Scan Path Testing (e.g., Level Sensitive Scan Design (lssd)) Patents (Class 714/726)
  • Patent number: 10497317
    Abstract: An integration driver includes a plurality of stages. Each of the plurality of stages includes a scan signal generator including first to third nodes and a fifth node and an emission control signal generator including a fourth node and sixth node. The scan signal generator is configured to generate a first signal provided to a first node, a second signal provided to a second node, and a third signal provided to a third node using a first clock signal, a second clock signal, and a start signal or a carry signal, and generate a scan signal using the second signal and the third signal. The emission control signal generator is configured to generate a fourth signal provided to a fourth node using the third signal and the second clock signal, and generate an emission control signal using the first signal and the fourth signal.
    Type: Grant
    Filed: July 7, 2017
    Date of Patent: December 3, 2019
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Jae-Keun Lim, Ji-Eun Park, Young-Wook Yoo, Hassan Kamal
  • Patent number: 10436840
    Abstract: A distributed test circuit includes partitions arranged in series to form a scan path, each partition including a scan multiplexer, a test data register, and a segment insertion bit component. The scan multiplexer of each partition provides inputs to the corresponding test data register of the each partition. Broadcast control logic generates a select signal to the scan multiplexer of each partition to place the test circuit in a broadcast mode when the select signal is asserted, and to switch the test circuit to a daisy mode when select signal is de-asserted. The segment insertion bit is operable to include or bypass each partition from the scan path.
    Type: Grant
    Filed: March 26, 2018
    Date of Patent: October 8, 2019
    Assignee: NVIDIA Corp.
    Inventors: Jau Wu, Saurabh Gupta
  • Patent number: 10429440
    Abstract: Various examples of a circuit and a technique for testing the circuit are disclosed herein. In an example, the circuit includes a data input coupled to a scan multiplexer and a path select multiplexer. The circuit further includes a scan-in input coupled to the scan multiplexer and to receive a value of a scan pattern. The circuit further includes a scan latch to store the value that has an input coupled to the scan multiplexer and an output coupled to the path select multiplexer. The scan multiplexer selects a first signal from the data input and the scan-in input and provides the first signal to the input of the scan latch. The path select multiplexer selects a second signal from the data input and the output of the scan latch and provides the second signal to a data output of the circuit.
    Type: Grant
    Filed: July 26, 2017
    Date of Patent: October 1, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Kuan-Yen Huang, Ting-Yu Shen, Chien-Mo Li
  • Patent number: 10417104
    Abstract: A scan circuit and methods of operating a scan circuit are provided. The method for operating a scan circuit includes providing a first scan flip-flop which includes an overwrite feature. With the overwrite feature enabled, a change in functional behavior of the first scan flip-flop occurs based on a control signal. The method may further include capturing data at a first input of the first scan flip-flop during a first state of the control signal and resetting captured data by using the overwrite feature during a first transition of the control signal. The method may further include forming a scan chain with one or more of the first scan flip-flops and one or more second scan flip-flops. The second scan flip-flops may include a similar overwrite feature, having the overwrite feature disabled.
    Type: Grant
    Filed: September 22, 2015
    Date of Patent: September 17, 2019
    Assignee: NXP USA, INC.
    Inventors: Colin MacDonald, Alexander B. Hoefler, Jose A. Lyon, Chris P. Nappi, Andrew H. Payne
  • Patent number: 10394307
    Abstract: Provided is an information processing apparatus including a processor configured to control a system of the information processing apparatus, a power source controller configured to perform control of power supply to the system and to turn off a power source of the power source controller in standby mode in which a power source of the processor is turned off, a memory configured to store information in standby mode, and a power supply unit configured to perform power supply to the memory in standby mode.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: August 27, 2019
    Assignee: SONY CORPORATION
    Inventors: Takeshi Masuda, Toshimasa Tsuchida, Takahiro Imai, Yoshiyuki Tanaka, Kiyotaka Akasaka, Kenichi Onishi, Norifumi Yoshida
  • Patent number: 10393804
    Abstract: A test circuit is operable in ATPG mode and LBIST mode. The test circuit includes a clock selection circuit. The clock selection circuit includes clock logic circuitry to receive an LBIST mode signal and an ATPG mode signal and to generate an indication of whether the test circuit is operating in either the ATPG mode or the LBIST mode, a multiplexing circuit to receive an ATPG clock and a functional clock as input and output a selected one of the ATPG clock and the functional clock, and a clock gate circuit enabled in response to enable signals. The enable signals are an inverse of a selected one of the ATPG clock and the functional clock. The clock gate circuit receives the indication of whether the test circuit is operating in either the ATPG mode or the LBIST mode and generates a test clock as a function of the indication.
    Type: Grant
    Filed: October 25, 2018
    Date of Patent: August 27, 2019
    Assignee: STMicroelectronics International N.V.
