; and a trigger generating unit configured to generate refresh triggers in a non-constant cycle to satisfy refresh-rate requirements defining the number of refresh operations necessary to be executed per predetermined period for the volatile memory to hold the data.

Abstract: A memory circuit (100), comprises a first set of memory cells (102a; 202a) configured to operate in a direct access mode or in a refresh mode and a second set of memory cells (102b; 202b) configured to operate in the direct access mode and in the refresh mode. The memory circuit (100) further comprises a controller (104) configured to receive a write request and to execute the write request for a set of memory cells being in direct access mode; and to buffer the write request for later execution for a set of memory cells being in refresh mode.

Abstract: A memory module includes an emergency power supplier, a plurality of ranks each including one or more volatile memories, a non-volatile memory, and a controller suitable for backing up data of the ranks into the non-volatile memory by using the emergency power supplier during a power failure, wherein the ranks are sequentially backed up, and while one rank is backed up among the ranks, the other ranks are controlled in a self-refresh mode.

Abstract: A refresh control device may include a command decoder configured to decode a command signal and a specific address, and output a refresh signal, an active signal and a row hammer refresh signal. The refresh control device may include a refresh controller configured to output an active address, a row hammer address and a refresh address based on the refresh signal, the active signal, the row hammer refresh signal and a latch address. The refresh control device may include a combiner configured to combine the active address, the row hammer address and the refresh address, and output a refresh control signal.

Abstract: The invention pertains to data disturb vulnerabilities in Dynamic Random Access Memory (DRAM) integrated circuits. In particular, it pertains to mitigating attacks on a computational system by deliberate inducement of disturbs on a targeted row (also known as “row hammering”) in the system's DRAM memory. The stream of row addresses accompanying ACTIVE commands is monitored and filtered to only track addresses that occur at a dangerous rate and reject addresses that occur at less than a dangerous rate. When a tracked address poses a danger of causing a memory disturb, each row adjacent to the tracked address row is refreshed thus mitigating the danger.

Abstract: A semiconductor device according to an aspect of the present invention has: a plurality of memory cells MC; a plurality of word lines WL each coupled to a corresponding one of the plurality of memory cells MC; and a control circuit that intermittently monitors accesses to the plurality of word lines WL, stores/erases some captured row-addresses in a first number of registers, and detects, by comparison with stored addresses, in response to a first number of accesses to one of the word lines WL in a first period of time. According to the present invention, access histories can be precisely analyzed by a small-scale circuit configuration, and measures against, for example, the Row Hammer problem, etc. can be taken.

Abstract: A semiconductor layout structure includes at least a first signal line and a pair of Vss lines. The first signal line and the pair of Vss lines are extended along a first direction, and the Vss lines are arranged along a second direction. The first direction and the second direction are perpendicular to each other. The Vss lines are arranged at respective two sides of the first signal line.

Abstract: A memory includes a first cell array configured to include a plurality of first memory cells connected to a plurality of word lines, a second cell array configured to include a plurality of second memory cells connected to the plurality of word lines, wherein a group of the plurality of second memory cells which are connected to a corresponding word line stores the number of activations for the corresponding word line, and an activation number update unit configured to update a value stored in the corresponding group of the plurality of second memory cells connected to the activated word line of the plurality of word lines.

Abstract: A memory system including a plurality of dynamic random access memory (DRAM) devices and a DRAM controller is provided. The plurality of DRAM devices includes one or more DRAM groups. Each of the one or more DRAM groups includes at least two DRAM devices. The DRAM controller outputs a clock enable signal, and controls a selection signal used to select a target DRAM device that operates in a normal mode in response to the clock enable signal. At least one target DRAM device is selected from the one or more DRAM groups. One or more stand-by DRAM devices other than the at least one target DRAM device operates in a self-refresh mode.

