Abstract: A light emitting device includes: a first light emitting element mounting unit including: a first substrate; a first light emitting element on a first surface of the first substrate; and a first substrate holder which includes a first column, and a first protrusion which extends from the first column toward the first light emitting element and bonded to the first surface of the first substrate; and a second light emitting element mounting unit including: a second substrate; a second light emitting element mounted on a first surface of the second substrate; and a second substrate holder which includes: a second column, and a second protrusion which extends from the second column toward the second light emitting element and bonded to the first surface of the second substrate. The second light emitting element mounting unit is stacked on the first light emitting element mounting unit.

Abstract: Various embodiments of an arrangement for generating fast wavelength-switched optical signal are described herein. In some embodiments, the arrangement can be integrated with lasers, optical waveguides, optical splitters and gates to form a fast wavelength switched monolithic optical source. In some embodiments, an optical modulator is incorporated into the arrangement to form a fast wavelength switched optical transmitter.

Abstract: Multi-mode diode emitters are stacked in a staircase formation to provide a spatially-mulitplexed output. Improved coupling efficiency is achieved by providing tilted collimated output beams that determine an effective step height of the stepped structure. Since the effective step height is dependent on the tilt angle, a variable number of emitters can be used inside packages having a same physical step height, while still attaining high coupling efficiency.

Abstract: A silicon-on-insulator wafer is provided. The silicon-on-insulator wafer includes a silicon substrate having optical vias formed therein. In addition, an optically transparent oxide layer is disposed on the silicon substrate and the optically transparent oxide layer is in contact with the optical vias. Then, a complementary metal-oxide-semiconductor layer is formed over the optically transparent oxide layer.

Abstract: An apparatus that includes a silicon-based support member and a silicon-based alignment structure is provided. The silicon-based alignment structure is received on a receiving surface of the support member. The alignment structure includes a first surface and a second surface parallel to and facing the first surface with a gap defined therebetween and configured to receive a light-emitting device inside the gap with the first surface and the second surface in contact with the light-emitting device such that, when a collimating rod lens is disposed on the alignment structure and over the gap, a longitudinal center line of the collimating rod lens is not aligned with a mid-point of the gap.

Abstract: An integrated semiconductor laser element includes: semiconductor lasers that oscillate at different oscillation wavelengths from one another, each laser oscillating in a single mode; an optical coupler; and a semiconductor optical amplifier. At least one of active layers of the semiconductor lasers and an active layer of the semiconductor optical amplifier have a same thickness and a same composition that is set to have a gain peak wavelength near a center of a wavelength band formed by the oscillation wavelengths. The semiconductor optical amplifier includes: an equal width portion formed on a side of the optical coupler to guide light in a single mode; and an expanded width portion formed on a light output side. The width of the expanded width portion is set according to a total thickness of well layers of the active layer of the semiconductor optical amplifier.

Abstract: A surface profile inspection device producing a sheet of light propagating in a linear region forming a plane from a laser beam emitted from a laser light source and irradiating the sheet of light to an object to be measured, and including an image capturing unit capturing an image of the object to be measured and a configuration data generating unit extracting a light section line defined by an irradiation of the sheet of light from image data of the captured image and generating surface profile data of the object to be measured. The laser light source includes a semiconductor laser emitting a laser beam from a light emitting layer formed in a linear direction along a boarder of a p-n junction. An attitude of the semiconductor laser is set to arrange the linear direction to be unparallel to a spread direction of the sheet of light.

Abstract: There is provided an optical interconnection system including a plurality of semiconductor integrated devices each including a surface emitting laser array device including a plurality of surface emitting laser devices each emitting an output laser signal light of a different wavelength modulated based on an input modulated signal, a silicon optical waveguide that guides output laser signal lights emitted from the surface emitting laser devices of each of the semiconductor integrated devices to another semiconductor integrated device, a plurality of optical couplers respectively corresponding to the semiconductor integrated devices and guiding the output laser signal lights to the silicon optical waveguide, and a plurality of optical splitters respectively corresponding to the semiconductor integrated devices, receiving the output laser signal lights guided by the silicon optical waveguide, and inputting an input laser signal light to a corresponding one of the semiconductor integrated devices.