    Inventors: Venkata Narayanan Srinivasan, Nimit Endlay, Balwinder Singh Soni
  • Patent number: 10386414
    Abstract: A device may include a control circuit configured to place, after a normal mode operation of N flip-flops, the N flip-flops in a test mode in which the test input of the first flip-flop of the chain is intended to receive a first sequence of test bits A memory may be configured to store a sequence of N values delivered by the test output of the last flip-flop of the chain. The control circuit may be configured to deliver, at the test input of the first flip-flop of the chain, the sequence of N stored values to restore the state of the N flip-flops before their placement in the test mode.
    Type: Grant
    Filed: May 28, 2015
    Date of Patent: August 20, 2019
    Assignees: STMICROELECTRONICS (CROLLES 2) SAS, STMICROELECTRONICS (GRENOBLE 2) SAS
    Inventors: Jean-Marc Daveau, Philippe Roche, Didier Fuin
  • Patent number: 10381093
    Abstract: A nonvolatile memory device includes a nonvolatile memory cell, a sensing circuit coupled between a sensing input line coupled to a bit line of the nonvolatile memory cell and a sensing output line, a sensing output grounding portion fixing an output signal of the sensing circuit at a low level if the output signal of the sensing circuit has a low level, and a bit line grounding portion fixing a bit line voltage at a ground voltage if the output signal of the sensing circuit is fixed at a low level.
    Type: Grant
    Filed: August 10, 2016
    Date of Patent: August 13, 2019
    Assignee: SK hynix Inc.
    Inventor: Hoe Sam Jeong
  • Patent number: 10375618
    Abstract: An apparatus which transfers information addressed to a master node, comprises a generation unit configured to generate an assessment value representing logical proximity to the master node; a transmit unit that sends/receives the assessment value to/from other apparatuses; and a communication unit that, when this apparatus is an apparatus that is logically closest to the master node within a communication range, receive information addressed to the master node from other apparatuses, otherwise, transmit information addressed to the master node to the logically closest apparatus, wherein the communication unit is configured to generate a delay time based on the assessment value when transferring the information received from the other apparatuses to yet another apparatus.
    Type: Grant
    Filed: March 27, 2017
    Date of Patent: August 6, 2019
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Ryokichi Onishi, Masaaki Sasahara
  • Patent number: 10366253
    Abstract: A Hardware-Embedded Delay Physical Unclonable Function (“HELP PUF”) leverages entropy by monitoring path stability and measuring path delays from core logic macros. Reliability and security enhancing techniques for the HELP PUF reduce bit flip errors during regeneration of the bitstring across environmental variations and improve cryptographic strength along with the corresponding difficulty of carrying out model building attacks. A voltage-based enrollment process screens unstable paths on normally synthesized (glitchy) functional units and reduces bit flip errors by carrying out enrollment at multiple supply voltages controlled using on-chip voltage regulators.
    Type: Grant
    Filed: December 15, 2015
    Date of Patent: July 30, 2019
    Assignee: STC.UNM
    Inventor: James Plusquellic
  • Patent number: 10345380
    Abstract: A method and circuit are provided for implementing enhanced scan data testing with over masking removal in an on product multiple input signature register plus (OPMISR+) test due to common Channel Mask Scan Registers (CMSRs) loading, and a design structure on which the subject circuit resides. An OPMISR plus satellite includes a multiple input signature register (MISR) for data collection and a plurality of associated scan channels. A common Channel Mask Scan Registers (CMSR) logic is used with the multiple input signature register (MISR). Unique CMSR data is loaded into at least one OPMISR plus satellite for implementing enhanced scan data testing. Scan pausing is used to reduce the amount of CMSR scan load data by loading the unique CMSR data only when needed.
    Type: Grant
    Filed: February 2, 2018
    Date of Patent: July 9, 2019
    Assignee: International Business Machines Corporation
    Inventors: Steven M. Douskey, Matthew B. Schallhorn, Mary P. Kusko, Amanda R. Kaufer, Michael J. Hamilton
  • Patent number: 10346557
    Abstract: A method for generating scan-based test patterns for an integrated circuit design includes, in a computer system, generating a number of current interval patterns for the integrated circuit design in a current pattern generation interval. The current interval patterns can be augmented to satisfy observe needs of a previous interval pattern generated in a previous pattern generation interval. Observe needs of the current interval patterns are stored in association with the current interval patterns. The current interval patterns are linked respectively to P streams of test patterns. The current pattern generation interval is subsequent to the previous pattern generation interval. The method includes simulating the current interval patterns to identify observable scan cells in the integrated circuit design, linking the P streams of test patterns into a single stream of test patterns, and storing the single stream of test patterns in a computer readable medium.
    Type: Grant
    Filed: March 6, 2017
    Date of Patent: July 9, 2019
    Assignee: Synopsys, Inc.
