Abstract: An electrical connection device includes a platform and a moving head. Between these components a semiconductor component is received and retained. The semiconductor component includes an electrical connection plate bearing an integrated circuit chip. The platform supports the making of electrical connection with front electrical connection terminals provided on a front panel of the electrical connection plate. The moving head bears a printed circuit board having interlinked pairs of contact terminals and associated pairs of electrical connection posts which make contact between the pairs of contact terminals of the printed circuit board and rear link terminals and rear transfer terminals provided on a rear panel of the electrical connection plate. The electrical connection plate includes circuitry which electrically connects the rear link terminals to the chip and also circuitry which electrically connects rear transfer terminals to front transfer terminals.

Abstract: According to one embodiment, a printed circuit board includes a first dielectric layer, a circuit component mounted on the first dielectric layer, and a second dielectric layer. The first dielectric layer is provided with a via hole which opens at a surface thereof and in which a conductive layer is provided, and a conductive pattern connected electrically to the conductive layer of the via hole. The circuit component is provided with a bump at least a part of which is inserted in the via hole and bonded to an inner surface of the via hole. The second dielectric layer is formed provided with another conductive pattern and laminated to the first dielectric layer to cover the circuit component.

Abstract: An expanding high speed transport interface hardware method for motherboard is provided. In the method, a mezzanine card is provided and the mezzanine card has a chip socket. An expanding hardware with high speed transport interface is installed in the chip socket of the mezzanine card. In addition, the mezzanine card is inserted into an idle CPU socket in a motherboard with plural CPU structure to make the mezzanine card electrically connect with the second CPU socket, so that the mezzanine card and the expanding hardware become components of the motherboard. Finally, the motherboard is activated to detect the mezzanine card and the expanding hardware and set the CPU bus as a data transmission path between the mezzanine card and the expanding hardware so as to expand interface hardware for the idle CPU socket. Besides, more design choices and opportunities are provided for the manufacturers of motherboard and peripheral.

Abstract: A modular board to board mezzanine ball grid array BGA connector includes a plug, a receptacle and if needed an adapter. The plug and the receptacle can be made form the same base pieces to accommodate different stack heights. If a greater stack height is needed, spacers can be used in the plug and the receptacle to accommodates a greater selected stack height. The plug and the receptacle both include a base having an interstitial diamond recesses in which the solder balls are disposed and in which one end of a contact is inserted. The plug may further include a plug cover that can be connected to the base, and the receptacle may include a receptacle cover that fits over its base. The plug can have a plug contact assembly, and the receptacle can have a receptacle contact assembly. The plug and the receptacle can be mated by mating the plug cover to the receptacle cover and the receptacle contacts to the plug contacts.

Abstract: A PGA socket including a plurality of sub-socket components, which when used in combination forms a larger effective socket, includes multiple apertures configured to receive corresponding pins of an IC. The PGA socket further includes multiple contact members, each of the contact members corresponding to a respective one of the apertures. The contact members are configured to movably engage corresponding pins of the IC upon respective movement of the apertures so as to provide electrical and mechanical contact thereto. Each of the sub-socket components is configured to mechanically engage at least one of the other sub-socket components such that the contact members in each of the sub-socket components are capable of electrically connecting to corresponding pins of the IC substantially simultaneously.

Abstract: A probe pin cartridge includes a first substrate disposed opposite to a positioning member, a second substrate laid beneath the first substrate, having the same contour as that of the first substrate and a plurality of probe pins held by the first and second substrates.

Abstract: An electrical connector includes an insulative housing (10) adapted to engage conductive terminals, and having an IC package mating surface (101) and an opposite substrate mounting surface (103). A rigid strip (12), in a substantially wavy, is attached to and configured to surround peripheral walls of the insulative housing. The rigid strip includes a first series of spaced protrusion portions (120) extending above the IC package mating surface so as to define a receiving cavity therebetween for receiving an IC package, and a second series of spaced protrusion portions (122) extending below the substrate mounting surface with at least four spaced protrusion portions around four corners of the insulative housing disposed in a substantially coplanar manner to function as standoffs. Such a configuration and shape of the rigid strip will have the function of reinforcing the insulative housing while not taking up much more “real estate” of the substrate.

