Abstract: Provided are a novel fluorene oxime ester compound, and a photopolymerization initiator and a photoresist composition containing the same.

Abstract: A colored curable composition of the present invention contains a compound represented by general formula (1). In general formula (1), X1 to X4 each represents a halogen atom, and M represents a metal atom, a metal oxide, a metal halide or a non-metal. R1 to R4 each represents a group represented by general formula (2) or a substituent other than the group, and at least one of R1 to R4 is a group represented by general formula (2). n1 to n4 each represents an integer of 0 to 4, and m1 to m4 represent an integer of 0 to 4. However, the sum total of n1 to n4 and the sum total of m1 to m4 are each 1 or higher. In general formula (2), L1 represents a divalent linking group, Ar represents an arylene group and A represents a group having a polymerizable group.

Abstract: The pattern forming method of the present invention includes: (i) forming a film including an actinic ray-sensitive or radiation-sensitive resin composition containing a compound (A) represented by General Formula (I) shown below; a resin (P) capable of decreasing solubility with respect to a developer including organic solvent by the action of an acid; and a compound (B) capable of generating an acid by irradiation of actinic rays or radiation; (ii) irradiating the film with actinic rays or radiation; (iii) developing the film irradiated with the actinic rays or radiation using a developer including an organic solvent. [Chem.

Abstract: A liquid crystal display including a first substrate; a second substrate facing the first substrate; a thin film transistor disposed on the first substrate; an organic layer disposed on the thin film transistor; a pixel electrode disposed on the organic layer; a lower alignment layer disposed on the pixel electrode; a common electrode disposed on the second substrate; and an upper alignment layer disposed on the common electrode, wherein a first free radical included in the organic layer and a second free radical included in at least one of the lower alignment layer and the upper alignment layer are radical bonded.

Abstract: An inkjet printing method includes, in order, the steps of a) providing to an inkjet printer at least two or more colorless liquids having a different composition and at least one color inkjet ink; b) mixing the color inkjet ink in a controlled amount with the two or more colorless liquids; and c) printing the ink-mixture of the color inkjet ink and the two or more colorless liquids with the inkjet printer onto an ink-receiver.

Abstract: There are provided a novel compound, a polymeric compound, a resist composition, an acid generator and a method of forming a resist pattern the compound represented by general formula (1-1): wherein each of R1 and R3 independently represents a single bond or a divalent linking group; A represents a divalent linking group; each of R2 and R4 independently represents a hydroxyl group, a hydrocarbon group which may have a substituent, or a group represented by general formula (1-an1), (1-an2) or (1-an3), provided that at least one of R2 and R4 represents a group represented by general formula (1-an1), (1-an2) or (1-an3); and n0 is preferably 0 or 1, and wherein Y1 represents a single bond or —SO2—; R5 represents a linear or branched monovalent hydrocarbon group of 1 to 10 carbon atoms, cyclic monovalent hydrocarbon group of 3 to 20 carbon atoms or monovalent hydrocarbon group of 3 to 20 carbon atoms having a cyclic partial structure which may be substituted with a fluorine atom; and M+ represents an organic ca

Abstract: A photosensitive resin composition for a color filter includes (A) an acrylic-based binder resin including a structural unit represented by the following Chemical Formula 1, wherein the definitions of R1, R2, R3 and R4 are the same as set forth in specification; (B) an acrylic-based photopolymerizable monomer; (C) a photopolymerization initiator; (D) a colorant; and (E) a solvent.

Abstract: An undercoat agent usable in phase separation of a layer formed on a substrate, the layer containing a block copolymer having a plurality of polymers bonded, the undercoat agent including a resin component, and 20 mol % to 80 mol % of all the structural units of the resin component being a structural unit derived from an aromatic ring-containing monomer; and a method of forming a pattern of a layer containing a block copolymer, the method including: step (1) coating the undercoat agent on a substrate (1), thereby forming a layer (2) composed of the undercoat agent, step (2) forming a layer (3) containing a block copolymer having a plurality of polymers bonded on the surface of the layer (2) composed of the undercoat agent, and subjecting the layer (3) containing the block copolymer to phase separation, and step (3) selectively removing a phase (3a) of at least one polymer of the plurality of copolymers constituting the block copolymer from the layer (3) containing the block copolymer.

