Abstract: A socket (10) for electronic devices has a plurality of retainers (500). Each retainer (500) has a first member (501), a first shaft (507) for pivotably connecting a proximal portion of the first member with a lower frame (200) so the distal portion of the first member moves between an operative position in which the distal portion of the first member stays on the electronic device to make contact with an upper surface of the electronic device and an inoperative position in which the distal portion of the first member stays away from the electronic device, a second member (512) having a distal portion and a proximal portion, a second shaft (510) for pivotably connecting the distal portion of the second member with the intermediate portion of the first member; and a third shaft (517) for pivotably connecting the proximal portion of the second member with the upper frame.

Abstract: An IC socket, adapted for electrically connecting an IC package to a printed circuit board, comprises a main body defining a plurality of passageways and a plurality of contacts received in the passageways of the main body. Each contact has a base portion, a first contacting portion and a second contacting portion extending upwardly from the base portion. The first contacting portion and the second contacting portion each is formed with a contacting end to cooperatively clamp a guiding trace of the IC package. The contacting end of the second contacting portion defines a recess to receive the contacting end of the first contacting portion when the IC package is disassembled to the main body.

Abstract: A socket assembly, for electrically connecting IC package and a printed circuit board, has a base with a cavity, a module received in the cavity of the base, a plurality of helical contacts received in the module and a cover mounted on the base. The module has a positioning board, a retaining board and a plurality of stacked insulative boards disposed between the positioning board and the retaining board. Each insulative board defines a plurality of through holes, which cooperatively define a plurality of separate helical channels to receive the contacts.

Abstract: A semiconductor circuit arrangement is disclosed. In one embodiment, a semiconductor module is attached to a board using a screw, with a mechanical and electrical contact being made between module contacts on the semiconductor module and associated board contacts on the board at the same time by attachment using the screw.

Abstract: An LGA socket assembly comprising individual sockets cells, the methods of fabricating and assembling the socket cells into a socket assembly. In an embodiment of the invention, each socket cell comprises an insulative body and a wire. The insulative body is formed around the wire. A first portion of the wire extends from the top surface of the insulative body to form contact tip. A second portion of the wire extends from the bottom surface of the insulative body to form contact paddle. Socket cells are aligned to form a socket assembly.

Abstract: A ball grid array (BGA) connection system includes an integrated circuit (IC) package that includes a plurality of conductive balls forming a ball grid array (BGA) arranged in a matrix pattern. A printed circuit board (PCB) includes a plurality of ball sockets arranged in a corresponding matrix pattern. Each ball socket includes a base having one side that engages the PCB and an opposing side configured for seating a conductive ball of the BGA. A plurality of prongs are secured to and extend from the base and configured to receive and hold a conductive ball into contact with the base.

Abstract: Socket terminal assemblies and intercoupling components are configured to electrically connect a contacting area of an integrated circuit with a corresponding connection region of a substrate. The socket terminal assembly includes a socket shell, a pin, and a resilient member. The socket shell includes a portion defining an interior cavity and a protrusion extending inwardly relative to the portion, the protrusion defining an opening into the cavity within the socket shell. The pin includes a first portion having a first outer dimension and defining an interior cavity within the pin, and a second portion having a second outer dimension that is smaller than the first outer dimension. The first pin portion is received within the cavity of the socket shell with the second pin portion extending through the opening and out of the socket shell. In addition, the resilient member is interposed between the socket shell and the pin.

Abstract: A vertical-type electric contactor connected to a bump of an electric contactor is provided. The vertical-type electric contactor includes a support beam, vertically bonded with the bump, in which at least two elastic parts are spaced apart from each other; a fixed part disposed at the bottom end of the support beam for fixing the support beam; and a tip part disposed at the bottom end of the fixed part, the tip part and the fixed part being a single body. According to the vertical-type electric contactor, a reaction force generated at a tip part is effectively distributed to test electric devices without damage of the vertical-type electric contactor.

Abstract: An electrical connector (100) used to transmit electric and optical signal from a module to a circuit substrate comprises an insulative housing (1), a plurality of contacts (2) received in the insulative housing (1) and a cover (3) being assembled on the insulative housing (1) and can move between an opened position to a closed position, the insulative housing (1) comprises a bottom wall (141) and a plurality of sidewalls (142) extending upwardly from the bottom wall (141), each of the sidewalls (142) each defines a plurality of datum blocks (145) and the inner surface of the datum (145) on one sidewall (142) are located in one plane, the datum blocks (145) together formed a space (14) to receive the module.

