Abstract: A process for joining a brass part and a silicon carbide ceramic part comprising: providing a brass part, a SiC ceramic part, a Ti foil and a Ni foil; placing the SiC ceramic part, the Ti foil, the Ni foil, and the brass part into a mold, the Ti foil and the Ni foil located between the SiC ceramic part and the brass part, the Ti foil abutting against the SiC ceramic part, the Ni foil abutting against the brass part and the Ti foil; placing the mold into a chamber of an hot press sintering device, heating the chamber and pressing the brass part, the SiC ceramic part, the Ti foil, and the Ni foil at least until the brass part, the SiC ceramic part, the Ti foil and the Ni foil form a integral composite article.

Abstract: A process for joining a bronze part and a silicon carbide ceramic part comprising: providing a bronze part, a SiC ceramic part, a Al foil and a Ni foil; placing the SiC ceramic part, the Al foil, the Ni foil, and the bronze part into a mold, the Al foil and the Ni foil located between the SiC ceramic part and the bronze part, the Al foil abutting against the SiC ceramic part, the Ni foil abutting against the bronze part and the Al foil; placing the mold into a chamber of an hot press sintering device, heating the chamber and pressing the bronze part, the SiC ceramic part, the Al foil, and the Ni foil at least until the bronze part, the SiC ceramic part, the Al foil and the Ni foil form a integral composite article.

Abstract: There is provided a copper alloy for electronic material which exhibits excellent plating uniformity. A copper alloy for electronic material, wherein, when its cross section parallel to a rolling direction is observed by SIM, an area ratio of amorphous structure and crystal grains having a grain size of less than 0.1 ?m at a depth range of 0.5 ?m or less from the surface is 1% or less, and a ratio of the number of crystal grains having a grain size of at least 0.1 ?m and less than 0.2 ?m to the overall number of crystal grains having a grain size of at least 0.1 ?m at a depth range of 0.2-0.5 ?m from the surface is 47.5% or more.

Abstract: A composite material for an electrical/electronic part, which is used as a material for use in an electrical/electronic part, containing: a metal base material having at least a surface formed of Cu or a Cu alloy; and an insulating film provided on at least a part of the metal base material; wherein a metal layer having Cu diffused in Ni or a Ni alloy is interposed between the metal base material and the insulating film; and wherein the ratio of the number of Cu atoms to the number of Ni atoms (Cu/Ni) obtained by analyzing the outermost surface of the metal layer by Auger electron spectroscopy is 0.005 or more.

Abstract: A barrier film for a flexible copper substrate comprising a Co—Cr alloy film containing 5 to 30 wt % of Cr and a balance of unavoidable impurities and Co is provided. The barrier film has a thickness of 3 to 150 nm and a film thickness uniformity of 10% or less at 1?. A sputtering target for forming a barrier film comprising a Co—Cr alloy containing 5 to 30 wt % of Cr and a balance of unavoidable impurities and Co is also provided. The relative magnetic permeability in the in-plane direction of the sputtered face of the target is 100 or less. The barrier film for a flexible copper substrate and the sputtering target for forming such barrier film have a film thickness that is thin enough to prevent film peeling and inhibiting the diffusion of copper to a resin film such as polyimide, is capable of obtaining a sufficient barrier effect even in a minute wiring pitch and has barrier characteristics that will not change even when the temperature rises due to heat treatment or the like.

Abstract: An adhesiveless copper clad laminate, which does not have defects on a copper film part due to a pin hole generated at the time of forming a base metal layer on an insulating film by dry plating process, has excellent adhesion between the insulating film and the base metal layer and corrosion resistance, and has a copper film layer having high insulation reliability The adhesiveless copper clad laminate is provided by forming a base metal layer directly at least on one plane of an insulating film without having an adhesive in between, and then by forming a copper film layer on the base metal layer, the base metal layer having a film thickness of 3 to 50 nm is formed by dry plating method and mainly contains a chrome-molybdenum-nickel alloy wherein the chrome ratio is 4 to 22 weight %, the molybdenum ratio is 5 to 40 weight %, and the balance is nickel.

