Abstract: A method of surface treatment of a Group III nitride crystal film includes polishing a surface of the Group III nitride crystal film, wherein a pH value x and an oxidation-reduction potential value y (mV) of a polishing liquid used for the polishing satisfy both relationships of y??50x+1,000 and y??50x+1,900.

Abstract: Chemical mechanical polishing pads having a window with an integral identification feature, wherein the window has a polishing face and a nonpolishing face, wherein the integral identification feature is observable through the window, and wherein the integral identification feature identifies the chemical mechanical polishing pad as a type of chemical mechanical polishing pad selected from a plurality of types of chemical mechanical polishing pads. Also provided is a method of making such chemical mechanical polishing pads and for using them to polish a substrate selected from a magnetic substrate, an optical substrate and a semiconductor substrate.

Abstract: A method of texturing a surface of a magnetic hard disk substrate includes the steps of rotating the magnetic hard disk substrate, supplying polishing slurry on the surface of the substrate, and pressing a polishing tape on the substrate surface and running the polishing tape. The polishing slurry includes abrading particles of monocrystalline diamond that are cluster particles with corners having diameters in the range of 1-10 nm, dispersed in a dispersant such as water and a water-based aqueous solution. The cluster particles are tasseled assemblies of crystalline particles with no directionality.

Abstract: A method and device for cleaning pipes of a heat exchanger includes placing a throttle-free jet nozzle against an end of a pipe. The throttle-free jet nozzle has an outlet opening of a same size or slightly smaller than an inner cross-sectional area of the pipe. A stream of air containing an abrasive is blown through the pipe for cleaning the pipe.

Abstract: The present disclosure relates to a chemical mechanical planarization pad and a method of making and using a chemical mechanical planarization pad. The chemical mechanical planarization pad may include a first component including a water soluble composition and water insoluble composition exhibiting a solubility in water of less than that of the water soluble composition, wherein at least one of the water soluble and water insoluble compositions of the first component is formed of fibers. The chemical mechanical planarization pad may also include a second component, wherein the first component is present as a discrete phase in a continuous of the second component.

Abstract: A panel including a surface made of a synthetic material may be subjected to a material removal process to create a specific decorative or architectural appearance. In one embodiment, a panel of cellular PVC is blasted with an abrasive material such as crushed glass to create a realistic stucco appearance on the panel surface. Benefits related to using certain synthetic materials as cladding may be realized, such as weather resistance. A coating containing aggregate may be applied to the blasted panel to enhance the surface appearance.

Abstract: A method for manufacturing a magnetic recording medium disk substrate is provided for achieving a magnetic disk having a suitable surface roughness, a high in-plane magnetic anisotropy and a high S/N. The manufacturing method has a texturing process wherein the magnetic recording medium disk substrate is rotated in the circumferential direction while a polishing tape is pressed against the rotating substrate. The polishing tape includes polyester fiber having a fiber diameter of 400 nm to 950 nm, on the surface coming into contact with the substrate. All the while, slurry including abrasive grains including a cluster diamond is supplied to the surfaces of the substrate. The present invention relates to a magnetic recording medium disk substrate produced by the manufacturing method; and a magnetic recording medium at least comprising a magnetic layer on the magnetic recording medium disk substrate and manufacturing method of the magnetic recording medium.

Abstract: The disclosure is directed to a processing fluid including at least 50 wt % of an aliphatic hydrocarbon having an average chain length of 8 to 16 carbons, 0.005 wt % to 10.0 wt % of Lewis active components, and not greater than 1.0 wt % water. The Lewis active components includes a Lewis acid and a Lewis base. The processing fluid has a conductivity of at least 10 nS/m and a Cannon viscosity of about 0.5 cp to about 5 cp at 25° C.

Abstract: Disclosed is a CMP slurry for silicon film polishing, comprising abrasive grains, an oxidizing agent, a cationic surfactant, and water. This CMP slurry is suitable for the CMP step of a silicon film of semiconductor devices, since it enables to obtain excellent planarity and excellent performance of controlling the remaining film thickness, while improving the yield and reliability of the semiconductor devices. This CMP slurry also enables to reduce the production cost.