Abstract: Semiconductor laser array devices capable of emitting mid- to long-wavelength infrared (i.e., 4-12 ?m) radiation are provided. The devices include a quantum cascade laser (QCL) structure comprising one or more active cores; an optical confinement structure; a cladding structure, and a plurality of laterally-spaced trench regions extending transversely through the cladding and optical confinement structures, and partially into the QCL structure. The trench regions define a plurality of laterally-spaced interelement regions separated by element regions in the laser array device. The element regions are characterized by a non-uniform structure across their widths. As a result of this structural non-uniformity, array modes composed of coupled first-order lateral modes of the element regions are preferentially suppressed relative to array modes composed of coupled fundamental lateral modes of the element regions.

Abstract: Provided is a tunable laser module emitting an optical signal having high speed, high power and wideband wavelength tuning. The tunable laser module includes a laser array configured to emit an optical signal having a plurality of different lasing wavelengths, a temperature controller configured to change a temperature of the laser array, and an optical integration device configured to modulate or amplify the optical signal at a side of the laser array opposing the temperature controller.

Abstract: A manufacturing method for manufacturing a surface-emitting laser device includes the steps of forming a laminated body in which a lower reflecting mirror, a resonator structure including an active layer, and an upper reflecting layer having a selective oxidized layer are laminated on a substrate; etching the laminated body to form a mesa structure having the selective oxidized layer exposed at side surfaces thereof; selectively oxidizing the selective oxidized layer from the side surfaces of the mesa structure to form a constriction structure in which a current passing region is surrounded by an oxide; forming a separating groove at a position away from the mesa structure; passivating an outermost front surface of at least a part of the laminated body exposed when the separating groove is formed; and coating a passivated part with a dielectric body.

Abstract: An optoelectronic (OE) package or system and method for fabrication is disclosed which includes a silicon layer with a wiring layer. The silicon layer has an optical via for allowing light to pass therethrough. An optical coupling layer is bonded to the silicon layer, and the optical coupling layer includes a plurality of microlenses for focusing and or collimating the light through the optical via. One or more first OE elements are coupled to the silicon layer and electrically communicating with the wiring. At least one of the first OE elements positioned in optical alignment with the optical via for receiving the light. A second OE element embedded within the wiring layer. A carrier may be interposed between electrical interconnect elements and positioned between the wiring layer and a circuit board.

Abstract: A surface-emitting laser device includes a transparent dielectric layer provided in an emitting region and configured to cause a reflectance at a peripheral part to be different from a reflectance at a central part in the emitting region. In the surface-emitting laser device, the thickness of a contact layer is different between a region having a relatively high reflectance and a region having a relatively low reflectance in the emitting region. The contact layer is provided on the high refractive index layer of an upper multilayer film reflecting mirror, and the total optical thickness of the high refractive index layer and the contact layer in the region having the relatively low reflectance is deviated from an odd number multiple of a one quarter oscillation wavelength of laser light emitted from the emitting region.

Abstract: A multibeam coherent laser diode source comprises a master laser, a linear amplifier and two perpendicular amplifiers. The master laser and amplifiers are in the form of a single heterostructure containing an active layer, two limiting layers and a radiation influx area with an influx layer. The heterostructure is characterized by the ratio of the refractive index of the heterostructure to the refractive index of influx layer. This ratio is determined from a range extending from one plus delta to one minus gamma, where delta and gamma are defined by a number much less than one and gamma is greater than delta. The linear amplifier is positioned so that optical axis of radiation propagation from master laser coincides with the axis of the linear amplifier. Each perpendicular amplifier has output edge and is positioned so that its optical axis is situated at right angle to the axis of linear amplifier.

Abstract: A diode-laser bar stack includes a plurality of diode-laser bars having different temperature dependent peak-emission wavelengths. The stack is arranged such that the bars can be separately powered. This allows one or more of the bars to be “on” while others are “off”. A switching arrangement is described for selectively turning bars on or off, responsive to a signal representative of the temperature of the diode-laser bar stack, for providing a desired total emission spectrum.