Abstract: A socket for an electric component may have a socket main body, a plurality of contact pins disposed within the socket main body, a socket cover, a slide plate disposed inside the socket main body to be movable up and down, and drive levers which are provided between the socket main body and the bottom face of the socket cover. The drive levers press both end portions of two opposing sides of the slide plate by a down-movement-operation of the socket cover to lower the slide plate. The socket may also include sub-levers provided between the socket main body and the bottom face of the socket cover for pressing one or plural positions of other opposing two sides of the slide plate, which oppose to each other in a direction perpendicular to the two opposing sides pressed by the drive levers to lower the slide plate.

Abstract: A socket connector is revealed. The socket connector is electrically connected with a chip module onto a circuit board. The chip module includes a carrier board, at least one chip electrically connected to one side of the carrier board and a heat spreader arranged on another side of chip and placed opposite to the side of chip connected with the carrier board. The carrier board disposed with a plurality of contact members includes a base arranged with a plurality of receiving slots and part of the contact members being in the receiving slot, a plurality of conductive terminals arranged in the receiving slots and contact with the contact members, and a cover that has one side connected with the base and the opposite side connected with the chip module while the cover is disposed with a plurality of receiving holes corresponding to the receiving slots for being inserted by the contact members. At least one projecting seat is arranged on the cover, against the chip module for supporting the chip.

Abstract: An electrical connector assembly (100) in accordance with a preferred embodiment of the present invention, comprises an electrical connector (200) for connecting an electronic package with a circuit substrate (60) and a connecting device (300) for fixing the electrical connector (200) to the circuit substrate (60). The electrical connector (200) includes a housing assembly (1) with a plurality of contacts (10) received therein. The connecting device (1) includes a first screw (70), a second screw (90) and a nut (80) connecting the first screw (70) and the second screw (90). The nut (80) connecting with the first screw (70) makes the first screw (70) securely located on the housing assembly (1) and prevents the first screw (70) losing in the transportation.

Abstract: An IC socket comprises an insulative housing having a plurality of periphery walls and a cover pivotally assembled to one end of the insulative housing and adapted to be locked to the insulative housing at the other end. The cover includes a plurality of peripheral edges. The cover also has a plurality of spring arms upwardly extending therefrom and disposed at the edges.

Abstract: Disclosed is an interposer for accessing one or more signals from an Integrated Circuit (IC) package. The interposer is disposed between the IC package and a socket body. The interposer comprises a plurality of clearance holes and at least one connecting element. The plurality of clearance holes allows an array of contacts on a first surface of the socket body to pass through the interposer and make electrical contact with a first set of contacts of a plurality of contacts of the IC package. The at least one connecting element is configured to make electrical contact with a second set of contacts of the plurality of contacts of the IC package. The electrical contact between the at least one connecting element and the second set of contacts of the plurality of contacts of the IC package provides access to the one or more signals from the IC package.

Abstract: A burn-in socket for receiving an IC package includes a base, a platform located within the base for loading the IC package, a number of contacts arranged in the base for connecting with the IC package, a cover movably mounted upon the base, and at least one slider arrangement actuated by the cover. The slider arrangement comprises a first rod pivotally connected to the cover, a slider capable of abutting against the IC package, and a second rod with one end pivotally connected to the first rod and the other end pivotally connected to the slider.

Abstract: The anisotropically conductive connector 36 of the present invention includes an anisotropic sheet 102 made up of conducting path forming parts 69 to electrically connect an electrode 101 of an electronic component 33 with an electrode for inspection of a circuit substrate 12 for inspections and of an anisotropically conductive film to insulate the conducting path forming parts 69 and a positioning member 103 connected between the anisotropically conductive sheet 102 and electronic component 33 and having an aperture portion in a position corresponding to the conducting path forming part 69, wherein the positioning member 103 has an insulating layer formed in a location surrounding a perforated metallic member and, when the electrode 101 is fitted into the aperture portion 107, the electrode 101 is guided into the conducting path forming parts 69.

Abstract: An IC socket comprises a base defining a plurality of passageways, a cover attached to the base and two actuating mechanisms disposed between the base and the cover. The cover has a plurality of apertures corresponding to the passageways. The two actuating mechanisms are disposed between the base and the cover to driving the cover moving along the base simultaneously.

