Abstract: A method of testing a proximity communication system for voltage margin by impressing a voltage upon the data link between the transmitter on one chip and the receiver on the other chip coupled to the transmitter through a capacitively coupling circuit formed by juxtaposed capacitor pads on the respective two chips. The impressed voltage is varied and the output of the receiver is monitored to determine an operational voltage margin. The floating inputs on the receiver may be continuously biased by connecting them to variable biasing supply voltages through high impedances. When the floating inputs are periodically refreshed to a refresh voltage during a quiescent data period, the refresh voltage is varied between successive refresh cycles. The variable test voltage may be applied to transmitter output when it is in a high-impedance state, and the output of the receiver is measured.

Abstract: Semiconductor memory device includes a cell array including a plurality of unit cells; and a test circuit configured to perform a built-in self-stress (BISS) test for detecting a defect by performing a plurality of internal operations including a write operation through an access to the unit cells using a plurality of patterns during a test procedure carried out at a wafer-level.

Abstract: A memory hub device with test logic is configured to communicate with memory devices via multiple hub device ports, and is also configured to communicate on one or more busses in an upstream and downstream direction. The test logic includes a built-in self test apparatus providing logic to simultaneously and independently test the memory devices interfaced to one or more of the hub device ports using read and write data patterns. The test logic also includes configuration registers to hold fault and diagnostic information, and to initiate one or more tests. The memory hub device can further include command collision detection logic, a trace array, buffer transmit mode logic, trigger logic, clock adjustment logic, transparent mode logic, and a configured command sequencer, as well as additional features.

Abstract: A system for testing or debugging a system including the integrated circuit having an embedded logic analyzer. In one embodiment, the system includes a computing device coupled to the logic analyzer for receiving the at least one output. A user interface run on the computing device assigns an attribute to at least one signal associated with the logic analyzer, determines a new signal or value not provided by the logic analyzer, the new signal or value being based upon the at least one signal as received from the logic analyzer and upon a predetermined definition, and presents the new signal or value to a system user.

Abstract: A method and circuitry for checking the programming (P) and deletion (L) operations of memory cells (5) in a nonvolatile memory device (1). Parallel to the programming (P) or deletion (L) operations of the actual memory cells (5) the respective programming or deletion process is carried out on at least one similar checking cell (4.1, 4.2, 4.3), with the programming (P) or deletion (L) operations being less favorable by a defined extent than the programming (P) or deletion (L) operations of the actual memory cells (5). From the content of the checking cell (4.1, 4.2, 4.3) an evaluation device (6) determines whether the programming (P) or deletion (L) operation was successful or not, and a corresponding output signal (ak) indicative thereof is produced.

Abstract: A method for operating a memory (28) includes storing data, which is encoded with an Error Correction Code (ECC), in analog memory cells (32) of the memory by writing respective analog input values selected from a set of nominal values to the analog memory cells. The stored data is read by performing multiple read operations that compare analog output values of the analog memory cells to different, respective read thresholds so as to produce multiple comparison results for each of the analog memory cells. At least two of the read thresholds are positioned between a pair of the nominal values that are adjacent to one another in the set of the nominal values. Soft metrics are computed responsively to the multiple comparison results. The ECC is decoded using the soft metrics, so as to extract the data stored in the analog memory cells.

Abstract: An on-chip functional debugger includes one or more functional blocks each providing one or more functional outputs. A hierarchical selection tree is formed by one or more selectors having the output of one of the selectors as a final output and individual selector inputs coupled either to a functional output from the functional blocks or to an output of another selector. A selection signal coupled to the select input of each of the selectors to enable a selected one of its output. An output node coupled to the final output. A method of providing on-chip functional debugging is also provided. A desired functional output from one or more available functional outputs is selected and then the selected functional output is coupled to an output node.

Abstract: The peripheral circuitry (350, 360, ESD, BH) of an integrated circuit die on a wafer is tested without physically contacting the bond pads of the die.

