Abstract: A circuit for power management of a memory cell. A first power switch is coupled between a power voltage, the power control signal and the memory cell. The first power switch is turned off to disconnect the power voltage and the memory cell when the power control signal is at a predetermined level, such that the memory cell operates in standby mode. A latch circuit is coupled between the power voltage, the first terminal and the second terminal to preserve the voltage levels respectively of the first terminal and the second terminal when the memory cell operates in the standby mode.

Abstract: Semiconductor memory devices. A semiconductor memory device includes a booster circuit generating a predetermined power voltage exceeding an external power voltage, a global power line supplying the predetermined power voltage, and a plurality of memory blocks. Each memory block has a local power line, a plurality of functional circuits coupled to the local power lines and a voltage control device coupled between the global power line and the local power line. The voltage control device outputs the predetermined power voltage or a first voltage to the functional circuits through the local power line in a first period and a second period respectively, according to a select signal, wherein the first voltage exceeds the external power voltage but is lower than the predetermined power voltage.

Abstract: A random access memory device has a memory array, and a refresh rate generator circuit. The memory array has a plurality of memory cells that are configured to hold a charge. The memory array has an active mode and a standby mode. The refresh rate generator circuit is coupled to the memory array and is configured to generate a refresh signal having a rate. The refresh signal is used to periodically refresh the memory cells. The memory device detects when the memory array changes from its standby mode to its active mode and then increases the rate of the refresh signal when the memory array changes from its standby mode to its active mode.

Abstract: A redundancy scheme for a memory integrated circuit having at least two memory sectors and, associated with each memory sector, a respective memory location selector for selecting memory locations within the memory sector according to an address. The redundancy scheme comprises at least one redundant memory sector adapted to functionally replace one of the at least two memory sectors, and a redundancy control circuitry for causing the functional replacement of a memory sector declared to be unusable by one of the at least one redundant memory sector; the redundancy control circuitry detects an access request to a memory location within the unusable memory sector and diverts the access request to a corresponding redundant memory location in the redundant memory sector. Associated with each memory location selector, respective power supply control means are provided adapted to selectively connect/disconnect the associated memory location selector to/from a power supply distribution line.

Abstract: A semiconductor integrated circuit has a memory which can enter active state or standby state, and the memory has voltage generation circuits for bit lines and source lines with which memory cells are connected. The voltage generation circuits make the potential of the bit lines and the potential of the source lines equal to each other in response to an instruction to transition from active state to standby state. The voltage generation circuits produce a potential difference between the bit lines and the source lines in response to an instruction to transition from standby state to active state. In standby state, the potential of the bit lines and that of the source lines are equal to each other. Therefore, sub-threshold leakage does not occur between the source and drain of each memory cell. In active state, the source line potential is not varied.

Abstract: Deterioration in characteristics of a MOS transistor due to bias instability caused in a stand-by mode is suppressed to prevent deterioration in circuit characteristics. An operational amplifier circuit according to this invention includes MOS transistors for connection that are connected between back gates of differential MOS transistors and their sources and a MOS transistor for biasing that is connected between a power supply potential and the back gates. One of the MOS transistors for connection is a P-channel type MOS transistor having a gate to which a stand-by signal STB is applied. Another of the MOS transistors for connection is an N-channel type MOS transistor having a gate to which the reverse stand-by signal STBB is applied. And the MOS transistor for biasing is a P-channel type MOS transistor having a gate to which the reverse stand-by signal STBB is applied.

Abstract: Various methods, apparatuses, and systems are described in which a volatile memory that includes a plurality of volatile memory cells as well as a voltage limiting component and a current limiting component. Power consumption in a standby mode is controlled. The voltage limiting component and the current limiting component couple between the volatile memory cells and the ground voltage potential. One or more rows of memory cells in the memory array are isolated from the ground voltage potential to control power consumption in the standby mode by having the current limiting component stop passing current in the standby mode. A floating ground voltage potential sensed by each memory cell when in the standby mode is controlled by configuring the voltage limiting component to conduct when the floating ground voltage potential is larger than a threshold voltage of the voltage limiting component in order to reduce leakage current but reliably maintain the stored contents of the volatile memory cell.

