Abstract: A circuit on an end column of a divided memory array is formed by a block selection transistor having the same shape as that of a memory cell transistor. As the pattern of the connecting section between the main bit line and the sub-bit line is made in the same shape as that of the memory cell, it is possible to realize a pattern uniformity and to eliminate the need for using memory array dummy patterns.

Abstract: A semiconductor device includes a plurality of word lines, a plurality of bit lines, a plurality of memory cells provided at the intersections of the plurality of word lines and the plurality of bit lines and each of that includes a MIS transistor and a memory element, a decoder circuit for selecting a plurality of word lines, and a sense-amplifier circuit for determining information that is read from any of the plurality of memory cells to any of the plurality of bit lines, wherein a twist connector for switching the wiring order of the plurality of word lines is provided and level-stabilizing circuits, for supplying the potential level of a non-selected state to the plurality of word lines in the non-selected state are arranged in the area below the twist connector.

Abstract: Methods and apparatus relating ultra-low voltage memory bit cells are described. In an embodiment, an ultra-low voltage memory device is provided using redundant paths to data storage nodes controlled by complementary write word lines. Other embodiments are also described.

Abstract: A multiple-port SRAM cell includes a latch having a first node and a second node for retaining a value and its complement, respectively. The cell has a write port separate from a read port for parallel operation. A number of transistors are used to connect the first and second nodes to a number of bit lines, such as a read port bit line, a read port complementary bit line, a read/write port bit line, and a read/write port complementary bit line. In a layout view of the multiple-port SRAM cell, the read port bit line, read port complementary bit line, read/write port bit line and read/write port complementary bit line are separated by at least one supply voltage line, one or more complementary supply voltage lines, and one or more word line landing pads.

Abstract: A symmetrical blocking transient voltage suppressing (TVS) circuit for suppressing a transient voltage includes an NPN transistor having a base electrically connected to a common source of two transistors whereby the base is tied to a terminal of a low potential in either a positive or a negative voltage transient. The two transistors are two substantially identical transistors for carrying out a substantially symmetrical bi-directional clamping a transient voltage. These two transistors further include a first and second MOSFET transistors having an electrically interconnected source. The first MOSFET transistor further includes a drain connected to a high potential terminal and a gate connected to the terminal of a low potential and the second MOSFET transistor further includes a drain connected to the terminal of a low potential terminal and a gate connected to the high potential terminal.

Abstract: A method adapts circuit components of a memory module to changing operating conditions within a predefined range. According to one embodiment, a memory module provides a sensor arrangement and a communication bus. Sub-ranges are defined for at least one operating condition, in which the circuit components can work with a fixed setup. During operation, the current state of the at least one operating condition is sensed using the sensing arrangement. The sensed state of the operating condition is mapped to one of the predefined ranges and an associated set of control signals is transmitted over the communication bus. The control signals transmitted over the communication bus are used to adapt at least one circuit component to the current operating conditions.

Abstract: A memory cell and method for making a memory cell in accordance with embodiments of the present invention includes two or more tunnel diodes, a loading system, and a driving system. The two or more tunnel diodes are coupled together, the loading system is coupled to the tunnel diodes and the driving system is coupled to the tunnel diodes and the loading system. The driving system drives a sense node from the tunnel diodes, the loading system, and the driving system between at least three or more substantially stable logic states.

Abstract: An integrated circuit includes a logic portion including M conductive layers, a memory portion including N conductive layers, and at least one common top conductive layer over the logic portion and the memory portion. M is greater than N.

Abstract: A system having a memory cell. In certain embodiments, the memory cell includes a resistive memory element, an access transistor having a gate, a first terminal, and a second terminal, and a control transistor having a gate, a first terminal, and a second terminal. The first terminal of the access transistor may be coupled to the resistive memory element, and the gate of the access transistor may be coupled to the gate of the control transistor. Additionally, the first terminal of the control transistor may be coupled to the resistive memory element.

Abstract: In a semiconductor storage device, either two memory cell gates TG or a memory cell gate TG and a bit-line connecting gate SW are formed in every set of n-type doped regionsOOD at the intersections with word lines WL or bit-line selecting lines KS. A portion near the center of the set of n-type doped regions OD serves as a source/drain region shared by two gates, whereas portions near both ends thereof serve as source/drain regions for respective gates. Each of the source/drain regions is connected to a storage electrode SN of a memory cell capacitor via a storage contact CA or is connected to a sub bit line or a main bit line via a sub-bit-line contact CH and/or a via of a metal interconnection. A pattern formed of four memory cell gates TG and four bit-line connecting gates SW is repeated.