    Inventors: Peter Wohl, John Waicukauski
  • Patent number: 10347351
    Abstract: Discussed are a display device and a method of driving the same. The display device can include a panel in which a pixel is formed in each of a plurality of intersection areas between a plurality of gate lines and a plurality of data lines, a built-in gate driver built into a non-display area of the panel, and configured to include a shift register including a plurality of scan stages which output a scan pulse, and a timing controller configured to generate first to nth clocks, a reset signal, and a start signal. In initial driving of the built-in gate driver, the timing controller continuously supplies a pulse of the reset signal to the plurality of scan stages while a pulse of the nth clock and a pulse of the first clock to a pulse of the (n?1) clock are each output once in a first frame.
    Type: Grant
    Filed: December 30, 2014
    Date of Patent: July 9, 2019
    Assignee: LG DISPLAY CO., LTD.
    Inventors: Eun Cheol Eom, Young Ho Kim
  • Patent number: 10338930
    Abstract: There is disclosed a self-timed processor. The self-timed processor includes combinatorial logic comprising multi-rail delay insensitive asynchronous logic (DIAL) to output one or more multi-rail data values to a multiplexer. It also includes a test pattern input to output a test pattern bit stream of multi-rail test data values to the multiplexer. The multiplexer has Boolean logic to output one or more multi-rail multiplexed values to a latch. The multiplexer also has a single rail selector input to select whether the multi-rail multiplexed values are the multi-rail data values or the multi-rail test data values.
    Type: Grant
    Filed: June 28, 2018
    Date of Patent: July 2, 2019
    Assignee: Eta Compute, Inc.
    Inventors: Ben Melton, Bryan Garnett Cope
  • Patent number: 10338139
    Abstract: According to one general aspect, in a large digital integrated circuit with on-chip scan test compression hardware, an apparatus may include a digital circuit receiver circuit and a scan chain reorder circuit. The digital circuit receiver circuit configured to: receive a circuit model file that includes logic circuits that are represented by respective cells, wherein a plurality of cells are arranged in an ordered scan chain, and insert, in to the circuit model file, a dummy cell as an end cell at an end of the ordered scan chain. The scan chain reorder circuit configured to reorder the ordered scan chain to a reordered scan chain based, wherein the scan-chain reorder circuit is configured to maintain a start cell and an end cell of the ordered scan chain as a start cell and an end cell of the reordered scan chain.
    Type: Grant
    Filed: April 13, 2017
    Date of Patent: July 2, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Guangyuan Kelvin Ge, Yu-Ming Chiang, Rajesh Rajagopalan Kashyap
  • Patent number: 10331506
    Abstract: Systems disclosed herein provide for efficient top-level compactors for systems on a chip (SoCs) with multiple identical cores. Embodiments of the systems provide for compactors with a time-skewed assignment configuration, compactors with a space-skewed assignment configuration, compactors with time/space-skewed assignment configuration, and compactors that can selectively switch between the time/space-skewed assignment configuration and a symmetric assignment configuration.
    Type: Grant
    Filed: June 30, 2017
    Date of Patent: June 25, 2019
    Assignee: CADENCE DESIGN SYSTEMS, INC.
    Inventors: Vivek Chickermane, Christos Papameletis, Krishna Vijaya Chakravadhanula, Brian Edward Foutz
  • Patent number: 10317466
    Abstract: A semiconductor device addresses to a problem in which a current consumption variation rate increases during BIST execution causing resonance noise generation in a power supply line. The semiconductor device includes a self-diagnosis control circuit, a scan target circuit including a combinational circuit and a scan flip-flop, and an electrically rewritable non-volatile memory. A scan chain is configured by coupling a plurality of the scan flip-flops. In accordance with parameters stored in the non-volatile memory, the self-diagnosis control circuit can change a length of at least one of a scan-in period, a scan-out period and a capture period, and can also change a scan start timing.
    Type: Grant
    Filed: September 18, 2017
    Date of Patent: June 11, 2019
    Assignee: Renesas Electronics Corporation
    Inventor: Takuro Nishikawa
  • Patent number: 10312164
    Abstract: Disclosure herein is related to a method and a system for intelligent weak pattern diagnosis for semiconductor product, and a related non-transitory computer-readable storage medium. In the method, a weak pattern layout is firstly retrieved from a defect pattern library and a frequent failure defect pattern library; defect data is retrieved from fab defect inspection tool; a design layout is then received and weak defect pattern screen is performed to extract known and unknown weak defect patterns. In addition to updating the weak pattern library, the weak pattern contour can be made upon SEM image data, and then the true systematic weak pattern can be justified.
    Type: Grant
    Filed: May 20, 2014
    Date of Patent: June 4, 2019
    Assignee: ELITE SEMICONDUCTOR, INC.
    Inventor: Iyun Leu
  • Patent number: 10311827
    Abstract: There is provided an IC board and a display apparatus. Switching components (01; 02) are added between the internal interfaces (J1, J2 . . . Jn; j1, j2 . . . jn) corresponding to the backend data processing chips (U2; U3) and the frontend data processing chip (U1), or a switching component (02) is added between the internal interfaces (j1, j2 . . . jn) corresponding to the backend data processing chip (U2) and another backend data processing chip (U3). The switching components (01; 02) can ensure normal signal transmission between the backend data processing chips (U2; U3) and the frontend data processing chip (U1) or between the backend data processing chips (U2; U2) when no external test signal is input into the internal interfaces, i.e., when the IC board operates normally; and interrupt the signal transmission between the backend data processing chips (U2; U3) and the frontend data processing chip (U1) or between the backend data processing chips (U2; U3) when the internal interfaces j1, j2 . . .
