Abstract: In some embodiments an Integrated Circuit package includes a plurality of system functional pins, at least one system functional pin depopulation zone, and at least one non-system functional pin located in the at least one functional pin depopulation zone. Other embodiments are described and claimed.

Abstract: Various circuit board sockets and methods of manufacturing and using the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a socket that is operable to receive a circuit board. The socket includes a surface for seating a first portion of a circuit board, a floor and a first support structure projecting away from the floor to support a second portion of the circuit board. The support structure includes a plurality of nested frames.

Abstract: An apparatus is described for burn-in and/or functional testing of microelectronic circuits of unsingulated wafers. A large number of power, ground, and signal connections can be made to a large number of contacts on a wafer. The apparatus has a cartridge that allows for fanning-in of electric paths. A distribution board has a plurality of interfaces that are strategically positioned to provide a dense configuration. The interfaces are connected through flexible attachments to an array of first connector modules. Each one of the first connector modules can be independently connected to a respective one of a plurality of second connector modules, thereby reducing stresses on a frame of the apparatus. Further features include for example a piston that allows for tight control of forces exerted by terminals onto contacts of a wafer.

Abstract: Methods and structures for testing a microelectronic packaging structure/device are described. Those methods may include placing a device in a floating carrier, wherein the floating carrier is coupled to a socket housing by pin dowels disposed in four corners of the socket housing, and wherein at least two actuating motors are disposed within the socket housing, and micro adjusting the device by utilizing a capacitive coupled or a fiber optic alignment system wherein a maximum measured capacitance or maximum measured intensity between alignment structures disposed in the socket housing and alignment package balls disposed within the device indicate optimal alignment of the device. Methods further include methods for active co-planarity detection through the use of a capacitive-coupled techniques.

Abstract: A multi-configuration interface device for coupling different types of GPUs (graphics processor units) to a PCB (printed circuit board). The interface device comprises a GPU interface for a connection to the GPU and a PCB interface for a connection to the PCB. The GPU interface is implemented using a customizable attachment footprint for effectuating a connection to differing GPU types while maintaining the PCB interface for the connection to the PCB. The ball array for different GPUs can be configured to respectively support them. The interface device maintains a consistent PCB interface. Thus, as GPU characteristics change and evolve, or as different GPU versions are implemented, a consistent connection can be maintained for the PCB.

Abstract: An apparatus is described for burn-in and/or functional testing of microelectronic circuits of unsingulated wafers. A large number of power, ground, and signal connections can be made to a large number of contacts on a wafer. The apparatus has a cartridge that allows for fanning-in of electric paths. A distribution board has a plurality of interfaces that are strategically positioned to provide a dense configuration. The interfaces are connected through flexible attachments to an array of first connector modules. Each one of the first connector modules can be independently connected to a respective one of a plurality of second connector modules, thereby reducing stresses on a frame of the apparatus. Further features include for example a piston that allows for tight control of forces exerted by terminals onto contacts of a wafer.

Abstract: According to one aspect of the present invention, there is provided a heat spreader to be mounted on an IC package, the IC package including: a circuit board; an IC chip mounted on one surface of the circuit board; and a plurality of connection terminals formed on the other surface of the circuit board, the heat spreader including: a top wall formed into a rectangular shape; a circumferential wall formed continuously from the top wall, the circumferential wall and the top wall defining a block-like cavity for enclosing the IC chip when the heat spreader is mounted on the IC package; and ear portions formed at lengthwise central portions of a facing pair of side walls of the circumferential wall so to extend outwardly from bottom edges of the facing pair of side walls, respectively.

Abstract: Sockets that provide easy access for users to change cards while allowing the use of thinner device enclosures. One example provides a socket having two positions. When the socket is in an open state, the card may be oriented in a direction substantially away from the main logic board. When the socket is in a closed state, the card moves such that it is oriented at least closer to being in parallel to the main logic board.

Abstract: Methods, systems, and devices are disclosed for producing and delivering packetized power within a DC computing environment. Within the DC computing environment a power requirement or request is communicated to a power router. The power router then determines a power source capable of fulfilling the power requirement and then causes the power to be delivered in packetized form. The packetized power is appended to a message header which allows the power packet to be received by the requesting device.