Abstract: A dual-in-line adaptor for mounting an electronic assembly that requires validation includes a pair of substantially parallel pin strips mounted to a first side of a dual-in-line adaptor circuit board and a first land pattern on at least one of the first side and a second side of the dual-in-line adaptor circuit board. The second side opposing the first side and the first land pattern corresponding to a second land pattern on the electronic assembly that requires validation. A method for testing an electronic assembly that requires validation using a dual-in-line adaptor is also described.

Abstract: A BIOS recovery apparatus for recovering a primary BIOS chip of a motherboard in a computer system comprises a switch controller unit (100), a connecting socket (106), and a plurality of insulated flexible cords (101, 102, 103). The connecting socket comprises a top socket (50), a bottom socket (51) and a printed circuit board (52). The top socket and the bottom socket are attached on opposite sides of the printed circuit board. The insulated flexible cords connect the switch controller unit and the connecting socket together. A secondary BIOS chip is received in the top socket and a primary BIOS chip is received in the bottom socket. The switch controller unit can be a button switch or a parallel port controller.

Abstract: A apparatus is described herein for configuring Input/Output (I/O) conductors on an integrated circuit (IC) or in a socket. At least a portion of the I/O conductors for an IC and/or contacts/receptacles of a socket are configured in a repeatable 2×4 rectangular T pattern. The rectangular T pattern includes a first line of four conductors, which include two ground conductors and a first differential pair of conductors, and a second line of four conductors, which include a second and a third pair of differential conductors. The I/O conductors on the IC may be pads/lands in an land-grid-array (LGA) style socket, pins in a pin-grid-array (PGA) style socket, or other conductor in another style of socket, while the socket includes corresponding contacts, receptacles, etc.

Abstract: A socket connector (100) includes an insulative housing (1) and a frame (3). The housing defines a mating interface (101), a mounting interface (102) opposite to the mating interface and periphery faces between the mating interface and the mounting interface. The frame has an opening (31) therein to accommodate the housing. At least one retaining device (11) includes a stopper portion (111) and a resilient claw portion (113) unitarily formed on the periphery face of the housing. One face of the frame is supported by the stopper portion and the opposite face is abutted against by the resilient claw potion while the housing is assembled in the opening of the frame.

Abstract: An electrical connector socket, comprising an insulating base defining a sector and a surrounding portion surrounding the electric area, a cover slidably mounted on the base, a metal reinforced device with a rectangular frame sandwiched between the base and the cover, and an actuation mechanism is also pivotally sandwiched between the base and the cover. The sector divided into several sections that each has at least one set of edge to form at least one channel thereon, and the metal reinforced device defines a bridge portion corresponding to the channel of the base. When the rotation of actuation mechanism, the metal reinforced device sustain greater forces exert on the base and the cover, the base and cover are resistant to deformation and maintain the effective displacement of the cover respect to the base.

Abstract: In an electrical characteristic measuring probe of the present invention constructed by assembling a plurality of probe parts, each comprising a base portion, a plurality of terminal portions extended outward from one end of the base portion, wiring patterns extended from a plurality of terminal portions onto the base portion respectively, and contact portions connected to the wiring patterns respectively, a plurality of thin plate-like probe parts are aligned such that respective thin-plate surfaces are placed in parallel with each other and the contact portions are directed in the same direction, and a plurality of probe parts and spacers are fixed by fixing means in a state that the spacer is arranged between a plurality of probe parts respectively.

Abstract: An IC socket comprises a plurality of conductive connecting sections each having a holding section for holding one of a plurality of lead terminals of an IC; and a plurality of conductive coil springs, which are protruded from the IC socket and respectively fixed to the conductive connecting sections, the conductive springs being closer to a circuit board than the conductive connecting sections.

Abstract: A set of electronic frames capable of detecting an external device includes a main frame and an external frame. The main frame includes an R-C circuit with a detecting pin, a resistor coupled to the detecting pin, and a voltage comparator for comparing the potential at the detecting pin and a reference potential. The external frame includes a connecting port coupled to the R-C circuit of the main frame. The connecting port includes an identifying pin coupled to the detecting pin, and an R-C circuit coupled to the identifying pin.