Abstract: As the chip manufacturing process progresses towards making smaller and finer chip circuitry, leakage currents of different types including the subthreshold leakage current, gate tunneling leakage current and GIDL (Gate-Induced Drain Leakage) current increase. These leakage currents increase the electrical current consumption of the chip. In a semiconductor integrated circuit device comprising a circuit block having a first MOS transistor, and a leakage current control circuit having a second MOS transistor and a current source, a source and drain circuit of the second MOS transistor is formed between the power supply line of the circuit block and a voltage point where operating voltage is supplied.

Abstract: A storage cell having a storage circuit and a readout circuit may be used in power-saving environments, where the storage circuit may be maintained in an ultra-drowsy mode during power-saving periods while the readout circuit may be powered down during power-saving periods. A pull-down transistor may be incorporated into the readout circuit to reduce current leakage during power-saving periods.

Abstract: A semiconductor memory device capable of reducing power consumption by employing a DLL drive controller. The semiconductor memory device includes: an idle state detector for detecting an idle state that all banks are precharged; a delay locked loop (DLL) for synchronizing an internal clock with an external clock; and a DLL drive controller for controlling the delay locked loop in response to an idle state detection signal outputted from the idle state detector and a delay locked signal outputted from the DLL.

Abstract: A power-down mode exit control circuit enables a memory device to exit from an initially set power-down mode state using a clock enable signal. Specifically, although a clock enable signal is inputted in an unstable state at an initial operation indicating that a supply of a supply voltage is started, the present invention provides the power-down mode exit control circuit which is capable of escaping from the power-down mode at an internally set correct time. For this, the present invention comprises: a clock enable signal sensor for sensing an activation or deactivation state of a clock enable signal; and a power-down mode exit signal generator for activating and outputting a power-down mode exit signal in accordance with the activation state of the clock enable signal sensed by the sensor, after storing information related to the deactivation state of the clock enable signal sensed by the sensor.

Abstract: The present technique relates to a method and apparatus to provide a deep power down mode. In a memory device, such as DRAM or SRAM, various internal voltage buses provide power throughout the semiconductor chip. In a deep power down mode, grounding devices may be utilized to ground the internal voltage buses. With the internal voltage buses grounded, the outputs of the level shifters, which are control signals, may need to be forced into specific states. Through the use of the grounding devices and level shifters, leakage may be reduced and latch-up conditions may be reduced. As a result, the operation of the semiconductor chip may be enhanced because the problems associated with grounding the internal voltage buses may be diminished.

Abstract: In a memory circuit, a transistor formed in the same process as that of a logic transistor is used for peripheral circuitry except for a region to be supplied with high voltage. Thus, the manufacturing process can be simplified and a logic-merged memory operating at a high speed is provided.

Abstract: A semiconductor memory device includes a memory cell array, a decoder circuit configured to assert a decoding signal for selecting an access position in the memory cell array in response to an address signal supplied from an exterior, and a first circuit configured to put the decoding signal of the decoder circuit in an asserted state regardless of a value of the address signal in response to assertion of a standby signal supplied from the exterior.

Abstract: A CMOS integrated circuit (e.g., an SRAM or a DRAM) is partitioned into a core block, a peripheral block, and a retention block. The core block includes circuits (e.g., memory cells) that are powered on at all times and is coupled directly to power supply and circuit ground. The peripheral block includes circuits that may be powered on or off and are coupled to the power supply via a head switch and/or to circuit ground via a foot switch. The switches and the core block may be implemented with high threshold voltage (high-Vt) FET devices to reduce leakage current. The peripheral block may be implemented with low-Vt FET devices for high-speed operation. The retention block includes circuits (e.g., pull-up devices) that maintain signal lines (e.g., word lines) at a predetermined level so that the internal states of the core block are retained when the peripheral block is powered off.

Abstract: A method and system is disclosed for controlling power supply to a memory device. After determining at least one word line being selected, supply voltage lines are controlled so that a predetermined active mode voltage is provided to one or more predetermined memory cells associated with the selected word line, and a standby voltage lower than the active mode voltage is provided to all other unselected portions of the memory device.

Abstract: A feeding technique for a storage unit is provided, in which power can be supplied from an optimum power source depending on an operation mode of a cache memory, the stable switching of feeding paths can be performed, and the feeding with high voltage accuracy and small voltage variation can be achieved. For its achievement, the feeding system in the RAID system including a hard disk drive, a disk adaptor, a channel adaptor, and a cache memory is provided. The feeding system includes a DC-DC power source to supply, to the cache memory, the voltage for a normal operation mode in which the data is written/read to/from the cache memory, and a DC-DC power source to supply, to the cache memory, the voltage for a backup operation mode in which the data stored in the cache memory is retained, and the power sources are switched during the feeding depending on the operation mode of the cache memory.