    Type: Grant
    Filed: September 30, 2014
    Date of Patent: June 4, 2019
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., K-TRONICS (SU ZHOU) TECHNOLOGY CO., LTD.
    Inventors: Shuhuan Yu, Xiao Zhang, Lijie Zhang, Xitong Ma, Peng Cheng
  • Patent number: 10305764
    Abstract: Methods, systems, and computer readable mediums for monitoring and managing a computing system using resource chains are disclosed. In some examples, a method includes obtaining resource component data from each of a plurality of resource managers in a computing system and organizing the resource component data to establish logical relationships among resource components included in the computing system. The method further includes defining a resource configuration that identifies at least two of the resource components used to facilitate a communication path between a virtual resource in the computing system to a designated network element and displaying the resource configuration as a resource chain that defines a linking order among the at least two of the resource components that facilitate the communication path.
    Type: Grant
    Filed: December 30, 2015
    Date of Patent: May 28, 2019
    Assignee: VCE IP HOLDING COMPANY LLC
    Inventors: Mohit Suresh Kshirsagar, Rahul Talekar, Boyu Wang, Akshaya Mahapatra
  • Patent number: 10262572
    Abstract: GOA driving unit includes an input end, a starting module, a control module, an output module and a gate driving signal output end. The starting module is configured to, within a starting time period, input a triggering signal from the input end into the control module under the control of a first clock signal. The control module is configured to, within an output time period, output a second clock signal to the output module. The output module is configured to output a first level to the gate driving signal output end within the starting time period, output the second clock signal to the gate driving signal output end within the output time period, and output the first level to the gate driving signal output end within a maintenance time period. The first clock signal is of a phase reverse to the second clock signal.
    Type: Grant
    Filed: March 23, 2015
    Date of Patent: April 16, 2019
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Chunping Long, Ying Wang
  • Patent number: 10247777
    Abstract: “Shoot-through” timing failures in a scan chain of a defective semiconductor integrated circuit corrupt test pattern data used to perform failure analysis. Methods and procedures are provided to detect “shoot-through” conditions, determine the number of shoot-through scan cells, and to determine the location of the shoot-through cells within a scan chain. Reset test pattern results can be analyzed to identify candidate locations of shoot-through cells and when combined with candidate cell locations from analysis of physical clock distribution trees and potential clock-skew issues, the exact location of all shoot-through cells can be determined. Methods are also provided to use shoot-through cell locations to identify the defective clock net containing the physical defect causing the clock skew conditions needed to produce shoot-through timing failures.
    Type: Grant
    Filed: November 13, 2017
    Date of Patent: April 2, 2019
    Assignee: TESEDA CORPORATION
    Inventor: Theodore Clifton Bernard
  • Patent number: 10247779
    Abstract: The disclosure describes novel methods and apparatuses for accessing test compression architectures (TCA) in a device using either a parallel or serial access technique. The serial access technique may be controlled by a device tester or by a JTAG controller. Further the disclosure provides an approach to access the TCA of a device when the device exists in a daisy-chain arrangement with other devices, such as in a customer's system. Additional embodiments are also provided and described in the disclosure.
    Type: Grant
    Filed: February 21, 2018
    Date of Patent: April 2, 2019
    Assignee: Texas Instruments Incorporated
    Inventor: Lee D. Whetsel
  • Patent number: 10249380
    Abstract: An integrated circuit (IC) is disclosed herein for embedded memory testing with storage borrowing. In an example aspect, an integrated circuit includes a functional logic block, a memory block, and test logic. The functional logic block includes multiple storage units and is configured to store functional data in the multiple storage units during a regular operational mode. The test logic is configured to perform a test on the memory block during a testing mode. The test logic is also configured to retain memory test result data in the multiple storage units of the functional logic block during the testing mode.
    Type: Grant
    Filed: January 27, 2017
    Date of Patent: April 2, 2019
    Assignee: QUALCOMM Incorporated
    Inventors: Tapan Jyoti Chakraborty, Roberto Fabian Averbuj
  • Patent number: 10234507
    Abstract: A method and circuit for implementing register array repair using Logic Built In Self Test (LBIST), and a design structure on which the subject circuit resides are provided. Register array repair includes identifying and creating a list of any repairable Register Arrays (RAs) that effect an LBIST fail result. Next a repair solution is detected for each of the repairable Register Arrays (RAs) isolating a failing location for the detected repair solution for each array.