Abstract: There are provided an electrode foil which has both the functions of a supporting base material and a reflective electrode and also has a superior thermal conductivity and heat resistance; and an organic device using the same. The electrode foil comprises a metal foil; a diffusion prevention layer for preventing diffusion of metal derived from the metal foil, the diffusion prevention layer being provided directly on the metal foil; and a reflective layer provided directly on the diffusion prevention layer.

Abstract: A method for making a coated article includes the steps of: providing a substrate; forming a copper-cobalt target by a hot isostatic pressing process using copper powder and cobalt powder; forming a copper-cobalt alloy layer on the substrate by vacuum sputtering using the copper-cobalt target. A coated article is also described.

Abstract: A method for making a coated article includes the steps of: providing a substrate; forming a copper-iron target by a hot isostatic pressing process using copper powder and iron powder; forming a copper-iron alloy layer on the substrate by vacuum sputtering using the copper-iron target. A coated article is also described.

Abstract: Disclosed are a hybrid copper alloy with high strength, high elastic modulus, high corrosion-resistance, wear resistance, and high conductivity and a method for producing the same. The hybrid copper alloy has a bi- or multi-layer structure in which (A) a copper alloy Cu (A) selected from the group consisting of Cu—Zn, Cu—Al, Cu—Ni—Zn, Cu—Ni—Si, Cu—Ni—Sn and Cu—Ni—Si—Sn is bonded to a copper alloy Cu (B) selected from the group consisting of Cu—Cr, Cu—Zr, Cu—Ag, Cu—Mg and Cu—Cr—Zr or molten alloys of a copper alloy Cu (A) and a copper alloy Cu (B) are cast in parallel such that a joint interface between these alloys is present. The hybrid copper alloy exhibits high strength, high elasticity, high corrosion resistance, abrasion resistance and high conductivity that cannot be obtained by a single copper alloy known to date.

Abstract: Adhesiveless copper clad laminates wherein a base metal layer is directly formed on at least one side of an insulating film without using an adhesive and a copper conductor layer having a desired thickness is formed on the base metal layer, the adhesiveless copper clad laminates is characterized in that a base metal layer having a thickness of 3 to 50 nm is formed on an insulating film by a dry plating method and a copper film layer is formed on the base metal layer, and the base metal layer mainly contains (1) a vanadium-molybdenum-nickel alloy consisting of 4 to 13% by weight of vanadium, 5 to 40% by weight of molybdenum, and the balance of nickel or (2) a vanadium-chromium-molybdenum-nickel alloy consisting of 4 to 13% by weight of vanadium and chromium in total including at least 2% by weight of vanadium, 5 to 40% by weight of molybdenum, and the balance of nickel.

Abstract: A surface-treated copper foil comprising an electrodeposited copper foil with a chromium-free rust-proofing layer which exhibits good performance in peel strength and resistance to peel loss after chemical treatment as a printed wiring board. The surface-treated copper foil comprises a rust-proofing layer and a silane coupling agent layer formed on an electrodeposited copper foil , wherein the rust-proofing layer comprises a nickel layer having a thickness by weight of 5 to 40 mg/m2 and a tin layer having a thickness by weight of 5 to 40 mg/m2 stacked in this order, and the silane coupling layer is applied on top of the tin layer. The surface-treated copper foil may be further coated with a very thin primer resin layer having a thickness of 0.5 to 5 ?m.

Abstract: In Sn-plated copper or a Sn-plated copper alloy according to the present invention, a surface plating layer including a Ni layer, a Cu—Sn alloy layer, and a Sn layer which are deposited in this order is formed on a surface of a base material made of copper or a copper alloy. An average thickness of the Ni layer is 0.1 to 1.0 ?m, an average thickness of the Cu—Sn alloy layer is 0.55 to 1.0 ?m, and an average thickness of the Sn layer is 0.2 to 1.0 ?m. The Cu—Sn alloy layer includes Cu—Sn alloy layers having two compositions, a portion thereof in contact with the Ni layer is formed of an ?-phase having an average thickness of 0.5 to 0.95 ?m, and a portion thereof in contact with the Sn layer is formed of a ?-phase having an average thickness of 0.05 to 0.2 ?m.

