Abstract: A polishing pad has a resin sheet having a flat surface and abrading particles fixed inside and on the surface of this resin sheet. Its tensile strength is in the range of 30 MPa or greater and 70 MPa or less and preferably in the range of 40 MPa or greater and 60 MPa or less. Its tensile tear elongation is in the range of 50% or less, preferably 20% or less and more preferably 5% or less. The average diameter of the primary particles of the abrading particles is in the range of 0.005 ?m or greater and less than 0.5 ?m, and preferably in the range of 0.005 ?m or greater and 0.2 ?m or less. The content of the abrading particles fixed to the resin sheet is 10 volume % or greater and 50 volume % or less, or preferably 10 volume % or greater and 24 volume or less.

Abstract: A transparent pad having a polishing surface with an average surface roughness of 5 ?m or less is used as a polishing pad. An indentation is formed on the back surface of the transparent pad such that its rate of light transmission is locally changed. The transparent pad has a rate of light transmission equal to or greater than 10% or preferably 30% for light of at least one wavelength in the range of 350 nm–900 nm.

Abstract: The present invention is directed to an abrasive article and methods of making the abrasive article. An abrasive coating on the abrasive article comprises at least 20% by weight of a superabrasive particle. The abrasive coating is derived from an abrasive slurry. The abrasive slurry may comprise and a dispersant having an AV wherein AV=1000*[(Amine Value)/(Mw)]. The dispersant comprises a polymer having a molecular weight (Mw) of greater than 500 g/mol and an AV of greater than 4.5, a polymer having a molecular weight (Mw) of greater than 10,000 g/mol and an AV of greater than 1.0, or a polymer having a molecular weight (Mw) of greater than 100,000 g/mol and an AV of greater than 0.

Abstract: A resilient flexible abrasive article includes a continuous backing layer including a support layer coated with foam, the continuous backing layer having opposed major surfaces, at least one of the major surfaces including a three dimensional surface topography including raised and recessed regions, and wherein the raised and recess regions are at least partially coated with abrasive particles, thereby defining an abrasive surface.

Abstract: A polishing pad having a polishing layer which has specific composition and a ratio of the storage elastic modulus at 30° C. to the storage elastic modulus at 60° C. of 2 to 15 and a ratio of the storage elastic modulus at 30° C. to the storage elastic modulus at 90° C. of 4 to 20 and is made of a polyurethane or polyurethane-urea. This polishing pad suppresses the scratching of the surface to be polished and planarizes the surface efficiently. A polishing pad having a polishing layer containing water-soluble particles can achieve a higher removal rate.

Abstract: Double-sided polishing equipment configured to polish a rectangular substrate, comprising a carrier having a pocket configured to accommodate a rectangular substrate, a lateral linear moving mechanism configured to move the carrier, first and second polishing pads with first and second rotational axes, respectively, offset from centers of the pads, the polishing surfaces of the first and second polishing pads being parallel. The equipment further includes at least one elevating mechanism coupled to at least one of the polishing pads, first and second rotary drive mechanisms coupled to each of the first and second polishing pads, respectively; and configured to rotate the first and second pads about the first and second rotational axes. A polishing-agent supplying device is present and configured to supply polishing agent to a plane where a substrate that is accommodated in the pocket to accommodate the substrate comes into contact with the polishing pads.

Abstract: The invention provides a chemical-mechanical polishing pad comprising a polishing layer comprising a hydrophobic region, a hydrophilic region, and an endpoint detection port. The hydrophobic region is substantially adjacent to the endpoint detection port. The hydrophobic region comprises a polymeric material having a surface energy of 34 mN/m or less and a polymeric material having a surface energy of more than 34 mN/m. The invention further provides a method of polishing a substrate comprising the use of the polishing pad.

Abstract: Provided are encapsulated belts and encapsulated pads for use in a variety of polishing application, including the chemical-mechanical polishing and planarization of semiconductor wafers and other workpieces. The encapsulated belts and pads are characterized by a robust seal between a polishing layer of the pad or belt and the edges of the subpad layer of the pad or belt. The robust seal is accomplished by casting a polymer directly over the subpad layer. The edges of the subpad layer may include one or more functional features that promote the formation of a watertight and slurry-resistant seal when the subpad layer is covered with a cast polymer. Also provided is a method of producing a robust seal between the polishing layer and the edge region of the subpad by encapsulating a subpad layer with a polymeric material.