Abstract: A socket device is installed on a circuit board of an electronic product and includes an insulating housing formed with a contained space for containing an electronic component, a plurality of terminals installed in the contained space, and a holding casing covered around the insulating housing. The insulating housing has at least one horizontal penetrating groove formed at two sides thereof. The terminals are electrically connected with the electronic component. The holding casing forms at least one elastic arm at its two sides, respectively. Each elastic arm forms a pressing portion from a top edge thereof to the contained space for pressing the electrical component, and a guiding portion transversely extended from a free end thereof to the contained space. Each guiding portion is slidably contained in the penetrating groove. Therefore, it can prevent the elastic arm twisted outwardly and the socket device from deforming during the assembly process.

Abstract: A burn-in socket assembly comprises a housing assembly with a plurality of contacts arranged therein. Each contact includes a contact engaging portion extends above a supporting surface of the housing assembly and located within a package receiving space. A pusher assembly pivotally assembles to a first side of the housing assembly and includes a pusher. A heat generating and sensor assembly is supported on the pusher, and includes a cable extending away and outward of the pusher. A latch pivotally assembles on the pusher assembly for securely locking the pusher assembly to the housing assembly. Wherein an organizer is arranged on the housing assembly such that the cable is securely arranged and protected therein.

Abstract: An electrical connector (2) comprises an housing (2), a plurality terminals (21) received in the housing (2), a stiffener (3) engaged with the housing (2), a clip (5) and a lever (6) pivotably mounted on two opposite sides of the stiffener (3) and a securing member (7). When the securing member (7) is assembled on the lever (6), the barbs of the securing member (7) engages interferentially with outer surface of one end of the lever (6), thus the lever (6) is reliably secured on the stiffener, and the mechanical connection of the electrical connector is achieved.

Abstract: An electrical connector (100) for accommodating an electrical device, and includes a shielding member (3), a terminal block positioned adjacent to the bottom of the shielding member (3), a number of terminals (2) received in the terminal block (1). The shielding member (3) includes a first wall (31), a second wall (32), a third wall (33) and a fourth wall (34) connecting with one another in turn, the terminal block (1) mainly extends along a first direction and is positioned adjacent to the bottom of the shielding member (3), the terminals (2) are assembled to the terminal block (1) and extends to a second direction perpendicular to the first direction.

Abstract: According to a first embodiment of the invention, a Land Grid Array (LGA) socket includes two sets of spring-loaded contacts, the contacts in the first set having an orientation opposite the contacts in the second set. Each set of contacts is positioned such that the total force and total moment of about the socket center by the wiping of the contacts is near zero. According to a second through fourth embodiment of the invention, a rectangular socket may be formed. According to these embodiments, the contacts are divided into four sets. Each set may have a different orientation, arranged so that the total force and moment are near zero.

Abstract: A method and structure is disclosed for forming a removable interconnect for semiconductor packages, where the connector is adapted to repeatedly change from a first shape into a second shape upon being subjected to a temperature change and to repeatedly return to the first shape when not being subjected to the temperature change. The connector can be disconnected when the connector is in its second shape and the connector cannot be disconnected when the connector is in its first shape.

Abstract: A hybrid non-abrasive electrical test contact element of a test socket is taught. Unlike cantilever contact elements of the prior art, the contact element of the present invention is able to contact a lead of an integrated circuit device under test without abrading the plating on the lead. This is achieved by the contact element possessing multiple loops to allow the tip of the contact element to move not only downwards, but also sideways in a rocking and non-sliding motion. The tip of the contact is also shaped to contact the lead at only a radius corner of each lead so as not to affect the solderability of the lead. In addition, tests have shown that the contact element of the present invention has at least twice the working life span compared to another contact element of the prior art.

Abstract: Circuit board and system with multi-portion sockets, and signal methods practiced thereon are described herein.

Abstract: A socket terminal assembly is configured to electrically connect a contacting area of an integrated circuit with a corresponding connection region of a substrate, the socket terminal assembly comprising a socket shell including a first end configured to contact the corresponding connection region of the substrate and a second end defining a first open cavity; a pin including an end defining a second open cavity; and a coiled spring interposed between the socket shell and the pin, the spring including a first end section received within the first open cavity and a second end section received within the second open cavity.