Abstract: A semiconductor storage device in which the chip area is prevented from increasing to reduce the leakage current during low power (power down) time caused by shorting across bit and word lines due to crossing failure. There are provided precharge equalizing NMOS transistors the gates of which are supplied with a control signal (BLEQT). These precharge equalizing NMOS transistors are connected across a power supply line (VNLR), supplying a precharge potential to the bit line, and the bit line. At the time of low power operation, a potential (0.7 to 1.4V) lower than the potential VPP (e.g. 3.2V) applied during the precharge operation of the normal operation is supplied to the gate terminals of the transistors to reduce the leakage current caused by shorting across the bit and word lines caused in turn by crossing failure.

Abstract: A backup memory control unit can reduce the current consumption when a memory (SDRAM) is inactive by providing the memory with an unsettled mode in which no power is supplied to the memory. It provides the memory with the unsettled mode, and halts the power supply from a backup power supply to the SDRAM in the unsettled mode in which the SDRAM is not in operation, thereby limiting an increase in the current consumption. The functions are executed by a hardware circuit without using a backup microcomputer.

Abstract: In a semiconductor memory device which has a plurality of operation modes and can reduce a consumed electric current by carrying out the switching control of an internal signal for every operation mode by required minimum control, a control method thereof, and a control method of a semiconductor device, there are provided an address switching circuit 13 for propagating either a refresh address ADD (Ref) from a refresh counter 14 at a time of a refresh mode or an external address ADD (R/W) at a time of data-input/output mode as internal address ADD (INT), a mode discriminating circuit 11 for discriminating between a refresh operation requesting signal REQ (Ref) and a data input/output requesting signal REQ (R/W) and for outputting a mode discriminating signal M, and a switch holding circuit 12 for outputting a switch change-over signal SW in accordance with the mode discriminating signal M, and the connection of the address switching circuit 13 is switched only at a time of a mode change.

Abstract: A method for locating in an array of memory cells a set of cells having a stand-by current that exceeds a certain value based on their programming state. The method includes selecting all the cells of the array of memory cells as a set of cells to be tested, and dividing the set of cells to be tested into subsets of cells, and repeatedly sensing a stand-by current absorbed by the array of memory cells after having changed the programming state of the subsets of cells. The sensed stand-by currents are compared and a subset of cells having a stand-by current exceeding the certain value are identified as a function of the comparison. The identified subset of cells is selected as a new set of cells to be tested, and the method is repeated. Otherwise, the testing stops with the just tested subset of cells having a stand-by current exceeding the certain value.

Abstract: A word line driver circuit for a semiconductor memory device. One or more transistors in the driver circuit are fabricated such that they are susceptible, under certain conditions, to gate-induced diode leakage (GIDL). One terminal of the transistors are coupled to a local supply node, which during standby conditions when the word line driver circuit is not driving a word line, is maintained at a voltage less than that of a global power supply node. In one embodiment, the local power supply node is coupled to the global power supply node by means of at least one decoupling transistor receiving a control signal at its gate and by a vt-connected transistor, such that the voltage on the local power supply node is maintained at a level not exceeding one transistor threshold voltage less than the global power supply node voltage when the decoupling transistor is off.

Abstract: A row driver receives an input signal and a test mode signal, and is coupled to first and second voltage sources and has an output coupled to a word line. The row driver operates in an active mode responsive to the test mode signal going inactive to couple the output to either the first or second voltage source responsive to the input signal. The row driver operates in a standby mode responsive to the test mode signal going active to present a high impedance to the word line. A method includes detecting a first mode of operation of a memory device and floating at least some of the word lines when the first mode is detected. The memory device may be a flash memory device and the first mode may be a standby mode of operation of the flash memory device.

Abstract: A method for controlling a semiconductor memory in which a mode register can be set in a burst mode. To set an operation mode in the burst mode, the semiconductor memory is changed first from the burst mode, through a power-down mode, to a standby mode of non-burst mode. Then the semiconductor memory is changed to a mode register set mode to set the mode register when commands are input in the same predetermined sequence that is used in the non-burst mode.