Abstract: The invention provides a polishing pad for chemical-mechanical polishing comprising (a) a first polishing layer comprising a polishing surface and a first aperture having a first length and first width, (b) a second layer comprising a body and a second aperture having a second length and second width, wherein the second layer is substantially coextensive with the first polishing layer and at least one of the first length and first width is smaller than the second length and second width, and (c) a substantially transparent window portion, wherein the transparent window portion is disposed within the second aperture of the second layer so as to be aligned with the first aperture of the first polishing layer and the transparent window portion is separated from the body of the second layer by a gap. The invention further provides a chemical-mechanical polishing apparatus and method of polishing a workpiece.

Abstract: The polishing body is attached to a substrates. The polishing body has a structure in which a polishing pad, a hard elastic member and a soft members are laminated in that order from the side of the polishing surface. For example, an IC1000 (commercial name) manufactured by Rodel, Inc. is used as the polishing pad. For example, a stainless steel plate is used as the hard elastic member. A Suba400 (commercial name) manufactured by Rodel, Inc. is used as the soft members. The polishing pad 6 has grooves in the polishing surface side. The residual thickness d of the areas of the grooves in the polishing pad is set so as to satisfy the condition 0 mm<d?0.6 mm. As a result, the ability to eliminate steps can be increased, thus allowing the “local pattern flatness” to be improved, while ensuring the “global removal uniformity”; furthermore, a polishing body with a long useful life can be obtained.

Abstract: A polishing pad has a sublayer; a top layer attached to the sublayer, the sublayer having a modulus of elasticity between 300 and 5000 psi and a compressibility of less than 30% at 73 psi, wherein the top pad has a modulus of elasticity which is greater than the modulus of elasticity of the sublayer and a compressibility which is smaller than a compressibility of the sublayer.

Abstract: The present invention provides a deformable pad useful for chemical mechanical polishing (“CMP”), a CMP apparatus incorporating the deformable pad of the present invention, and methods for using the deformable pad and CMP apparatus of the present invention. The deformable pad of the present invention includes a plurality of solid supports which substantially eliminate the nonuniform polishing rates in known CMP processes and may be tailored to optimize a wide array of CMP processes. The CMP apparatus of the present invention incorporates a deformable pad of the present invention and may include several other known features, such as a polishing pad, a substrate carrier, mechanical assemblies for agitating the polishing pad or substrate carrier, etc.

Abstract: Methods are provided for shaping, maintaining the shape of, and cleaning a probe tip using a pad such as a multi-layer adhesive and abrasive pad. The multi-layer adhesive and abrasive pad may be formed from layers of adhesive material having abrasive particles in-between each layer. Using the pad, probe tips may be shaped as desired from an unfinished probe stock, substantially limiting the use of relatively expensive conventional machining operations. Further, the pad may also be used to maintain probe tips in a desired operating shape. Still further, the pad may be used to clean accumulated debris from the probe tip. Preferably, the maintenance and cleaning operations are performed on-line, with the probes operatively installed in connection with testing machinery.

Abstract: A polishing article and method for manufacturing a polishing article for use in a chemical mechanical polishing process is disclosed. The polishing article has a plurality of polishing material tiles separated by grooves formed in or through a polishing material and may be adhesively bound to a base film. The polishing article may include various polygonal tiles and oval shapes formed in the polishing material which allow enhanced slurry retention and ease in rolling from a polishing material supply roll and onto a take-up roll in a web type platen assembly. The polishing article may also include an upper carrier film adapted to minimize delaminating stress placed in an area of the polishing article that is not adapted for polishing. A method and apparatus for manufacturing the various embodiments of the polishing article and a replacement supply roll are also disclosed.

Abstract: A resilient hand-held abrasive article suitable, for example, for woodworking, includes a plurality of separated raised abrasive surfaces to allow the article to more effectively conform to a contoured surface. A method of making such an abrasive article is also disclosed.

Abstract: Provided is a fixed abrasive article for polishing a workpiece having a hardness comprising (a) a substrate having a first surface and a second surface, (b) a region of abrasive composites distributed on the first surface of the substrate, and (c) a region of conditioning amalgams distributed on the first surface of the substrate. The abrasive composites include a composite binder and abrasive particles of a first hardness, which first hardness is higher than the hardness of the workpiece. The amalgams include an erodible binder and conditioning particles sufficient to condition the composite binder and having a second hardness, which second hardness is less than the hardness of the workpiece and greater than the hardness of the composite binder. Also provided are other abrasive articles, and methods of making them.