Abstract: A chip socket includes first and second bottom plates attached together, four first sidewalls and second sidewalls, and a number of first and second conductive. Each of the first sidewalls vertically extends upward from a side of the first bottom plate. The first conductive metal sheets are fixed in an inner side of each of the first sidewalls. The conductive metal sheets are insulated from one another. Each of the second sidewalls vertically extends downward from a side of the second bottom plate. The second conductive metal sheets are fixed in an inner side of each of the second sidewalls. The second conductive metal sheets are insulated from one another. Each of the first conductive metal sheets are connected to a corresponding second conductive metal sheet by the first conductive metal sheet extending through the first and second bottom plates to contact with the second conductive metal sheet.

Abstract: Apparatus including a body as an intermediary between a device and a printed circuit board, the body including a contact area defined by a plurality of openings each to accommodate a contact therethrough and an alignment feature adjacent the contact area and protruding from a plane defined by the contact area, wherein a surface of the alignment feature includes a friction-reducing material. A method including contacting an alignment feature of a socket with a friction-reducing material. Apparatus and system including a body as an intermediary between a device and a printed circuit board; a plurality of contacts each disposed through a contact area of the body and oriented to deflect a device in a first direction; and a load plate coupled to the body and configured to apply an actuation force on a device in a different second direction. A method including inserting a device into a socket.

Abstract: A socket adaptor 10 made of an electrically insulating material has a main adaptor body 12 on which a plurality of through holes 14 containing an upper opening and a lower opening has been formed. In certain preferred embodiments a probe pin 60 and coil spring 62 is placed in each through hole 14. An electrical engagement clipping part 68 for clipping a contact inserted in a respective through hole from said upper opening is formed on the upper end of each probe pin 60. The coil spring 62 is installed on each probe pin and biases the respective probe pin toward a position so that a tip formed on the lower end of the probe pin protrudes from the lower opening.

Abstract: A test socket assembly is for use in testing integrated circuits. A single piece socket is formed substantially of an insulating material and having a plurality of holes formed therein configured to receive a plurality of electrically conductive springs. Each hole of the single piece socket has therein a separate one of the electrically conductive springs. A test socket includes a plurality of pins configured to receive leads of an integrated circuit, the pins of the test socket extending into the plurality of holes of the single piece socket with each pin engaging a spring, wherein the single piece socket is positioned on a circuit board with the plurality of holes being in alignment with electrical contacts on the circuit board such that the plurality of springs are electrically interconnecting the contacts and the plurality of pins. The single -piece socket is comprised substantially of a high-temperature insulating material, such as ceramic.

Abstract: A printed circuit board is disclosed. The printed circuit board comprises a substrate having a top surface and a bottom surface. A ground plane is on the bottom surface. A signal trace is on the top surface along a first direction. At least two isolated power planes are on the top surface adjacent to opposite sides of the signal trace, respectively. A conductive connection along a second direction couples to the two power planes, across the signal trace without electrically connecting to the signal trace, wherein the signal trace doesn't directly pass over any split of the ground plane.

Abstract: An electrical connector for interconnecting integrated circuits (ICs) to a circuit board, includes a number of contacts (9) and an insulative housing (8) having a mating face (81) toward an IC, a mounting face (83) for attaching to a printed circuit board (7), and rows and columns of passageways extending from the mating face to the mounting face. The housing comprises outer standoffs (832) and at least one central standoff (834) on the mounting face. The height of the outer standoff is larger than that of the central standoff.

Abstract: A connector to be connected to a mating connector includes a housing having a receptacle recess portion for receiving the mating connector, and a terminal retained in the housing. The housing includes a containing groove extending in a connecting direction for containing a fitting portion of the terminal. The fitting portion of the terminal includes an engaging portion at a side end edge thereof. The containing groove includes a regulating wall portion extending in the connecting direction and located inner side than a position of an edge surface of the engaging portion at the containing groove. The regulating wall portion includes a regulating surface extending in the connecting direction and a width direction of the terminal. When the mating connector is extracted, the regulating surface regulates an elastic deformation of the fitting portion by abutting against and engaging with the engaging portion.

Abstract: Method for preventing solder from rising to a portion of an electric contact when the electric contact is being soldered to a copper foil so as to extend therefrom. The portion is plated with a noble metal and adapted to contact a mating object. Cooling means is brought into contact with at least the portion of the electric contact adapted to contact the mating object, and connection portion between the electric contact and the copper foil is heated by heating means. The rising of solder can be prevented and the electric contacts thus obtained are superior in mechanical property (sufficient bonding strength), electrical property (conductive property and low contact resistance), resistance to environmental conditions (impediment to oxidization), and physical property (limitation of rise of solder due to capillary action).