Abstract: There is provided a pattern forming method including: (a) forming a film by an actinic ray-sensitive or radiation-sensitive resin composition containing (A) to (C), (A) a resin capable of increasing polarity by the action of an acid to decrease solubility in a developer containing an organic solvent, (B) a compound capable of generating acid upon irradiation with an actinic ray or radiation, and (C) a salt having a conjugate base structure of an acid having a pKa of ?2 or more in a molecule thereof and substantially not capable of decomposing by an actinic ray or radiation, (b) exposing the film, and (c) developing the exposed film using a developer containing an organic solvent to form a negative pattern.

Abstract: The present invention relates to a radiation-sensitive resin composition that contains: a compound that has a structure represented by the following formula (1); a first polymer that includes a fluorine atom; and a solvent. In the following formula (1), X represents a carbonyl group, a sulfonyl group or a single bond. Y+ represents a monovalent radiation-degradable onium cation. The first polymer preferably has at least one selected from the group consisting of a structural unit represented by the following formula (2a) and a structural unit represented by the following formula (2b). The first polymer preferably includes an alkali-labile group. The first polymer preferably includes an acid-labile group. It is preferred that a radiation-sensitive acid generator is further contained.

Abstract: According to one embodiment, an actinic-ray- or radiation-sensitive resin composition includes compound (A) that when exposed to actinic rays or radiation, generates acids and resin (B) that when acted on by an acid, is decomposed to thereby increase its solubility in an alkali developer. Compound (A) is expressed by general formula (I) below. Resin (B) contains at least one of repeating units of general formula (1) below.

Abstract: A radiation-sensitive resin composition includes (A) a block copolymer, and (B) an acid-generating agent. The block copolymer (A) includes a polymer block (I), a polymer block (II), and a moiety contained in the polymer block (I), the polymer block (2), or both thereof. The polymer block (I) includes an acid-dissociable group. The polymer block (II) includes an alkali-dissociable group. The moiety provides water repellency.

Abstract: An actinic ray-sensitive or radiation-sensitive resin composition includes; a compound (A) which generates an acid by irradiation with actinic rays or radiation, wherein the acid is linked with a group represented by the following general formula (M) through covalent bonding. In the formula, Y1 and Y2 each independently represent a hydrogen atom, an alkyl group, a cycloalkyl group, an alkenyl group, an alkynyl group, an aryl group, or an acyl group. Z represents a hydrogen atom or a substituent.

Abstract: A photoresist composition comprising: a resin which has an acid-labile group; an acid generator; a compound which has a sulfide bond and a mercapto group; and a solvent.

Abstract: A resist composition including a base component (A) which generates acid upon exposure and exhibits changed solubility in a developing solution under action of acid, the base component (A) including a resin component (A1) containing a structural unit (a0-1) having a group represented by general formula (a0-1) shown below and a structural unit (a1) derived from an acrylate ester which may have the hydrogen atom bonded to the carbon atom on the ?-position substituted with a substituent and contains an acid decomposable group which exhibits increased polarity by the action of acid.

Abstract: There is provided a pattern forming method comprising (i) a step of forming a film by an actinic ray-sensitive or radiation-sensitive resin composition; (ii) a step of exposing the film; and (iii) a step of performing development by using a developer containing an organic solvent to form a negative pattern, wherein the actinic ray-sensitive or radiation-sensitive resin composition contains (A) a resin capable of increasing the polarity by an action of an acid to decrease the solubility in a developer containing an organic solvent, (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation, (C) a solvent, and (D) a resin having a repeating unit having a fluorine atom and not having a CF3 partial structure.