Abstract: The present invention is directed to an abrasive article comprising a fixed abrasive layer and a subpad. The fixed abrasive element is co-extensive with the subpad. The subpad comprises a resilient element. The resilient element has a Shore A hardness of no greater than 60 as measured using ASTM-2240.

Abstract: The present invention provides an abrasive pad for abrading a surface to be abraded in the presence of an abrasive solution, which includes a hydrophobic polymer as a base material, and in which a graft-polymer chain having a hydrophilic group is introduced into the surface of the hydrophobic polymer. The hydrophilic group possessed by the graft-polymer chain is preferably a nonionic hydrophilic group selected from the group consisting of hydrophilic groups having an N-monoalkyl substituted structure and hydrophilic groups having an N-dialkyl substituted amide group. An amount of the hydrophilic graft-polymer to be introduced into the base material is preferably 10.0% to 150.0% in terms of graft ratio.

Abstract: A buff is made from a non-woven fabric where the fibers are first carded and formed into a fairly thick fleece. The fleece is passed over a topographical surface on, for example, a moving belt or a drum. The fleece is subject to a bow-tie hydroentanglement process where many fine jets of water entangle the fibers on the topographical surface. Excess water is vacuumed from the system. The fabric is dried and chemically treated. With the fabric a variety of buffing tools are made, in wheel, belt or roll form. Tests against standard and mill treatment buffs show a remarkably lower fabric weight loss percentage and lower or normal operating temperatures. The fabric has exceptional mechanical strength having a tensile strength in excess of 650 N/50 mm according to DIN 29073/3. Preferably the fabric has a tensile strength of at least 1,000 N/50 mm in the machine direction and in excess of 900 N/50 mm in the cross direction according to such DIN.

Abstract: A device and method for laminating CMP pads includes supporting the CMP pad with a board having material compositions similar to the CMP pad. By thus supporting the CMP pad during lamination, there is less likelihood of damage to the CMP pad and better adhesion from lamination. In particular, the CMP pad materials are laminated while in contact with a first board that may have a recess to accept the CMP pad. The pad has dimensions that are equal to or greater than the pad material. In an alternative embodiment, a board is provided on the opposite side of the CMP pad for lamination.

Abstract: A polishing pad used for polishing the surface of a semiconductor wafer in CMP equipment, includes a support layer adhered to the top of a rotary plate of the CMP equipment, a polishing layer disposed on top of the support layer, and an adhesive layer interposed between the support layer and the polishing layer and adhesively fixing the polishing layer to the support layer. In one embodiment, the polishing support layer is a plate-shaped molded article formed of a mixture including magnetic powder and a bonding agent containing synthetic resin. In another embodiment, a protective film extends along outer peripheral side walls of the adhesive layer and the support layer.

Abstract: In one embodiment, a dielectric layer (144, 156) overlying a semiconductor substrate (28) is uniformly polished. During polishing, the perimeter (32) of the semiconductor substrate (28) overlies a peripheral region (16, 48, 66, 86, 120) of a polishing pad (6, 42, 60, 80, 100) and an edge portion (36) of the front surface of semiconductor substrate (28) is not in contact with the front surface (18, 50, 68, 88, 122) of the polishing pad (6, 42, 60, 80, 100), in the peripheral region (16, 48, 66, 86, 120). As a result, the polishing rate at the edge portion (36) of the semiconductor substrate (28) is reduced, and the semiconductor substrate (28) is polished with improved center to edge uniformity. Since the semiconductor substrate (28) is polished with improved center to edge uniformity, die yield is increased because die located within the edge portion (36) of the semiconductor substrate (28) are not over polished.

Abstract: A disposable sanding device is fabricated as a continuous rope-like article which is adapted for selective segmentation and application as a plurality of serially arranged disposable hand sanding devices or ropes. Each hand sanding device is formed as a generally elongated rod shaped base portion formed of lightweight material such as closed cell foam having a relatively constant cross-section along its line of elongation. An abrasive surface is permanently applied to the external surface of the base portion via an intermediate adhesive layer. As constructed, the sanding device is operable to conform to curvilinear contours of a work piece to be sanded upon application of user induced loading against the work piece. A dispenser holds a rolled length of sanding rope and includes a cutter feature for severing pieces of sanding rope from the coil as required as well as a retainer for the free end of the coil. A tensioning hand tool holds a severed length of sanding rope for precise applications.