Abstract: A bus bar distributes power to a plurality of electronic components supported on a printed circuit board. One embodiment of the bus bar comprises a plurality of compressible contact pads made from an electronically conductive polymer, spaced along the bus bar for contacting conductive contacts that are coupled to a power domain or individual electronic component. The pads may be secured to the bus bar and the conductive traces using an electronically conductive epoxy adhesive. Rivets may then be used to secure the bus bar to the printed circuit board and compress the pads, which conform to the printed circuit board to make a reliable electrical connection with the conductive traces. The bus bar further comprises a plurality of current sense points disposed adjacent to the pads for measuring the amount of current provided to each power domain.

Abstract: The present invention relates to a contact terminal unit and a socket connector incorporated with the same contact terminal units. The contact terminal units each comprises a bottom piece and a top piece. The bottom pieces comprise a base portion and a number of clips extending upwardly from the base portion and the top piece is clamped by the clips such that upward movement of the top piece is limited by the bottom piece. The socket connector is incorporated with a plurality of the same contact terminal units.

Abstract: An electronic device test fixture deploys a plurality of contact elements in a dielectric housing. The plumb arrangement of contact elements each include an armature or transversal configured to first depress and then slide laterally when urged downward by the external contacts of a device under test. The rotary movement of the transversal is optimized via the configuration of a surrounding forked regulator such that surface oxide deposition on the external device under test terminal is disrupted to reliably minimize contact resistance without damaging or unduly stressing the electrical junction of the device under test.

Abstract: Provided is a socket which protects an upper surface of a semiconductor device from being scratched due to contact, by using a latch plate. A socket (10) includes a base member (20), a cover member (30) that reciprocates in a direction to be close to or separated from the base member (20), a plurality of contacts (40), an adaptor (50) that moves in a direction to be close to or separated from the base member and provides a surface for placing a semiconductor package, a latch member (60) that rotationally shifts with reciprocation of the cover member (30), and a latch plate (70) connected to the latch member (60). The latch plate (70) prevents the leading edge of the latch member (60) from being directly brought into contact with a Ball Grid Array (BGA), and presses down the BGA placed on the adaptor (50) in the vertical direction.

Abstract: An apparatus is described for burn-in and/or functional testing of microelectronic circuits of unsingulated wafers. A large number of power, ground, and signal connections can be made to a large number of contacts on a wafer. The apparatus has a cartridge that allows for fanning-in of electric paths. A distribution board has a plurality of interfaces that are strategically positioned to provide a dense configuration. The interfaces are connected through flexible attachments to an array of first connector modules. Each one of the first connector modules can be independently connected to a respective one of a plurality of second connector modules, thereby reducing stresses on a frame of the apparatus. Further features include for example a piston that allows for tight control of forces exerted by terminals onto contacts of a wafer.

Abstract: An electrical contact used in an electrical connector adapted for electrically connecting with an integrated circuit (IC) package and a printed circuit board is provided. Each contact comprises a base section, an upper resilient arm and a lower elastic arm extending from two opposite ends of the base section, respectively. The electrical connector comprises an insulative housing and a plurality of contacts retained in the insulative housing. The insulative housing includes a mating surface, a mounting surface, and a plurality of contact passageways passing through the mating surface and the mounting surface. The lower elastic arm of the contact at least partially projects below the mounting surface of the insulative housing. The lower elastic arm includes a first resisting portion for guiding the contact to be inserted into a via of the printed circuit board and resisting against inner wall of the via of the printed circuit board.

Abstract: Various sockets for packaged integrated circuits and methods of making the same are provided. In one aspect, a method of mounting a semiconductor chip is provided that includes providing a package that has a base substrate with a first side and a second side opposite the first side. The second side has a central region. The package includes a semiconductor chip and a lid coupled to the first side. A socket is provided for receiving the base substrate. The socket includes a mound that projects toward the second side of the base substrate when the base substrate is seated in the socket to provide support for the central region of the base substrate. The package is mounted in the socket. The mound provides support for the central region of the base substrate.

Abstract: Methods, systems, and devices are disclosed for producing and delivering packetized power within a DC computing environment. Within the DC computing environment a power requirement or request is communicated to a power router. The power router then determines a power source capable of fulfilling the power requirement and then causes the power to be delivered in packetized form. The packetized power is appended to a message header which allows the power packet to be received by the requesting device.