Abstract: Provided herewith is a CPU socket made of composite configuration of passageways. The Socket includes an insulative housing defining an opening therein. A grid is securely assembled in the opening defining a plurality of passageways for securely receiving a contact terminal therein. The grid includes a plurality of latitudinal partitions, and a plurality of longitudinal partitions orthogonally intersected from each other so as to define the passageway across the opening.

Abstract: A socket connector comprises an insulation body and a plurality of conductive terminals. A plurality of terminal receptacle grooves go through the insulation body from its upper surface to its lower surface. At least a first limit portion and a second limit portion are provided on each of the terminal receptacle grooves. Each of the conductive terminals is received in the corresponding terminal receptacle groove, and comprises a soldering portion, a base portion connected to a side of the soldering portion, an elastic arm connected to another side of the base portion and a contact portion connected to the elastic arm. In one embodiment, first wedge portions respectively extend and bend from an edge of the soldering portion opposite the base portion and another two edges. The first limit portion is positioned above the first wedge portion and limits it to moving upwards, and the second limit portion is positioned under the second wedge portion and limits it to moving downwards.

Abstract: Disclosed are a camera module and a camera module assembly. The camera module can include a Printed Circuit Board (PCB) provided on an outer side thereof with contact terminals connected to a corresponding socket module, an image sensor mounted on the PCB, and a housing disposed on the PCB. The camera module assembly includes a camera module provided on a lower surface thereof with contact terminals, and a socket module in which the camera module is coupled.

Abstract: An apparatus for supporting BGA packages for one or more testing processes is disclosed. The apparatus includes a substrate member. The substrate member has a plurality of contact pads, with each of the contact pads being spatially disposed around a peripheral region of the substrate. The apparatus further includes a plurality of contact regions spatially configured on a portion of the substrate member. Each of the plurality of contact regions is numbered from 1 through N being electrically connected to respective contact pads numbered from 1 through N. The plurality of contact regions is configured to provide electrical contact to respective plurality of balls provided on a BGA package. The apparatus additionally includes a holder device coupled to the substrate member. The holder device is adapted to mechanically hold the BGA package in place to provide mechanical contact between the plurality of balls and respective plurality of contact regions.

Abstract: An electrical connector comprises an insulation body, a plurality of terminals, and an elastic part; the insulation body is provided with the first and the second sidewalls oppositing to each other; an accommodation space being formed and enclosed in the first and second sidewalls for accommodating a chip module. Each terminal is accommodated in the insulation body and is provided with an elastic arm protruding and stretching into the accommodation space; the elastic arm is provided with a contact portion for contacting an electrically conductive slice of the chip module. The elastic part is accommodated in the insulation body and used to precisely locate the electrically conductive slice and the contact portion. Being pressed downwards, the electrically conductive slice of the chip module presses the elastic arm, and the elastic arm bends toward the second sidewall and deforms, so that the chip module moves toward the second sidewall.

Abstract: An apparatus for coupling an integrated circuit (IC) package to a printed circuit board. The apparatus includes an interposer an interposer having a plurality of connections suitable for surface mounting on corresponding pads of a printed circuit board (PCB). The plurality of connections is arranged in a grid array. The interposer further includes a plurality of plated through holes. The apparatus further includes a substrate having a plurality of pins. The substrate is coupled to the interposer by inserting each of the plurality of pins into a corresponding one of the plurality of plated through holes of the interposer. An IC package including an IC is mounted on the substrate.

Abstract: A connector system is provided including a housing defining a plurality of through openings. A plurality of electrical contact assemblies, each including at least one torsion spring supported upon a conductive mandrel are arranged so that one electrical contact assembly is positioned within a corresponding one through opening such that each of the mandrels is lodged within a respective one of the through openings with portions of the torsion springs standing proud of the housing.

Abstract: An electrical connecting apparatus uses a plurality of contacts each of which includes: a principal portion having an outer face curved and directed to a conductive portion of a base plate and received in a recess and a slit of a housing; a front end portion continuous to the front end side of the principal portion and projected upward from the slit so as to be relatively pressed against an electrode of a device under test; and a rear end portion continuous to the rear end side of the principal portion and located in the recess. The front end portion of each contact is projected upward from the slit by the dimension of the thickness of the front end portion or more than that and has an arc-shaped front end face extend in the longitudinal direction of the slit.