Abstract: A method for image projection on a screen, including providing an image to be projected on the screen, determining excitation light representing the image, and illuminating with the excitation light at least one light excitable layer disposed on the screen, wherein the light excitable layer is configured to be stimulated for the emission of visible light based on the excitation light.

Abstract: A method of manufacturing a laser diode array capable of inhibiting electric cross talk is provided. The method of manufacturing a laser diode array includes a processing step of forming a peel layer containing an oxidizable material and a vertical resonator structure over a first substrate sequentially from the first substrate side by crystal growth, and then selectively etching the peel layer and the vertical resonator structure to the first substrate, thereby processing into a columnar shape, a peeling step of oxidizing the peel layer from a side face, and then peeling the vertical resonator structure of columnar shape from the first substrate, and a rearrangement step of jointing a plurality of vertical resonator structures of columnar shape obtained by the peeling step to a surface of a metal layer of a second substrate formed with the metal layer on the surface.

Abstract: Provided is a nitride semiconductor laser device that is reduced in capacitance to have a better response. The nitride semiconductor laser device includes: an active layer; an upper cladding layer which is stacked above the active layer; a low dielectric constant insulating film which is stacked above the upper cladding layer; and a pad electrode which is stacked above the low dielectric constant insulating film.

Abstract: A laser diode package includes a laser diode, a cooler, and control circuitry, such as an integrated circuit. The laser diode is used for converting electrical energy to optical energy. The cooler receives and routes a coolant from a cooling source via internal channels. The cooler includes a plurality of ceramic sheets. The ceramic sheets are fused together. The ceramic sheets include traces or vias that provide electrically conductive paths to the integrated circuit. The control circuitry controls the output of the laser diode, e.g. the output at each of the laser diode's emitters. Multiple laser diode packages are placed together to form an array.

Abstract: High-power, phased-locked, laser arrays as disclosed herein utilize a system of optical elements that may be external to the laser oscillator array. Such an external optical system may achieve mutually coherent operation of all the emitters in a laser array, and coherent combination of the output of all the lasers in the array into a single beam. Such an “external gain harness” system may include: an optical lens/mirror system that mixes the output of all the emitters in the array; a holographic optical element that combines the output of all the lasers in the array, and an output coupler that selects a single path for the combined output and also selects a common operating frequency for all the coupled gain regions.

Abstract: One embodiment of the present invention provides a system that facilitates adjusting the wavelengths of lasers via temperature control. This system includes a chip with an active face upon which active circuitry and signal pads reside. A thermal-control mechanism provides localized thermal control of two lasers mounted upon the active face of the chip. By individually controlling the temperature of the lasers, the thermal-control mechanism controls the wavelengths emitted by each respective laser. By creating a temperature gradient that causes a temperature difference between two or more lasers, the system can cause the lasers to emit different wavelengths.

Abstract: A multi-wavelength semiconductor laser device includes a plate stem; a prism shaped submount with a bottom face on a face of the stem; laser diodes having emission wavelengths different from each other are mounted on lateral sides of the submount so that their respective emission points are positioned at substantially the same distance from a center axis of the stem; and lead pins penetrating the stem are located along and opposite edge lines between adjacent pairs of the lateral sides of the submount.

Abstract: A high power laser source comprises a bar of laser diodes having a first coefficient of thermal expansion CTEbar on a submount having a second coefficient CTEsub and a cooler having a third coefficient CTEcool. The submount/cooler assembly shows an effective fourth coefficient CTEeff differing from CTEbar. This difference leads to a deformation of the crystal lattice of the lasers' active regions by mechanical stress. CTEeff is selected to be either lower than both CTEbar and CTEcool or is selected to be between CTEbar and CTEcool. The submount may either comprise layers of materials having different CTEs, e.g., a Cu layer of 10-40 ?m thickness and a Mo layer of 100-400 ?m thickness, or a single material with a varying CTEsub. Both result in a CTEsub varying across the submount's thickness.