Abstract: An acid diffusion control agent includes a compound represented by a formula (1), a compound represented by a formula (2) or both thereof. R1 represents a hydrocarbon group comprising a monovalent alicyclic structure, or the like. R2 and R3 each independently represent a monovalent hydrocarbon group, or the like. R4 and R5 each independently represent a monovalent hydrocarbon group, or the like. R6 and R7 each independently represent a monovalent hydrocarbon group, or the like. R8 represents a monocyclic heterocyclic group together with the ester group and with the carbon atom. n is an integer of 1 to 6. R9 represents a monovalent hydrocarbon group, or the like. R10 represents a monovalent hydrocarbon group having 1 to 10 carbon atoms. R11 and R12 each independently represent a monovalent hydrocarbon group, or the like. R13 and R14 each independently represent a monovalent hydrocarbon group, or the like.

Abstract: A photosensitive resin composition includes (a) a compound polymerizable in the presence of an acid, and (b) a photoacid generating agent including an onium salt having a cationic part structure represented by formula (b1) below and an anionic part structure represented by formula (b2) below, wherein the component (b) absorbs 50% or more of the amount of 365 nm wavelength light absorbed by the photosensitive resin composition,

Abstract: The present invention relates to a photosensitive resin composition, which comprises an alkali-soluble resin (A), a compound (B) containing vinyl unsaturated group(s), a photoinitiator (C), ortho-naphthoquinone diazide sulfonic acid ester (D), a thermal initiator (E) and a solvent (F). The photosensitive resin composition added with the ortho-naphthoquinone diazide sulfonic acid ester (D) and the thermal initiator (E) can have excellent resolution and development adherence. Moreover, the present invention further provides a spacer or a protective film formed by the aforementioned photosensitive resin composition, as well as a liquid crystal display device (LCD) including the aforementioned spacer or protective film.

Abstract: A chemical amplification resist composition according to the present invention includes (A) a compound including a triarylsulfonium cation having one or more fluorine atoms and capable of generating an acid with a volume of 240 ?3 or higher by irradiation of active rays or radiation; and (B) a compound including a phenolic hydroxyl group.

Abstract: The present invention provides a method for producing a resist composition used in a process for producing a semiconductor apparatus, the method including the steps of: cleaning an apparatus for producing the resist composition with a cleaning liquid; applying the cleaning liquid on an evaluation substrate by spin-coating after removing the cleaning liquid from the apparatus for producing the resist composition; repeating the step of cleaning and the step of applying until the change in the density of defects having a size of 100 nm or more on the evaluation substrate between before and after the application of the cleaning liquid becomes 0.2/cm2 or less; and producing the resist composition by using the apparatus for producing the resist composition after the step of repeating. There can be provided a method for producing a resist composition capable of producing a resist composition whose coating defects are reduced.

Abstract: Oxime ester compounds of the formula I, II, III, IV or V, wherein Z is for example (formula A); Z1 for is NO2, unsubstituted or substituted C7-C20aroyl or unsubstituted or substituted C4-C20heteroaroyl; provided that at least one Z1 is other than NO2; Z2 is for example unsubstituted or substituted C7-C20aroyl; R1, R2, R3, R4, R5 and R6 for example are hydrogen, halogen, or unsubstituted or substituted C1-C20alkyl, unsubstituted or substituted C6-C20aryl, or unsubstituted or substituted C4-C20heteroaryl; R9, R10, R11, R12 and R13 for example are hydrogen, halogen, OR16, unsubstituted or substituted C1-C20alkyl; provided that R9 and R13 are neither hydrogen nor fluorine; R14 is for example unsubstituted or substituted C6-C20aryl or C3-C20heteroaryl Q is for example C6-C20arylene or C3-C20heteroarylene; Q1 is —C1-C20alkylene-CO—; Q2 is naphthoylene; Q3 is for example phenylene; L is for example O-alkylene-O—; R15 is for example hydrogen or C1-C20alkyl; R20 is for example hydrogen, or unsubstituted or substituted

