Abstract: A basic cell comprises a memory cell capable of retaining data having at least a binary value, a first selecting transistor connected between a first terminal of the memory cell and the Mth bit line, and a second selecting transistor connected between the first terminal of the memory cell and the M+1th bit line. A gate of the first selecting transistor is connected to the 2·N?1th selecting line, and a gate of the second selecting transistor is connected to the 2·Nth selecting line.

Abstract: Disclosed is a memory cell array including word and first bit lines and second bit lines respectively connected to memory cells, wherein each memory cell includes a MOS transistor and switching element having first and second conductive layers and a gap in which a resistance value changes by applying a predetermined voltage, and data is written by specifying the first bit line to connect it to a ground, specifying the word line and supplying a write voltage to the second bit lines, and read by specifying the word line, and specifying the first bit line to supply a read voltage lower than the write voltage to the second bit lines, and the word line is specified when the voltage of the word line becomes a gate threshold value voltage or more and a sum of a drive voltage and the gate threshold value voltage or less.

Abstract: A semiconductor storage device includes: a memory cell array including a plurality of first wirings, a plurality of second wirings intersecting with the first wirings, and a plurality of memory cells respectively arranged at intersections of the first and second wirings; a plurality of drivers that drive the first wirings; a dummy wiring continuously extending in a direction of the first wirings and in a direction of the second wirings, a part of the dummy wiring extending in the direction of the second wirings being connected to the plurality of drivers; a plurality of switch circuits connected to respective connection portions of the plurality of drivers and the dummy wiring; and a replica line extending in the direction of the second wirings and connected to the dummy wiring through the plurality of switch circuits.

Abstract: A magnetic memory cell and a magnetic memory incorporating the cell are described. The magnetic memory cell includes at least one magnetic element and at least one non-planar selection device. The magnetic element(s) are programmable using write current(s) driven through the magnetic element. The magnetic memory may include a plurality of magnetic storage cells, a plurality of bit lines corresponding to the plurality of magnetic storage cells, and a plurality of source lines corresponding to the plurality of magnetic storage cells.

Abstract: A semiconductor memory is achieved which allows a reduction in the area of a memory array block without reducing the gate widths of floating gates. A plurality of select gates extend in straight lines in the X direction. Between the upper- and lower-side select gates, two rows' worth of floating gates are arranged. The plurality of floating gates are placed in a staggered arrangement (in other words, in a zigzag pattern). That is, looking at one floating gate in a specific column and another floating gate in a column adjacent to that specific column, those floating gates deviate from each other in the Y direction.

Abstract: A semiconductor device that can transmit and receive data without contact is popular partly as some railway passes, electronic money cards, and the like; however, it has been a prime task to provide an inexpensive semiconductor device for further popularization. In view of the above current conditions, a semiconductor device of the present invention includes a memory with a simple structure for providing an inexpensive semiconductor device and a manufacturing method thereof. A memory element included in the memory includes a layer containing an organic compound, and a source electrode or a drain electrode of a TFT provided in the memory element portion is used as a conductive layer which forms a bit line of the memory element.

Abstract: A semiconductor memory device includes a memory cell array disposing a plurality of memory cells at each intersection of word lines and bit lines, the memory cell including one pair of cross-connected inverters including a transistor, a first dummy transistor having a threshold voltage which has a certain relationship with a threshold voltage of the transistor of the memory cell, a dummy bit line connected to one end of the first dummy transistor, and the dummy bit line charged so as to have a predetermined voltage, a dummy transistor control circuit configured to control conduction of the first dummy transistor, and a word line driver configured to supply a word line voltage to the word line connected to the selected memory cell, and the word line driver configured to change a rise time of the word line voltage in accordance with a change in a voltage of the dummy bit line.

Abstract: A data read/write device according to an example of the present invention includes a recording layer, and means for applying a voltage to the recording layer, generating a resistance change in the recording layer, and recording data. The recording layer is composed of a composite compound having at least two types of cation elements, at least one type of the cation element is a transition element having a “d” orbit in which electrons have been incompletely filled, and the shortest distance between the adjacent cation elements is 0.32 nm or less.