Abstract: A method of forming solder mask, suitable for forming a solder mask on the surface of a wiring board, is provided. The surface of the wiring board includes a first region and a second region, and the surface of the wiring board has a wiring pattern thereon. The method includes forming a first sub solder mask in the first region on the surface of the wiring board by performing a screen-printing or a photolithographic process, and forming a second sub solder mask in the second region on the surface of the wiring board by performing an ink-jet printing process. The method not only improves the precision of the solder mask alignment on the wiring board and its reliability, but also increases the production rate and lowers the manufacturing cost.

Abstract: An improved heating element connector assembly includes an insulative, rectangular frame with a central opening, and a plurality of conductive terminals which are press fit into openings in the frame. The terminals are spaced apart from each other lengthwise of two opposing sidewalls of the frame, and pairs of terminals are aligned with each other between the two sidewalls. A plurality of conductive strips are held together in an assembly and the ends of the strips are interconnected along two spaced apart lines by carrier members that may be molded over the ends of the conductive strips. The carrier members extend down into cavities on the frame and terminals are pushed into the cavities to bear against the ends of the strips and effect an electrical connection between the terminals and the strips.

Abstract: A surface mount electronic chip (10) is mounted on a holder (70) and electrically connected to holder terminals (74,76, 80) by the use of a carrier device (30). The carrier device has clips (36) mounted on walls of the carrier frame. The chip is merely pressed into a cavity (48) between inner tabs (44) of the chips. The carrier with the chip in place is merely pressed into a cradle (78) formed in the holder by the holder terminals, so outer tabs (46) of the clips press against the holder terminals.

Abstract: An electrical connector (1) for connecting an LGP (12) to a printed circuit board includes a housing having a bottom wall (100), side walls (101) and a number of contacts (11) mounted into the bottom wall. The side walls have a first side wall (1011) including a number of spring plates (104) assembled thereto, and a second side wall (1012) opposite to the first side wall having a guiding portion (102) disposed thereon. A receiving space (105) is defined between the guiding portion and the bottom wall for receiving the LGP.

Abstract: A portable electronic device including a device printed wiring board; an electrical connector connected to the device printed wiring board; and a camera coupled to the device printed wiring board by the electrical connector at a sliding height connection. The sliding height connection allows the camera to slide relative to the electrical connector along a first axis to allow positioning of the camera relative to the electrical connector at one of a plurality of different heights along the first axis.

Abstract: The configuration comprises a base board to be mounted a circuit board, with an IC receiving concave place and a resilient member receiving area, having an upper wall and a lower wall surrounding the resilient member receiving area, the upper wall provided with a first slot for contact and the lower wall provided with a second slot, a contact comprising a first contact portion on which a lead of the IC is loaded, a second contact portion coming into contact with a circuit lead of the circuit board, a contact main body communicating the first contact portion with the second contact portion, and a compressing portion protruding from the rear of the contact main body, the resilient member receiving area receiving the resilient member of integral structure, set in the resilient member receiving area, in which a plurality of contacts are implanted, wherein the compressing portion compresses the resilient member in order that a contact pressure can be obtained for the contact to the IC lead and the circuit lead by

Abstract: A socket for an electrical tester is disclosed. The socket includes a first contact board being arranged at a bottom side of a test object, and a second contact board being arranged at a top side of the test object. The first contact board includes a first contact member and a first conductive connection member, wherein the first contact member is electrically connected to a bottom connection terminal formed on the bottom side of the test object, and the first conductive connection member is isolated from the test object. The second contact board includes a second contact member, wherein the second contact member is electrically connected to the first conductive connection member and a top connection terminal formed on a top side of the test object, respectively. Therefore, the socket can have a simple configuration for providing the test current.

Abstract: An electronic component assembly including an electrical connector and an electronic subassembly. The electrical connector has a housing with a receiving area, electrical contacts connected to the housing, and fusible elements. The electrical contacts include first electrical connection sections in the receiving area and second electrical connection sections proximate a first exterior side of the housing. The fusible elements are connected to the second electrical connection sections. The electronic subassembly includes a printed wiring assembly and electronic components connected to opposite sides of the printed wiring assembly. The printed wiring assembly includes a relatively rigid section with the electronic components connected thereto and a flex cable forming deflectable lateral side sections with contact areas contacting the first electrical connector sections of the electrical contacts.