Abstract: A polishing system and a method are presented for uniformly polishing efficiently at a fast rate the surface of a tape-like metallic base material of several hundred meters in length. The polishing system is provided not only with devices for causing the base material to travel continuously and applying a specified tension in the base material but also with a first polishing device for randomly polishing the target surface and a second polishing device for carrying out a final polishing on the target surface in the direction of travel of the base material. Polishing marks are formed in the direction of travel on the target surface by the final polishing.

Abstract: Polishing particles are made of artificial diamond produced by a shock method, having density of 3.0-3.35 g/cm3 and including secondary particles with average particle diameter of 30 nm-500 nm. Such polishing particles are produced by firstly obtaining a product containing artificial diamond by a shock method, then subjecting this product to an acid treatment by using one or more strong acids such as concentrated sulfuric acid, concentrated nitric acid and concentrated hydrochloric acid to thereby remove impurities from and wash the product, thereafter subjecting the product to a classification process to thereby separate artificial diamond of a first kind having secondary particles with particle diameters of 30 nm-500 nm and artificial diamond of a second kind having secondary particles with particle diameters in excess of 500 nm and selecting artificial diamond of a third kind having density of 3.0-3.35 g/cm3 out of the artificial diamond of the first kind.

Abstract: The present invention relates to a method of designing, previewing a natural stone veneer project in its entirety before a single stone is cut; cutting and finishing the edges of a natural veneer stone to form interconnecting finished natural stone veneer components having a weathered appearance, each component having a perimeter of a pre-determined contour and a finished edge.

Abstract: A novel titania nanosheet material synthesized using a novel mechanism using titania nanotubes as a starting material is described. The novel nanosheet material may be useful for many coating applications where titania nanoparticles are traditionally deposited including, but not limited to, self-cleaning coatings, gas sensors, hydrogen production, photocatalytic solar cells, and batteries.

Abstract: The present disclosure relates to a wire and a method of forming a wire including an iron based glass forming alloy including iron present in the range of 43.0 to 68.0 atomic percent, boron present in the range of 12.0 to 19.0 atomic percent, nickel present in the range of 15.0 to 17.0 atomic percent, cobalt present in the range of 2.0 to 21.0 atomic percent, optionally carbon present in the range of 0.1 to 6.0 atomic percent and optionally silicon present in the range of 0.4 to 4.0 atomic percent, wherein said wire has a thickness of 140 ?m or less and wherein said wire includes spinodal glass matrix microconstituents. The wire may be used in abrading a substrate.

Abstract: Disclosed is a metal-polishing liquid comprising: a metal-oxide-dissolving agent; a metal-oxidizing agent; a metal anticorrosive; a water-soluble polymer having a weight-average molecular weight of 8,000 or higher and having an anionic functional group and a nonionic functional group; and water, and having a pH within the range of 2.5 or higher but 5.0 or less. The metal-polishing liquid is effective in reducing the frictional force in polishing which generates during CMP. And is highly effective in flattening the surface of a work to be polished.

Abstract: A soluble abrasive is used to lap workpieces to overcome the problem of embedding and retaining abrasive particles in the workpieces. The soluble abrasives are dissolved from the workpiece even if they become embedded in the workpiece. For example, the abrasives may be dissolved with water and comprise ionic salts. The soluble abrasive has a hardness that is equal to or slightly greater than the hardness of the metal being lapped.

Abstract: A system for lapping a head on a wafer including at least one head each having an electrical lapping guide (ELG), a plurality of wafer contacts in electrical communication with the ELG, and a closure formed thereon defining a slot in which the wafer contacts are positioned, the system comprising a lapping cable coupled to a testing device, the lapping cable including a plurality of lapping cable contacts extending outwardly therefrom; wherein the lapping cable contacts are removably positionable in electrical communication with the wafer contacts during a lapping process. Additional systems and methods are also presented.

Abstract: A finishing device for finishing the exterior, flutes and tip of a drill bit is disclosed. The finishing device includes a containment vessel which houses an abrasive media which may have a visco-elastic component and an abrasive component. The drill bit is inserted into or through the abrasive media and rotated. A rotary member may be connected to the shank of the drill bit to provide rotation of the drill bit. The drill bit displaces the abrasive media thereby finishing the exterior, flutes, cutting edges and tip of the drill bit.