Abstract: A novel compound having satisfactory sensitivity (base generating performance), a photosensitive resin composition containing the compound as a photo-initiator, and a cured product of the composition are provided. Specifically, a compound represented by general formula (1) (compound (1)), a photosensitive resin composition containing (A) a photo-initiator including at least one compound (1) and (B) a photosensitive resin are provided. Preferred are the compound (1) in which R1 is an unsubstituted or substituted C6-C20 aromatic hydrocarbon group, the compound (1) in which at least one of R5, R6, R7, R8, R9, R10, and R11 is nitro, and the compound (1) in which n is 0. The symbols in general formula (1) are as defined in the description.

Abstract: A photoresist composition, a method of forming a pattern using the photoresist composition, and a method of manufacturing a display substrate are disclosed. A photoresist composition includes an alkali-soluble resin, a quinone diazide-based compound, a multivalent phenol-based compound, and a solvent. Therefore, photosensitivity for light having a wavelength in a range of about 392 nm to about 417 nm may be improved, and reliability of forming a photo pattern and a thin film pattern using the photoresist composition may be improved.

Abstract: Disclosed is a photosensitive resin composition for an organic insulating layer. More specifically, the photosensitive resin composition is suitable for forming a substrate of a transflective thin film transistor liquid crystal display (TFT-LCD) or a pattern of an interlayer insulating layer by improving remarkably a pattern property with a high taper angle besides improvement of flatness, sensitivity, heat resistance, and transparency. Particularly, the photosensitive resin composition can provide low power dissipation besides a wide viewing angle and high visibility when being applied to a transflective type display. In addition, the photosensitive resin composition can provide a clear screen under natural light without a backlight by maintaining the brightness of a screen and prominent field visibility.

Abstract: The present invention relates to a phthalocyanine compound represented by Formula 1, a dye including the same, a photosensitive resin composition including the same, and a color filter prepared using the same. In Formula 1, 1 to 8 of Z1 to Z16 are substituted with one of Formulae 2 to 5, as defined in the specification. The phthalocyanine compound can have high luminance, high contrast, and excellent heat resistance. wherein Z1 to Z16 and M1 are the same as in the detailed description of the invention.

Abstract: Compounds of formula (I), (II), and (III), wherein R1, R2, R?2 and R??2 for example are C1-C20alkyl, provided that at least one of R1, R2, R?2 and R??2 carries a specified substituent; R3, R4, and R5 for example independently of one another are hydrogen or a defined substituent provided that at least one of R3, R4 or R5 is other than hydrogen or C1-C20alkyl; R6, R7, R8, R?7, RV, R?8, R?6, R?7, R??6 and R??7 for example independently of one another have one of the meanings as given for R3, R4, and R5; and R9 for example is C1-C20alkyl; exhibit an unexpectedly good performance in photopolymerization reactions.

Abstract: A photosensitive composition and a photoresist are provided. The photoresist is formed by compounding a photosensitive composition. The photosensitive composition includes a binder agent, a first photomonomer, and a photo initiator. The first photomonomer has at least a lactic oligomer and at least two unsaturated acrylic functional groups, wherein the first photomonomer has an amount of about 25-95 parts by weight relative to 100 parts by weight of a solid content of the binder agent. The photoinitiator has an amount of about 0.5-15 parts by weight relative to 100 parts by weight of the solid content of the binder agent.

Abstract: Provided are a photosensitive resin composition for a color filter and a color filter using the same. The photosensitive resin composition for a color filter includes (A) a colorant including a diaminopyridine azo-based dye including a structure represented by Chemical Formula 1, and having an absorption wavelength at about 450 to about 550 nm, (B) an acrylic-based binder resin, (C) an acrylic-based photopolymerizable monomer, (D) a photopolymerization initiator, and (E) a solvent.