Abstract: A surface mount electrical connector includes a terminal body having a first elongate member that cooperates with a housing to secure the terminal body to the connector housing. A second elongate member of the terminal body includes a curved portion having an aperture therethrough. The curved portion includes a convex surface that facilitates automated assembly operations, and the aperture helps to overcome surface tension in liquid solder, thereby promoting a secure electrical connection.

Abstract: An electrical connector for receiving an electrical module. The electrical module has a convex on a lateral surface. The electrical connector comprises an insulated housing, a plurality of terminals and a metallic shell. The insulated housing has at least a stop wall on an edge and has an indentation corresponding to the convex. The terminals are set in the insulated housing separately. The metallic shell completely surrounds both the insulated housing and the electrical module to avoid operations of the electrical module from being affected by exterior electromagnetic waves.

Abstract: Disclosed is an apparatus for separating interconnects between, for example, a card and a substrate. The apparatus includes one or more rotationally biased (e.g., spring-loaded, etc.) partial-circle structures (e.g., blades, squeegee, plow, etc.) and one or more temperature-sensitive releases connected to the partial-circle structures. The partial-circle structures are positioned to rotate and separate the interconnects when released by the temperature-sensitive releases. The invention can also include solder reservoirs positioned to receive solder from the interconnects separated by the partial-circle structures.

Abstract: A connector (20) is coupled with a circuit board (10) of a portable electronic device, and the circuit board includes a board hole (12) therein and a plurality of conductive pads (14) thereon, adjacent the board hole. The connector includes a housing (22) and a plurality of conducting terminals (24). The housing has an open end and includes a top wall (222) and sidewall (224), with the top wall and the sidewall together co-operatively defining a cavity (220). The plurality of conducting terminals is positioned near/proximate the open end of the housing. The housing is fixed with circuit board corresponding with the board hole and is electronically connected with the conductive pads via the conducting terminals.

Abstract: A printed wiring board, comprising a signal plane having a baseband block for processing a baseband signal and a high-frequency block for processing a high-frequency signal which is obtained by converting the baseband signal, and a ground plane opposing to the signal plane. The baseband block and the high-frequency block are connected through a transmission line for transmitting a signal of a specific frequency region. The ground plane is provided with a first ground portion and a second ground portion, the first ground portion being provided at an area opposing to the baseband block, the second ground portion being provided at an area opposing to the high-frequency block. The first ground portion and the second ground portion are coupled to each other through a coupling portion provided therebetween which has a low impedance with respect to the signal of the specific frequency region.

Abstract: A male contact having a longitudinal axis includes a head configured to contact a corresponding electrical contact and a first portion extending along the longitudinal axis and configured to be received within a socket of a corresponding terminal assembly. The first portion comprises resilient members extending axially from the head, the resilient members defining an interior cavity within the male contact, at least one of the resilient members having an arcuate inner surface in parallel with the longitudinal axis of the corresponding male contact.

Abstract: A land grid array socket and a microelectronic assembly including the socket. The socket comprises: a housing; an array of through-contacts on the housing; a solder ball standoff element on a PCB side of the housing; and a seating plane standoff element on a package side of the housing, the seating plane standoff element being aligned with the solder ball standoff element to form a loading force support element therewith.

Abstract: An electrical connector includes a dielectric housing having a lower base body that cooperates with an upper mounting body to confine a heat-dissipating space therebetween, and at least one opening in fluid communication with the heat-dissipating space. Conductive terminals extend through first through holes in the upper mounting body and second through holes in the lower base body, and have first contact portions that extend upwardly and outwardly of the upper mounting body to contact an electronic element mounted on the upper mounting body, and second contact portions that extend downwardly and outwardly of the lower base body. An anchoring unit is operable so as to anchor the electronic element to the upper mounting body.

Abstract: An electrical connection device includes a platform and a moving head. Between these components a semiconductor component is received and retained. The semiconductor component includes an electrical connection plate bearing an integrated circuit chip. The platform supports the making of electrical connection with front electrical connection terminals provided on a front panel of the electrical connection plate. The moving head bears a printed circuit board having interlinked pairs of contact terminals and associated pairs of electrical connection posts which make contact between the pairs of contact terminals of the printed circuit board and rear link terminals and rear transfer terminals provided on a rear panel of the electrical connection plate. The electrical connection plate includes circuitry which electrically connects the rear link terminals to the chip and also circuitry which electrically connects rear transfer terminals to front transfer terminals.