Abstract: An electrical connector assembly includes a connector comprising a base with a plurality of passageways receiving a plurality of conductive contacts, a cover mounted on the base, the cover defining a plurality of through holes corresponding to the passageways, and an actuator for driving the cover to move from an open position to a closed position; a chip module mounted on the connector and including an abutting surface resting on the cover and a plurality of pins extending from the abutting surface. A first guiding device is defined on the chip module and a second guiding device is defined on the connector for engaging with the first guiding device along an engaging direction, and a length of the two guiding devices along the engaging direction is longer than that of the pins, and wherein the module is provided with a first guider and the connector is provided with a second guider, and the two guiders have different heights in the engaging direction.

Abstract: A land grid array (LGA) socket connector (10) includes a number of contact segments (120, 140, 160, 180) and location members (122, 142, 162, 182). The contact segments are combined to form a substantially rectangular contact region. The location members are physically separated from one another, and further disposed around the respective corners of the combined contact regions to receive and hold an IC package (2) in position.

Abstract: A connector has an inner side face defining a chamber formed with an opening. A module body is inserted from the opening to be accommodated in the chamber. A first conductive member is provided on an outer periphery of the module body which is opposed to the inner side face of the connector in a case where the module body is accommodated in the chamber. A second conductive member is provided on the inner side face of the connector, such that the first conductive member is brought into contact with the first conductive member in a case where the module body is plenarily accommodated in the chamber.

Abstract: An electrical connector assembly (1) includes an insulative housing (20) receiving conductive terminals (26) therein, an integrated circuit package (30) mounted on the housing, a stiffener (40) surrounding the housing, a load plate (50) pivotally assembled with a first end (401) of the stiffener, and a load lever (60) assembled with a second end (402) of the stiffener. The housing defines at least one cut (241) in a side wall thereof, and the IC package defines at least one protrusion (302). After the IC package is mounted on the housing, the at least one protrusion is located in the at least one cut.

Abstract: A method and structure is disclosed for forming a removable interconnect for semiconductor packages, where the connector is adapted to repeatedly change from a first shape into a second shape upon being subjected to a temperature change and to repeatedly return to the first shape when not being subjected to the temperature change. The connector can be disconnected when the connector is in its second shape and the connector cannot be disconnected when the connector is in its first shape.

Abstract: In a connector with a component built-in, a base member is formed of three-dimensional formation circuit substrate, and has a fitting portion that is to be fitted to a connector of counterpart. Terminals electrically connected to a wiring pattern on a mother board, contacts electrically connected to contacts of the connector of counterpart, and a conductive pattern electrically connected to the electronic component are formed on a surface of the base member. Thus, the conductive pattern can easily be modified depending on application, and it is possible to provide complicated wirings. Furthermore, since the electronic component is mounted on the base member, it is possible to make the connector embed a lot of electronic components, and degrees of freedom of design are increased. Still furthermore, the electronic component can be connected by reflow soldering, so that mounting workability of the electronic component is increased.

Abstract: A socket for removably mounting an electronic device and which has utility for testing of the electronic device. The socket includes pinch-style support contacts which establish a reference seating plane for an IC package. The pinch-style support contacts each include a stationary contact arm, a movable contact arm, and a terminal portion. The stationary contact arm and the movable contact arm each include a contact surface configured to contact a terminal of the IC package. The stationary contact arm additionally includes an IC package support surface and extends beyond the height of the movable contact arm. A method of supporting and electrically connecting the socket and IC package is also disclosed.

Abstract: An electrical connecting apparatus comprises: a plurality of plate-like probes, each of which electrically connects an electrode of a device under test and a conductive portion formed in a base plate, and each of which has a tip to be pressed against the electrode on one end side of the probe and a curved outer face on one side in the width direction of the probe, and each of which further has a first recess opening on the one side; and an assembler for assembling the probes into the base plate such that the probes are arranged at intervals in the thickness direction and that the tips are projected to the side opposite to the base plate.

Abstract: A grounded conductive plate in a land grid array package assembly includes a plurality of openings. The openings allow contacts from the socket to pass through to contact a package. The diameter of each opening is customizable to produce desired impedance between the contacts and the conductive plate. Impedance discontinuity seen by signals passing through the socket may be reduced.

Abstract: A test socket (52) for a semiconductor component (12) includes a base (54), a movable lid (56), socket contacts (68) for electrically engaging terminal contacts (14) on the component (12), and a retention mechanism (74) having latches (74) actuated by movement of the lid (56) for inward and outward movement during retention and release of the component (12). Such lid (56) and latch (74) movement provides a loading/unloading position, in which the component (12) can be loaded or unloaded, and then a testing position, in which the component (12) is retained by the retention mechanism (74) in electrical communication with the socket contacts (68). The test socket (52) also includes a nest (58) for aligning the component (12), which is configured for removal or installation in the testing position of the test socket (52) while the latches (74) are in the inward or retention position.