Abstract: A contact structure and assembly and a method for manufacturing the same for a microelectronics device includes first and second electrically conductive contacts being helically shaped. A carrier element is attached to and positioned between the first and second contacts. The first and second contacts are in electrical communication with each other, and the first and second contacts are in a mirror image relationship with each other. A pair of insulating substrates each include electrically conductive members. A contact point on each of the first and second contacts is attached and electrically communicating to respective electrically conductive members such that the first and second electrically conductive contacts between the pair of insulating substrates form an electrically conductive package. A metal layer on the carrier element provides electrical conductivity through a first opening defined by the carrier element between the first and second portions of the helix shaped contact.

Abstract: The memory module comprises a circuit board with a first and a second side, wherein memory chips are arranged at least on the first side. A longitudinally extending module heat conductor is arranged on the first side. The module heat conductor comprises a contact surface configured to contact a heat transfer system.

Abstract: An electrical connector includes an insulative housing, at lease one contact mounted to the insulative housing and a fusible element mounted to the contact. The contact includes a body portion and a mounting portion extending from the body portion. The mounting portion includes a support portion and first and second tails bent from the support portion along opposite directions in order to form a discrete receiving slot. The first and the second tails are substantially perpendicular to the body portion. The fusible element is received in the receiving slot and is in line with the body portion of the contact for reliable fixation.

Abstract: A chip adapter used to install a chip on a first chip arranging area of a circuit board includes a board. The size of the board has the same size as the first chip arranging area of the circuit board. Edges of the chip adapter define a number of gaps corresponding to first pads of the circuit board. A second chip arranging area of the same size as the chip is arranged in a center of the chip adapter. A number of second pads are arranged around the second chip arranging area of the chip adapter corresponding to pins of the chip. Each second pad is electrically connected to a sidewall of the corresponding gap of the chip adapter.

Abstract: An electrical connector for electrically connecting a circuit processing unit (CPU) with a number of soldering balls to a print circuit board (PCB) comprises a first body having a plurality of bottom holes, a second body mounted on the first body and having a plurality of upper holes, a plurality of terminals located between the first body and the second body, and a number of fusible members holed by the terminals. Each terminal includes a planar horizontal base portion, a plurality of upper hands and lower legs respectively bent upwardly and downwardly from the base portion, and a plurality of holding portions extending from the base portion in a horizontal direction. The upper hands received in the upper holes can hold the soldering balls. The lower legs received in the bottom holes can hold the fusible members and be soldered to the PCB through the fusible members.

Abstract: A socket connector (100) adapted for electrically connecting an integrated circuit (IC) package comprises an insulative housing (1) comprising a plurality of passageways (101) extending therethrough, a plurality of terminal units (2) received in the passageways (101), the terminal units (2) each comprises an insulated elastomer (21) acting as a resilient portion and an electrical element (22) received in the insulated elastomer (21), the electrical element (22) comprises a first contact portion (221) and a second contact portion (222) extending out of the insulated elastomer (21) and sandwiching the insulated elastomer (21) therebetween.

Abstract: An electrical connector includes an insulting main body having a plurality of receiving holes, and a plurality of pins located in the receiving holes. Each pin has a base portion, a welding portion and a flexible arm. The flexible arm has a first bend portion bent and extended upwards from the base portion, a second bend portion bended from the first bend portion, a first yield space above the second bend portion, a third bend portion bent slantedly and extended upwards from the second bend portion and a second yield space below the third bend portion. A contact portion is located at the end of the flexible arm. Due to the pin structure with the first yield space and the second yield space, the two flexible arms will not easily contact each other to prevent the short circuit problem or the interference problem from occurring.

Abstract: An exemplary socket assembly includes a circuit plate and a socket mounted on the circuit plate for fixing an IC. The socket includes a first fixing member and a second fixing member. The first fixing member includes installed portions, elastic connecting portions, and a first buckling portion, the elastic connecting portions interconnects the electric portions and the first buckling portion. The second fixing member includes electric portions, elastic connecting portions, and a second buckling portion, and the elastic connecting portions interconnect the electric portions and the second buckling portion.

Abstract: A socket for an electric component provided with a plurality of contact pins in a socket body. The contact pin each have a lower contact part that is electrically conductive with a contact point on a substrate, an upper contact part that contacts the terminal of the electric component when pressure is applied, and an upper spring part that is located between the lower contact part and the upper contact part, that is elastically deformed when pressure is applied, and that, by its elasticity, presses the upper contact part against the terminal. The contact pins are each formed in such a shape that the location of the contact point with respect to the terminal does not change when pressure is applied and the upper contact part is rotated about the contact point (contact projection) of the upper contact part and the terminal.