Abstract: A semiconductor integrated circuit includes first and second bump pads configured to output data, a probe test pad coupled to the first bump pad, and a pipe latch unit configured to selectively transfer data loaded on first and second data lines to one of the first and second bump pads in response to a pipe output dividing signal during a normal mode, and sequentially transfer the data loaded on the first and second data lines to the probe test pad in response to the pipe output dividing signal during a test mode.

Abstract: Disclosed is a semiconductor device including a BIST provided with a plurality of scan FFs (flip-flops), a data address signal generation circuit unit which respectively generates a data signal and an address signal based on a set value of a scan FF, WEB generation circuit unit which generates a signal WEB which controls writing to and reading data from the semiconductor memory based on an scan FF value, and a test signal control circuit unit which controls the data address signal generation circuit unit and the WEB generation circuit unit, based on a received control signal, controls selectors, and selects and controls, as data and address signals to be supplied to the memory, data signal and address signals from the data address signal generation circuit unit or data and address signals via a user defined circuit.

Abstract: A semiconductor integrated circuit includes: a memory collars including: a memory cell; a fetch register that is configured to fetch data as a first fetch data; a comparing unit that is configured to compare the first fetch data with an expected value; a failure detecting signal output unit that is configured to receive the compared result and output a failure detecting signal; and a BIST circuit including: a BIST control unit that is configured to output an instruction and output a BIST status; a shift controller that is configured to receive a first clock signal, the BIST status signal, and the failure detecting signal and output sift enable signal; a shift counter that counts the number of clock pulses on the first clock signal; a first storage register that is configured to receive the first clock signal and the shift enable signal, and a second storage register that is configured to receive a second clock signal.

Abstract: This disclosure describes a reduced pin bus that can be used on integrated circuits or embedded cores within integrated circuits. The bus may be used for serial access to circuits where the availability of pins on ICs or terminals on cores is limited. The bus may be used for a variety of serial communication operations such as, but not limited to, serial communication related test, emulation, debug, and/or trace operations of an IC or core design. Other aspects of the disclosure include the use of reduced pin buses for emulation, debug, and trace operations and for functional operations. In a fifth aspect of the present disclosure, an interface select circuit, FIGS. 41-49, provides for selectively using either the 5 signal interface of FIG. 41 or the 3 signal interface of FIG. 8.

Abstract: A test method for an ASIC uses an embedded processor in the ASIC to execute test routines from an embedded memory or an external memory. During ASIC production, the test routines can comprehensively test of the blocks of the ASIC without a complicated test pattern from test equipment. The test routines can also perform power-up tests in systems or end products containing the ASIC. Test selection, activation, and result output can be implement using a few terminals of the ASIC.

Abstract: To increase scan compression during testing of an IC design, an X-chain method is provided. In this method, a subset of scan cells that are likely to capture an X are identified and then placed on separate X-chains. A configuration and observation modes for an unload selector and/or an unload compressor can be provided. The configuration and observation modes provide a first compression for non-X-chains that is greater than a second compression provided for X-chains. ATPG can be modified based on such configuration and observation modes. This X-chain method can be fully integrated in the design-for-test (DFT) flow, requires no additional user input, and has negligible impact on area and timing. Test generation results on industrial designs demonstrate significantly increased compression, with no loss of coverage, for designs with high X-densities.

Abstract: The present invention provides a method and system for improving memory testing efficiency, raising the speed of memory testing, detecting memory failures occurring at the memory operating frequency, and reducing data reported for redundancy repair analysis. The memory testing system includes a first memory tester extracting failed memory location information from the memory at a higher memory operating frequency, an external memory tester receiving failed memory location information at a lower memory tester frequency, and an interface between the first memory tester and the external memory tester. The memory testing method uses data strobes at the memory tester frequency to clock out failed memory location information obtained at the higher memory operating frequency. In addition, the inventive method reports only enough information to the external memory tester for it to determine row, column and single bit failures repairable with the available redundant resources.