Abstract: A cross point memory cell includes a portion of a first distributed diode, a portion of a second distributed diode, a memory layer located between the portion of the first distributed diode and the portion of a second distributed diode, a bit line electrically connected to the first distributed diode, and a word line electrically connected to the second distributed diode.

Abstract: An integrated circuit with buried control line structures. In one embodiment, the control lines are subdivided into sections, wherein regions free of switching transistors are provided at intervals along the control lines. Connections for feeding the control potentials into the sections of the control lines are provided at least in a subset of the regions free of switching transistors. The isolations lines are connected to one another by an interconnect running transversely with respect to the control lines.

Abstract: An SRAM device that includes an array of SRAM cells arranged in rows and columns. The SRAM device also includes a word line associated with at least one row, the word line operable to control access to cells in the row for both read and write. In addition, the SRAM device includes a write bit-line associated with at least one column operable to provide input to the cells in the column for write. Furthermore, the SRAM device includes a read bit-line associated with the column operable to receive output from cells in the column.

Abstract: A semiconductor device including a memory cell is provided. The memory cell comprises a transistor and a capacitor, and one of a resistor and a diode. A gate of the transistor is electrically connected to a word line, and one of a source and a drain of the transistor is electrically connected to a bit line. One terminal of the capacitor is electrically connected to the other of the source and the drain of the transistor, and the other terminal of the capacitor is electrically connected to a wiring. One terminal of one of the resistor and the diode is electrically connected to the other of the source and the drain of the transistor, and the other terminal of one of the resistor and the diode is electrically connected to the wiring.

Abstract: A semiconductor device is provided in which two adjacent cell lines extending in a word line direction are connected by one word line. Additionally, A semiconductor device comprising: word lines; bit lines which are disposed to cross the word lines; a plurality of cell lines extending in a word line direction; and a word line provided to share one cell line and the other cell line, of a pair of cell lines comprising two adjacent cell lines, wherein a distance between two adjacent cell lines in the pair of cell lines is smaller than a distance between two adjacent cell lines between one pair of cell lines and the other pair of cell lines.

Abstract: Memory elements are provided that exhibit immunity to soft error upset events when subjected to high-energy atomic particle strikes. The memory elements may each have ten transistors. To overcome difficulties in writing data into the memory elements, signal strengths for one or more of the signals provided to the array may be adjusted. There may be two positive power supply voltages that are used in powering each memory element. One of the power supply voltages may be temporarily lowered relative to the other power supply voltage to enhance write margin during data loading operations. Other signal strengths that may be adjusted in this way include other power supply signals, data signal levels, address and clear signal magnitudes, and ground signal strengths. Adjustable power supply circuitry and data read-write control circuitry may be used in making these signal strength adjustments.

Abstract: A fuse circuit comprising one or more one-time programmable electrical fuses; one or more unidirectional conductive devices each coupled to one of the fuses; a programming device coupled to the unidirectional conductive devices; and a selection module coupled to the electrical fuses for selecting a predetermined electrical fuse, wherein upon a selection by the selection module, a programming current is introduced through at least one selected electrical fuse, wherein the selection module is an N-to-one multiplexer selecting one of the N number of electrical fuses to be programmed, and the unidirectional conductive devices not coupled to the selected electrical fuse to prevent the programming current from interfering with the remaining electrical fuses.

Abstract: A nonvolatile memory array includes a plurality of dual-sided charge-trapping dual-sided charge-trapping nonvolatile memory cells arranged in rows and columns. The dual-sided charge-trapping dual-sided charge-trapping nonvolatile memory cells on each column form at least one grouping that is arranged in a NAND series string of dual-sided charge-trapping dual-sided charge-trapping nonvolatile memory cells. Each NAND series string has a top select transistor and a bottom select transistor. Pairs of braided bit lines are connected in a braided columnar bit line structure such that each column of the dual-sided charge-trapping dual-sided charge-trapping nonvolatile memory cells is connected to an associated pair of braided bit lines.

Abstract: A memory system including a random access memory (RAM) array and a corresponding redundant RAM array which stores information redundant to the RAM array, where a designed cell circuit topology of cells within the redundant RAM array differs from a designed cell circuit topology of cells within the RAM array. The redundant RAM array is selectively accessed when accessing the RAM array to store data to the redundant RAM array for failed cells of the RAM array.