Abstract: The aqueous slurry is useful for chemical mechanical polishing semiconductor substrates having copper interconnects. The slurry includes by weight percent, 0 to 25 oxidizing agent, 1 to 50 abrasive particles, 0.001 to 10 inhibitor for decreasing static etch of the copper interconnects, 0.001 to 5 poly(methyl vinyl ether) having a formula as follows: and the poly(methyl vinyl ether) is water soluble and n has a value of at least 5, 0 to 10 copper complexing agent formed during polishing and balance water.

Abstract: The present invention relates to a method of glass surface fine processing for forming a convex portion on a surface of a glass containing alkali-metal oxides, the method including: a step of coating a surface of a first region adjacent to a surface of a second region which is to be a convex portion, with a protective layer; a step of removing alkali ions from the surface of the second region; a step of removing the protective layer from the surface of the first region; and a step of polishing the surface of the second region from which the alkali ions have been removed and the surface of the first region from which the protective layer has been removed.

Abstract: The present invention incorporates at least one thermoplastic or elastomeric polymer in abrasive flow machining media either as the sole or as one of the polymeric constituents. The presence of thermoplastic polymer imparts a greater elastomer characteristic (elasticity, compression resistance, increased relaxation times) as contrasted with traditional media. Enhanced elastomeric characteristics enable more uniform abrasive machining. In a particularly preferred embodiment, silicone- or polyorganosiloxane-based medium contains elastic silicone rubber particles dispersed therethrough to achieve increased relaxation times comparable to those attainable with the inclusion of a thermoplastic polymer.

Abstract: In a method of producing a glass substrate for a mask blank, a surface of the glass substrate is polished by the use of an alkaline polishing liquid that contains colloidal silica abrasive grains, from which alkali metal is removed to suppress occurrence of an alkali metal gel substance protrusion adhered on the glass substrate. The polishing process may include a surface roughness control step for initially finishing the surface of the glass substrate to a predetermined surface roughness by moving a polishing member and the glass substrate relative to each other under a predetermined pressure. This may be followed by a protrusion suppressing step under a pressure lower than the predetermined pressure, to minimize polishing rate and suppress occurrence of a fine convex protrusion.

Abstract: Disclosed is a polishing apparatus including a shell, a magnetic controller, an axle, a pusher, a ring, posts, and a stirring element. The shell includes a roof, a floor and a wall between the roof and the floor. Abrasive solution is filled in the shell. The abrasive solution includes abrasive grains and magnetic material. The magnetic controller is located around the wall. The axle can be engaged with a rotary element of a machine. The pusher is connected to the axle and inserted through the roof. A ring is located between the pusher and the wall. Posts are located between the ring and the floor. The stirring element is located on the floor.

Abstract: A manufacturing method includes providing a component, such as a superalloy aircraft component, with a substrate surface having damaged brittle compound particles from machining. The manufacturing method removes the damaged compound particles from the substrate surface without producing significant amount of new damaged compound particles in the substrate surface. In one example, the damaged compound particles are removed with an abrasive media. The method results in a machined substrate surface free from damaged intermetallic component particles.

Abstract: A polishing pad used in a CMP step in the manufacture of a semiconductor integrated circuit device is relatively expensive; thus, it is necessary to avoid a wasteful exchange of the pad. Accordingly, it is important to measure the abrasion amount of this pad precisely. However, in ordinary measurement thereof through light, the presence of a slurry hinders the measurement. In measurement thereof with a contact type sensor, a problem that pollutants elute out is caused. In a CMP step in the invention, the height position of a dresser is measured while the dresser operates, thereby detecting the abrasion amount or the thickness of a polishing pad indirectly. In this way, the time for exchanging the polishing pad is made appropriate.