Abstract: A socket connector assembly includes a housing, signal terminals, and a power module subassembly. The housing is mounted to a circuit board and includes opposing walls having internal surfaces. The signal terminals are joined to the internal surfaces of the walls and engage conductive members disposed along side edges of an electronic package that is received into the housing between the walls. The power module subassembly is coupled to the circuit board between the walls of the housing. The power module subassembly includes a power contact configured to engage a current carrying conductor disposed on a surface of the electronic package that extends between the side edges of the electronic package.

Abstract: An electrical socket comprises an insulative housing, a stiffener defined around the insulative housing, a load plate and a load lever. The housing defines two supporting portions at two opposite sides, each of said supporting portions defining a mounting portion in a middle portion thereof. The stiffener comprises a first side, a second side opposite to the first side, a third side and a fourth side opposite to the third side, the third, fourth sides defined corresponding to the two supporting portions of the housing respectively and with an engaging portion engageable with the mounting portion, each of said third, fourth sides formed with an upwardly curved configuration at a middle portion thereof for supporting the supporting portion. The two supporting portions seat on the third, fourth sides respectively, thus making a gap formed between the supporting portions and opposite end of corresponding sides respectively.

Abstract: An electrical connector includes an insulting main body having a plurality of receiving holes, and a plurality of pins located in the receiving holes. Each pin has a base portion, a welding portion and a flexible arm. The flexible arm has a first bend portion bent and extended upwards from the base portion, a second bend portion bended from the first bend portion, a first yield space above the second bend portion, a third bend portion bent slantedly and extended upwards from the second bend portion and a second yield space below the third bend portion. A contact portion is located at the end of the flexible arm. Due to the pin structure with the first yield space and the second yield space, the two flexible arms will not easily contact each other to prevent the short circuit problem or the interference problem from occurring.

Abstract: The present disclosure generally pertains to wireless communication modules that can be used for enabling wireless communication in various applications. A wireless communication module in accordance with one embodiment may be interfaced with other devices, such as nodes of a wireless sensor network (WSN). The module has rows of male integrated circuit (IC) pins that may be interfaced with female pin receptacles of another device. The module receives wireless signals and provides the data of such wireless signals to the other device. The module also receives data from the other devices and packetizes such data for wireless communication.

Abstract: An electrical linear drive device comprises an outer housing consisting of a housing tube and two housing covers disposed at the ends thereof The outer housing defines in the interior thereof a receiving space, into which the drive part of a drive unit in the form of an electrodynamic linear direct drive like a cartridge is placed, and an output drive rod extends outward through the front housing cover. From a drive coil arrangement of the drive unit an electrical operation cable extends to an central electrical interface means. The electrical interface means is disposed laterally on the housing tube and the operation cable and the signal cable extend in a cable channel formed in the wall of the housing tube.

Abstract: A socket apparatus comprises a base portion defining an array of contact cavities. A plurality of contacts are inserted into the array of contact cavities defined in the base portion. The base portion includes a top side and a bottom side and a plurality of ribs extending from the bottom side. Each rib defines at least one sidewall that engages with an anchor of a contact to securely mount the contact. Each contact includes a mounting portion having a first anchor and a second anchor extending from the mounting portion and operable to engage a mounting surface of the base portion to securely mount the contact. The first anchor provides a first anchor force for the contact to the base portion that is substantially greater than a second anchor force provided by the second anchor to the base portion.

Abstract: One ends of a plurality of interface pins are attached to a substrate in a line. Optical semiconductor device and an electric circuit are mounted on this substrate. The other ends of the interface pins are fit into holes in an another substrate. Signals are exchanged between the two substrates via the interface pins. The interface pins are embedded in a dielectric material. A plurality of ground pins and/or ground through holes may be provided in the dielectric material around the interface pins. The dielectric constant of the dielectric material is less than the dielectric constants of the two substrates.

Abstract: An electrical connector assembly includes an electrical connector, an IC seated on connector and a PCB. The electrical connector includes an insulative housing and a number of electrical contacts each having a retaining portion secured to the housing, a main portion connecting with the retaining portion and a contact portion. The contact portion has a pair of first contacting sections electrical connected with the PCB and a pair of second contacting sections contacting with the IC, and the first and second contacting sections of the electrical contact are disposed in passageways on the PCB.