Abstract: An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate and a mounting surface. A plurality of perforations may be formed in the polishing article for flow of material therethrough. In another aspect, a polishing article for polishing a substrate includes a body having a polishing surface and a conductive element disposed therein. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. The polishing surface may have one or more pockets formed therein. The conductive element may be disposed in each of the polishing pockets.

Abstract: Embodiments of a pad assembly for processing a substrate are provided. The pad assembly includes a processing layer having a working surface adapted to process a substrate, a lower layer coupled to and disposed below the processing layer, and an electrode having an upper surface disposed above the lower layer and below the working surface of the processing layer. The upper surface of the electrode is at least partially exposed to the working surface to provide an electrolyte pathway between the upper surface of the electrode and the working surface.

Abstract: Endless abrasive belt useful for polishing or otherwise abrading surfaces.

Abstract: A polishing cloth has a surface layer stacked over a base material. The surface layer is made of a foamed layer and a non-foamed layer, the foamed layer including air bubble cells and the non-foamed layer having an externally exposed surface where linear cuts are formed. These linear cuts reach the air bubble cells such that the air bubble cells communicate with the exterior through the linear cuts. These linear cuts are controlled to be 10 ?m or less in length.

Abstract: An abrasive tool comprising of a base portion (2), having a foam layer (3) affixed to the abrasive tool base portion, and a plastic film layer (4) affixed, bonded or glued to the foam layer. This tool is adapted to receive an abrasive material layer (5) or sand paper or other abrasive material having a pressure sensitive adhesive applied to one side of the abrasive material, to allow said abrasive material to be stuck and affixed to the abrasive tool. The abrasive tool may be hand operated, or operated by electric power, air power, or other motive power.

Abstract: Superabrasive tools and methods for the making thereof are disclosed and described. In one aspect, superabrasive particles are chemically bonded to a matrix support material according to a predetermined pattern by a braze alloy. The brazing alloy may be provided as a powder, thin sheet, or sheet of amorphous alloy. A template having a plurality of apertures arranged in a predetermined pattern may be used to place the superabrasive particles on a given substrate or matrix support material.

Abstract: A polishing pad, polishing system, method of making a polishing pad and method of using a polishing pad. The polishing pad includes a polishing layer having a polishing surface, a backing layer with an aperture and a first portion that is permeable to liquid, and a sealant that penetrates a second portion of the backing layer adjacent to and surrounding the aperture such that the second portion is substantially impermeable to liquid. The aperture is positioned below a substantially fluid-impermeable element.

Abstract: A resilient, laminated polishing pad for chemical mechanical polishing is disclosed. The polishing pad includes a base layer and a polishing layer bonded by a hot-melt adhesive. The hot-melt adhesive of the present invention provides a Tpeel strength for the polishing pad of at least greater than 40 Newtons at 305 mm/min, reducing pad delamination.

Abstract: A polishing pad is described as comprising, (a) particulate polymer which can be chosen from particulate thermoplastic polymer (e.g., particulate thermoplastic polyurethane), particulate crosslinked polymer (e.g., particulate crosslinked polyurethane and/or particulate crosslinked polyepoxide) and mixtures thereof; and (b) organic polymer binder (e.g., polyurethane binder and/or polyepoxide binder), which can bind the particulate polymer together, wherein said organic polymer binder can be prepared in-situ. The particulate polymer and organic polymer binder can be distributed substantially across the work surface the polishing pad, and the pad can have a percent pore volume of from 2 percent by volume to 50 percent by volume, based on the total volume of said polishing pad.

Abstract: A chemical mechanical polishing pad which can be advantageously used for the polishing of a metal film or the polishing of an insulating film, provides a flat polished surface, enables slurry to be efficiently removed, has sufficiently long service life, can provide a high polishing rate and has the effect of reducing the number of scratches. This polishing pad has one or more grooves on its polishing surface, wherein the groove(s) is/are formed in the polishing surface in such a manner that it/they intersect(s) a single virtual straight line extending from the center portion toward the peripheral portion of the polishing surface a plurality of times and has/have a width of 0.1 to 1.5 mm and a depth of 0.9 to 9.8 mm, the shortest distance between adjacent intersections between it/them and the virtual straight line is 0.3 to 2.0 mm, and the ratio of the depth of the groove(s) to the thickness of the polishing pad is 1/7 to 1/1.1.