Abstract: A metallic material for a connecting part, having a rectangular wire material of copper or a copper alloy as a base material, and formed at an outermost surface thereof, a copper-tin alloy layer substantially composed of copper and tin, wherein the copper-tin alloy layer of the outermost surface further contains at least one selected from the group consisting of zinc, indium, antimony, gallium, lead, bismuth, cadmium, magnesium, silver, gold, and aluminum, in a total amount of 0.01% or more and 1% or less in terms of mass ratio with respect to the content of the tin.

Abstract: The material for metal cases of secondary batteries using a non-aqueous electrolyte includes a steel sheet; and a plated layer that has a Ni layer, and a Cu—Ni layer, which is disposed between the Ni layer and the steel sheet and is in contact with the Ni layer, and is in contact with the steel sheet.

Abstract: An article for protecting an airfoil component includes a sheath having an outer side and an inner side that forms a cavity for receiving a leading edge of the airfoil component. The sheath is made of cobalt and phosphorus to protect the leading edge of the airfoil component from erosion.

Abstract: The invention relates to a cooling element to be used in the structure of a pyromettalurgical reactor used in the manufacturing of metals, which cooling element comprises a housing element mainly made of copper, provided with a channel system for the cooling medium circulation, made of pipe that is mainly made of copper; on the outer surface of the pipes forming the channel system, there is arranged a coating that has a lower melting point than the material of the housing element and the pipe. The invention also relates to a method for manufacturing the cooling element.

Abstract: Provided is a metal foil with a carrier as a laminated body in which a carrier A and a metal foil B are placed alternately, wherein the metal foil with a carrier comprises a structure where the adjoining carrier A has an area which covers the entire surface of the metal foil B, and the edge of the carrier A protrudes partially or entirely from the metal foil B. The copper foil with a carrier is used for producing a single-sided laminated plate or a multilayer laminated plate of two or more layers or an ultrathin coreless substrate for use in a printed wiring board. In particular, this copper foil with a carrier is used for producing a laminated plate, and its objective is to improve the handling performance in the production process of a printed board and reduce costs by increasing the yield.

Abstract: A brazing method includes assembling a first member and a second member, the first member including a base plate made of a ferrous material and a diffusion suppressing layer laminated on the base plate and made of a Ni—Cr alloy including more than about 15% and less than about 40% of Cr, the second member being disposed on the first member with a brazing material of a Cu—Ni alloy including more than about 10% and less than about 20% of Ni therebetween, and maintaining the temporary assembly at a temperature of more than about 1,200° C. to fuse the brazing material and diffuse Ni atoms and Cr atoms into the fused brazing material to form the braze joint, causing the resulting brazing material to have an increased melting point due to the Ni and Cr contents of the braze joint to self-solidify the braze joint, and then cooling the resulting assembly.

Abstract: An ultrathin copper foil with a carrier not causing blistering at a release layer interface, having a low carrier peeling force, friendly to the environment, and enabling easy peeling of a carrier foil and an ultrathin copper foil even under a high temperature environment and a printed circuit board enabling a stable production quality of a base of a printed circuit board for fine pattern applications using the ultrathin copper foil with the carrier, that is, a ultrathin copper foil with a carrier comprising a carrier foil, a diffusion prevention layer, a release layer, and an ultrathin copper foil, wherein the release layer is formed by a metal A for retaining a release property and a metal B for facilitating plating of the ultrathin copper foil, a content “a” of the metal A and a content “b” of the metal B forming the release layer satisfying an equation: 10?a/(a+b)*100?70 and a printed circuit board prepared by using such a ultrathin copper foil with a carrier.

Abstract: A copper foil reducing transmission loss at a high frequency and excellent in bond strength with a resin substrate, including at least a granular layer and a columnar layer in its thickness direction, the columnar layer being formed on at least one surface of the granular layer forming the copper foil or the granular layer being formed on at least one surface of the columnar layer forming the copper foil, the relation of the thickness A of the granular layer and the thickness B of the columnar layer in the copper foil being preferably A/(A+B)=40 to 99%, a method of production and apparatus for production for the same, and a high frequency circuit using the same.