Abstract: A precharge control circuit of a pseudo SRAM including a precharge set signal generation unit configured to output a precharge set signal, a precharge standby signal generation unit configured to output a precharge standby signal, a precharge signal output unit configured to output a precharge signal in response to the precharge set signal and the precharge standby signal, a first precharge control unit configured to forcedly control the output signal of the precharge standby signal generation unit such that the precharge signal is generated in a period where a chip select signal is disabled, in the case where the chip select signal is disabled long for a first time, and a second precharge control unit configured to forcedly control the output signal of the precharge standby signal generation unit such that the precharge signal is generated in a period where the chip select signal is disabled, in the case where the chip select signal is disabled long for a second time longer than the first time, wherein the p

Abstract: A semiconductor integrated circuit has a memory which can enter active state or standby state, and the memory has voltage generation circuits for bit lines and source lines with which memory cells are connected. The voltage generation circuits make the potential of the bit lines and the potential of the source lines equal to each other in response to an instruction to transition from active state to standby state. The voltage generation circuits produce a potential difference between the bit lines and the source lines in response to an instruction to transition from standby state to active state. In standby state, the potential of the bit lines and that of the source lines are equal to each other. Therefore, sub-threshold leakage does not occur between the source and drain of each memory cell. In active state, the source line potential is not varied.

Abstract: A memory system includes a memory array, a plurality of wordline drivers, a row address decoder block which has a plurality of outputs connected to selected ones of the wordline drivers, a row selector block which has a selector lines connected to individual ones of the wordline drivers. A power management circuit having a power down input for a power down input signal (WLPWRDN) and a wordline power down output (WLPDN) is connected to the wordline drivers to lower the power consumption thereof as a function of the power down input signal.

Abstract: A semiconductor storage device for driving a word line by a voltage higher than an external supply voltage that includes a boost circuit for outputting a boosted voltage of a first electric potential by boosting the external power supply potential, an auxiliary capacitor for storing the output potential of the boost circuit at the time of a standby state, a switch for supplying to a word line driving power supply line a second electric potential obtained by voltage dividing the first electric potential at the time of the standby and being turned off at the time of an operation, and an amplifier circuit for receiving the first electric potential as a driving power supply potential and driving the word line driving power supply line by the second electric potential at the time of the operation.

Abstract: A semiconductor integrated circuit is provided with a reference voltage generation circuit for generating a voltage to be a reference, a function circuit that is operated using an output voltage of the reference voltage generation circuit, and a reference voltage stabilization capacitor for stabilizing the output voltage, which is connected to an output terminal of the reference voltage generation circuit. During standby, the function circuit stops operating while the reference voltage generation circuit continues operating to prevent discharging of the reference voltage stabilization capacitor, thereby realizing reduction in power consumption of the function circuit such as an analog circuit as well as high-speed recovery from the standby state to the normal operation state.

Abstract: In a semiconductor memory device which has a plurality of operation modes and can reduce a consumed electric current by carrying out the switching control of an internal signal for every operation mode by required minimum control, a control method thereof, and a control method of a semiconductor device, there are provided an address switching circuit 13 for propagating either a refresh address ADD (Ref) from a refresh counter 14 at a time of a refresh mode or an external address ADD (R/W) at a time of data-input/output mode as internal address ADD (INT), a mode discriminating circuit 11 for discriminating between a refresh operation requesting signal REQ (Ref) and a data input/output requesting signal REQ (R/W) and for outputting a mode discriminating signal M, and a switch holding circuit 12 for outputting a switch change-over signal SW in accordance with the mode discriminating signal M, and the connection of the address switching circuit 13 is switched only at a time of a mode change.

Abstract: A leakage current of the MOS transistor of a power control section at a standby time is drastically reduced and the reduction of the consumption power is achieved. A memory module is provided with power control sections. When either of the memory mats is not selected, the power control sections stop the power supply voltage to a non-selected memory mat, a word driver, an input-output circuit, a control circuit and an output circuit. At the standby time of the memory module, the power control section stops a power supply to power control sections, a control circuit, a predecoder circuit, and an input circuit. In this manner, the leakage current of the MOS transistor of the power control sections at the standby time can be drastically reduced.

Abstract: The present invention achieves technical advantages as embodiments of an SRAM cell (20, 30) having the bit line voltage (BLB/BLB) controlled during standby, such as allowing the bit line to float allowing the bit line voltage to be established by balance of leakage currents to the minimum leakage through the bit line. Advantageously, a controller (22, 32) also controls voltages of supplies Vdd, Vss and the n-well (Vnwell) voltage. The controller reduces a voltage differential between the supply voltage Vdd and voltage Vss in the standby mode. In one embodiment, the bit line may be tied to the reference voltage Vss, and a time delay may be introduced to reduce the possibility of using more charge in switching than that saved.