    Type: Grant
    Filed: July 20, 2016
    Date of Patent: March 19, 2019
    Assignee: International Business Machines Corporation
    Inventors: Steven M. Douskey, Michael J. Hamilton, Amanda R. Kaufer, Phillip A. Senum
  • Patent number: 10234504
    Abstract: According to certain aspects, the present embodiments relate to optimizing core wrappers in an integrated circuit to facilitate core-based testing of the integrated circuit. In some embodiments, an integrated circuit design flow is adjusted so as to increase the use of shared wrapper cells in inserted core wrappers, and to reduce the use of dedicated wrapper cells in such core wrappers, thereby improving timing and other integrated circuit design features. In these and other embodiments, the increased use of shared wrapper cells is performed even in the presence of shift registers in the integrated circuit design.
    Type: Grant
    Filed: March 7, 2017
    Date of Patent: March 19, 2019
    Assignee: CADENCE DESIGN SYSTEMS, INC.
    Inventors: Subhasish Mukherjee, Jagjot Kaur, Vivek Chickermane, Susan Marie Genova
  • Patent number: 10234505
    Abstract: A disclosed integrated circuit includes first and second clock generation circuits, a stagger circuit, and a plurality of scan chains. The first clock generation circuit receives a first clock signal and generates a first set of clock pulses having a first frequency in response to receipt of a first clock trigger signal and a first enable signal. The second clock generation circuit receives a second clock signal and generates a second set of clock pulses having a second frequency in response to receipt of a second clock trigger signal and a second enable signal. The stagger circuit generates the first and second clock trigger signals from the global trigger signal at different times. The first set of clock pulses are staggered relative to the second set of clock pulses. The plurality of scan chains test functionality of logic circuitry within the IC chip using the first and second set of clock pulses.
    Type: Grant
    Filed: February 27, 2017
    Date of Patent: March 19, 2019
    Assignee: XILINX, INC.
    Inventors: Banadappa V. Shivaray, Ismed D. Hartanto, Alex S. Warshofsky, Pranjal Chauhan
  • Patent number: 10222421
    Abstract: Embodiments are disclosed for systems and methods that include pulsing a clock pin of retention cells included within a scan chain to shift a sequence of logic values into the scan chain, so that successive cells are loaded with opposite logic values. Embodiments also include pulsing a retain pin to retain the logic values, and pulsing the clock pin to shift the sequence of logic values through the chain, so that retained logic values are output from, and logic values opposite to the retained logic values are loaded into, the cells. Embodiments also include pulsing a restore pin to restore the retained logic values, pulsing the clock pin to shift the logic values out of the scan chain, comparing the logic values shifted out of the scan chain with the logic values shifted into the scan chain, and detecting a fault on the retain pin based on said comparison.
    Type: Grant
    Filed: February 14, 2018
    Date of Patent: March 5, 2019
    Assignee: Silicon Laboratories Inc.
    Inventors: Mudit Srivastava, Raghavendra Pai Kateel, Shantonu Bhadury
  • Patent number: 10215808
    Abstract: A scan test circuit includes a scan chain formed of a plurality of sub-scan chains, an input distribution circuit, and an output compression circuit. With the use of a bypass circuit, a plurality of sub-scan chains are formed in a compression scan mode by connecting scan cell circuits of a high confidentiality-requiring circuit among a plurality of scan cell circuits included in an internal circuit, and a plurality of sub-scan chains are formed in a non-compression scan mode by bypassing the scan cell circuits of the high confidentiality-requiring circuit.
    Type: Grant
    Filed: January 20, 2017
    Date of Patent: February 26, 2019
    Assignee: MegaChips Corporation
    Inventor: Hiroyuki Nakamura
  • Patent number: 10209305
    Abstract: Testing of die on wafer is achieved by; (1) providing a tester with the capability of externally communicating JTAG test signals using simultaneously bidirectional transceiver circuitry, (2) providing die on wafer with the capability of externally communicating JTAG test signals using simultaneously bidirectional transceiver circuitry, and (3) providing a connectivity mechanism between the bidirectional transceiver circuitry's of the tester and a selected group or all of the die on wafer for communication of the JTAG signals.
    Type: Grant
    Filed: July 3, 2018
    Date of Patent: February 19, 2019
    Assignee: Texas Instruments Incorporated
    Inventor: Lee D. Whetsel
  • Patent number: 10210811
    Abstract: Disclosed is a pixel for improving an image quality. A pixel includes: an organic light emitting diode; a first transistor to control a current supplied to the organic light emitting diode from a first power source connected to a first electrode of the first transistor in response to a voltage applied to a first node; a second transistor connected between the first node and a second node, and turned on when a scan signal is supplied to a scan line; a first capacitor connected between the second node and a data line; and a third transistor connected between a second electrode of the first transistor and the second node, and turned on when a common control signal is supplied to a common control line.
    Type: Grant
    Filed: April 9, 2015
    Date of Patent: February 19, 2019
    Assignee: Samsung Display Co., Ltd.