Abstract: Metalized plastic substrates, and methods thereof are provided herein. The method includes providing a plastic having a plurality of accelerators dispersed in the plastic. The accelerators have a formula ABO3, wherein A is one or more elements selected from Groups 9, 10, and 11 of the Periodic Table of Elements, B is one or more elements selected from Groups 4B and 5B of the Periodic Table of Elements, and O is oxygen. The method includes the step of irradiating a surface of plastic substrate to expose at least a first accelerator. The method further includes plating the irradiated surface of the plastic substrate to form at least a first metal layer on the at least first accelerator, and then plating the first metal layer to form at least a second metal layer.

Abstract: A Cu—Zn alloy strip and Sn plating strip thereof having improved thermal peel resistance of Sn Plating is provided. In a Cu—Zn alloy strip comprising 15 to 40% by mass of Zn and a balance of Cu and unavoidable impurities, the total concentration of P, As, Sb and Bi is regulated to 100 ppm by mass or less, the total concentration of Ca and Mg is regulated to 100 ppm by mass or less, and the concentrations of O and S are each regulated to 30 ppm by mass or less.

Abstract: A laminate for use in the production of a printed circuit board includes a main layer and a face layer made of a material different from the material that the main layer is made of. The main layer is made of a good electrically conductive metal and has a top surface. The face layer is disposed on the top surface of the main layer and made of a material having an etching rate substantially smaller than that of the material that the main layer is made of. The laminate can exhibit a high etching factor even if the laminate is etched by a conventional etchant.

Abstract: A copper alloy for electronic machinery and tools, having a surface layer of a work affected layer whose thickness is 0.2 ?m or below; and a method of producing the same.

Abstract: A clad textured metal substrate for forming the epitaxial thin film thereon, which includes a metallic layer and a copper layer bonded to at least one face of the metallic layer, wherein the copper layer has a {100}<001> cube texture in which a deviating angle ?? of crystal axes satisfies ???6 degree. The clad textured metal substrate has an intermediate layer on the surface of the copper layer to form the epitaxial thin film thereon. The intermediate layer preferably includes at least one layer of a material selected from the group consisting of nickel, nickel oxide, zirconium oxide, rare-earth oxide, magnesium oxide, strontium titanate (STO), strontium barium titanate (SBTO), titanium nitride, silver, palladium, gold, iridium, ruthenium, rhodium and platinum.

Abstract: The invention relates to tuned multifunctional linker molecules for charge transport through organic-inorganic composite structures. The problem underlying the present invention is to provide multifunctional linker molecules for tuning the conductivity in nanoparticle-linker assemblies which can be used in the formation of electronic networks and circuits and thin films of nanoparticles. The problem is solved according to the invention by providing a multifunctional linker molecule of the general structure CON1-FUNC1-X-FUNC2-CON2 in which X is the central body of the molecule, FUNC1 and FUNC2 independently of each other are molecular groups introducing a dipole moment and/or capable of forming intermolecular and/or intramolecular hydrogen bonding networks, and CON1 and CON2 independently of each other are molecular groups binding to nanostructured units comprising metal and semiconductor materials.

Abstract: An ultrathin copper foil with a carrier not causing blistering at a release layer interface, having a low carrier peeling force, friendly to the environment, and enabling easy peeling of a carrier foil and an ultrathin copper foil even under a high temperature environment and a printed circuit board enabling a stable production quality of a base of a printed circuit board for fine pattern applications using the ultrathin copper foil with the carrier, that is, an ultrathin copper foil with a carrier comprising a carrier foil, a release layer, and an ultrathin copper foil, wherein the release layer is formed by a metal A for retaining a release property and a metal B for facilitating plating of the ultrathin copper foil, a content a of the metal A and a content b of the metal B forming the release layer satisfying an equation: 10?a/(a+b)*100?70 and a printed circuit board prepared by using such an ultrathin copper foil with a carrier.

Abstract: An electrodeposited copper foil with carrier foil on which a resin layer for forming an insulating layer is formed, comprising a carrier foil, a bonding interface layer, an electrodeposited copper foil with smooth surfaces on both sides and a resin layer. The resin layer is composed of 20 to 80 parts by weight of an epoxy resin and a curing agent, 20 to 80 parts by weight of a solvent soluble aromatic polyamide resin polymer and optionally a curing accelerator in a suitable amount.