Abstract: A memory system includes a memory array, a plurality of wordline drivers, a row address decoder block which has a plurality of outputs connected to selected ones of the wordline drivers, a row selector block which has a selector lines connected to individual ones of the wordline drivers. A power management circuit having a power down input for a power down input signal (WLPWRDN) and a wordline power down output (WLPDN) is connected to the wordline drivers to lower the power consumption thereof as a function of the power down input signal.

Abstract: Systems and methods are provided for reducing power consumption in the form of leakage current in a memory array. One embodiment discloses a memory array system. The memory array system comprises a plurality of memory cells and a programmable switching control circuit. The programmable switching control circuit is operative to arrange the plurality of memory cells in a standard configuration in an activation mode and to arrange the plurality of memory cells in a stacked configuration in a retention mode.

Abstract: A method and related apparatus for utilizing an ACPI to maintain data stored in a DRAM includes a processor, a DRAM, a south bridge chipset, and a rechargeable battery device. The south bridge chipset includes a system controller, a buffer, a memory controller, an integrated device electronics controller, and a data conversion circuit. The data conversion circuit converts a hard-disk access command transmitted from the system controller into a memory access command of the memory controller. The memory controller accesses the buffer and the DRAM by executing the memory access command. When the computer system enters a power-saving mode, a switch is turned on allowing the battery device to constantly self-refresh the DRAM for maintaining the data stored in the DRAM. When the computer system powers up, the switch is turned off and the battery device is recharged.

Abstract: An apparatus and method are provided for limiting a drop of a supply voltage in an SRAM device to retain the state of the memory during an IDLE state. The apparatus may include a memory array, a sleep device, and a clamping circuit. The clamping circuit may be configured to activate the sleep device when a voltage drop across the memory array falls below a preset voltage and the memory array is in an IDLE state.

Abstract: The present invention relates to a semiconductor memory device having a voltage driving circuit.

Abstract: A power control unit activates a control signal ST for a circuit block to be set to a standby state before turning off power of the circuit block or a whole chip, and saves an operation result of data processing of the circuit block into a memory unit. When the power is again supplied to the circuit block in the standby state, the power control unit activates a control signal RES after the power supply is started and restores the data saved in the memory unit to the circuit block. Flip-flops in the circuit block are connected in series when the saving or restoring of data is performed, and perform a data transfer operation with a path different from that in a normal operation. Therefore, a semiconductor device can be provided which can rapidly transit to a standby mode having reduced current consumption while holding internal information.

Abstract: In order to reduce a gate-source leakage current in a standby state, the gate insulating film of one of transistors in each of inverters IV1–IV5 is made thick. In a standby state, an input signal IN has L level and accordingly one of the transistors in inverters IV1–IV5 each that is connected to a main power supply line or a main ground line is turned on. The turned-on transistors have the gate insulating film which is made thicker than that of normal transistors to reduce the gate leakage current thereby reduce current consumption in the standby state.

Abstract: An electronic device (10), comprising a plurality of data storage cells (12), collectively operable in a data access mode and separately in a sleep mode. The sleep mode comprises a period of time during which the plurality of data cells are not accessed and during which a data state stored in each cell in the plurality of data cells is to be maintained at a valid state. The electronic device further comprises circuitry (18?) for providing at least one temperature-dependent voltage to at least one storage device in each cell in the plurality of data storage cells during the sleep mode.

Abstract: When power stoppage of a main power supply is detected during a normal operation, a power controller switches a power supply for a DRAM from the main power supply to a battery power supply and makes an instruction signal for instruction a self-refresh mode to a memory controller active. In response to this, the memory controller changes a clock enable signal for the DRAM to a low level to establish the self-refresh mode of the DRAM, and, after, the self-refresh mode of the DRAM is established, supplying of power to the memory controller is stopped. The clock enable signal for the DRAM is maintained to the low level by pull-down resistance even when the supplying of power to the memory controller is stopped from a condition that the signal is changed to the low level in the self-refresh mode, thereby maintaining the self-refresh mode of the DRAM.