Abstract: A memory integrated circuit has memory arrays that are vertically layered. These memory arrays include word lines and bit lines. Intersections between the word lines and the bit lines include a diode and a memory state storage element. The diode and the memory storage element are connected in between a word line and a bit line. The diode at the intersections includes a first diode node and a second diode node. Various aspects of the memory integrated circuit are electrically interconnected in various ways, such as corresponding word lines, corresponding first diode nodes, or corresponding second diode nodes of different memory arrays being electrically interconnected. Various aspects of the memory integrated circuit are isolated in various ways, such as word lines, first diode nodes, or second diode nodes of different memory arrays being isolated.

Abstract: In an exemplary aspect, the present invention provides a semiconductor memory device including sense amplifiers that drive bit lines to which memory cells are connected, and driver transistors that supply a power supply to the sense amplifiers, wherein the sense amplifiers are arranged in rows and constitutes a first sense-amplifier row in which transistors of a first conductive type are arranged and a second sense-amplifier row in which transistors of a second conductive type are arranged, and the driver transistors constitutes at least one transistor row including a first driver transistor of the first conductive type corresponding to the first sense-amplifier row and a second driver transistor of the second conductive type corresponding to the second sense-amplifier row between the first sense-amplifier row and the second sense-amplifier row.

Abstract: An integrated circuit and a method of forming an integrated circuit. One embodiment includes a conductive line formed above a surface of a carrier. A slope of the sidewalls of the conductive line in a direction perpendicular to the surface of the carrier reveals a discontinuity and a width of the conductive line in an upper portion thereof is larger than the corresponding width in the lower portion.

Abstract: A memory chip with a plurality of FB DRAM cells, having a word line coupled to a first FB DRAM cell and a second FB DRAM cell is disclosed. The memory chip further has a first bit line coupled to the first FB DRAM cell, and a first state memory circuit coupled to the first bit line. The memory chip further includes a second bit line coupled to the second FB DRAM cell, and a second state memory circuit coupled to the second bit line. The memory chip further includes a sense amplifier, which can be coupled to the first FB DRAM cell, the second FB DRAM cell, the first state memory circuit or the second state memory circuit.

Abstract: A ferroelectric memory is provided with a voltage generating circuit configured to generate prescribed driving potential, a driving interconnection to which the driving potential is applied, a plurality of memory cells connected to the driving interconnections and an internal voltage comparison circuit configured to compare inputted potential and to output results thereof. A plurality of voltage monitoring interconnections are provided to connect between a portion of the driving interconnection disposed at a position distant from the voltage generating circuit on the substrate and the internal voltage comparison circuit. The internal voltage comparison circuit compares potential inputted through the voltage monitoring interconnection with the driving potential.

Abstract: An integrated circuit having a memory cell array and a method of forming an integrated circuit is disclosed. One embodiment provides bitlines running along a first direction, wordlines running along a second direction substantially perpendicular to the first direction, active areas and bitline contacts. The bitline contacts are arranged in columns extending in the second direction and in rows extending in the first direction. A distance between neighboring bitlines is DL, and a distance between neighboring bitline contacts is DC, DC being measured parallel to the first direction. The following relation holds: 1/2.25?DL/DC?1/1.75.

Abstract: A phase change memory device has a word line driver layout which allows for a reduction in the size a core area of the device. In one aspect, phase change memory device includes a plurality of memory cell blocks sharing a word line, and a plurality of word line drivers driving the word line. Each of the word line drivers includes a precharge device for precharging the word line and a discharge device for discharging the word line, and where the precharge device and the discharge device are alternately located between the plurality of memory cell blocks.

Abstract: A semiconductor memory device for reducing the power consumption of an entire low power consumption SRAM LSI circuit employing scaled-down transistors and of increasing the stability of read and write operations on the memory cells by reducing the subthreshold leakage current and the leakage current flowing from the drain electrode to the substrate electrode is provided. The semiconductor memory device also prevents an increase in the number of transistors in a memory cell and thereby preventing an increase in the cell area, and ensures stable operation of an SRAM memory cell made up of SOI or FD-SOI transistors having a BOX layer by controlling the potentials of the wells under the BOX layers of the drive transistors.