Abstract: Disclosed is a conductive material for a connecting part, including: a base material made up of a Cu strip; a Cu—Sn alloy covering layer having an average thickness of 0.2 to 3.0 ?m; and an Sn covering layer, the Cu—Sn alloy covering layer being provided between the base material and the Sn covering layer, wherein in a cross section perpendicular to the surface of the conductive material, the diameter [D1] of the minimum inscribed circle of the Sn covering layer is 0.2 ?m or less, the diameter [D2] of the maximum inscribed circle of the Sn covering layer is 1.2 to 20 ?m, the difference in elevation [y] between the outermost point of the material and the outermost point of the Cu—Sn alloy covering layer is 0.2 ?m or less, and a bright or semi-bright tin electroplating layer having an average thickness of 0.01 ?m or more in an approximately uniform thickness is formed on the outermost layer as part of the Sn covering layer.

Abstract: A brazing material for brazing tungsten/carbide/cobalt substrates (e.g., wear pads) to substrates comprising titanium or alloys thereof (e.g., fan or compressor blades). The brazing material includes gold, nickel, silver, aluminum, and copper present in respective amounts to provide a post-braze hardness of between 450 and 600 KHN to thereby increase the impact resistance of the braze joint. The substrates may be brazed by induction heating at temperatures less than about 1800° F. (982° C.).

Abstract: Free standing articles or articles at least partially coated with substantially porosity free, fine-grained and/or amorphous Co-bearing metallic materials optionally containing solid particulates dispersed therein, are disclosed. The electrodeposited metallic layers and/or patches comprising Co provide, enhance or restore strength, wear and/or lubricity of substrates without reducing the fatigue performance compared to either uncoated or equivalent thickness chromium coated substrate. The fine-grained and/or amorphous metallic coatings comprising Co are particularly suited for articles exposed to thermal cycling, fatigue and other stresses and/or in applications requiring anti-microbial properties.

Abstract: A nickel plating solution preparation method has the steps of: dissolving in water 100 g/L or more and less than 200 g/L of nickel sulfate, and 10 g/L or more and less than 30 g/L of sodium citrate or 8 g/L or more and less than 25 g/L of citric acid, but adding no nickel chloride; and adjusting a pH of the resultant solution to 2 or more and less than 4. Another nickel plating solution preparation method has the steps of: dissolving in water 100 g/L or more and less than 200 g/L of nickel sulfate, and 10 g/L or more and less than 30 g/L of sodium citrate or 8 g/L or more and less than 25 g/L of citric acid, but adding no boric acid; and adjusting a pH of the resultant solution to 2 or more and less than 4.

Abstract: A plated material 5, containing: on a conductive substrate 1, an underlayer 2 composed of nickel and the like; an intermediate layer 3 composed of Cu or a Cu alloy being provided thereon; and an outermost layer 4 composed of a Cu—Sn intermetallic compound being provided thereon; and an electric or electronic part using the same.

Abstract: There is provided a conductive material comprising a base material made up of a Cu strip, a Cu—Sn alloy covering layer formed over a surface of the base material, containing Cu in a range of 20 to 70 at.%, and having an average thickness in a range of 0.1 to 3.0 ?m and an Sn covering layer formed over the Cu—Sn alloy covering layer having an average thickness in a range of 0.2 to 5.0 ?m, disposed in that order, such that portions of the Cu—Sn alloy covering layer are exposed the surface of the Sn covering layer, and a ratio of an exposed area of the Cu—Sn alloy covering layer to the surface of the Sn covering layer is in a range of 3 to 75%.

Abstract: In Sn-plated copper or a Sn-plated copper alloy according to the present invention, a surface plating layer including a Ni layer, a Cu—Sn alloy layer, and a Sn layer which are deposited in this order is formed on a surface of a base material made of copper or a copper alloy. An average thickness of the Ni layer is 0.1 to 1.0 ?m, an average thickness of the Cu—Sn alloy layer is 0.55 to 1.0 ?m, and an average thickness of the Sn layer is 0.2 to 1.0 ?m. The Cu—Sn alloy layer includes Cu—Sn alloy layers having two compositions, a portion thereof in contact with the Ni layer is formed of an ?-phase having an average thickness of 0.5 to 0.95 ?m, and a portion thereof in contact with the Sn layer is formed of a ?-phase having an average thickness of 0.05 to 0.2 ?m.