Abstract: A laser light source comprises, in particular, a semiconductor layer sequence (10) having an active layer having at least two active regions (45) which are suitable for emitting electromagnetic radiation during operation via a side area of the semiconductor layer sequence (10) along an emission direction (90), said side area being embodied as a radiation coupling-out area (12), a respective electrical contact area (30) above each of the at least two active regions (45) on a main surface (14) of the semiconductor layer sequence (10), and a surface structure in the main surface (14) of the semiconductor layer sequence (10), wherein the at least two active regions (45) are arranged in a manner spaced apart from one another in the active layer (40) transversely with respect to the emission direction (90), each of the electrical contact areas (30) has a first partial region (31) and a second partial region (32) having a width that increases along the emission direction (90) toward the radiation coupling-out area (

Abstract: An optoelectronic (OE) package or system and method for fabrication is disclosed which includes a silicon layer with wiring. The silicon layer has an optical via for allowing light to pass therethrough. An optical coupling layer is bonded to the silicon layer, and the optical coupling layer includes a plurality of microlenses for focusing and or collimating the light through the optical via. A plurality of OE elements are coupled to the silicon layer and electrically communicating with the wiring. At least one of the OE elements positioned in optical alignment with the optical via for receiving the light. A carrier is interposed between electrical interconnect elements. The carrier is positioned between the wiring of the silicon layer and a circuit board and the carrier is electrically connecting first interconnect elements connected to the wiring of the silicon layer and second interconnect elements connected to the circuit board.

Abstract: An optical device includes a surface-emitting laser array having a plurality of light-emitting portions; a package member on which the surface-emitting laser array is disposed; and a transparent member retained on the package member and disposed on an optical path of a light beam emitted by the surface-emitting laser array. The transparent member includes an incident plane on which the light beam emitted by the surface-emitting laser array is incident. The incident plane is inclined with respect to an emitting surface of the surface-emitting laser array at a first inclination angle which is smaller than a second inclination angle at which the light emitted by one of the light-emitting portions is incident on another, most-distant one, of the light-emitting portions via reflection by the transparent member.

Abstract: A fabrication method of a surface-emitting laser element includes a step of preparing a conductive GaN multiple-region substrate including a high dislocation density high conductance region, a low dislocation density high conductance region and a low dislocation density low conductance region, as a conductive GaN substrate; a semiconductor layer stack formation step of forming a group III-V compound semiconductor layer stack including an emission layer on the substrate; and an electrode formation step of forming a semiconductor layer side electrode and a substrate side electrode. The semiconductor layer and electrodes are formed such that an emission region into which carriers flow in the emission layer is located above and within the span of the low dislocation density high conductance region. Thus, a surface-emitting laser element having uniform light emission at the emission region can be obtained with favorable yield.

Abstract: Electrophotographic print system, comprising a photosensitive medium, and a laser array being provided with a plurality of laser diodes arranged to emit light onto the photosensitive medium for varying an electrical potential on a surface of the photosensitive medium, and a plurality of heat dissipation diodes, each heat dissipation diode being arranged in proximity to a corresponding laser diode, wherein each laser diode and the corresponding heat dissipation diode are coupled to a common drive circuit and are arranged in opposite current flow directions with respect to each other, so that in use the current flows either through the laser diode or through the heat dissipation diode depending on the current flow direction in the drive circuit.

Abstract: Semiconductor laser array devices capable of emitting mid- to long-wavelength infrared (i.e., 4-12 ?m) radiation are provided. The devices include a quantum cascade laser (QCL) structure comprising one or more active cores; an optical confinement structure; a cladding structure; and a plurality of laterally-spaced trench regions extending transversely through the optical confinement and cladding structures, and partially into the QCL structure. The trench regions, each of which comprises a lower trench layer comprising a semi-insulating material and an upper trench layer comprising a material having a refractive index that is higher than that of the semi-insulating material, define a plurality of laterally-spaced interelement regions separated by element regions in the laser array device.