Abstract: It is an object of the present invention to provide a semiconductor integrated circuit having a chip layout that reduces line length to achieve faster processing. A cache comprises a TAG memory module and a cache data memory module. The cache data memory module is divided into first and second cache data memory modules which are disposed on both sides of the TAG memory module, and input/output circuits of a data TLB are opposed to the input/output circuit of the TAG memory module and the input/output circuits of the first and second cache data memory modules across a bus area to reduce the line length to achieve faster processing.

Abstract: Provided are a non-volatile memory device and a cross-point memory array including the same which have a diode characteristic enabling the non-volatile memory device and the cross-point memory array including the same to operate in a simple structure, without requiring a switching device separately formed so as to embody a high density non-volatile memory device. The non-volatile memory device includes a first electrode; a diode-storage node formed on the first electrode; and a second electrode formed on the diode-storage node.

Abstract: This disclosure concerns a memory including: unit cells having ferroelectric capacitors and cell transistors; two depletion transistors and two enhancement transistors serially connected between two adjacent unit series configurations configured by serially connecting the unit cells; four selective lines respectively connected to the gates of the two enhancement transistors and the two depletion transistors; word lines connected to the gates of the cell transistors; a bit line connected to the unit series configuration via at least one of the enhancement transistors and the depletion transistors; and a bit line contact connecting the bit line to at least one of the enhancement transistors and the depletion transistors, wherein in two of adjacent bit lines, the bit line contact connected to one of the two adjacent bit lines and the bit line contact connected to the other bit line are opposed to each other with respect to one of the selective lines.

Abstract: A multiple-port SRAM cell includes a latch having a first node and a second node for retaining a value and its complement, respectively. The cell has a write port separate from a read port for parallel operation. A number of transistors are used to connect the first and second nodes to a number of bit lines, such as a read port bit line, a read port complementary bit line, a read/write port bit line, and a read/write port complementary bit line. In a layout view of the multiple-port SRAM cell, the read port bit line, read port complementary bit line, read/write port bit line and read/write port complementary bit line are separated by at least one supply voltage line, one or more complementary supply voltage lines, and one or more word line landing pads.

Abstract: There is provided a semiconductor storage device having a memory cell including a transfer transistor, a load transistor and a drive transistor, which includes a first transfer transistor to become conductive by a potential applied to a first word line placed in parallel with a pair of bit lines, a second transfer transistor to become conductive by a potential applied to a second word line placed orthogonal to the pair of bit lines, and a control circuit to output a control signal for controlling the potentials of the first word line and the second word line in such a way that the first transfer transistor becomes conductive earlier than the second transfer transistor when setting both of the first transfer transistor and the second transfer transistor to a conductive state.

Abstract: A semiconductor memory device including a transistor having a vertical channel structure is provided. The device comprises a first sub memory cell array comprising a first memory cell connected to a first bit lines and comprising a transistor having a vertical channel structure, a second sub memory cell array comprising a second memory cell connected to a first inverted bit lines and comprising a transistor having a vertical channel structure, and a plurality of precharge blocks. In addition, first and second precharge blocks are disposed at first and second sides of the first bit line and precharge the first bit line, and third and fourth precharge blocks are disposed at first and second sides of the first inverted bit line and precharge the first inverted bit line.

Abstract: In a semiconductor memory device the power level of which is strengthened by using data input/output pads in a no connection state, and a method of strengthening the power of the semiconductor memory device at a stabilized power level, the semiconductor memory device comprises: a plurality of data input/output drivers; and a plurality of data input/output pads, each connected to a corresponding one of the plurality of data input/output drivers. A first subset of the data input/output pads are connected to respective data input/output pins of a package, and several or all of a remaining subset of the data input/output pads that are not connected to data input/output pins of the package are connected to power pins of the package.