Abstract: Disclosed herein is a semiconductor device that includes: a memory cell array including a plurality of memory groups each having a plurality of memory cells, the memory groups being selected by mutually different addresses; a first control circuit periodically executing a refresh operation on the memory groups in response to a first refresh command; and a second control circuit setting a cycle of executing the refresh operation by the first control circuit. The second control circuit sets the cycle to a first cycle until executing the refresh operation to all the memory groups after receiving the first refresh command, and the second control circuit sets the cycle to a second cycle that is longer than the first cycle after executing the refresh operation to all the memory groups.

Abstract: A semiconductor memory device may include: a memory bank comprising a plurality of word lines; a smart command generation unit suitable for generating a smart refresh command, which is enabled at a random cycle, in response to an active command; and a refresh operation control unit suitable for performing a refresh operation to at least one of adjacent word lines of a target word line among the plurality of word lines in response to the smart refresh command.

Abstract: A manager program for managing virtual machines includes a process which receives a notification message indicating an occurrence of an event affecting a data storage unit in a data storage system that supports a shared file system. The notification message might have come from a virtual machine host or resulted from a hardware reconfiguration. The manager program then determines whether another virtual machine host is sharing the data storage unit. The manager program might make this determination by polling each of the virtual machine hosts it manages or by checking information previously collected and stored in a database. If another virtual machine host is sharing the data storage unit, the manager program sends a refresh message to that virtual machine host that causes the virtual machine host to update information relating to the data storage unit in a cache associated with the virtual machine host.

Abstract: A semiconductor memory device includes a command buffering unit suitable for receiving and buffering a command signal based on an enable control signal, a fuse array suitable for programming data based on the command signal, and an enable control unit suitable for generating the enable control signal, wherein an activation operation on the command buffering unit by the enable control signal is controlled during a programming operation period of the fuse array.

Abstract: Methods, systems, and apparatuses for redundancy in a memory array are described. A memory array may include some memory cells that are redundant to other memory cells of the array. Such redundant memory cells may be used if a another memory cell is discovered to be defective in some way; for example, after the array is fabricated and before deployment, defects in portions of the array that affect certain memory cells may be identified. Memory cells may be designated as redundant cells for numerous other memory cells of the array so that a total number of redundant cells in the array is relatively small fraction of the total number of cells of the array. A configuration of switching components may allow redundant cells to be operated in a manner that supports redundancy for numerous other cells and may limit or disturbances to neighboring cells when accessing redundancy cells.

Abstract: A semiconductor system includes a first semiconductor device and a second semiconductor device. The first semiconductor device outputs a command/address signal. The second semiconductor device extracts an active signal, a pre-charge signal, and addresses from the command/address signal, performs an active operation on a memory cell corresponding to the addresses, and performs a refresh operation on the memory cell corresponding to counting signals generated by counting a number of pulses in a refresh signal.

Abstract: An information processing apparatus, equipped with a WideIO memory device stacked on an SOC die including a CPU, and a method of controlling the same, are provide. The apparatus obtains temperature information of each of a plurality of memories of the WideIO memory device, and generates temperature distribution information of the WideIO memory device in accordance with respective execution of a plurality of function modules. Then, the apparatus determines a refresh rate of the WideIO memory device based on the maximum temperature of the WideIO memory device, decides a period, at which the refresh rate is determined, based on an operation mode of the information processing apparatus and a change rate of the maximum temperature for a predetermined time interval, and refreshes the WideIO memory device in accordance with the determined refresh rate.

Abstract: Systems, apparatuses and methods may provide a way to reduce and or eliminate contention between refresh operations and read/write operations, and a larger page buffer for read/write operations for dynamic random access memory (DRAM) technology. More particularly, systems, apparatuses and methods may provide a way to improve a DRAM to perform read/write operations with section selection. Systems, apparatuses and methods may provide for including additional transfer gates in a DRAM to provide section selection to reduce and or eliminate contention between refresh operations and read/write operations, and a larger page buffer for read/write operations.