    Inventor: Chang-Ho Lee
  • Patent number: 10198542
    Abstract: In a compression scan, the number of test steps is reduced without reducing a defection efficiency. A semiconductor apparatus includes one or more scan chains each including one or more MMSFFs being serially connected and combinational circuits and can switch between a scan shift operation and a capture operation. The MMSFF includes an MUX that selects one of an external input test signal which is externally input and a shift test signal which is input via the MMSFF in a preceding stage in the same scan chain, and an FF that outputs one of the external input test signal and the shift test signal which has been selected by the MUX.
    Type: Grant
    Filed: December 9, 2015
    Date of Patent: February 5, 2019
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventor: Hiroyuki Iwata
  • Patent number: 10180457
    Abstract: The present disclosure relates to a system and method for performing scan chain diagnosis of an electronic design. The method may include identifying, at a computing device, at least one failing scan chain associated with the electronic design. The method may also include selecting a plurality of defect locations associated with the at least one failing scan chain, wherein the plurality of defect locations corresponds to a number of parallel patterns that a simulator is configured to process. The method may further include selecting a sliced failing pattern set and generating a plurality of copies of a pattern associated with the sliced failing pattern set, wherein each of the plurality of copies corresponds to one of the plurality of defect locations. The method may also include simulating the plurality of copies of the pattern in parallel.
    Type: Grant
    Filed: March 4, 2016
    Date of Patent: January 15, 2019
    Assignee: Cadence Design Systems, Inc.
    Inventors: Sameer Chakravarthy Chillarige, Sharjinder Singh, Anil Malik, Joseph Michael Swenton
  • Patent number: 10163525
    Abstract: A test apparatus includes a device under test (DUT) configured to exchange data using a serial interface protocol and a test controller configured to receive a binary vector corresponding to a physical layer of the serial interface protocol from an external device and to buffer and transmit the received binary vector to the DUT.
    Type: Grant
    Filed: March 10, 2017
    Date of Patent: December 25, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Joosung Yun, Seongseob Shin, Moon-Ho Lee, Woonsup Choi
  • Patent number: 10151797
    Abstract: A logic built-in self-test (LBIST) circuit implements a pipeline scan enable launch on shift (LOS) feature. A first scan chain flip-flop has a scan enable input configured to receive a first scan enable signal. A logic circuit has a first input coupled to a data output of the first scan chain flip-flop and a second input coupled to receive the first scan enable signal. A second scan chain flip-flop has a scan input coupled to a scan output of the first scan chain flip-flop. A scan enable input of the second scan chain flip-flop is coupled to receive a second scan enable signal generated at an output of the logic circuit. The first and second scan chain flip-flops are clocked by a same clock signal.
    Type: Grant
    Filed: July 29, 2016
    Date of Patent: December 11, 2018
    Assignee: STMicroelectronics International N.V.
    Inventors: Venkata Narayanan Srinivasan, Tripti Gupta
  • Patent number: 10140058
    Abstract: A memory controller coupled between an external device and a memory is provided. The memory controller is coupled to the external device via a second interface and coupled to the memory via a first interface. The memory controller further includes a control logic to control the first interface and the second interface. The control logic sets the second interface to be at a receiving mode to receive a test data from the external device, and sets the first interface to be at a transmitting mode to transmit the test data to the memory. After a predetermined time, the control logic sets the first interface to be at the receiving mode to receive a test result from the memory, and sets the second interface to be at a transmitting mode to transmit the test result to the external device.
    Type: Grant
    Filed: May 26, 2016
    Date of Patent: November 27, 2018
    Assignee: SILICON MOTION, INC.
    Inventor: Jiyun-Wei Lin
  • Patent number: 10140943
    Abstract: The invention discloses a thin film transistor drive circuit and a drive method thereof and a liquid crystal display device. The thin film transistor drive circuit includes a plurality of scan lines, a scan signal output port configured to sequentially apply a scan signal to each of the scan lines, and a plurality of logic circuits. Each of the logic circuits is connected with one of the scan lines and a control signal line. The logic circuits are added to a drive circuit, and an input control signal corresponding to a truth table of the logic circuit is input for a preset duration by using a logic relationship of the logic circuit, so that an output control signal output to a scan line can be obtained to improve a scan signal on the scan line, to improve a delay distortion at the time of being turned off.
    Type: Grant
    Filed: March 20, 2017
    Date of Patent: November 27, 2018
    Assignees: XIAMEN TIANMA MICRO-ELECTRONICS CO., LTD., TIANMA MICRO-ELECTRONICS C., LTD.
    Inventors: Yuan Li, Zifeng Chen
  • Patent number: 10126361
    Abstract: Processing a circuit design that specifies application logic and debugging logic includes partitioning the circuit design. Each partition includes a part of the application logic and a part of the debugging logic, each partition is specified for implementation on a respective IC die, and the circuit design specifies connections between a part of the application logic in one partition and a part of the debugging logic in another partition. The connections between the part of the application logic in the one partition and the part of the debugging logic in the other partition are changed to connections from the part of the application logic in the one partition to a part of the debugging logic in the one partition. The part of the application logic and the part of the debugging logic of each partition are placed and routed on the respective IC die.