Abstract: A test socket is provided for use in testing integrated circuits, especially integrated circuits in BGA packages. The test socket comprises a base member and a cover member configured to move vertically between an upper position and a lower position with respect to the base member. Springs are positioned between the base member and the cover member and configured to bias the cover member in the upper position. A lever is coupled to the base member and to the cover member and is configured to pivot to an open position when the cover member is in the lower position and to pivot to a closed position to confine an integrated circuit within the base member when the cover member is in the upper position.

Abstract: A center processing unit (CPU) socket holds a CPU and has a base, multiple contacting tabs and multiple contacting tab holders. The base has a bottom, a seat, a cover and a latch. The seat is mounted in the bottom and has a recess. The contacting tabs are mounted in the recess in multiple lines and each contacting tab has a curved top contact end. The contacting tab holders extend up from the recess in seat and are aligned respectively with the curved top contact ends of the contacting tabs. When a CPU is installed in the CPU socket and presses against the contacting tabs, the contacting tab holders hold the curved top contact ends of the contacting tabs to avoid the vibration of the contacting tabs due to the transmission of the high frequency signals between the CPU and the CPU socket.

Abstract: A connector for coupling a component to external circuitry, comprising a base, a guide for guiding the component along an axis towards the base, a first barb positioned to latch an edge of the component at a first distance along the axis from the base, and a second barb positioned to latch an edge of the component at a second distance along the axis from the base.

Abstract: An electrical connector (1) is used for electrically connecting a ball grid array (BGA) central processing unit (CPU) (3) with a printed circuit board (PCB). The connector includes a generally rectangular insulative housing (10) and a number of terminals (20) received in the housing. Each of the terminals includes a connecting portion (200), a solder pad (202) extending from a bottom end of the connecting portion, and a cantilever (204) extending aslant from a top end of the connecting portion. The cantilever has a concave portion (206) near a free end thereof. When the CPU with a multiplicity of solder balls is attached onto the connector, the concave portions of the terminals cover bottom portions of the solder balls. Therefore, the terminals of the connector electrically connect with the solder balls of the CPU steadily, and a reliable connection between the CPU and the PCB is established.

Abstract: A load board for packaged IC testing. The load board with predetermined testing circuit thereon has bonding pad areas on its surface. A plurality of bonding pads is formed on the bonding pad areas, each of which is disposed corresponding to a lead of a packaged IC for testing connection, such as a quad flat packaged IC (QFP), a dual inline packaged IC (DIP) or a small outline packaged IC (SOP). The bonding pads on the load board connect the leads of the testing IC directly during IC testing, thus the conventional test socket between a conventional load board and a packaged IC is omitted.

Abstract: An intercoupling component is of the type used to couple an array of electrical connection regions disposed on a first substrate to an array of electrical connection regions disposed on a second substrate. The intercoupling component comprises: an insulative support member; a plurality of electrically conductive terminal elements; a second insulative support member; and a seal member positioned between the first insulative support member and the second insulative member to restrict fluid flow along the terminal elements.

Abstract: A hybrid interface apparatus including a fixed base including a contact-locking structure supporting several spring-based contact members, and a nesting member slidably positioned over the fixed base and having a central test area that includes an array of through-holes that are aligned with upper ends of the contact members. To facilitate testing of ICs including both relatively low-speed general-purpose I/O structures and new high-speed I/O structures, the contact members mounted on the contact structure include both low-cost, relatively high-inductance contact members for facilitating communication with the general-purpose I/O structures of the IC, and relatively expensive, low-inductance contact members for facilitating high-speed communications with the high-speed I/O structures of the IC.

Abstract: A connector has an inner side face defining a chamber formed with an opening. A module body is inserted from the opening to be accommodated in the chamber. A first conductive member is provided on an outer periphery of the module body which is opposed to the inner side face of the connector in a case where the module body is accommodated in the chamber. A second conductive member is provided on the inner side face of the connector, such that the first conductive member is brought into contact with the second conductive member in a case where the module body is plenarily accommodated in the chamber.