Abstract: A memory (1205) is disclosed. The memory (1205) can includes a stack of dynamic Random Access Memory (DRAM) cores (1210, 1215, 1220, 1225) in a three-dimensional stacked memory architecture (1230). Each of the DRAM cores (1210, 1215, 1220, 1225) can include a plurality of banks (205-1, 205-2, 205-3, 205-4) to store data. The memory (1205) can also include logic layer (1235) which can include an interface (1305) to connect the memory (1205) with a processor (120). The logic layer (1235) can also include a refresh engine (115) that can be used to refresh one of the plurality of banks (205-1, 205-2, 205-3, 205-4) and a Smart Refresh Component (305) that can advise the refresh engine (115) which bank to refresh using an out-of-order per-bank refresh. The Smart Refresh Component (305) can use a logic (415) to identify a farthest bank in the pending transactions in the transaction queue (430) at the time of refresh.

Abstract: A memory device and system supporting command bus training are provided. An operating method of the memory device includes entering into a command bus training mode, receiving a clock signal, a chip selection signal and a first command/address signal, generating an internal clock signal by dividing the clock signal, generating a second command/address signal by latching the first command/address signal at a rising edge or a falling edge of the internal clock signal when a chip selection signal is activated, and outputting the second command/address signal.

Abstract: The present disclosure includes apparatuses and methods related to refresh circuitry. An example apparatus can include a memory array including a main portion and a redundant portion. The apparatus can include refresh circuitry configured to, responsive to a determination of a hammering event, refresh at least a portion of the redundant portion.

Abstract: A refresh control device may include a plurality of latch circuits configured to receive an active signal, a refresh signal, an active control signal, and a refresh control signal, and output a word line enable signal for controlling a refresh operation to banks. The refresh control device may include a command decoder configured to decode a row address in correspondence to an external command signal and generate the active signal and the refresh signal. The refresh control device may include an address buffer configured to buffer an active address and generate the active control signal. The refresh control device may include an address control circuit configured to generate the refresh control signal in correspondence to a refresh command signal.

Abstract: In described examples, a memory controller circuit controls accesses to an SRAM circuit. Precharge mode control circuitry outputs: a burst mode enable signal to the SRAM circuit indicating that a series of SRAM cells along a selected row of SRAM cells will be accessed; a precharge first mode signal to the SRAM circuit indicating that a first access along the selected row will occur; and a precharge last mode signal to the SRAM circuit indicating that a last access along the selected row will occur. The SRAM circuit includes an array of SRAM cells arranged in rows and columns to store data. Each SRAM cell is coupled to: a corresponding word line along a row of SRAM cells; and a corresponding pair of complementary bit lines.

Abstract: A memory including a plurality of word lines to which one or more memory cells are coupled, an address storage unit suitable for storing an input address corresponding to a first external signal that is inputted at a random time, and a control unit suitable for activating a word line corresponding to the input address of the plurality of word lines in response to an active command and refreshing one or more target word lines selected using an address stored in the address storage unit when performing a refresh operation.

Abstract: Memory subsystem refresh management enables commands to access one or more identified banks across different bank groups with a single command. Instead of sending commands identifying a bank or banks in separate bank groups by each bank group individually, the command can cause the memory device to access banks in different bank groups. The command can be a refresh command. The command can be a precharge command.

Abstract: A system has a plurality of memory devices arranged in a fly-by topology, each having on-die termination (ODT) circuitry for connecting to an address and control (RQ) bus. The ODT circuitry of each memory device includes a set of one or more control registers for controlling on-die termination of one or more signal lines of the RQ bus. A first memory device includes a first set of one or more control registers storing a first ODT value, for controlling termination of one or more signal lines of the RQ bus by the ODT circuitry of the first memory device, and a second memory device includes a second set of one or more control registers storing a second ODT value different from the first ODT value, for controlling termination of one or more signal lines of the RQ bus by the ODT circuitry of the second memory device.