Abstract: A Vertical-Cavity Surface-Emitting Laser (VCSEL) device includes a substrate, a first semiconductor multi-layer film of a first conductive type formed on the substrate, an active layer, a second semiconductor multi-layer film of a second conductive type, an electrode pad electrically coupled to the second semiconductor multi-layer film, and a post structure formed on the substrate, the post structure comprising a light emitter, the post structure being continuously surrounded by a first groove, and a second groove being continuously formed outside of the first groove with respect to the post structure.

Abstract: A semiconductor light emitting device downsized by devising arrangement of connection pads is provided. A second light emitting device is layered on a first light emitting device. The second light emitting device has a stripe-shaped semiconductor layer formed on a second substrate on the side facing to a first substrate, a stripe-shaped p-side electrode supplying a current to the semiconductor layer, stripe-shaped opposed electrodes that are respectively arranged oppositely to respective p-side electrodes of the first light emitting device and electrically connected to the p-side electrodes of the first light emitting device, connection pads respectively and electrically connected to the respective opposed electrodes, and a connection pad electrically connected to the p-side electrode. The connection pads are arranged in parallel with the opposed electrodes.

Abstract: An apparatus that includes a first diode laser and a silicon-based support structure is provided. The first diode laser is configured to emit a first laser beam when powered. The support structure includes a silicon-based support plate, a silicon-based first fin structure, and a silicon-based second fin structure. The support plate has a first primary surface and a second primary surface opposite the first primary surface. The first fin structure has a first primary surface, a second primary surface opposite the first primary surface, and a plurality of edges between the first and the second primary surfaces including a first edge and a second edge opposite the first edge. The first fin structure is physically coupled to the support plate with the first edge of the first fin structure attached to the first primary surface of the support plate.

Abstract: Invention relates to three types of laser light sources: diode laser, integral diode laser (in form of integrally connected diode lasers) and integral semiconductor optical amplifier (in form of integrally connected driving laser diode and semiconductor amplifier element), which amplifier consists of original optical resonator of diode laser and original laser radiation coupling. Two reflectors in optical resonator of diode laser, which falls into three types of above-mentioned laser radiation sources, have greatest possible reflection factor on both sides thereof and radiation coupling from active layer is carried out, by-passing active layer, through broadband semiconductor layers of the modified heterostructure of diode laser with practically fully antireflective (less than 0.01%) optical face.

Abstract: A heat sink is made of a material excellent in thermal conductivity and is mounted on a stem; a sub-mount substrate is made of a material excellent in insulation property and is mounted on the heat sink; a first lead frame made of a material excellent in electric conductivity and thermal conductivity and having a linear expansion coefficient similar to that of a semiconductor laser array, is mounted on the sub-mount substrate, having the semiconductor laser array mounted thereon, and composing a power feeding path of the semiconductor laser array; a second lead frame made of a material excellent in electric conductivity and thermal conductivity, is arranged on the sub-mount substrate side by side with the first lead frame, and composing the power feeding path of the semiconductor laser array; and a wire electrically bonds the semiconductor laser array and the second lead frame.

Abstract: To provide a surface emitting laser having a structure that can suppress the oscillation of a high-order transverse mode. In the surface emitting laser, a plurality of semiconductor layers including a lower DBR, an upper DBR, an active layer interposed therebetween, and a current confinement layer for confining a current injected to the active layer are stacked on a substrate, and a barrier structure limits the migration of a majority carrier, that has passed through a current unconfining portion, in an electric field application direction; the barrier structure is provided between the current confinement layer and the active layer so that an oscillation of a high-order transverse mode is suppressed by the barrier structure promoting the diffusion of the majority carrier in an in-plane direction of the barrier structure.

Abstract: An extended cavity surface emitting laser has a first laser die with a first cavity and a first gain element and a second laser die with a second cavity and a second gain element. The first and second gain elements are in series to provide optical gain and optical feedback in an extended optical cavity configuration. The first and second gain elements provide optical gain and optical feedback in a common extended cavity with the first and second gain elements operating serially as a common extended cavity optical mode.