Abstract: A module connector includes an insulated component, a plurality of contacts inside the module connector and a housing shell outside of the module connector. The insulated component has four sidewalls that define an inserting space to receive another module. Each sidewall has a plurality of contacts parallel L-shaped slots to accommodate the contacts that are electrically connected with the outside module. The housing shell has four side containing walls. A pressing pin and an elastic pin are extended from the top of each side-containing wall towards the inserting space. The pressing pins prop downwardly the outside module.

Abstract: A Land Grid Array structure is enhanced with a flex film interposer that not only provides a Land Grid Array (LGA) electrical connection between a Multi-Chip Module (MCM) and the next level of integration such as a system board, but also provides a reliable means to implement desired Engineering Change (EC) capability as well as a means for decoupling power to ground structure to minimize switching activity effects on the System. The invention as described can be implemented for EC repair, for Capacitive Decoupling or both.

Abstract: A sheet capacitor of the invention has a contact portion formed in a through-hole requiring electrical connection with an IC connection pin among the through-holes in which the IC connection pins are inserted, and a capacitor element connected to the contact portion. Another sheet capacitor of the invention includes an insulating board and a capacitor element mounted on the insulating board. The insulating board has a connection land with an IC at the upper side, and a connection land with a printed wiring board at the lower side. The capacitor element and connection lands at the upper and lower side of the insulating board are connected with each other electrically. In any one of these configurations, a capacitor element of large capacity and low ESL is connected closely to the IC, and the mounting area of the peripheral circuits of the IC can be increased.

Abstract: An IC socket (10) includes an insulative housing (12) mounted on a burn-in board, a plurality of conductive contacts (14) received in the housing. The housing defines a recessed area (120) bounded by two pairs of sidewalls (122), the recessed area defining a plurality of passageways therein. One of the sidewalls fabricates a receiving channel (1220) substantially parallel to an upper surface of the recessed area and a fastening channel (1222) substantially perpendicularly communicating with the receiving channel. A bolt (16) is screwed in the fastening channel. When the IC socket is used, a sensor (20) is received in the receiving channel and restricted in the proper position by the bolt screwed in the fastening channel.

Abstract: A sheet capacitor of the invention has a contact portion formed in a through-hole requiring electrical connection with an IC connection pin among the through-holes in which the IC connection pins are inserted, and a capacitor element connected to the contact portion. Another sheet capacitor of the invention includes an insulating board and a capacitor element mounted on the insulating board. The insulating board has a connection land with an IC at the upper side, and a connection land with a printed wiring board at the lower side. The capacitor element and connection lands at the upper and lower side of the insulating board are connected with each other electrically. In any one of these configurations, a capacitor element of large capacity and low ESL is connected closely to the IC, and the mounting area of the peripheral circuits of the IC can be increased.

Abstract: A system for using an electrical adapter to test an electrical device is provided. The system includes a tester, an electrical device, and the electrical adapter. The electrical adapter includes a board having first and second planar surfaces, a first electrical socket coupled to the first planar surface of the printed circuit board and a second electrical socket coupled to the second planar surface of the printed circuit board. The board includes electrical connectors electrically coupling the first and second electrical sockets to each other. The first electrical socket of the adapter is suitable for temporary connection to an electrical interface of the tester, and the second electrical socket is suitable for temporary connection to an electrical interface of the electrical device. The electrical device can be one of a plurality of electrical devices and the tester can be one of a plurality of testers.

Abstract: An apparatus in one example includes a compliant component for supporting an electrical interface component that serves to electrically and mechanically couple a die with a separate layer. In one example, the compliant component, upon relative movement between the die and the separate layer, serves to promote a decrease in stress in one or more of the die and the separate layer. The apparatus in another example includes a compliant component for supporting an electrical interface component that serves to create an electrical connection between a die and a separate layer. The compliant component, upon relative movement between the die and the separate layer, serves to promote maintenance of the electrical connection.

Abstract: A test device includes a test receptacle from which projects contact elements project and spring contacts that can be electrically contact-connected to the external contacts of an integrated circuit type. Corresponding to the external contact positions of the integrated circuit type, the test device includes module components having at least one electrically conductive contact plate and having an insulating carrier plate, the contact plate being incorporated in cutouts of the carrier plate and having a contact section, a spring section and a holding section.