Abstract: A polishing pad (10) has an upper-layer pad (11) having a hole (11a) defined therein, a light-transmittable window (41) disposed in the hole (11a) for allowing light to pass therethrough, and a lower-layer pad (12) disposed below the upper-layer pad (11) and having a light passage hole (12a) defined therein which has substantially the same diameter as the hole (11a) in the upper-layer pad (11). A transparent film (13) with an adhesive agent applied to upper and lower surfaces thereof is interposed between the upper-layer pad (11) and the lower-layer pad (12). The hole (11a) defined in the upper-layer pad (11) and the light passage hole (12a) defined in the lower-layer pad (12) have substantially the same size as each other.

Abstract: A subpad support for use in a web format or belt format polishing apparatus for polishing one or more layers of semiconductor device structures. The subpad support includes a subpad retention element for non-adhesively securing the subpad thereto. The subpad support may also include one or more lips protruding therefrom so as to at least substantially inhibit lateral movement of the subpad relative to the subpad support. Polishing apparatus including the subpad support are also disclosed. The polishing pads of such polishing apparatus may be at least partially moved away from the subpad or subpad support so as to facilitate assembly of a subpad with the subpad support or removal of the subpad from the subpad support without damaging the polishing pad. Methods of removably securing a subpad to the subpad support, removing the subpad from the subpad support, and replacing another subpad on the subpad support, as well as polishing methods, are also disclosed.

Abstract: A flexible file system for providing abrasive files that can be used for wood or metal working that can be supplied in different sizes, stiffness and with different types of abrasive surfaces in different cross-sections. These flexible files can be attached to form a web that can be loaded into a dispenser either on a spindle or folded for easy dispensing of files as they are needed. The dispenser can have optional blades for separating the files as they are dispensed. Various methods can be used to attach the files into a web for easy dispensing and later separation including attach strips with cut or break points.

Abstract: A polishing pad is useful planarizing semiconductor substrates. The polishing pad comprises a polymeric material having a porosity of at least 0.1 volume percent, a KEL energy loss factor at 40° C. and 1 rad/sec of 385 to 750 1/Pa and a modulus E? at 40° C. and 1 rad/sec of 100 to 400 MPa.

Abstract: An abrasive cutting blade is provided to achieve high-quality surface finishes at high feed rates. The blade is fabricated by electroplating fine abrasive onto a steel cathode disc to form a first layer, followed by electroplating a second layer of coarser abrasive onto the first layer. A third layer of fine abrasive is then electroplated onto the second layer. The resulting composite is then removed from the cathode disc to form a multi-grit, multi-layer, hub-less blade.

Abstract: A polishing pad used for precise polishing of the surface of a lapped glass workpiece when a glass substrate for use in data recording media is manufactured from a glass workpiece. The polishing pad comprises a base and a polishing portion laminated on the base and contacting the surface of the glass workpiece at the time of polishing. The polishing portion is formed of a foam made of a synthetic resin having a 100% modulus of 11.8 MPa or less. A type of parameter representing the surface roughness of the polishing portion, namely, the maximum height (Rmax), is 70 ?m or less.

Abstract: Provided is a polishing pad for a chemical mechanical polishing (CMP) apparatus, having a sealing barrier which prevents fluid leakage and moisture accumulation on a window. The polishing pad comprises an upper pad having polishing surface in contact with a wafer, a bottom pad an upper face of which is attached to a lower face of the upper pad and a lower face of which is attached to an upper face of a platen of the CMP apparatus, an aperture through the bottom pad and the upper pad, a transparent window fitted in the aperture in the upper pad, and a sealing barrier, placed between the aperture and an external face of the bottom pad in contact with a fluid, to prevent fluid leakage and accumulation of moisture derived from fluid fed on the polishing surface through the bottom pad.

Abstract: An abrasive sheet member is disclosed, including a substrate having first and second major surfaces, an abrasive on the first major surface, and a plurality of hooking stems on the second major surface. The hooking stems are adapted to hook engaging structures on an opposed surface to releasably affix the abrasive sheet member to the surface.