Abstract: Disclosed is a semiconductor integrated circuit that allows a fail path to be detected. A semiconductor integrated circuit as described herein can be configured to include a data register that can receive input data to generate and store a write expectation value and a read expectation value, during a period in which a test mode is activated, a first comparing unit that compares write data written in a memory cell with the write expectation value, and a second comparing unit that compares read data read from the memory cell with the read expectation value.

Abstract: A device test architecture and interface is provided to enable efficient testing embedded cores within devices. The test architecture interfaces to standard IEEE 1500 core test wrappers and provides high test data bandwidth to the wrappers from an external tester. The test architecture includes compare circuits that allow for comparison of test response data to be performed within the device. The test architecture further includes a memory for storing the results of the test response comparisons. The test architecture includes a programmable test controller to allow for various test control operations by simply inputting an instruction to the programmable test controller from the external tester. The test architecture includes a selector circuit for selecting a core for testing. Additional features and embodiments of the device test architectures are also disclosed.

Abstract: A design structure for implementing redundancy programming in a memory macro of an integrated circuit chip. It is assumed that all fails are row fails until determined to be bitline fails, circuits for implementing a method wherein it is assumed that all fails are row fails until determined to be bitline fails and test patterns are passed back to the failure detecting circuit when a wordline destination of the test patterns has previously been determined to be failing, and the test patterns and resultant patterns are passed between the memory macro and a test engine via logic paths connecting the memory macro to other circuits in said integrated circuit chip.

Abstract: Apparatuses, systems, and methods are disclosed for performing Built-In Self Tests (BIST) on memories. One such BIST includes loading microcode instructions into a main microcode sequencer and loading subroutine instructions into a subroutine microcode sequencer on the memory. The microcode instructions generate subroutine calls to the subroutine microcode sequencer. The subroutine instructions generate memory operation codes, address codes, and data codes for testing a memory device. BIST addresses are generated in response to the memory operation codes and the address codes. BIST data are generated in response to the memory operation codes and the data codes. Conventional memory commands are created by generating command signals, address signals, and data signals for the memory in response to the memory operation codes, the BIST data, and the BIST addresses. Test results output data may be stored in a data checker in the form of information stored in data registers or checksum registers.

Abstract: A method of sharing testing components for multiple embedded memories and the memory system incorporating the same. The memory system includes multiple test controllers, multiple interface devices, a main controller, and a serial interface. The main controller is used for initializing testing of each of the dissimilar memory groups using a serial interface and local test controllers. The memory system results in reduced routing congestion and faster testing of plurality of dissimilar memories.

Abstract: A memory collar includes a first circuit, a second circuit and a third circuit. The first circuit may be configured to generate a first control signal, a second control signal and a third control signal in response to one or more test commands. The second circuit may be configured to generate a fourth control signal in response to said third control signal and the fourth control signal. The third circuit may be configured to generate one or more address sequences. The one or more address sequences are presented to a memory during a test mode.

Abstract: A method for storing a memory defect map is disclosed whereby a memory component is tested for defects at the time of manufacture and any memory defects detected are stored in a memory defect map and used to optimize the system performance. The memory defect map is updated and the system's remapping resources optimized as new memory defects are detected during operation.

Abstract: A system is described having a JTAG diagnostic unit and a serial wire diagnostic unit. A watcher unit is connected to a data connection shared between the diagnostic units. Special patterns detected upon the shared data connection serve to switch between diagnostic modes with respective ones of the diagnostic units becoming active.

Abstract: The disclosure describes a process and apparatus for accessing devices on a substrate. The substrate may include only full pin JTAG devices (504), only reduced pin JTAG devices (506), or a mixture of both full pin and reduced pin JTAG devices. The access is accomplished using a single interface (502) between the substrate (408) and a JTAG controller (404). The access interface may be a wired interface or a wireless interface and may be used for JTAG based device testing, debugging, programming, or other type of JTAG based operation.