Abstract: Provided is a metal covered polyimide composite comprising a tie-coat layer and a metal seed layer formed on a surface of a polyimide film by electroless plating or a drying method, and a copper layer or a copper alloy layer formed thereon by electroplating, wherein the copper plated layer or copper alloy plated layer includes three layers to one layer of the copper layer or copper alloy layer. The provided metal covered polyimide composite can effectively prevent peeling in a non-adhesive flexible laminate (especially a two-layer flexible laminate), particularly can effectively inhibit peeling from the interface of a copper layer and tin plating. Additionally provided are a method of producing the composite and an apparatus for producing the composite.

Abstract: A method for producing titanium alloy brazing strips and the resulting brazing strips and/or foils. The method uses a cold-rolling process without heat treating to generate a titanium based multi-layer alloy strip or foil made up of discrete layers of titanium and an additional layer or layers of one or more metals, such as zirconium, nickel and/or copper, for example, or alloys thereof, with the layer of titanium roll bonded without heat treating to the layers of the additional metal(s). The resulting strip or foil can include, for example, Cu/Ti/Cu, Ni/Ti/Ni, Ni/Ti/Cu, Cu/Ni/Ti/Ni/Cu, Ni/Cu/Ti/Cu/Ni, Ni/Cu/Ni/Ti/Ni/Cu/Ni, Ni/Zr/Cu/Ti/Cu/Zr/Ni and Ni/Ti/Cu/Zr/Cu/Ti/Ni among other combinations. The resulting strip or foil can be used for brazing, creating an alloy of the weight percentage of the original materials.

Abstract: An ultrathin copper foil with a carrier not causing blistering at a release layer interface, having a low carrier peeling force, friendly to the environment, and enabling easy peeling of a carrier foil and an ultrathin copper foil even under a high temperature environment and a printed circuit board enabling a stable production quality of a base of a printed circuit board for fine pattern applications using the ultrathin copper foil with the carrier, that is, a ultrathin copper foil with a carrier comprising a carrier foil, a diffusion prevention layer, a release layer, and an ultrathin copper foil, wherein the release layer is formed by a metal A for retaining a release property and a metal B for facilitating plating of the ultrathin copper foil, a content a of the metal A and a content b of the metal B forming the release layer satisfying an equation: 10?a/(a+b)*100?70 and a printed circuit board prepared by using such a ultrathin copper foil with a carrier.

Abstract: The object is to provide copper foil of high adhesion even when the roughness Rz of a nodular surface of the copper foil is low, and a method of manufacturing the copper foil. To achieve this object, there is adopted a copper foil which is characterized in that an area coefficient C(S), which is defined by A(S)/B(S) from a three-dimensional surface area A(S), which is obtained by performing three-dimensional measurement of a surface area of a nodular surface of a copper foil sample S under a laser microscope, and from a measuring region area B(S), which is an area of a measuring region of the three-dimensional surface area A(S), and a roughness Rz(S) of a nodular surface of the copper foil sample S, which is measured by a stylus-type roughness meter, have a relationship of equation (1) below, and in that the roughness Rz(S) is 1.0 ?m to 3.0 ?m, 0.5×Rz(S)+0.5?C(S)??(1) where Rz(S) is a numerical value represented by ?m.

Abstract: The present invention provides electrodeposited copper foil with a carrier foil which permits the formation of finer-pitch circuits and also enables the multilayer process to be easily performed to meet the requirements for recent printed wiring boards. According to the invention, there is provided electrodeposited copper foil with a carrier foil in which an adhesive interface layer is formed on a surface of the carrier foil and an electrodeposited copper foil layer is formed on the adhesive interface layer, which is characterized in that the electrodeposited copper foil layer is provided with a passivated layer formed without performing roughening treatment as nodular treatment and that a nickel-zinc alloy consisting essentially of 50 to 99% nickel by weight and 50 to 1% zinc by weight is adopted as the passivated layer.