Abstract: A method for manufacturing a lapping board having abrasive grains fixed on its surface, which is performed by the steps of: preparing a rotatable metal board having a surface of soft metal, an abrasive slurry-supplying tool arranged over the surface of the metal board, an abrasive-pressing tool which is placed on the metal board and has a hard surface, and a ultrasonic oscillation-generating tool attached to either or both of the abrasive-pressing tool and the metal board; rotating the metal board while supplying an abrasive slurry onto the surface of the metal board and while supplying electric power to the ultrasonic oscillation-generating tool to generate and apply ultrasonic oscillation to either or both of the abrasive-pressing tool and the metal board, whereby introducing the supplied abrasive slurry between the metal board and the abrasive-pressing tool and partly embedding some abrasive grains onto the metal board; and removing unfixed abrasive grains from the metal board.

Abstract: A manufacturing method of a thin-film head includes the steps of, laminating and patterning a soft magnetic layer with iron alloy that contains silicon and aluminum through a base layer on a substrate; laminating an insulating layer on the patterned soft magnetic layer; performing a chemical-mechanical polishing of a surface of the laminated insulating layer and the patterned soft magnetic layer with a first acid slurry; forming a lower shield layer by a mechanical polishing with a second weak acid, or neutral slurry with a pH different from that of the first slurry; and forming a lower shield gap layer and a magnetoresistive effect layer on the lower shield layer.

Abstract: A method and apparatus for polishing or planarzing a substrate by a chemical mechanical polishing process. In one embodiment a method of processing a semiconductor substrate is provided. The method comprises positioning a substrate on a polishing apparatus comprising a polishing pad assembly, delivering a polishing slurry to a surface of the polishing pad assembly, polishing the substrate with the surface of the polishing pad assembly, monitoring the removal rate of material from a plurality of regions on the surface of the substrate, determining whether the plurality of regions on the surface of the substrate are polishing uniformly, and selectively delivering a polishing slurry additive to at least one region of the plurality of regions to obtain a uniform removal rate of material from the plurality of regions on the surface of the substrate, wherein the removal rate of material from the at least one region is different than at least one other region of the plurality of regions.

Abstract: An apparatus and method for spiral polishing with electromagnetic abrasive has adopted the principle of electromagnetic and magnetic abrasive along with a lead screw to polish the inner or outer surface of a precise screw or a complicated part. The apparatus includes a clamp, a lead screw, a first electromagnet, and a second electromagnet assembled in an airtight space, wherein the airtight space is filled with magnetic abrasive which is driven by the rotation of the lead screw and the electromagnetic function to polish a processed part in a regular shape or in an irregular shape.

Abstract: The lapping of a slider is controlled based on an amplitude of a readback signal which is produced from an externally applied magnetic field. A lapping plate is used to lap a slider which includes at least one magnetic head having a read sensor. During the lapping, a coil produces a magnetic field around the slider and processing circuitry monitors both a readback signal amplitude and a resistance of the read sensor. The lapping of the slider is terminated based on the monitoring both the readback signal amplitude and the resistance. Preferably, the lapping of the slider is terminated when the resistance is within a predetermined resistance range and the readback signal amplitude is above a predetermined minimum amplitude threshold or reaches its peak value. Asymmetry can also be measured in the described system, where the lapping process is terminated based on asymmetry as well as resistance and amplitude measurements.

Abstract: To provide a technique employed when a plane to be polished of a silicon dioxide type material layer is polished in production of a semiconductor integrated circuit device, which is capable of polishing protruded portions by priority while suppressing polishing at recessed portions and planarizing the plane to be polished at a high level with an extremely small polishing amount, with small pattern dependence of the polishing rate. In production of a semiconductor integrated circuit device, when a plane to be polished is a plane to be polished of a silicon dioxide type material layer, a polishing compound containing cerium oxide particles, a water-soluble polyamine and water is used as a polishing compound for chemical mechanical polishing to polish the plane to be polished.

Abstract: Aqueous slurry compositions for use in loose-abrasive machining processes, particularly aqueous abrasive slurries for use in wire saw processes. These aqueous slurry compositions comprise abrasive particles uniformly and stably dispersed in lubricant, which comprises a combination of a vehicle and water, particularly PEG and water.