Abstract: An apparatus and method for a processor-memory unit for use in system-in-package (SiP) and system-in-package (SiP) integrated circuit devices. The apparatus includes a processing module, a memory module and a programmable system module. The programmable system module is configured to function as an interface between the memory module and the processing module, or as an interface between the memory module and a testing device. The invention facilitates integration and testing of processor-memory units including functional components having different communication protocols.

Abstract: A pipelined scan compression method and apparatus for reducing test data volume and test application time in a scan-based integrated circuit without reducing the speed of the scan chain operation in scan-test mode or self-test mode. The scan-based integrated circuit contains one or more scan chains, each scan chain comprising one or more scan cells coupled in series. The method and apparatus includes a decompressor comprising one or more shift registers, a combinational logic network, and an optional scan connector. The decompressor decompresses a compressed scan pattern on its compressed scan inputs and drives the generated decompressed scan pattern at the output of the decompressor to the scan data inputs of the scan-based integrated circuit. Any input constraints imposed by said combinational logic network are incorporated into an automatic test pattern generation (ATPG) program for generating the compressed scan pattern for one or more selected faults in one-step.

Abstract: A system that provides large instruction sets for testing memory yet reduces area overhead is disclosed. The system for testing a memory of an integrated circuit comprises a set of registers providing element based programmability for a plurality of tests, wherein each test includes a plurality of test elements; a finite state machine for receiving a plurality of test instructions from the set of registers, wherein the finite state machine dispatches signals instructing a test pattern generator to generate a test pattern; a memory control module for applying the generated test pattern to the memory; and a comparator module for comparing a response received from the memory to a stored, known response.

Abstract: A packet switch routes data packets based on both packet headers and data payloads in the data packets. The packet switch receives data packets, identifies a destination port of the packet switch for each data packet based on a packet header of the data packet, and routes the data packet to the destination port. Additionally, the packet switch selects data packets among the data packets received by the packet switch based on the data payloads of the received data packets, identifies a trace port of the packet switch for each selected data packet, and routes the selected data packet to the trace port.

Abstract: A method and a circuit for protecting a digital quantity stored in a microcontroller including a JTAG interface, including the step of making the digital quantity dependent from a value stored in non-volatile fashion in the microcontroller and made inaccessible if signals are present at the input of the JTAG interface.

Abstract: A method and apparatus for operating a component including a memory device. The method includes receiving a plurality of commands and determining if a set of the plurality of commands matches a predefined pattern of commands configured to place the memory device into a test mode. Upon determining that the set of the plurality of commands matches the predefined plurality of commands, the memory device is placed in the test mode.

Abstract: The invention provides an inspection method of a semiconductor device which receives a test program wirelessly. As an inspection method of the semiconductor device, a test program is transmitted as a communication signal for every test. By transmitting a test program as a communication signal wirelessly in the case of an operation test, test contents are changed as required. As a result, a test program can be easily changed and an inspection circuit or the like is not required. In this manner, manufacturing cost of a wireless chip can be reduced.

Abstract: A TAP Linking Module (TLM) couples plural TAPs, via select and enable signals, to an externally accessible IEEE 1149.1 interface. The select signals are outputs from the TAPs to the TLM, and the enable signals are output from the TLM to the TAPs. Each select signal is output in response to a special instruction scanned into a TAP's instruction register, which causes the TLM to be selected as the data register scan path between the TDI and TDO pins. A conventional data register scan operation shifts data through the TLM. Following the scan operation, the TLM outputs one enable signal to the TAPS and outputs select signals to a multiplexer to establish a TAP link configuration.

Abstract: Provided is a test apparatus that tests a device under test, comprising a plurality of test circuits that each perform a predetermined test function; a plurality of I/O circuits that are provided between the test circuits and the device under test, where at least one of the circuits has electrical characteristics that differ from the electrical characteristics of the other circuits; and an I/O switching section that switches which of the I/O circuits is used to electrically connect at least one of the test circuits to the device under test.