Abstract: An exemplary socket assembly includes a circuit plate and a socket mounted on the circuit plate for fixing an IC. The socket includes a first fixing member and a second fixing member. The first fixing member includes installed portions, elastic connecting portions, and a first buckling portion, the elastic connecting portions interconnects the electric portions and the first buckling portion. The second fixing member includes electric portions, elastic connecting portions, and a second buckling portion, and the elastic connecting portions interconnect the electric portions and the second buckling portion.

Abstract: An electrical contact used in an electrical connector adapted for electrically connecting with an IC package and a printed circuit board is provided. Each contact comprises a base section, an upper resilient arm and a lower elastic arm extending from two opposite ends of the base section, respectively. The electrical connector comprises an insulative housing and a plurality of contacts retained in the insulative housing. The insulative housing includes a mating surface, a mounting surface, and a plurality of contact passageways passing through the mating surface and the mounting surface. The lower elastic arm of the contact at least partially projects below the mounting surface of the insulative housing. The lower elastic arm includes a first resisting portion for guiding the contact to be inserted into a via of the printed circuit board and resisting against inner wall of the via of the printed circuit board.

Abstract: The electrical connector (50) includes an insulative housing (51) defining a mounting face (501) for mounting onto a printed circuit board (10) and a mating face (502) opposite to the mounting face, a plurality of contacts (52) received in the insulative housing, an insulator (20) mounted to an underside of the printed circuit board, a back panel (30) attached to the insulator, and a plurality of fastening elements (40) mechanically interconnecting the back panel, the insulator and the insulative housing onto opposite sides of the printed circuit board. The insulator has a plurality of pairs of guiding posts (23) extending oppositely towards the back panel and the printed circuit board. The back panel defines a plurality of guiding holes (33) aligned with holes (14) on the printed circuit board for receiving corresponding guiding posts.

Abstract: An apparatus for supporting BGA packages for one or more testing processes is disclosed. The apparatus includes a substrate member. The substrate member has a plurality of contact pads, with each of the contact pads being spatially disposed around a peripheral region of the substrate. The apparatus further includes a plurality of contact regions spatially configured on a portion of the substrate member. Each of the plurality of contact regions is numbered from 1 through N being electrically connected to respective contact pads numbered from 1 through N. The plurality of contact regions is configured to provide electrical contact to respective plurality of balls provided on a BGA package. The apparatus additionally includes a holder device coupled to the substrate member. The holder device is adapted to mechanically hold the BGA package in place to provide mechanical contact between the plurality of balls and respective plurality of contact regions.

Abstract: The socket system comprises a set of vertically-stackable sockets. A first socket mounts on a printed circuit board to receive a first chip module, and a second socket stacks on the first socket to receive a second chip module. The first socket includes a first set of embedded contacts to electrically connect the first chip module to the printed circuit board, and a second set of embedded contacts to electrically connect the second socket to the printed circuit board. The second socket includes a third set of embedded contacts to electrically connect the second chip module to the printed circuit board. System upgrades are enabled by replacing the chip modules.

Abstract: A digital camera is mounted to a circuit-board in a cellphone. The camera is mounted in a plastic main-body, and is supported therein on a bed of springs, which provides a stable resilient mechanical support. The springs double as connector-strips, being electrically-active connector-strips for conducting electrical signals and services between the component and a circuit-board. The connector-strips are solidly attached to the circuit-board, by being soldered thereto. The main-body is not attached directly to the circuit-board, but rather is attached directly to the connector-strips. These measures ensure that the camera is mechanically isolated from the circuit-board whereby, if the cellphone is dropped or knocked, the inertia of the camera does not damage the circuit board.

Abstract: An electrical connector for electrically connecting a circuit processing unit (CPU) with a number of soldering balls to a print circuit board (PCB) comprises a first body having a plurality of bottom holes, a second body mounted on the first body and having a plurality of upper holes, a plurality of terminals located between the first body and the second body, and a number of fusible members holed by the terminals. Each terminal includes a planar horizontal base portion, a plurality of upper hands and lower legs respectively bent upwardly and downwardly from the base portion, and a plurality of holding portions extending from the base portion in a horizontal direction. The upper hands received in the upper holes can hold the soldering balls. The lower legs received in the bottom holes can hold the fusible members and be soldered to the PCB through the fusible members.