    Type: Grant
    Filed: November 14, 2016
    Date of Patent: November 13, 2018
    Assignee: XILINX, INC.
    Inventors: Xiaojian Yang, Maogang Wang, Grigor S. Gasparyan, Raoul Badaoui
  • Patent number: 10120027
    Abstract: Scan architectures are commonly used to test digital circuitry in integrated circuits. The present disclosure describes a method of adapting conventional scan architectures into a low power scan architecture. The low power scan architecture maintains the test time of conventional scan architectures, while requiring significantly less operational power than conventional scan architectures. The low power scan architecture is advantageous to IC/die manufacturers since it allows a larger number of circuits (such as DSP or CPU core circuits) embedded in an IC/die to be tested in parallel without consuming too much power within the IC/die. Since the low power scan architecture reduces test power consumption, it is possible to simultaneously test more die on a wafer than previously possible using conventional scan architectures. This allows wafer test times to be reduced which reduces the manufacturing cost of each die on the wafer.
    Type: Grant
    Filed: May 12, 2017
    Date of Patent: November 6, 2018
    Assignee: Texas Instruments Incorporated
    Inventor: Lee D. Whetsel
  • Patent number: 10120029
    Abstract: Aspects of the disclosed technology relate to low power testing. A low power test circuit comprises a test stimulus source, a controller; and a grouping and selection unit. The grouping and selection unit has inputs coupled to the test stimulus source and the controller and has outputs coupled to a plurality of scan chains. The grouping and selection unit is configured to dynamically group scan chains in the plurality of scan chains into a plurality of scan chain groups and to selectively output either original test pattern values generated by the test stimulus source or a constant value to each scan chain group in the plurality of scan chain groups based on control signals received from the controller.
    Type: Grant
    Filed: May 12, 2015
    Date of Patent: November 6, 2018
    Assignee: Mentor Graphics Corporation
    Inventors: Janusz Rajski, Sylwester Milewski, Grzegorz Mrugalski, Jerzy Tyszer
  • Patent number: 10094876
    Abstract: A system disclosed herein includes an on-chip clock controller (OCC) circuit receiving a test pattern and responsively generating output clock pulses in response to the test pattern. An OCC test circuit is coupled to the OCC circuit and configured to detect data corresponding to output clock pulses generated by the OCC controller circuit and generate corresponding OCC test outputs. A test output logic circuit is configured to receive the OCC test outputs from the OCC test circuit. A debug controller is operable to configure the test output logic circuit to output the OCC test outputs.
    Type: Grant
    Filed: October 3, 2016
    Date of Patent: October 9, 2018
    Assignee: STMicroelectronics International N.V.
    Inventor: Danish Hasan Syed
  • Patent number: 10089172
    Abstract: Information communication circuitry, including a first integrated circuit for coupling to a second integrated circuit in a package on package configuration. The first integrated circuit comprises processing circuitry for communicating information bits, and the information bits comprise data bits and error correction bits, where the error correction bits are for indicating whether data bits are received correctly. The second integrated circuit comprises a memory for receiving and storing at least some of the information bits. The information communication circuitry also includes interfacing circuitry for selectively communicating, along a number of conductors, between the package on package configuration. In a first instance, the interfacing circuitry selectively communicates only data bits along the number of conductors.
    Type: Grant
    Filed: December 31, 2014
    Date of Patent: October 2, 2018
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Rahul Gulati, Aishwarya Dubey, Nainala Vyagrheswarudu, Vasant Easwaran, Prashant Dinkar Karandikar, Mihir Mody
  • Patent number: 10078720
    Abstract: Systems and methods for circuit fault diagnosis are provided. An original circuit design is evaluated to determine whether the original circuit design is to be modified based at least in part on one or more first faults. In response to the original circuit design being determined not to be modified based at least in part on the one or more first faults, a first test pattern set is automatically generated based at least in part on the original circuit design. The original circuit design is evaluated to determine whether the original circuit design is to be modified based at least in part on the first test pattern set. In response to the original circuit design being determined not to be modified based at least in part on the first test pattern set, fault testing is performed to determine whether the original circuit design fails.
    Type: Grant
    Filed: March 13, 2015
    Date of Patent: September 18, 2018
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Sandeep Kumar Goel, Zipeng Li, Yun-Han Lee
  • Patent number: 10078115
    Abstract: An integrated circuit has controller circuitry having coupled to a test clock and a test mode select inputs, and having state a register clock state output, a register capture state output, and a register update state output. Register circuitry has a test data in lead input, control inputs coupled to the state outputs of the controller circuitry, and a control output. Connection circuitry has a control input connected to the control output of the register circuitry and selectively couples one of a first serial data output of first scan circuitry and a second serial data output of second scan circuitry to a test data out lead. Selection circuitry has an input connected to the serial data input lead, an input connected to a test pattern source lead, a control input coupled to the scan circuitry control output leads, and an output connected to the scan input lead.