Abstract: An integrated circuit has a plurality of first memory cells, which are electrically coupled along a first line, and additionally has a plurality of second memory cells which are electrically coupled along a second line. The integrated circuit furthermore has a switching unit having a plurality of switching elements having in turn a first contact and a second contact. The first contact of a first switching element is coupled to the plurality of first memory cells, and the first contact of a second switching element is coupled to the plurality of second memory cells. In addition, the first contact of a third switching element is coupled to the second contact of the first switching element, and the first contact of a fourth switching element is coupled to the second contact of the second switching element.

Abstract: An integrated circuit comprises a memory cell array portion and a support circuitry portion. The memory cell array portion comprises at least one bitline and at least one wordline, which is disposed above the bitline. The support circuitry portion comprises a FinFET comprising a gate electrode. An upper side of a portion of the gate electrode is disposed at the same height as an upper side of a portion of the bitline. A method of manufacturing an integrated circuit comprises the steps of forming a memory cell array and forming a support circuitry. The step of forming the memory cell array comprises forming a bitline and forming a wordline disposed above the bitline. The step of forming the support circuitry comprises forming a FinFET. The step of forming the FinFET comprises forming a gate electrode, an upper side of a portion of the gate electrode being formed at the same height as an upper side of a portion of the bitline.

Abstract: A basic cell comprises a memory cell capable of retaining data having at least a binary value, a first selecting transistor connected between a first terminal of the memory cell and the Mth bit line, and a second selecting transistor connected between the first terminal of the memory cell and the M+1th bit line. A gate of the first selecting transistor is connected to the 2·N?1th selecting line, and a gate of the second selecting transistor is connected to the 2·Nth selecting line.

Abstract: An object of this invention is to provide a rewritable nonvolatile memory cell that can have a wide reading margin, and can control both a word line and a bit line by changing the level of Vcc. As a solution, a flip-flop is formed by cross (loop) connect of inverters comprising memory transistors that can control a threshold voltage by charge injection into the side spacer of the transistors. In the case of writing data to one memory transistor, a high voltage is supplied to a source of the memory transistor through a source line and a high voltage is supplied to a gate of the memory transistor through a load transistor of the other side inverter. In the case of erasing the written data, a high voltage is supplied to the source of the memory transistor through the source line.

Abstract: A semiconductor memory device that can achieve high-speed operation or that is highly integrated and simultaneously can achieve high-speed operation is provided. Transistors are disposed on both sides of diffusion layer regions to which capacitor for storing information is connected and other diffusion layer region of each transistor is connected to the same bit line. When access to a memory cell is made, two transistors are activated and the information is read. When writing operation to the memory cell is carried out, two transistors are used and electric charges are written to the capacitor.

Abstract: An exposure apparatus illuminates a pattern with an energy beam and transfers the pattern onto a substrate via a projection optical system. The exposure apparatus includes a substrate stage on which the substrate is mounted that moves within a two-dimensional plane holding the substrate. The apparatus also includes a supply mechanism that supplies liquid to a predetermined spatial area which includes a space between the projection optical system and the substrate on the substrate stage, and an adjustment unit that adjusts exposure conditions based on temperature information on the liquid between the projection optical system and the substrate.

Abstract: A semiconductor memory device includes a memory cell array region in which vertical transistors each having a lower electrode connected to a bit line is regularly arranged with a predetermined pitch, including memory cells formed using at least the vertical transistors; a peripheral circuit region arranged adjacent to the memory cell array region in a bit line extending direction; and a predetermined circuit arranged overlapping the peripheral circuit region and the memory cell array region. In the semiconductor memory device, the vertical transistors each having an upper electrode connected to the predetermined circuit are included in an end region of the memory cell array region, in which no word line is provided.

Abstract: A semiconductor memory device has a simple layout pattern of a sub hole region. The semiconductor memory device includes a segment input/output line, a first local input/output line and a second local input/output line corresponding to the segment input/output line, an input/output switch configured to selectively connect the segment input/output line and the first local input/output line in response to a first switch control signal, and a dummy input/output switch which is connected to a second local input/output line but is not connected to the segment input/output line.

Abstract: Non-volatile memory devices utilizing a modified NAND architecture where both ends of the NAND string of memory cells are selectively coupled to the same bit line may facilitate increased memory densities, reduced fabrication steps and faster read operations when compared to traditional NAND memory array architectures. Programming and erasing of the memory cells can be accomplished in the same manner as a traditional NAND memory array. However, reading of the memory cells may be accomplished using charge sharing techniques similar to read operations in a DRAM device.