Abstract: A resist pattern-forming method is provided, including: providing a resist film using a photoresist composition; exposing the resist film; and developing the resist film exposed, the photoresist composition containing a polymer having a weight average molecular weight of no less than 1,000 and no greater than 7,500 and having a structural unit that includes an acid-labile group that is dissociated by an action of an acid, a radiation-sensitive acid generator and a solvent composition, and the photoresist composition having a content of solids of no less than 20% by mass and no greater than 60% by mass. The photoresist composition preferably has a viscosity of no less than 50 mPa·s and no greater than 150 mPa·s at 25° C.

Abstract: An undercoat agent usable in phase separation of a layer formed on a substrate, the layer containing a block copolymer having a plurality of polymers bonded, the undercoat agent including a resin component, and 20 mol % to 80 mol % of all the structural units of the resin component being a structural unit derived from an aromatic ring-containing monomer; and a method of forming a pattern of a layer containing a block copolymer, the method including: step (1) coating the undercoat agent on a substrate (1), thereby forming a layer (2) composed of the undercoat agent, step (2) forming a layer (3) containing a block copolymer having a plurality of polymers bonded on the surface of the layer (2) composed of the undercoat agent, and subjecting the layer (3) containing the block copolymer to phase separation, and step (3) selectively removing a phase (3a) of at least one polymer of the plurality of copolymers constituting the block copolymer from the layer (3) containing the block copolymer.

Abstract: Lithographic printing plates and processes for preparing the lithographic printing plates are provided. The plates have excellent printing durability, staining resistance and staining resistance over time. The lithographic printing plate precursor includes: a substrate; a photosensitive layer provided on the substrate; and an extra layer optionally provided between the substrate and the photosensitive layer. The photosensitive layer or the extra layer adjacent to the substrate contains (A) a copolymer. The copolymer (A) includes: (a1) a repeating unit of formula (a1-1) below in a side chain, and (a2) a repeating unit having at least one of the structures represented by formulae (a2-1) to (a2-6) shown in the specification in a side chain. L1, Z1, R1, and R21, R22 and R23 in formula (a1-1) and the variables in formulae (a2-1) to (a2-6) are as defined in the specification.

Abstract: The present invention relates to a photo-curable and thermo-curable resin composition that can provide a dry film solder resist having a higher glass transition temperature and improved heat resistance reliability, and the dry film solder resist. Said resin composition may include an acid-modified oligomer including an iminocarbonate-based compound having a carboxy group (—COOH) and a photo-curable unsaturated functional group, a photo-polymerizable monomer having two or more photo-curable unsaturated functional groups, a thermo-curable binder having a thermo-curable functional group, and a photo-initiator.

Abstract: A negative photosensitive resin composition including an alkali-soluble resin (A), a photoacid generator (B), a basic compound (C), a cross-linking agent (D), and a solvent (E) is provided. The alkali-soluble resin (A) includes an acrylate resin (A-1) and a novolac resin (A-2). The acrylate resin (A-1) is synthesized by polymerizing a monomer for polymerization, wherein the monomer for polymerization includes an unsaturated carboxylic acid or unsaturated carboxylic acid anhydride monomer (a-1-1) and a monomer (a-1-2). The monomer (a-1-2) includes a compound (a-1-2-1) with a tricyclodecane or dicyclopentadiene structure, a compound (a-1-2-2) represented by formula (1), or a combination of both. The novolac resin (A-2) is synthesized by polymerizing an aldehyde compound with an aromatic hydroxy compound, wherein the aromatic hydroxy compound includes a xylenol compound.