Abstract: A semiconductor memory device includes first to third memory cell units each including a first select transistor, a second select transistor and a plurality of memory cell transistors which are connected in series in a first direction between the first select transistor and the second select transistor, the first and second select transistors of the respective memory cell transistors being disposed to neighbor in a second direction crossing the first direction. Those of the memory cell transistors, which neighbor the first and second select transistors, are used as select memory cell transistors.

Abstract: Method for conversion of a Flash memory cell on a first semiconductor device to a ROM memory cell in a second semiconductor device, the first and second semiconductor device each being arranged on a semiconductor substrate and each comprising an identical device portion and an identical wiring scheme for wiring the device portion to the Flash memory cell and to the ROM memory cell, respectively; the Flash memory cell being made in non-volatile memory technology and comprising an access transistor and a floating transistor, the floating transistor comprising a floating gate and a control gate; the ROM memory cell being made in a baseline technology and comprising a single gate transistor, which method includes manipulating a layout of at least one baseline mask as used in the baseline technology; the manipulation including: incorporating into the layout of the at least one baseline mask a layout of the Flash memory cell, and converting the layout of the Flash memory cell to a layout of one ROM memory cell by e

Abstract: An exemplary dynamic random access memory includes a first transistor (210), a second transistor (220) and a comparator (230). The first transistor includes a first gate electrode (211), a first source electrode (213) and a first drain electrode (215). The second transistor includes a second gate electrode (221), a second source electrode (223) and a second drain electrode (225). The first source electrode is connected with the second source electrode. The first drain electrode is an input terminal for inputting a message. The comparator is connected to the second drain electrode, and preconfigured with a reference current. The comparator compares the reference current and a current through the second drain electrode to define a state of the current read from the comparator.

Abstract: A semiconductor device includes an active region defined in a semiconductor substrate, and gate electrodes crossing over the active region. Source/drain regions are defined in the active region on two sides of the gate electrode. At least one of the source/drain regions is a field effect source/drain region generated by a fringe field of the gate. The other source/drain region is a PN-junction source/drain region having different impurity fields and different conductivity than the substrate. At least one of the source/drain regions is a field effect source/drain region. Accordingly, a short channel effect is reduced or eliminated in the device.

Abstract: An SRAM cell has reduced gate and sub-threshold leakage currents. The SRAM cell is designed to include eight operatively coupled transistors to reduce leakage currents irrespective of data stored in the SRAM cell. The transistors lower the effective supply voltage at different nodes, when either bit ‘0’ or ‘1’ is stored in the SRAM cell. The reduced effective supply voltage is passed to other coupled transistors for minimizing leakages. The SRAM cell operates in an active mode and dissipates no dynamic power during active mode to inactive mode transition and vice-versa operations. The SRAM cell is also capable of reducing bit line leakage currents under suitable conditions.

Abstract: A floating gate memory cell includes isolation regions between adjacent cells, and a staggered pattern of columns of cells. Word lines are formed parallel to control gate structures.

Abstract: Embodiments disclosed herein relate to a non-volatile memory bitcell and arrays thereof, methods of detecting whether the bitcell is in a programmed state, methods of detecting whether the bitcell is in an erased state, methods of setting the bitcell in a programmed state and methods of setting the bitcell in an erased state. The non-volatile memory bitcell may be a four terminal bitcell. The bitcell may have a pull-up electrode, a pull-down electrode, a cantilever electrode and a contact electrode. An NMOS transistor may be coupled to the contact electrode. Depending upon the orientation of the word line, the current through the bitcell may be measured on the bitline, the data line or the pull-down electrode.

Abstract: Example embodiments provide a semiconductor memory device and method of forming a semiconductor memory device that may equalize load due to a coupling capacitance between a line and a component signal when the line intersects the component signal in a memory cell array. A line may intersect a memory cell region between a transmitting point (A) and a receiving point (B) of a signal. A line between the transmitting point (A) and the receiving point (B) may be bent at two portions of each of bit lines. Because areas where the line and the bit lines extend parallel to each other may be equal in dimension at each bit line, coupling capacitances between the line and the bit lines may be equalized. The read characteristic may not be affected by the coupling capacitances.