Abstract: To secure a sufficient read-out voltage even when lines are arranged at a fine pitch, a semiconductor memory device including: a memory array in which a plurality of memory cells are arranged in rows and columns; and a plurality of bit lines associated with the respective columns of the memory cells is provided. The bit lines include main bit lines and sub bit lines to have a hierarchical structure, the main bit lines are divided among a plurality of interconnection layers, and a distance between the main bit lines in one of the interconnection layers is larger than a distance between the sub bit lines.

Abstract: A semiconductor memory is achieved which allows a reduction in the area of a memory array block without reducing the gate widths of floating gates. A plurality of select gates extend in straight lines in the X direction. Between the upper- and lower-side select gates, two rows' worth of floating gates are arranged. The plurality of floating gates are placed in a staggered arrangement (in other words, in a zigzag pattern). That is, looking at one floating gate in a specific column and another floating gate in a column adjacent to that specific column, those floating gates deviate from each other in the Y direction.

Abstract: Disclosed is a multi-chip package having a plurality of memory chips. Each memory chip includes a memory cell array storing e-fuse data, a read-out control circuit reading e-fuse data in response to a read signal, a first internal pad receiving a first control signal, a read-out controller generating the read signal to define a read period, and to generate a second control signal following the read period, and a second internal pad receiving the second control signal, wherein the plurality of memory chips is connected series and each respective read-out control circuit and read-out controller in each one of the plurality of memory chips cooperate to implement a sequential read of e-fuse data across the plurality of memory chips.

Abstract: A memory cell structure of a metal (or via) programmable ROM whereby a transistor is shared between bit cells of the programmable ROM. Such a memory cell structure may include: a word line; a bit line; first and second virtual grounding lines; a grounding line; a first bit cell selected by signals of the word line and the first virtual grounding line; and a second bit cell selected by signals of the word line and the second virtual grounding line, wherein a cell transistor, one side of which is connected to the bit line is shared both by the first and second bit cells. Also, the other side of the cell transistor may be floated or connected to the bit line or, alternatively, connected to any one of the first virtual grounding line, the second virtual grounding line and the grounding line, and the gate of the cell transistor is connected to the word line.

Abstract: An embodiment of the present invention is an SRAM memory array comprising memory cells with each cell containing six devices, the storage nodes which store the true and complement of the data are constructed from a four device, cross coupled flip-flop cell, wherein one internal storage node of this cell is connected through an access pass gate to one local bit line (LBL), the second internal storage node connected in a like manner to a second LBL, each LBL connected to a limited number, e.g. 8 to 32 of other similar storage cells, the two LBLs each connected to the gate of a separate read head nFET for discharging to ground one of two previously precharged global read lines so as to pass the inverse of the signal on the LBL and thus on the read head gate to a global read/write bit line.

Abstract: An integrated circuit (IC) is provided that includes at least one static random access memory (SRAM) cell wherein performance of the SRAM cell is enhanced, yet with good stability and writability. In particular, the present invention provides an IC including at least one SRAM cell wherein the gamma ratio is about 1 or greater. The gamma ratio is increased with degraded pFET device performance. Morever, in the inventive IC there is no stress liner boundary present in the SRAM region and ion variation for all devices is reduced as compared to that of a conventional SRAM structure. The present invention provides an integrated circuit (IC) that comprises at least one SRAM cell including at least one nFET and at least one pFET; and a continuous relaxed stressed liner located above and adjoining the nFET and the pFET.

Abstract: Subarrays, which constitute a memory cell array, each include a bit line driving transistor having a drain connected to a bit line, a source is connected to an interconnection having a power supply potential, and a gate is connected to a sub-bit line. The plurality of memory cells are each provided in such away that a gate is connected to a word line, a source is grounded, and whether a drain is connected to the sub-bit line or not is selected in correspondence to data to be stored. Transmission transistors each have a gate connected to the bit line, a source connected to a loading transistor section, and a drain connected to the sub-bit line.