Abstract: An alkali-soluble resin is provided. The alkali-soluble resin is prepared using a polyfunctional thiol compound as a chain transfer agent. The alkali-soluble resin has a lower viscosity than a resin having the same molecular weight. Further provided is a negative-type photosensitive resin composition comprising the alkali-soluble resin as a binder resin. The use of the alkali-soluble resin lowers the overall viscosity of the photosensitive resin composition to effectively reduce the height of a stepped portion of a photoresist pattern using a small amount of the photosensitive resin composition.

Abstract: Provided is an organic light emitting element having a high light emission efficiency and a low drive voltage. In the organic light emitting element including a positive electrode, a negative electrode and an organic compound layer disposed between the positive electrode and the negative electrode, the organic compound layer includes a thioxanthone compound represented by the following general formula [1].

Abstract: A resist composition containing a compound represented by general formula (m0), wherein R1 and R2 each independently represents an aryl group which may have a substituent, an alkyl group which may have a substituent, or an alkenyl group which may have a substituent, provided that R1 and R2 may be mutually bonded to form a ring with the sulfur atom; R3 represents an aromatic hydrocarbon group which may have a substituent, an alkenyl group which may have a substituent, or an alkynyl group which may have a substituent; V1 represents a single bond or an alkylene group, provided that, when R3 is an aromatic hydrocarbon group which may have a substituent, V1 is an alkylene group; and X0? represents a monovalent organic anion.

Abstract: The present invention provides a class of molecular glass photoresist (I and II) comprising bisphenol A as a main structure and their preparation. The molecular glass photoresist is formulated with a photoacid generator, a cross-linking agent, a photoresist solvent, and other additives into a positive or negative photoresist. A photoresist with a uniform thickness is formed on a silicon wafer by spin-coating. The photoresist formulation can be used in modern lithography, such as 248 nm photolithography, 193 nm photolithography, extreme-ultraviolet (EUV) lithography, nanoimprint lithography, electron beam lithography, and particularly in the EUV-lithography technique.

Abstract: An embodiment of the invention discloses an alkaline soluble resin and a method for preparing the same. The chemical formula of this alkaline soluble resin is shown in Formula I: wherein a is an integer of 1 to 5, b is an integer of 1 to 5, c is an integer of 1 to 10, d is an integer of 1 to 10, m is an integer of 1 to 30, n is an integer of 1 to 10, R is hydrogen, alkyl, alkoxy or acrylate; the alkaline soluble resin has a weight-average molecular weight of 3,500-35,000. The invention also discloses a light sensible resin composition comprising the alkaline soluble resin, as well as a colored photoresist for color filters comprising the aforementioned light sensible resin composition and a display element comprising this colored photoresist.

Abstract: A radiation-sensitive composition containing a resist compound having a high sensitivity, a high resolution, a high etching resistance, and a low outgas which forms a resist pattern with a good shape is described.

Abstract: Provided is a pattern forming method that is excellent in resolving power such as pre-bridging dimension, a roughness performance such as line edge roughness, and development time dependency, and an actinic-ray-sensitive or radiation-sensitive resin composition and a resist film used for the pattern forming method. The pattern forming method includes (1) forming a film using an actinic-ray-sensitive or radiation-sensitive resin composition that contains a resin (A) and a compound (B) which has a polymerizable group and generates an acid by being irradiated with actinic rays or radiations; (2) exposing the film; and (3) developing the exposed film using a developer that contains an organic solvent, wherein a pattern formed in this method is a negative pattern.

Abstract: Provided is a photosensitive composition, which comprises a carboxyl group-containing resin, a photopolymerization initiator, a photosensitive acrylate compound and a filler, wherein the filler has a refractive index of 1.5 to 1.6 and a dry coating film of the photosensitive composition shows an absorbance of at least either 0.01 to 0.2 at a wavelength of 365 nm or 0.01 to 0.2 at a wavelength of 405 nm per thickness of 25 ?m. The content of the filler is preferably 20 to 60 wt % with respect to the total amount of the composition. This photosensitive composition can be advantageously used as a plating resist of a printed wiring board or a solder resist and is useful particularly in the formation of a very finely patterned resist film having a high aspect ratio.