Abstract: Provided are a thin film transistor substrate and a display using the same. A display includes: a first thin film transistor, the first thin film transistor including: a polycrystalline semiconductor layer, a first gate electrode on the polycrystalline semiconductor layer, a first source electrode, and a first drain electrode, a second thin film transistor, the second thin film transistor including: a second gate electrode, an oxide semiconductor layer on the second gate electrode, a second source electrode, and a second drain electrode, an intermediate insulating layer including a nitride layer and an oxide layer on the nitride layer, the intermediate insulating layer being disposed on the first gate electrode and the second gate electrode and under the oxide semiconductor layer, and an etch-stopper layer disposed on the oxide semiconductor layer.

Abstract: A circuit includes: a first data line; a second data line; a write driver including first and second transistors; a first switch connected in series with the first transistor to form a first series-connected pair; a second switch in series with the second transistor to form a second series-connected pair; and a level shifter which includes the first and second transistors. The first series-connected pair is coupled between a first voltage node and the first data line. The second series-connected pair is coupled between the first voltage node and the second data line. Gate terminals of the first and second transistors are correspondingly cross-coupled with the second and first data lines.

Abstract: An apparatus and method for performing on-chip parameter measurement is disclosed. In one embodiment, an IC includes a number of functional circuit blocks each having one or more sensors for measuring parameters such as voltage and temperature. Each of the functional blocks includes circuitry coupled to receive power from a local supply voltage node. Similarly, the circuitry in each of the sensors is also coupled to receive power from the corresponding local supply voltage node. Each of the sensors may be calibrated to compensate for process, voltage, and temperature variations. Various methods based on characterization of the sensors may be used to perform the calibrations.

Abstract: Embodiments are generally directed to performance of additional refresh operations during self-refresh mode. An embodiment of a memory device includes one or more memory banks, a mode register set, the mode register set including a first set of mode register bits, and a control logic to provide control operations for the memory device, the operations including refresh operations for the one or more memory banks in a refresh credit mode. The control logic is to perform one or more extra refresh cycles in response to receipt of a self-refresh command, the self-refresh command to provide current refresh status information, and is to store information in the first set of mode register bits regarding a modified refresh status after the performance of the one or more extra refresh cycles.

Abstract: A fabrication process is provided for a 3D stacked non-volatile memory device which provides a source contact to a bottom of a memory hole in a stack without exposing a programmable material lining of an interior sidewall of the memory hole and without exposing a channel forming region also lining an interior of the memory hole to an energetic and potentially damaging etch environment. The stack includes alternating control gate layers and dielectric layers on a substrate, and the memory hole is etched through the stack before lining an interior sidewall thereof with the programmable material and then with the channel forming material. The process avoids a need to energetically etch down through the memory hole to open up a source contact hole near the bottom of the channel forming material by instead etching upwardly from beneath the memory hole.

Abstract: An apparatus includes a detector to detect an idle state of a communication link that communicates bursts or packets of information. The apparatus also includes an oscillator having low-power and normal modes of operation. The oscillator makes a transition to the low-power mode during the idle state of the communication link. The oscillator leaves the low-power mode of operation and enters the normal mode of operation when the communication link is in a non-idle state.

Abstract: A method of refreshing a semiconductor device may be provided. A semiconductor device may include a refresh control circuit and a memory circuit. The refresh control circuit may be configured to compare addresses generated based on a command with fail addresses to generate a normal word line signal and a redundancy word line signal which are enabled during a predetermined time section from a point of time that the command is inputted to the refresh control circuit. The memory circuit may be configured to inactivate a fail word line connected to a failed memory cell based on the addresses if the normal word line signal is enabled and activates a redundancy word line replacing the fail word line if the redundancy word line signal is enabled.

Abstract: A channel controlling device includes: a multiplexing circuit coupled to a plurality of channels for selecting a specific channel from the channels to output a channel data according to a selecting signal, wherein the channels correspond to a plurality of predetermined digital numbers; a sorting circuit arranged to queue the predetermined digital numbers to form a plurality of queued digital numbers according to a data output order of the channels; and an arbitration circuit, arranged to determine the selecting signal according to the plurality of queued digital numbers.