Abstract: A basic cell comprises a memory cell capable of retaining data having at least a binary value, a first selecting transistor connected between a first terminal of the memory cell and the Mth bit line, and a second selecting transistor connected between the first terminal of the memory cell and the M+1th bit line. Agate of the first selecting transistor is connected to the 2·N?1th selecting line, and a gate of the second selecting transistor is connected to the 2·Nth selecting line.

Abstract: A high-density non-volatile memory array. In one aspect of the invention, a memory array circuit includes a plurality of word lines, a plurality of bit-lines, and a plurality of memory cell transistors. The gate of each memory cell transistor is connected to one of the word lines, and the drains and sources of each memory cell transistor are connected only to the bit-lines.

Abstract: An integrated circuit and associated method of programming are provided. Such integrated circuit includes a memory cell with a diode and an antifuse in communication with the diode. The antifuse is constructed to include a high-K dielectric material with a K greater than 3.9. Further, the memory cell is programmed utilizing a programming pulse that reverse biases the diode thereof.

Abstract: A layout structure of a Sub-Word Line Driver (SWD) and a forming method thereof. A layout structure of an SWD may include first through fourth metal-oxide-semiconductor (MOS) transistors. The layout structure may include a first area including an active area of the first MOS transistor, wherein a gate-poly (GP) of the first MOS transistor may be disposed in a predefined direction over a portion of the first area. The layout structure may also include a second area including an active area of the second through fourth MOS transistors. Each GP of the second through fourth MOS transistors may be disposed in parallel to each other. The GP of the first MOS transistor disposed in the predefined direction may be substantially perpendicular to each GP of the second through fourth MOS transistors. The layout structure of an SWD can improve a driving capability without increasing an area of the chip.

Abstract: A memory structure, includes: an array of individual memory cells arranged in a network of bit lines and word lines, each individual memory cell further comprising a resistive memory device that is capable of being programmed to a plurality of resistance states, each of the resistive memory devices coupled to one of the bit lines at a first end thereof; a rectifying element in series with each of the resistive memory devices at a second end thereof; an access transistor associated with each of the individual memory cells, the access transistors activated by a signal applied to a corresponding one of the word lines, with each access transistor connected in series with a corresponding rectifying element; and a common connection configured to short neighboring rectifying devices together along a word line direction, in groups of two or more.

Abstract: An NBTI-resilient memory cell is made up of a ring of multiple NAND gates. The NAND gates are arranged such that one of the NAND gates has a “0” in its output, while the remaining NAND gates have a “1” in their outputs. PMOS transistors within the memory cell experience less degradation than in inverter-based memory cells. Guard-banding to account for transistor degradation may be mitigated, or the operating frequency of the memory cell may be increased.

Abstract: This invention provides a semiconductor memory device with enhanced speed performance or enabling timing adjustment reflected in characteristic variation of memory cells, adapted to suppress an increase in the number of circuit elements. A write dummy bit section comprises a first dummy line and a second dummy line corresponding to complementary bit lines and a plurality of first dummy cells formed to be similar in shape to static memory cells, wherein a write current path is coupled between the first dummy line and the second dummy line. In the write dummy bit section, one voltage level is input to the first dummy line through driver MOSFETs in relation to write signal inputs to the static memory cells and a signal change in the second dummy line precharged at the other voltage level is sensed and output. A timing control circuit deselects a word line selected by an output signal from the write dummy bit section.

Abstract: A DRAM whose operation is sped up and power consumption is reduced is provided. A pair of precharge MOSFETs for supplying a precharge voltage to a pair of input/output nodes of a CMOS sense amplifier is provided; the pair of input/output nodes are connected to a complementary bit-line pair via a selection switch MOSFET; a first equalize MOSFET is provided between the complementary bit-line pair for equalizing them; a memory cell is provided between one of the complementary bit-line pair and a word line intersecting with it; gate insulators of the selection switch MOSFETs and first equalize MOSFET are formed by first film thickness; a gate insulator of the precharge MOSFET is formed by second film thickness thinner than the first film thickness; a precharge signal corresponding to a power supply voltage is supplied to the precharge MOSFET; and an equalize signal and a selection signal corresponding to a boost voltage are supplied to the first equalize MOSFET and the selection switch MOSFET, respectively.