Abstract: A method for performing a logical built-in self-test of an integrated circuit is disclosed. The method includes performing a flush and scan test to determine whether the scan chains function correctly. If one of the scan chains does not function correctly, the logical built-in self-test is terminated. If each of the scan chains functions correctly, a structural test of the design-for-test logic supporting LBIST is performed to determine whether the LBIST design-for-test logic functions correctly. If the LBIST design-for-test logic does not function correctly, the logical built-in self-test is terminated. If the LBIST design-for-test logic functions correctly, a level sensitive scan design test of the functional combinational logic is performed using the logic supporting LBIST design-for-test to determine if the integrated circuit functions correctly.

Abstract: An LBIST captures pseudo-random values from a pseudo-random pattern generator. Next, the LBIST stabilizes an untimed logic path by inputting the captured pseudo-random value into the untimed logic path. In turn, the LBIST tests one or more timed signal transitions that are dependent upon the stabilized untimed logic path.

Abstract: A system for receiving serial messages from a device under test includes a deserializer configured to i) receive the serial messages and, ii) based on the serial messages, form data frames. A frame sync module is configured to form Joint Task Action Group (JTAG) data bits based on the data frames. A plurality of virtual JTAG test access ports are configured to i) receive the JTAG data bits and ii) shift the JTAG data bits between the plurality of virtual JTAG test access ports.

Abstract: An interface device receives test data from a tester. A signal representing the test data is transmitted to a device under test through electromagnetically coupled structures on the interface device and the device under test. The device under test processes the test data and generates response data. A signal representing the response data is transmitted to the interface device through electromagnetically coupled structures on the device under test and the interface device.

Abstract: A method for implementing at speed bit fail mapping of an embedded memory system having ABIST (Array Built In Self Testing), comprises using a high speed multiplied clock which is a multiple of an external clock of an external tester to sequence ABIST bit fail testing of the embedded memory system. Collect store fail data during ABIST testing of the embedded memory system. Perform a predetermined number of ABIST runs before issuing a bypass order substituting the external clock for the high speed multiplied clock. Use the external clock of the tester to read bit fail data out to the external tester.

Abstract: In a first embodiment a TAP of IEEE standard 1149.1 is allowed to commandeer control from a WSP of IEEE standard P1500 such that the P1500 architecture, normally controlled by the WSP, is rendered controllable by the TAP. In a second embodiment (1) the TAP and WSP based architectures are merged together such that the sharing of the previously described architectural elements are possible, and (2) the TAP and WSP test interfaces are merged into a single optimized test interface that is operable to perform all operations of each separate test interface. One approach provides for the TAP to maintain access and control of the TAP instruction register, but provides for a selected data register to be accessed and controlled by either the TAP+ATC or by the discrete CaptureDR, UpdateDR, TransferDR, ShiftDR, and ClockDR WSP data register control signals.

Abstract: The peripheral circuitry (350, 360, ESD, BH) of an integrated circuit die on a wafer is tested without physically contacting the bond pads of the die.

Abstract: An architecture for testing a plurality of circuits on an integrated circuit is described. The architecture includes a TAP Linking Module located between test pins on the integrated circuit and 1149.1 Test Access Ports (TAP) of the plurality of circuits to be tested. The TAP Linking Module operates in response to 1149.1 scan operations from a tester connected to the test pins to selectively switch between 1149.1 TAPs to enable test access between the tester and plurality of circuits. The TAP Linking Module's 1149.1 TAP switching operation is based upon augmenting 1149.1 instruction patterns to affix an additional bit or bits of information which is used by the TAP Linking Module for performing the TAP switching operation.

Abstract: A method and circuit for implementing substantially perfect array access time tracking with Logic Built In Self Test (LBIST) diagnostics of dynamic memory array and random logic, and a design structure on which the subject circuit resides are provided. The dynamic memory array is initialized to a state for the longest read time for each bit and the dynamic memory array is forced into a read only mode. During LBIST diagnostics with the array in the read only mode, the array outputs are combined with the data inputs to provide random switching data on the array outputs to the random logic.