Abstract: The invention discloses a high power laser diode comprising a plurality of laser light emitters (2) and a plurality of light collimating means (33), wherein each of the laser light emitters (2) defines, in a direction perpendicular to a direction of propagation (32) of an output laser beam, a fast axis (y) and a slow axis (x), and wherein each of the light collimating means is associated with a laser light emitter and configured for collimating the output laser beam at least in a fast axis (y) direction. In order to enable a simple and cost-efficient assembly of the diode laser with collimating means, having a layered structure consisting of a plurality of plane-parallel substrates.

Abstract: Designs of fiber-coupled solid state microcavity light emitters based on microdisk cavities, photonic crystal cavities and other microcavity configurations to provide efficient optical coupling.

Abstract: Modular electrical, mechanical and optical components allow for the building of a laser combiner system that can be used, for example, for biological research that allows different lasers to be easily added to or removed from a laser system. Each individual laser can be packaged into a module which can be added to or taken away from the laser system with relative ease. Each of the modules can be controlled via a control module that allows one or more of varying of power levels, switching on/off, shutter control and diagnostic/status information monitoring.

Abstract: A surface emitting laser includes a stepped structure including portions having different thicknesses. The optical path length from a plane defined above the stepped structure and extending parallel to a base substrate to an interface between a front mirror and the stepped structure is set to a specific value in each of the portions of the stepped structure.

Abstract: A monolithically integrated laser diode chip having a construction as a multiple beam laser diode, which, on a semiconductor substrate (3) comprised of GaAs, has at least two laser stacks (4a, 4b, 4c) which are arranged one above another and which each contain an active zone (7). The active zone (7) is in each case arranged between waveguide layers (8). The waveguide layers (8) each adjoin a cladding layer (6) at a side remote from the active zone. At least one of the waveguide layers (8) or cladding layers (6) of at least one laser stack (4a, 4b, 4c), comprises AlxGa1-xAs, where 0?x?1, and at least one additional material from main group III or V, such that the lattice mismatch between the at least one waveguide layer (8) or cladding layer (6) comprising the at least one additional element and the semiconductor substrate (3) composed of GaAs is reduced. This increases the lifetime of the laser diode chip.

Abstract: The semiconductor device includes: a base; a first mount placed on the bottom of the base; a second mount placed on the top of the base; a first light-emitting element placed on the bottom of the first mount; and a second light-emitting element placed on the top of the second mount for emitting light. The first light-emitting element and the second light-emitting element are placed so that the emission direction of light from the second light-emitting element is at an angle of depression with respect to the emission direction of light from the first light-emitting element and that the emission direction of light from the first light-emitting element and the emission direction of light from the second light-emitting element substantially coincide with each other as viewed from above the base.

Abstract: A surface-emitting laser includes a substrate; a lower semiconductor multilayer film reflector disposed on the substrate; a resonator structure including an active layer and disposed on the lower semiconductor multilayer film reflector; and an upper semiconductor multilayer film reflector disposed on the resonator structure. The second semiconductor multilayer film reflector includes a confinement structure in which a current passage region is surrounded by an oxidized portion of a selectively oxidized layer containing aluminum. An emission region includes a central portion and a peripheral portion, the peripheral portion being covered with a transparent dielectric film whose reflectivity is lower than a reflectivity of the central portion. The selectively oxidized layer has a thickness in a range from 30 nm to 40 nm. The temperature at which an oscillation threshold current is minimized is 60° C. or lower.

Abstract: A surface emitting laser emitting a laser beam in a single transverse mode irrespective of an emission area while one-dimensionally aligning polarization of the output beam, including a two-dimensional photonic crystal, having resonance modes in directions of the primitive translation vector a1 and a2, lengths |a1| and |a2| of the primitive translation vectors a1 and a2 satisfied |a1|=p×(?1/2neff1), |a2| =?2/2neff2 described by a resonance wavelengths ?1 and ?2 in the resonance modes in the a1 and a2 directions, effective refractive indexes neff1 and neff2 determined by the resonance modes in the a1 and a2 directions, an integer p of 2 or more, the resonance wavelengths ?1 and ?2 satisfy ?2?2×(neff2/(nout+neff2))×?1 described by the effective refractive index neff2 and a refractive index nout of an external medium located out of the surface emitting laser.