Abstract: Embodiments of the present invention provide a method of manufacturing a magnetic head slider, the method being adapted so that throat height of a main magnetic pole piece of a perpendicular recording magnetic head can be controlled with high accuracy. According to one embodiment, a first Electrical Lapping Guide element (ELG) is disposed on the same layer as a plated underlayer of a shield of one write head in a row bar, and other ELGs are disposed on the same layer as that of a main magnetic pole piece of another write head. Front end positions (Tops) are detected from changes in resistance values of the other ELGs and an ending position of lapping is calculated. Since the front end positions (Tops) of the other ELGs are accurate, it is possible to assign a correlation to throat height “Th” of the main magnetic pole piece and the resistance value of the first ELG by detecting this resistance value existing when the front end positions (Tops) are detected.

Abstract: A method for surface treatment of a pedicle screw including roughening a surface of a pedicle screw by blasting the surface with a Resorbable Blast Media (RBM).

Abstract: A production method of a semiconductor device including: producing a polishing composition containing zirconium oxide sol; and planarizing a substrate having an uneven surface with said polishing composition, wherein the polishing composition containing zirconium oxide is produced by the steps comprising: baking at a temperature ranging from 400 to 1000° C.

Abstract: The invention is directed to a chemical-mechanical polishing composition comprising (a) an abrasive consisting essentially of aggregated silica, (b) an acid, and (c) a liquid carrier, wherein the polishing composition has a pH of about 5 or less. The invention is also directed to a method of polishing a substrate comprising a dielectric layer using the polishing composition.

Abstract: A method of polishing to reduce surface roughness of at least one surface of a glass ceramic substrate that includes an amorphous glass portion and a crystalline portion. The method comprises at least one step of polishing the surface using a polishing pad and an abrasive polishing slurry. The polishing slurry comprises a first concentration of Ceria particulates and a second concentration of Silica particulates. The amorphous glass portion and the crystalline portion of the at least one surface are polished substantially equally.

Abstract: A method of prepping a surface using a high-frequency forced pulsed waterjet entails generating a high-frequency signal having a frequency f using a high-frequency signal generator, applying the high-frequency signal to a transducer having a microtip to cause the microtip of the transducer to vibrate to thereby generate a forced pulsed waterjet through an exit orifice of a nozzle having an exit orifice diameter d and a length L. The forced pulsed waterjet prepares the surface to within a predetermined range of surface roughness. The surface roughness is determined by selecting operating parameters comprising a standoff distance (SD), a traverse velocity VTR of the nozzle, a water pressure P, a water flow rate Q, a length-to-diameter (L/d) ratio, a microtip-to-orifice distance (a), the frequency f, and an amplitude A of the high-frequency signal.

Abstract: An apparatus for removing scales from metal wires including: a liquid container tank 12 through which the metal wires 10 pass, mixing nozzles 14 disposed to allow the metal wirings to pass through the liquid container tank for injecting a high-pressure liquid toward the metal wires 10; a high-pressure pump 16 for feeding the high-pressure liquid to the mixing nozzles 14; and cyclone separators 20 which are slurry feeders for feeding a slurry of the liquid with which an abrasive scavenging agent is mixed to the mixing nozzles 14. The mixing nozzles 14 inject the slurry of the abrasive scavenging agent together with the high-pressure liquid so that the abrasive scavenging agent bombards the scales on the surfaces of the metal wires 10 to remove the scales.

Abstract: A polishing pad, a polishing method and a method of forming a polishing pad are provided. The polishing pad includes a polishing layer and a plurality of arc grooves. The arc grooves are disposed in the polishing layer. Each of the arc grooves has two ends, and at least one end thereof has an inclined wall. The angle between the inclined wall of each groove and the surface plane of the polishing layer is less than 90 degree.

Abstract: To optimize the results of rounding and therefore to optimize the high pressure resistance of the component, it is firstly proposed that prior to the machining step of hydro-erosive rounding, the edge (5) and the surfaces (4, 6) of the high pressure-resistant component (1) which adjoin the edge (5) are each placed under compressive stresses in the region of their surface by means of a grinding and/or honing process. Also with regard to the method, and with regard to an apparatus for the hydro-erosive rounding, it is proposed that a closure element (9) is inserted into the continuing first bore (2), downstream of the second bore (3), which branches off from the first bore, as seen in the main direction of flow (S) of the liquid (8) mixed with abrasives (7), in order to divert the liquid (8) mixed with abrasives (7) from the first bore (2) into the second bore (3).