Abstract: The present disclosure describes novel methods and apparatuses for directly accessing JTAG Tap domains that exist in a scan path of many serially connected JTAG Tap domains. Direct scan access to a selected Tap domain by a JTAG controller is achieved using auxiliary digital or analog terminals associated with the Tap domain and connected to the JTAG controller. During direct scan access, the auxiliary digital or analog terminals serve as serial data input and serial data output paths between the selected Tap domain and the JTAG controller.

Abstract: A Scan-BIST architecture is adapted into a low power Scan-BIST architecture. A generator 102, compactor 106, and controller 110 remain the same as in the known art. The changes between the known art Scan-BIST architecture and the low power Scan-BIST architecture involve modification of the known scan path into scan path 502, to insert scan paths A 506, B 508 and C 510, and the insertion of an adaptor circuit 504 in the control path 114 between controller 110 and scan path 502.

Abstract: Electronic apparatus, systems, and methods of operating and constructing the electronic apparatus and/or systems include an embedded processor disposed in a logic chip to direct, among other functions, self-testing of an electronic device structure in conjunction with a pattern buffer disposed in the logic chip, when the electronic device structure is coupled to the logic chip. Additional apparatus, systems, and methods are disclosed.

Abstract: A life parameter generator generates life parameters related to the life of a nonvolatile memory device by using parameters related to allowable capacity for memory defect and occurrence capacity for memory defect. The life parameters are stored in a life parameter storing block of a nonvolatile memory. An access device reads and displays the stored life parameters. Thus, the user can precisely know the life of the nonvolatile memory device or the moment when a device having a built in nonvolatile memory such as a portable audio becomes unusable.

Abstract: A system comprising a plurality of components and an automation module coupled to the plurality of components. The automation module is adapted to automatically initialize a software test environment for at least one of the plurality of components, where the software test environment prepares the at least one of the plurality of components to be tested. The automation module also is adapted to, without transferring a testing agent to the at least one of the plurality of components, automatically test the at least one of the plurality of components.

Abstract: A method, system and computer program product for testing the Design-For-Testability/Design-For-Diagnostics (DFT/DFD) and supporting BIST functions of a custom microcode array. Upon completion of the LSSD Flush and Scan tests, the ABIST program is applied to target the logic associated direct current (DC) and alternating current (AC) faults of ABIST array Design-For-Testability/Design-For-Diagnostics DFT/DFD functions that support the microcode array. A LSSD test of the DFT functional combinational logic is performed by applying generated LSSD deterministic test patterns targeting the ABIST design-for-test faults to determine if the DFT supporting the microcode array is functioning correctly. Additional tests may be terminated upon resulting failure of the applied ABIST DFT circuitry surrounding the arrays.

Abstract: A method of determining the intrinsic electrical characteristics of a device under test (DUT) includes determining a set of test measurements for a test structure including the device and determining test measurements for a number of de-embedding test structures. Based on the test measurements, DUT measurements are determined using both open-short and three-step de-embedding processes. The DUT measurements are combined to determine an imperfection error, which is used to adjust the calculations of a four-port de-embedding method. The adjusted calculations provide for a more accurate measurement of the parasitic elements in the test structure, thereby improving the determination of the intrinsic electrical characteristics of the device.

Abstract: Scan architectures are commonly used to test digital circuitry in integrated circuits. The present disclosure describes a method of adapting conventional scan architectures into a low power scan architecture. The low power scan architecture maintains the test time of conventional scan architectures, while requiring significantly less operational power than conventional scan architectures. The low power scan architecture is advantageous to IC/die manufacturers since it allows a larger number of circuits (such as DSP or CPU core circuits) embedded in an IC/die to be tested in parallel without consuming too much power within the IC/die. Since the low power scan architecture reduces test power consumption, it is possible to simultaneously test more die on a wafer than previously possible using conventional scan architectures. This allows wafer test times to be reduced which reduces the manufacturing cost of each die on the wafer.