Abstract: A non-volatile memory bitcell which comprises a first bistable cantilever module and a second bistable cantilever modules. The bistable cantilever modules have a shared output terminal and each has an input terminal and two actuating terminals. The first and second cantilever modules are arranged such that their states are complementary. The memory bitcell further includes buffering means arranged to prevent the flow of current from the shared output terminal and further arranged to indicate the states of the first and second cantilever modules.

Abstract: A semiconductor memory device includes first and second driving transistors; first and second load transistors; and first and second transmission transistors. Their respective drain diffusion layers of the transistors are isolated from one another. The semiconductor memory device also includes a bit cell in which the first and second driving transistors, the first and second load transistors, and the first and second transmission transistors are arranged; a first wiring for connecting their respective drains of the first driving transistor, the first load transistor, and the first transmission transistor; and a second wiring for connecting their respective drains of the second driving transistor, the second load transistor, and the second transmission transistor.

Abstract: A high voltage switching circuit that has a depletion mode NMOS transistor, an enhancement mode PMOS transistor and, an enhancement mode NMOS transistor. A control circuit generates first and second control signals. A first control signal controls the enhancement mode NMOS transistor and a logical combination of both control signals provides a bias to control the PMOS transistor. The bias on the PMOS transistor provides a gate voltage greater than ground potential after the high voltage has been switched to the circuit output.

Abstract: A semiconductor integrated circuit device includes a dynamic random access memory (DRAM) unit. The DRAM unit comprises a plurality of bit line pairs. Each bit line pair includes a first bit line and a second bit line. The first bit line and the second bit line within each bit line pair are aligned adjacent to each other. Each of a plurality of word lines is associated with the bit lines such that an array is formed by the bit lines and the associated word lines. Each bit line is associated with both first and second interconnect layers. Each of a plurality of memory cells is associated with every other bit line along each word line. Each of a plurality of amplifiers is in communication with a first bit line and a second bit line within a bit line pair.

Abstract: An improved circuit wiring layout provides smooth circuit wiring in a peripheral circuit region adjacent to a memory cell region of a semiconductor memory device, and eliminates a write-speed limiting factor. Forming a metal (instead of a metal silicided polysilicon) wiring layer to be connected to a gate layer, to transmit an electrical signal to the gates of FET (e.g., MOSFET (Metal Oxide Semiconductor Field Effect Transistor) transistors formed in the peripheral circuit region; the metal wiring layer is formed (e.g., using one metal damascene process), on a layer different from a word line layer formed on the gate layer (e.g., using another metal damascene process), thereby obtaining a layout of a peripheral circuit region having a reduced area and without using a silicide process.

Abstract: An SRAM device include: a latch unit for retaining data; one or more pass gate transistors controlled by a word line for coupling the latch unit to a bit line and a complementary bit line; and a power saving module coupled to the latch unit for raising a source voltage of the latch unit in response to a control signal on the word line, thereby reducing a leakage current for the latch unit.

Abstract: A semiconductor device is provided, which includes a transistor, a memory element, a first control circuit and a second control circuit. A gate of the transistor is electrically connected to the first control circuit through a first word line, one of a source and a drain of the transistor is electrically connected to the second control circuit through a bit line, the other of the source and the drain of the transistor is electrically connected to a first terminal of the memory element, and a second terminal of the memory element is electrically connected to the first control circuit through a second word line.

Abstract: An integrated circuit device comprises a plurality of bit line pairs. First and second bit lines are aligned with each other in an end-to-end arrangement. The first and second bit lines are arranged consecutively adjacent to one another, respectively. A plurality of word lines is associated with the first bit lines and the second bit lines. A first array includes the first bit lines and first associated ones of the plurality of word lines, and wherein a second array includes the second bit lines and second ones of the plurality of associated word lines. A first plurality of multiplexers communicates with two adjacent bits lines within one of the first and second arrays. The first array operates as a sense array and the second array operates as a reference array when at least one of the plurality of word lines is active in the first array.