Abstract: A diode laser structure includes multiple stripe emitters disposed next to each other, in which each of the stripe emitters is configured to emit, during operation, a laser beam having a corresponding beam parameter product with respect to a slow axis (BPPSA), where the stripe emitters are arranged such that the corresponding BPPSA of the laser beams successively decrease from a center of the diode laser structure towards a first edge of the diode laser structure and from the center of the diode laser structure towards a second edge of the diode laser structure, the second edge being opposite the first edge. The stripe emitters are oriented in a direction of the slow axis and are offset from one another in the direction of the slow axis.

Abstract: This semiconductor laser apparatus includes a base, a plurality of electrodes arranged along a first direction on an upper surface of the base, a plurality of semiconductor laser devices bonded to respective upper surfaces of the plurality of electrodes, emitting laser beams in a second direction, and a photodetector having a photosensitive surface arranged in a region of the base in a third direction relative to the plurality of semiconductor laser devices. An electrode arranged in a position other than end portions in the first direction and a fourth direction, of the plurality of electrodes has an extraction wiring portion arranged on the photosensitive surface of the photodetector.

Abstract: It is demonstrated that substantial operating-parameter-dependent temperature-differences can exist between diode-laser bars in pulsed operation of a stack of such bars arranged to provide a two-dimensional array of diode-laser emitters. These differences can produce distortion of the aggregate output spectrum of the stack. By selecting particular nominal emitting wavelengths of the diode-laser bars for specific positions in the stack, the aggregate emission-spectrum can be tailored to a desired shape for one or more sets of operating parameters of the stack.

Abstract: A method of manufacturing a surface-emitting laser element having a light-emitting mesa structure with an emitting area including a high-reflectance portion and a low-reflectance portion includes forming a layered body that includes a lower reflecting mirror, a cavity structure, and an upper reflecting mirror on a substrate; forming a first area on an upper surface of the layered body; forming a second area having the same size as the first area on the upper surface of the layered body; forming a light-emitting mesa structure and a monitoring-mesa structure by etching the first area and the second area, respectively; forming a confinement structure including a current passage area surrounded by an oxide in the light-emitting mesa structure and the monitoring-mesa structure; and measuring the size of the current passage area of the monitoring-mesa structure.

Abstract: A optical apparatus (201) for use in an laser imaging system (200) is provided. The optical apparatus (201) includes one or more optical elements (215) that are configured to create an intermediate image plane (217) in the laser imaging system (200). A diffractive optical element (216) is then disposed at the intermediate image plane (217) to reduce speckle. The diffractive optical element (216) includes a periodically repeating phase mask (218) that can be configured in accordance with steps, vortex functions, Hermite-Gaussian functions, and so forth. Smooth grey-level phase transitional surface (337) can be placed between elements (333,334) to improve brightness and image quality. The periodically repeating phase mask (218) makes manufacture simple by reducing alignment sensitivity, and can be used to make applicable safety standards easier to meet as well.

Abstract: A semiconductor laser element 10 according to the present invention comprises a waveguide 12 of a high mesa type. And then such the waveguide 12 comprises an oblique end face 17 as an emitting facet that is different from a cleaved end face 16. And hence it becomes possible to reduce a reflection factor at the end face by making of such the oblique end face 17, and it becomes possible to design a direction of an emitting beam 21, that is to be emitting from the oblique end face 17, to be independent of that for the cleaved end face 16 as well. Moreover, the emitting beam 21 is designed to be emitting as vertical to the cleaved end face 16. And then therefore in a case where an emitting beam from a semiconductor optical device is designed to be coupled with such as an optical fiber or another waveguide or the like, it is not necessary to device such as that the semiconductor laser element 10 is required to be arranged at a sub mount by being inclined to be oblique or the like.