Abstract: An abrasive waterjet assembly has a cutting head assembly with a venting system for controlling the flow of abrasive within a cutting head body. The venting system includes one or more vents for regulating the pressure within a cutting head body to minimize, limit, or substantially eliminate any abrasive from reaching a jewel orifice. The vents include venting ports positioned between an orifice mount that retains the jewel orifice and a mixing region in which abrasive is mixed with a fluid jet produced by the jewel orifice. An isolator retained in the cutting head body further inhibits the upstream flow of abrasive, if any.

Abstract: Embodiments of the present invention allow control over the element height of read and write heads without damage to a lapping surface table when an air-bearing surface is lapped with a row bar or magnetic head slider tilted. According to one embodiment, the air-bearing surface is lapped with the row bar tilted in the longitudinal direction of a slider to compensate element height-wise positional deviations of the read head and the write head. The lapping is performed while changing an inclination angle stepwise and swinging the row bar in the longitudinal direction of the slider centering around an inclination angle at each step. Thus, the element heights of the magnetic pole piece and the read element can be controlled without damage to a lapping surface table.

Abstract: An ultrasonic waterjet apparatus (10) has a mobile generator module (20) and a high-pressure water hose (40) for delivering high-pressure water from the mobile generator module (20) to a hand-held gun (50) with a trigger and an ultrasonic nozzle (60). An ultrasonic generator in the mobile generator module (20) transmits high-frequency electrical pulses to a piezoelectric or magnetostrictive transducer (62) which vibrates to modulate a high-pressure waterjet flowing through the nozzle (60). The waterjet exiting the ultrasonic nozzle (60) is pulsed into mini slugs of water, each of which imparts a waterhammer pressure on a target surface. The ultrasonic waterjet apparatus (10) may be used to cut and de-burr materials, to clean and de-coat surfaces, and to break rocks.

Abstract: A positioning member is used to position the movable jaw to the sliding groove of the adjustable wrench and the adjustable wrench together with the positioning member are applied by vibrate grinding technology so as to make the outer surface of the movable jaw to be a mirror surface and the rod of the movable jaw is kept as the surface condition after being machine. The tolerance between the rod and the sliding groove is controlled within expected range.

Abstract: A method is provided for efficiently and securely smoothing a surface of an electrode disposed on a base, such as a ceramic substrate, without damaging the electrode or the base. The electrode is fired by a non-shrinkage process using a constraining layer and is separated from the constraining layer. The base including the electrode disposed thereon is prepared and a surface of the electrode is smoothed by vibrating media such that the media are arranged to be in contact with the electrode.

Abstract: Provided are a single type substrate treating apparatus and method. A polishing unit is disposed in a process chamber for polishing a substrate chemically and mechanically, and a cleaning unit is disposed in the same process chamber for cleaning the substrate. Therefore, according to the single substrate treating apparatus and method, a polishing process and a cleaning process can be performed on a substrate in the same process chamber by a single substrate treating method in which substrates are treated one by one.

Abstract: Surface treated implantable articles and related methods are disclosed. The surface treated implantable articles can be substantially flash-free, include one or more rounded edges, or include an enhanced optical clarity, one or all of which can be produced by polishing. The polishing can include causing the implantable articles to be repeatedly impacted with polishing media when the articles are swelled to an enlarged state. The polishing process can be particularly useful for smoothing lacrimal implants insertable in a lacrimal canaliculus.

Abstract: A surface treating apparatus treats a substrate surface by rotating a cylindrical polishing member in a state where the polishing member makes contact with the substrate surface. A polishing liquid is supplied to a polishing liquid passage that is provided in a central portion of the polishing member, and the polishing liquid is supplied to the substrate surface by rotating the polishing member while filtering the polishing liquid by a foam member provided on an outer periphery of the polishing liquid passage. Aperture diameters of the foam member are larger on the side of the polishing liquid passage than on the outside of the polishing member.

Abstract: Disclosed herein is a polishing method for polishing the end surface of a wafer by using a polishing tape, wherein the end surface of the wafer is polished in the condition where a polishing liquid containing an oxidizing agent is supplied to the end surface of the wafer.