Abstract: A hybrid connector used for connecting different package modules includes an insulative housing, a plurality of first type of contacts, and a plurality of second type of contacts. The insulative housing has a first area with a plurality of first openings and a second area with a plurality of second openings. The first contacts and the second contacts are received in the first and the second openings respectively. The first and the second contacts both have a base received in the opening, a spring portion upward extending from the base. A lower portion downwardly extends from the first contact base, and a soldering pad downwardly extends from the second contact base. The first contacts connect with one package module and the second contacts connect with another package module.

Abstract: An apparatus for forming a temporary electrical connection with a microelectronic component and associated systems and methods are disclosed herein. Embodiments of the apparatus can include a base, a plurality of electrical contacts coupled to the base, and a nest attached to the base. The nest includes a plurality of contact compartments aligned with peripheral leads of the microelectronic component and at least partially covering the contacts. Individual contact compartments are masked to prevent a corresponding contact from electrically contacting the peripheral leads of the microelectronic component. In one embodiment, the masked contact compartments are used as a guide zone to guide individual peripheral leads when the microelectronic component is seated at or unseated from the support surface. In an additional or alternative embodiment, the masked contact compartments are used to selectively isolate contacts, for example, from supply or ground electrical potentials.

Abstract: An electrical connector assembly includes an electrical connector, an IC seated on connector and a PCB. The electrical connector includes an insulative housing and a number of electrical contacts each having a retaining portion secured to the housing, a main portion connecting with the retaining portion and a contact portion. The contact portion has a pair of first contacting sections electrical connected with the PCB and a pair of second contacting sections contacting with the IC, and the first and second contacting sections of the electrical contact are disposed in passageways on the PCB.

Abstract: A burn-in includes a base, a number of contacts received in the base, and a cover pivotally mounted to the base and rotatably moving between an open position and a closed position. The base defines a receiving space and a plurality of recesses adjacent to and communicating with the receiving space. Two hard stoppers are mounted to the recesses of the base and support upwardly the cover.

Abstract: A support portion of an elastic contactor is located in a fixed region surrounded by a plurality of openings on a contact sheet. The support portion extends over the substantially entire fixed region and along the outer rims of the surrounding openings.

Abstract: The present invention provides a socket for an element with an element electrode. The socket comprises a base shell, a cover shell and a contact member. The cover shell is engaged with the base shell so that the base shell and the cover shell define a cavity. Each of the base shell and the cover shell is made of a high thermal-conductive material. The contact member comprises an elastic member and a contact electrode provided on the elastic member and are designed and arranged so that the element is mountable on the contact member within the cavity with the element electrode connected to the contact electrode.

Abstract: The electrical connecting apparatus according to the present invention is used for providing electrical contacts for an electronic device and comprises a housing and a plurality of electrical contacts. At least one passageway is set on the housing. At least two ribs are set in the passageways. Within the passageways, at least one holding space is formed between two adjacent ribs. The electrical contacts are set in the passageways, respectively. In addition, portions of at least two electrical contacts are accommodated in the same holding space. The electrical contact has a base portion located underneath the rib. A pair of contact portions is formed by extending upwards from the base portion along corresponding two sides of the rib. Besides, at least one contact portion pass through the holding space. When the paired contact portions of each said electrical contact make contact with the electronic device, the contact portions move away from said rib.

Abstract: An electrical connection device is used for electrically connecting an electronic element having solder balls, and includes an insulating body and a plurality of pins. The insulating body has a plurality of receiving slots formed by a plurality of first rib boards and second rib boards respectively and crossly disposed along the X and Y-coordinate direction. Each pin has a base portion extending upwardly to form a first and a second flexible arm. The end of the first and the second flexible arm respectively form a first contact portion and a second contact portion. At least one of the receiving slots receives the first flexible arm of the pin and the second flexible arm of another pin. The first and the second contact portion located in the same receiving slot are disposed staggered in an upper and a lower location along the X-coordinate direction and not connected to each other.

Abstract: A socket connector comprises an insulative housing defining a plurality of passageways and a receiving cavity for receiving an electrical package, and a plurality of contact respectively disposed in said passageways. The receiving cavity comprises a first cavity, and a second cavity smaller than the first cavity. The second cavity is in communication with the first cavity and outer space, the second cavity defining standoffs for positioning the electrical package when the electrical package is inserted into the receiving cavity.