Abstract: Provided is an alkali-developable photosensitive resin composition, the dry coating film of which has a favorable dryness to touch, excellent storage stability and few substances that are harmful to humans. The alkali-developable resin composition comprising (A) a carboxyl group-containing resin, (B) a photopolymerization initiator, (C) a compound with two or more ethylenic unsaturated groups in the molecule, (D) filler and (E) an aromatic petroleum solvent, is characterized in that the naphthalene content of said composition is 300 ppm or less.

Abstract: There is provided a pattern forming method comprising (i) a step of forming a film by using an actinic ray-sensitive or radiation-sensitive composition containing (A) a non-polymeric acid-decomposable compound having an aromatic ring and a molecular weight of 500 to 5,000 and (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation; (ii) a step of exposing the film, and (iii) a step of performing development by using an organic solvent-containing developer to form a negative pattern.

Abstract: A resist pattern-forming method includes forming a resist film using a photoresist composition. The resist film is exposed. The exposed resist film is developed. The photoresist composition includes an acid generator and a polymer. The acid generator generates a protonic acid upon application of exposure light. The protonic acid generates a proton. The polymer includes a first structural unit which includes a first group. The first group and the proton form a cationic group. The polymer substantially does not include a structural unit which includes an acid-labile group.

Abstract: There is provided an actinic ray-sensitive or radiation-sensitive composition containing (?) a compound represented by the formula (?I) capable of generating an acid having a size of 200 ?3 or more in volume and (?) a compound capable of generating an acid upon irradiation with an actinic ray or radiation, and the formula (?I) is defined as herein, and a resist film formed using the actinic ray-sensitive or radiation-sensitive composition, a resist-coated mask blanks coated with the resist film, a resist pattern forming method comprising exposing the resist film and developing the exposed film, a photomask obtained by exposing and developing the resist-coated mask blanks, a method for manufacturing an electronic device, comprising the resist pattern forming method and an electronic device manufactured by the manufacturing method of an electronic device.

Abstract: An object of the present invention is to provide a pigment dispersion excellent in the dispersibility of C.I. Pigment yellow 185. The present invention provides a pigment dispersion wherein C.I.

Abstract: The invention relates to a method for making a polymer wherein during the polymerization is incorporated in the polymer chain by ring opening polymerization a cyclic (alkyl)acryloyl carbonate having the formula (4): wherein R1 and R2 each independently are hydrogen, methyl or ethyl. Preferable the polymer is an (alkyl)acryloyl polycarbonate such that at least one first monomer a cyclic (alkyl)acryloyl carbonate having the formula (4). The (alkyl)acryloyl polyester may be modified and used in biodevices.

Abstract: The present invention relates to a photosensitive resist composition comprising a colorant. More specifically, it relates to a photosensitive resist composition which is advantageously used for the production of a color filter for use in electronic paper displays devices, color image pick-up elements and the like.

Abstract: A photoresist composition containing: a polymer including an acid-labile group; a radiation-sensitive acid generator; and an acid diffusion control agent that contains a compound represented by a formula (1). In the formula (1), R1, R2 and R3 each independently represent a hydrogen atom or a monovalent hydrocarbon group having 1 to 10 carbon atoms. A represents a group having a valency of n that is obtained by combining: a hydrogen atom, a linear hydrocarbon group having 1 to 30 carbon atoms, an alicyclic hydrocarbon group having 3 to 30 carbon atoms or a combination thereof; —O—, —CO—, —COO—, —SO2O—, —NRSO2—, —NRSO2O—, —NRCO— or a combination thereof; and n nitrogen atoms as a binding site to the carbonyl group in the formula (1), in which a sum of atomic masses of the atoms constituting A is no less than 120. n is an integer of 1 to 4.