Abstract: An abrasive sheet is made from an abrasive media mounted to a polymeric foam support member forming a one-piece abrasive sheet that is easily cut into any desirable configuration. The abrasive sheet is easily mounted to a holder adaptable to hand-held manual or powered tools.

Abstract: Embodiments of a pad assembly for processing a substrate are provided. The pad assembly includes a processing layer having a working surface adapted to process a substrate, a lower layer coupled to and disposed below the processing layer, and an electrode having an upper surface disposed above the lower layer and below the working surface of the processing layer. The upper surface of the electrode is at least partially exposed to the working surface to provide an electrolyte pathway between the upper surface of the electrode and the working surface.

Abstract: An integral polishing pad includes an elastic support layer and a polishing layer, which is formed on the elastic support layer and has a higher hardness than the elastic support layer. The elastic support layer and the polishing layer are made from materials chemically compatible with each other so that a structural border between the elastic support layer and the polishing layer does not exist. In addition, the integral polishing pad also includes a transparent region, which is transparent to a light source used to detect the surface state of an object being polished and integrated with the other elements of the integral polishing pad. The integral polishing pad has high planarization efficiency and uniform properties, and thus can be reliably used for polishing. In addition, the integral polishing pad prevents a congestion of a polishing slurry and facilitates delivery of the polishing slurry.

Abstract: The present invention comprises a customized polishing pad for use in a wafer polishing machine. The polishing pad of the present invention includes a polishing surface integral with the polishing pad. The polishing surface is adapted to frictionally contact a wafer in the polishing machine, thereby polishing the wafer. The polishing surface of the polishing pad includes at least two areas, where each area is adapted to frictionally contact the wafer and achieve a polishing effect specific for that area. A customized polishing effect is achieved by the polishing pad of the present invention when the wafer is selectively moved frictionally against the at least two areas by the wafer polishing machine.

Abstract: A method and apparatus for using fixed abrasive polishing pads that contain posts for chemical mechanical polishing (CMP). The posts have different shapes, different sizes, different heights, different materials, different distribution of abrasive particles and different process chemicals. This invention also includes preconditioning fixed abrasive articles comprising a plurality of posts so that the posts have equal heights above the backing to achieve a uniform texture. This invention relates to improvements with respect to in situ rate measurement (ISRM) devices. The invention resides in providing a mechanical means, such as a notch, to determine when approaching the end of the abrasive web roll. The invention resides in coding the web throughout its length to enable determining the location of different portions of the web. This invention resides in providing perforations in the sides or end of the web for improved handling.

Abstract: A sensor for monitoring a conductive film in a substrate during chemical mechanical polishing generates an alternating magnetic field that impinges a substrate and induces eddy currents. The sensor can have a core, a first coil wound around a first portion of the core and a second coil wound around a second portion of the core. The sensor can be positioned on a side of the polishing surface opposite the substrate. The sensor can detect a phase difference between a drive signal and a measured signal.

Abstract: A disposable sanding device is fabricated as a continuous rope-like article which is adapted for selective segmentation and application as a plurality of serially arranged disposable hand sanding devices or ropes. Each hand sanding device is formed as a generally elongated rod shaped base portion formed of lightweight material such as closed cell foam having a relatively constant cross-section along its line of elongation. An abrasive surface is permanently applied to the external surface of the base portion via an intermediate adhesive layer. As constructed, the sanding device is operable to conform to curvilinear contours of a work piece to be sanded upon application of user induced loading against the work piece. A dispenser holds a rolled length of sanding rope and includes a cutter feature for severing pieces of sanding rope from the coil as required as well as a retainer for the free end of the coil. A tensioning hand tool holds a severed length of sanding rope for precise applications.

Abstract: This tool applies treatments to surfaces by rubbing. It employs a mildly abrasive body of compacted non-woven fibres to carry and release fluids onto a surface as it cleans and massages the surface. It comprises a spill proof rubbing applicator capable of dispensing chemical substances ranging from low viscosity liquids to fine dry particulate and includes slumes and gels. The tool is provided with means of removing dirty used fibres from its treatment face.

Abstract: An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate and a mounting surface. A plurality of perforations may be formed in the polishing article for flow of material therethrough. In another aspect, a polishing article for polishing a substrate includes a body having a polishing surface and a conductive element disposed therein. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. The polishing surface may have one or more pockets formed therein. The conductive element may be disposed in each of the polishing pockets.