Abstract: A brazing filler metal includes quaternary alloy powder and copper powder. The quaternary allow powder consists of from 0.1 to 27.4 mass percent tin, from 0.8 to 5.1 mass percent nickel, from 2.2 to 10.9 mass percent phosphorous and a balance including copper and any unavoidable impurity. The brazing filler metal can be used in a form of paste by being mixed with an organic binder and an organic solvent. The brazing filler metal and the brazing filler metal can be used for joining members made of copper or copper alloy, such as members of a heat exchanger.

Abstract: A metallic composite wire has at least two metallic layers. One layer, preferably the inner layer, is a non-ferrous metal alloy. A second layer, preferably the outermost layer, consists of copper.

Abstract: A solder joint (200) has a first contact pad 114 and a second contact pad 124 of a first metal, preferably copper, facing each other across a gap. A coat and 125, respectively) of a second metal, preferably nickel, covers each pad. A layer 201 of crystals of first intermetallic compounds, such as Ni3Sn4 and (Ni, Cu)3Sn4, covers the surface of each coat. Isolated crystals 202 of second intermetallic compounds, such as Cu6Sn5 and (Cu, Ni)6Sn5, different from the first intermetallic compounds, are dispersed on top of the layer 201 of crystals of the first intermetallic compounds. A solder alloy 203 including a third metal, preferably tin, and the first metal fills the gap. The solder alloy 203 may further include a fourth metal, preferably selected from a group of metals including silver, zinc, and indium.

Abstract: A flexible film and a display device including the same are disclosed. The flexible film includes an insulating film including at least one hole. The insulating film further includes a first surface corresponding to an inner circumferential surface of the hole, a second surface corresponding to an upper surface of the insulating film, and a third surface corresponding to a lower surface of the insulating film. The flexible film includes a first metal layer and a second metal layer that is positioned on the first surface and at least one of the second and third surfaces. A thickness of the first metal layer is smaller than a thickness of the second metal layer.

Abstract: Methods and articles are disclosed. The methods are directed to depositing nickel duplex layers on substrates to inhibit tin and tin alloy surface oxidation and improve solderability of the substrates.

Abstract: This disclosure provides a joining area and method between copper and stainless steel or titanium, as well as the permanent cathode obtained, where said joining area is made of a first zone of a copper-nickel (Cu—Ni) alloy, an intermediate zone with a mostly nickel alloy or pure nickel and a second zone made of a stainless steel-nickel alloy, which is the result of the participating materials being cast in an arc welding process, for example TIG, MIG or manual arc using electrodes of nickel as welding contributor between said materials and their space arrangement, that is to say, leaving a separation between the materials when performing the welding process, thus ensuring as follows: a) greater tensile strength, b) a substantial improvement of corrosion resistance of the joint welding, and c) improvement of conductibility, which can be improved still further by modifying the straight design of the conducting bar by providing it with the “horn”-type shape.

Abstract: An electronic component is provided which includes external electrodes having a multilayer structure of first and second sintered electrode layers that are densely sintered and have less possibility of causing poor appearance and decreased reliability in electrical connection. The external electrodes include a first sintered electrode layer and a second sintered electrode layer containing different metals. The first and second sintered electrode layers contain a borosilicate glass containing an alkali metal.

Abstract: The invention relates to the use of lead-free sliding layers in the laminated composite materials for slide bearings or bushes. According to the invention, the laminated composite material comprises a support layer, an antifriction layer (3) produced from a copper alloy or an aluminum alloy, an intermediate nickel layer (2) having a thickness >4 ?m and a sliding layer (1) consisting of approximately 0 to 20% by weight of copper and/or silver and the remainder tin. The sliding layer is electrodeposited from a methlysulfonic acid electrolyte.

Abstract: An electromagnetic shielding copper foil superior in electromagnetic shielding ability, high in transmittance, and free from particle shedding comprising a copper foil on at least one surface of which a fine roughening particle layer of copper or an alloy is provided and having on the fine roughening particle layer a smoothening layer comprised of cobalt, nickel, indium, or an alloy of the same and an electromagnetic shield able to be suitably used for a PDP using the same. The fine roughening particle layer may also be a layer comprised of a fine particle roughening particle layer of copper on which a fine roughening particle layer of a copper alloy is stacked or may also be formed by a copper-cobalt-nickel alloy. The smoothening layer of the copper foil may be treated for stainproof or by a silane coupling agent to protect the surface of the copper foil.