Abstract: While a memory section (1) is in standby mode, a power supply/interruption circuit (2) supplies electric power to a memory section (1) only during periods in which a refresh operation is performed in synchronization with a timing of the refresh operation generated by the clock circuit (3), and interrupts power supply to the memory section (1) during periods in which the refresh operation is not performed. Thus, power consumption of the memory section that performs the refresh operations is suppressed, by which a power consumption reduction of the semiconductor storage device is realized.

Abstract: A semiconductor device that quickly saves data stored in an area to which power is supplied intermittently. Power is supplied intermittently to a first area. Power is supplied continuously to a second area. A memory is located in the second area. A save circuit saves data used in the first area in the memory before the supply of power being stopped. A restoration circuit restores data which has been saved in the memory to a predetermined circuit in the first area. A power supply control circuit supplies power to the memory if data has been saved in the memory. Otherwise the power supply control circuit stops the supply of power to the memory.

Abstract: A CPU (1) automatically preserves the CPU context in a computer memory (5) that remains powered-up when the CPU is powered down in sleep mode. By means of the preserved CPU context, the CPU is able to instantly and transparently resume program execution at the instruction of the program that was asserted for execution when the CPU was powered down. The CPU is permitted to power down frequently, even during execution of a program, and results in reduced average overall power consumption.

Abstract: A circuit for reducing standby leakage in a memory unit contains a capacitive divider coupled to the memory unit so as to generate a voltage across the memory unit, which is adequate to retain memory values during one of a sleep state and a standby state. An inductive circuit for reducing standby leakage in a memory unit includes an inductive divider coupled to the memory unit so as to generate a voltage across the memory unit, which is adequate to retain memory values during one of a sleep state and a standby state.

Abstract: An internal voltage generator when activated, generates an internal voltage to be supplied to an internal circuit. Operating the internal voltage generator consumes a predetermined amount of the power. In response to a control signal from the exterior, an entry circuit inactivates the internal voltage generator. When the internal voltage generator is inactivated, the internal voltage is not generated, thereby reducing the power consumption. By the control signal from the exterior, therefore, a chip can easily enter a low power consumption mode. The internal voltage generator is exemplified by a booster for generating the boost voltage of a word line connected with memory cells, a substrate voltage generator for generating a substrate voltage, or a precharging voltage generator for generating the precharging voltage of bit lines to be connected with the memory cells.

Abstract: A semiconductor memory device is provided, which is capable of effectively reducing a current comsumption caused by a self-refresh operation in a stand-by mode. In the refresh operation in the stand-by mode, under the control by a refresh control circuit 8B, firstly, a suppression is made for current driving abilities of sense amplifiers 70A˜70D provided for amplifying data signals appearing on bit lines, and secondly, an expansion is made of a pulse width of a row enable signal RE, which defines a period of time for selecting word lines WL, and thirdly, parallel activations of plural word lines are made based on the row enable signal RE with the expanded pulse width, thereby reducing the frequency of operations of the circuit system associated with the refresh operations, resulting in a suppression of the current consumption.

Abstract: A dynamic semiconductor memory device capable of reducing standby current is disclosed. In a standby mode wherein only a refresh operation is performed, a precharge/equalize signal is activated only during a predetermined period before a word line is activated so as to precharge a bit line pair to a voltage that is half a line voltage immediately before the word line is activated. In the standby mode, the bit line pair is electrically isolated from a regulator that generates a voltage that is half the line voltage except for the above predetermined period, thus preventing leakage current from flowing therebetween even if a defect in which the word line is shorted with the bit lines occurs.

Abstract: An operating current is supplied from a power supply node to an internal circuit. In a test mode, current supply from a power supply to the power supply node is stopped by a current switch, and an externally adjustable test current is supplied to the power supply node. The test current is set in accordance with an acceptable value of a leakage current in the internal circuit. Evaluation is made as to whether the leakage current in the internal circuit is not greater than the acceptable value, in accordance with an output of a voltage comparison circuit detecting a voltage drop at the power supply node.

Abstract: A semiconductor integrated circuit device includes connected TC unit type ferroelectric memory which includes series connected memory cells each having a cell transistor having a source terminal and a drain terminal and a ferroelectric capacitor inbetween the two terminals, a first power supply circuit which generates a first power supply potential supplied to the gate of the cell transistor when the cell transistor is in a standby state, and a second power supply circuit. The second power supply circuit generates a second power supply potential supplied to the source or drain of the cell transistor and starts operating following the start-up of the first power supply circuit after a power-on.