Abstract: An integrated circuit having a memory cell array and a method of forming an integrated circuit is disclosed. One embodiment provides bitlines running along a first direction, wordlines running along a second direction substantially perpendicular to the first direction, active areas and bitline contacts. The bitline contacts are arranged in columns extending in the second direction and in rows extending in the first direction. A distance between neighboring bitlines is DL, and a distance between neighboring bitline contacts is DC, DC being measured parallel to the first direction. The following relation holds: 1/2.25?DL/DC?1/1.75.

Abstract: In a flat cell read only memory, two bit lines or two virtual ground lines share a common contact such that the contact is slightly adjustable in its location for inserting a local metal word line without increasing the layout area to improve the reading speed of the memory. Moreover, two adjacent banks of the memory share common bit lines or virtual ground lines, whereby reducing the contact density and height of the memory.

Abstract: A multi-threshold integrated circuit (IC) that may be supplied by multiple supplies, with an array of latches such as an array static random access memory (SRAM) cells and a CMOS SRAM with improved stability and reduced subthreshold leakage. Selected devices (NFETs and/or PFETs) in array cells and support logic, e.g., in the data path and in non-critical logic, are tailored for lower gate and subthreshold leakage. Normal base FETs have a base threshold and tailored FETs have a threshold above. In a multi-supply chip, circuits with tailored FETs are powered by an increased supply voltage.

Abstract: A semiconductor memory device includes memory cell arrays, word lines, bit lines, column gates, sense amplifiers, and an error correcting circuit. The memory cell array includes first regions and a second region. The first region includes first element isolating regions which have stripe shapes along the bit lines. The memory cell is formed on an element region between the adjacent element isolating regions. The first regions are arranged in plurality along the word line direction. The second region is provided adjacent to the first region in a direction along the word lines. The second region includes a second element isolating region whose width along the word line direction is greater than that of the first element isolating region. Addresses of the bit line adjacent to the second region are different from one another among the memory cell arrays.

Abstract: A semiconductor storage array has a first array portion on a first plane of circuitry and a second array portion on a second plane of circuitry. A composite bit line and/or a composite word line is divided and arranged to have a first portion on the first array portion and a second portion on the second array portion. The two portions of the composite word line or the composite bit line are on different planes of circuitry, and three-dimensional interconnections connect proximal ends of the word line portions, or proximal ends of the bit line portions. A word line driver drives the word line portions in parallel. A bit line driver drives the bit line portions in parallel. Signal propagation times down the composite word or bit lines are significantly less than signal propagation times down corresponding undivided word or bit lines.

Abstract: There are many inventions described and illustrated herein. In a first aspect, the present invention is directed to a memory device and technique of reading data from and writing data into memory cells of the memory device. In this regard, in one embodiment of this aspect of the invention, the memory device and technique for operating that device that minimizes, reduces and/or eliminates the debilitating affects of the charge pumping phenomenon. This embodiment of the present invention employs control signals that minimize, reduce and/or eliminate transitions of the amplitudes and/or polarities. In another embodiment, the present invention is a semiconductor memory device including a memory array comprising a plurality of semiconductor dynamic random access memory cells arranged in a matrix of rows and columns.

Abstract: Some embodiments may include a memory with a first memory device and data pins, and a second memory device coupled with some of the data pins of the first memory device, allowing the first memory device to operate as a data repeater for the second memory device. An embodiment may comprise a memory device with a memory die, a first plurality of data pins to operate as input and output to the memory die, and a second plurality of data pins to function as a repeater. An embodiment method may involve configuring a first memory device as a repeater, sending data to the first memory device, and forwarding the data to a second memory device.

Abstract: An embodiment of the present invention is an SRAM memory array comprising memory cells with each cell containing seven devices, wherein the basic storage nodes, which store the true and complement of the data, are constructed from six devices, forming a cross-coupled flip-flop cell. One internal storage node of this cell being connected to a separate read-pass device which passes the state of this node to a local bit line (LBL) for single-ended sensing, with the gate of this separate read-pass device connected to a separate read-word line.

Abstract: An embodiment of the present invention is an array of 2 transistor DRAM cells organized in rows and columns in which the rows represent words and columns represent bits of the words, each bit column having a pair of balanced, true and complement bit lines, the bit lines being connected in a hierarchical bit line structure, comprising at least one local bit line pair and one global bit line pair, a sensing circuit connected to the global bit line pair detects a differential voltage transition on either line during a read access and provides a sensing strobe signal.