    Type: Grant
    Filed: April 27, 2017
    Date of Patent: September 18, 2018
    Assignee: Texas Instruments Incorporated
    Inventor: Lee D. Whetsel
  • Patent number: 10078114
    Abstract: It is possible to reduce the number of test point circuits to be inserted necessary to accomplish a target fault coverage, to suppress an increase in an area overhead, and to reduce a test time. A test point circuit according to an embodiment constitutes a scan chain, and captures, in one capture operation period of a clock sequential test, a first operation result in a second capture clock that comes after a first capture clock, the first operation result having been captured by a test point circuit at a previous stage or a last stage of the scan chain in the first capture clock.
    Type: Grant
    Filed: July 27, 2016
    Date of Patent: September 18, 2018
    Assignee: Renesas Electronics Corporation
    Inventors: Hiroyuki Iwata, Jun Matsushima
  • Patent number: 10060980
    Abstract: Testing of die on wafer is achieved by; (1) providing a tester with the capability of externally communicating JTAG test signals using simultaneously bidirectional transceiver circuitry, (2) providing die on wafer with the capability of externally communicating JTAG test signals using simultaneously bidirectional transceiver circuity, and (3) providing a connectivity mechanism between the bidirectional transceiver circuitry's of the tester and a selected group or all of the die on wafer for communication of the JTAG signals.
    Type: Grant
    Filed: January 5, 2018
    Date of Patent: August 28, 2018
    Assignee: Texas Instruments Incorporated
    Inventor: Lee D. Whetsel
  • Patent number: 10054637
    Abstract: Testing an integrated circuit (IC) that has a set of nominally similar cores and pairs of test data input (TDI) and test data output (TDO) pads common to the different cores. Similar scan chains in parallel in the different cores provide response signals as functions of corresponding TDI signals. Respective combined TDO signals are provided to the TDO pads. In the absence of a defect, the combined TDO signals are asserted and de-asserted like the response signals from corresponding chains in the different cores and like corresponding expected response signals. The combined TDO signals are different from the corresponding expected response signals in the presence of a defect in at least one of the cores. If the result is a fail, the ATE may identify a defective core using a diagnosis module in the IC providing response signals from a selected core.
    Type: Grant
    Filed: September 1, 2016
    Date of Patent: August 21, 2018
    Assignee: NXP USA, INC.
    Inventors: Zhiyong Hao, Yuliang Zhou, Yongfeng Zhu
  • Patent number: 10048317
    Abstract: A chain of flip-flops is tested by passing a reference signal through the chain. The reference signal is generated from a test pattern that is cyclically fed back at the cadence of a clock signal. The reference signal propagates through the chain of flip-flops at the cadence of the clock signal to output a test signal. A comparison is carried out at the cadence of the clock signal of the test signal and the reference signal, where the reference signal is delayed by a delay time taking into account the number of flip-flops in the chain and the length of the test pattern. An output signal is produced, at the cadence of the clock signal, as a result of the comparison.
    Type: Grant
    Filed: August 23, 2016
    Date of Patent: August 14, 2018
    Assignee: STMicroelectronics (Crolles 2) SAS
    Inventors: Sylvain Clerc, Gilles Gasiot
  • Patent number: 10033385
    Abstract: In accordance with some embodiments, the present disclosure relates to a dual mode control interface that can be used to provide both a radio frequency front end (RFFE) serial interface and a two-mode general purpose input/output (GPIO) interface within a single digital control interface die. In certain embodiments, the dual mode control interface, or digital control interface, can communicate with a power amplifier. Further, the dual mode control interface can be used to set the mode of the power amplifier.
    Type: Grant
    Filed: December 22, 2016
    Date of Patent: July 24, 2018
    Assignee: SKYWORKS SOLUTIONS, INC.
    Inventor: David Steven Ripley
  • Patent number: 10024909
    Abstract: Multi-bit data flip-flops are disclosed that provide bit initialization through propagation of scan bits. Input multiplexers are configured to select between input data bits and input scan bits based upon mode select signals. Master latches receive and latch outputs from the input multiplexers. Slave latches receive and latch outputs from the master latches and also provide propagated input scan bits to the input multiplexers. A first state for the mode select signals selects the input data bits for a data mode of operation, and a second state for the mode select signals selects the input scan bits for a scan mode of operation. Further, the input multiplexers, master latches, and slave latches are configured to operate in an initialization mode to pass a fixed input scan bit through the multi-bit data flip-flop based upon initialization signals (e.g., set and/or reset signals).
    Type: Grant
    Filed: October 21, 2016
    Date of Patent: July 17, 2018
    Assignee: NXP USA, INC.
    Inventors: Mikhail Yurievich Semenov, Alexander Ivanovich Kornilov, Victor Mikhailovich Mikhailov, Denis Borisovich Malashevich, Viacheslav Sergeyevich Kalashnikov