Abstract: The present invention provides a new semiconductor Read-Only Memory, ROM, which stores more than one bit per cell. The potential of multiple threshold voltages combined with the potential multiple ratios of device channel width and length makes an ROM cell store multiple bits feasible. An N-type or a P-type MOS device of the standard CMOS process or a flat-cell mask ROM process are operable devices and processes in the design of this multi layer cell ROM. The ROM cell with smaller size is implemented to represent the LSB bits, while the larger size ROM cell is to represent the MSB bits.

Abstract: The circuit arrangement comprises a symmetrically constructed comparator (3), a non-volatile memory cell (10) and a reference element (20). The comparator (3) exhibits a latching function, and is connected in a differential current path that joins the power supply terminal (9) to a reference potential terminal (8). The non-volatile memory cell (10) is connected in a first branch (35) of the differential current path, and the reference element (20) is connected in a second branch (55) of the differential current path.

Abstract: A magnetic memory device includes a first signal line (BL) and a second signal line (/BL) extended column-wise; a third signal line (WL) extended row-wise; a memory cell including a first parallelly connected set which is disposed at the intersection of the first signal line and the third signal line, including a first magnetoresistive effect element (MTJ1) and a first select transistor (Tr1) and having one end connected to the first signal line; a second parallelly connected set which is disposed at the intersection of the second signal line and the third signal line, including a second magnetoresistive effect element (MTJ2) and a second select transistor (Tr2) and having one end connected to the second signal line; and a read circuit connected to the first signal line and the second signal line, for reading information memorized in the memory cell, based on voltages of the first signal line and the second signal line.

Abstract: Non-volatile multi-bit memory cells are programmed by hot electron programming and erased by high voltage tunneling, or by the use of a lower voltage Metal-Insulator-Metal (MIM) Diode carrier generation method and technology called the Tunnel-Gun (TG), in which the use of a Nitride layer or a silicon-nodule layer having location-specific charge storage elements with no spreading allows easy implementation of multi-bit technology. If charges are stored in the traps in the Nitride storage layer, an Oxide Nitride Oxide is used as the storage element. If charges are stored in layer of discrete silicon-nodules separated by a thin insulating film, an Oxide silicon-nodule Oxide storage element is used as the storage layer.

Abstract: A unit operator cell includes a plurality of SOI (Silicon on Insulator) transistors, write data is stored in a body region of at least two SOI transistors, and the storage SOI transistors are connected in series with each other to a read port or each of the storage SOI transistors is singly connected to the read port. Therefore, an AND operation result or a NOT operation result of data stored in the unit operator cells can be obtained, and operation processing can be performed only by writing and reading data. A semiconductor signal processing device that can perform logic operation processing and arithmetic operation processing at high speed is implemented with low power consumption and a small occupation area.

Abstract: The present invention relates generally to integrated circuits, to methods for manufacturing integrated circuits, and to integrated memory arrays.

Abstract: A semiconductor device to improve layout uniformity may include an active region formed in a substrate, a dummy active region formed in the substrate and separated from the active region, a word line crossing over the active region, and a dummy word line. The dummy word line is formed over the dummy active region to overlap at least part of the dummy active region and may have an end positioned within the dummy active region.

Abstract: An apparatus comprising a two or three dimensional array of a plurality of pairs of non-volatile memory (“NVM”) cells coupled to enable program and erase of the NVM cells. The plurality of pairs of NVM cells is electrically connected to word lines and bit lines. Each pair of NVM cells comprises a first memory cell and a second memory cell. The first and second memory cells comprise a first source/drain, a second source/drain, and a control gate. The first source/drain of the first memory cell is connected to one of the bit lines. The second source/drain of the first memory cell is connected to the first source/drain of the second memory cell. The second source/drain of the second memory cell is connected to another one of the bit lines. The control gates of the first and second memory cells are connected to different word lines.

Abstract: A circuit on an end column of a divided memory array is formed by a block selection transistor having the same shape as that of a memory cell transistor. As the pattern of the connecting section between the main bit line and the sub-bit line is made in the same shape as that of the memory cell, it is possible to realize a pattern uniformity and to eliminate the need for using memory array dummy patterns.