Abstract: A semiconductor device includes: a clock synchronizing circuit that operates in synchronization with a clock; an enable signal generating circuit that generates an enable signal in an operation period during which the clock synchronizing circuit is operated; and a clock supplying circuit that supplies a clock to the clock synchronizing circuit or stop the supply of the clock according to the enable signal when a clock frequency is equal to or lower than a predetermined frequency, and supply a clock to the clock synchronizing circuit, irrespective of the enable signal, when the clock frequency is higher than the predetermined frequency.

Abstract: A memory includes a plurality of word lines each of which are connected to one or more memory cells, an address detection unit suitable for detecting a target address of a target word line among the plurality of word lines, wherein the target word line has an activation history satisfying a predetermined condition, and a control unit suitable for activating one or more word line among the plurality of word lines each time a refresh command is applied, and activating one or more adjacent word lines in response to a refresh command after detection of the target address, wherein the adjacent word line is adjacent to the target word line and identified by the target address.

Abstract: A memory device includes a per bank refresh counter applicable to multiple banks in a group. The memory device increments a row address counter only when the per bank refresh counter is reset. The memory device receives a per bank refresh command from an associated memory controller, and performs a per bank refresh in response to receiving the per bank refresh command. The memory device refreshes a row identified by a row address counter for a bank identified by the per bank refresh command. The memory device increments the per bank refresh counter in response to receiving the per bank refresh command, and increments the row address counter when the per bank refresh counter is reset, either by rolling over or by a reset condition.

Abstract: A memory device includes a buffer memory configured to receive commands from a memory controller via first to Nth channels, wherein N denotes an integer which is equal to or greater than ‘2’; and first to Nth core memories each connected to the buffer memory via one of the first to Nth channels. The buffer memory may deconcentrate refresh commands corresponding to the first to Nth core memories, based on a number of commands input during a specific time.

Abstract: A memory includes a plurality of memory cells and a plurality of bitlines. Each of the plurality of bitlines is coupled to a corresponding one of the plurality of memory cells. A precharge circuit precharges each of the plurality of bitlines before a read operation and precharges all but one of the plurality of bitlines following the read operation. A write driver drives the one of the plurality of bitlines following the read operation. A method includes precharging each of a plurality of bitlines before a read operation. Each of the plurality of bitlines is coupled to a corresponding one of a plurality of memory cells. The method further includes precharging all but one of the plurality of bitlines following the read operation and driving the one of the plurality of bitlines following the read operation.

Abstract: A video processing device can receive in an encoded bitstream of video data a network abstraction layer (NAL) unit and parse a first syntax element in a header of the NAL unit to determine a temporal identification (ID) for the NAL unit, wherein a value of the first syntax element is one greater than the temporal identification.

Abstract: A semiconductor memory device includes a memory bank including a plurality of word lines, and a refresh operation control unit suitable for performing a first refresh operation for a first adjacent word line group of a target word line of the plurality of word lines, and performing a second refresh operation for a second adjacent word line group of the target word line after the first refresh operation, in response to a smart refresh command.

Abstract: A memory module is provided. A plurality of DRAMs is mounted on a PCB. At least one DRAM has an operating parameter different from other DRAMs according to a position where the at least one DRAM is mounted on the PCB.

Abstract: A semiconductor memory apparatus includes a plurality of cell arrays; and a use information storage block configured to determine whether a data write operation has already been performed for the plurality of cell arrays, and generate a plurality of control signals, wherein the semiconductor memory apparatus is configured to control a refresh operation for the plurality of cell arrays according to the plurality of control signals.

Abstract: A memory controller for heterogeneous computer processors dynamically adjusts access priorities by the different processors to maximize performance in the execution of a single parallel application program on both processor architectures. In one embodiment, the memory controller predicts sequential memory accesses by the processor having higher memory latency or fewer access requests to lockout the other processor during those sequences for improved implementation of the intended prioritization.