Abstract: A design hierarchy based on an implementation set abstraction of a user design for an integrated circuit design includes a plurality of nodes and a definition for each of the nodes in the plurality of nodes that describes the type of elements contained in each node and the hierarchy defined by each of the nodes. Each node can include at least one implementation element of the design and the at least one implementation element can be selected among the group including a set of logical elements, a set of placed elements, and a set of placed and routed elements.

Abstract: A semiconductor device includes a semiconductor island having at least one electrical dopant atom and encapsulated by dielectric materials including at least one dielectric material layer. At least two portions of the at least one dielectric material layer have a thickness less than 2 nm to enable quantum tunneling effects. A source-side conductive material portion and a drain-side conductive material portion abuts the two portions of the at least one dielectric material layer. A gate conductor is located on the at least one dielectric material layer between the source-side conductive material portion and the drain-side conductive material portion. The potential of the semiconductor island responds to the voltage at the gate conductor to enable or disable tunneling current through the two portions of the at least one dielectric material layer. Design structures for the semiconductor device are also provided.

Abstract: Disclosed are embodiments of on-chip identification circuitry. In one embodiment, pairs of conductors (e.g., metal pads, vias, lines) are formed within one or more metallization layers. The distance between the conductors in each pair is predetermined so that, given known across chip line variations, there is a random chance (i.e., an approximately 50/50 chance) of a short. In another embodiment different masks form first conductors (e.g., metal lines separated by varying distances and having different widths) and second conductors (e.g., metal vias separated by varying distances and having equal widths). The first and second conductors alternate across the chip. Due to the different separation distances and widths of the first conductors, the different separation distances of the second conductors and, random mask alignment variations, each first conductor can short to up to two second conductors.

Abstract: A method for reducing a surface area of a pad limited semiconductor die layout includes choosing an outer die pad row from a group of outer die pad rows on the semiconductor die, each of the outer die pad rows being adjacent an edge of the semiconductor die. Next, the method performs selecting, from the outer die pad row, a common die pad group with die pads that are arranged to be electrically connected to an external connection pad. The method then performs repositioning a subgroup of the common die pad group on an inner die pad row, the inner pad row being adjacent the outer die pad row. After he repositioning there is performed a step of adjusting positions of at least some of the remaining pads in the outer die pad row thereby reducing an overall length of the outer die pad row.

Abstract: A pad layout method for surface mount circuit board and a surface mount circuit board are described. The layout method includes the following steps. Firstly, coefficients of thermal expansion of a circuit board and a surface mounted component are obtained, and the circuit board is supplied with a plurality of predetermined layout positions in advance. Then, an operating temperature for combining the surface mounted component with the circuit board is determined, and a room temperature is measured. A plurality of actual layout positions on the circuit board is determined according to d=(CTEa?CTEb)×(Ts?Tr), where d is an offset distance between the actual layout position and the predetermined layout position. Finally, a plurality of pads is laid out on the actual layout positions, such that the pads are formed on the circuit board.

Abstract: A system for creating layout and wiring diagrams for an integrated circuit (IC) includes a placement engine configured to receive a hierarchical schematic and to create a placed layout. The system also includes a flat layout engine configured to receive the hierarchical schematic and to create a flat layout and a back annotation engine coupled to the placement engine and the flat layout engine, the back annotation engine configured to receive the hierarchical placed layout and the flat unplaced layout and to create a flat placed layout there from.

Abstract: A method for defining a layout of 3-D devices, such as a finFET, is provided. The method includes determining an area required by a desired 3-D device and designing a circuit using planar devices having an equivalent area. The planar device corresponding to the desired 3-D device is used to layout a circuit design, thereby allowing circuit and layout designers to work at a higher level without the need to specify each individual fin or 3-D structure. Thereafter, the planar design may be converted to a 3-D design by replacing planar active areas with 3-D devices occupying an equivalent area.

Abstract: A cell-based architecture for an integrated circuit that uses at least two categories of cells: cut-gate cells and breaker cells. Cut-gate cells have gates that extend from one boundary of the cell to an opposite boundary of the cell. Cut gate features are located along the boundaries of the cell to indicate locations for cutting the gates during fabrication. Instances of the cut-gate cells are arranged in abutting rows that result in the formation of continuous gate strips during the fabrication process, which are then cut into individual gates with a cut-gate mechanism. Breaker cells have gates that do not extend to the boundaries of the breaker cell. To prevent the continuous gate strips from exceeding design rule requirements, instances of breaker cells are placed at intervals between the rows of cut-gate cell instances to restrict the size of the gate strips.

Abstract: A method for proximity-aware circuit design where a set of layout constraint values that satisfy predetermined performance or yield goals is determined in accordance with a layout effect model. One of the layout constraint values is then selected as a constraint input to layout design, and a design layout is performed with the selected layout constraint value to provide a semiconductor circuit design for the semiconductor circuit. The set of layout constraint values can be determined by varying an instance parameter of the layout effect model to determine a set of instance parameters that satisfy the at least one predetermined performance or yield goal in accordance with the layout effect model, and determining layout constraints associated with each instance parameter of the set of instance parameters, thus providing a number of candidates in a design space that can be evaluated according to performance and/or yield tradeoffs.

Abstract: A method is provided to produce an integrated circuit layout design comprising: providing in non-transitory storage a pPar parent cell that includes one or more pPar instances and that specifies one or more corresponding input parameter values; producing a graphical representation on a computer display screen of a first schematic design that includes a pPar parent instance; instantiating in non-transitory storage a parameterized cell supermaster that corresponds to the pPar parent cell; determining whether a core layout cell is stored in non-transitory storage that corresponds to the parameterized cell supermaster and the one or more corresponding input parameter values; in response to determining that such a core layout cell is stored, filling a first parameterized cell submaster with an instance of the stored core layout cell; in response to determining that such a core layout cell is not stored, using program code associated with the parameterized cell supermaster to generate a core layout cell; and storin

Abstract: An object of the present invention is to largely reduce a period required for a layout design of a semiconductor integrated circuit device by simplifying a hierarchical layout process. It is necessary to couple a signal line between a circuit belonging to a top and a signal terminal of a block, and there is such an inadequate situation that the signal line cannot be coupled to a predetermined location of the signal terminal of the block or the signal line needs to be largely detoured depending on congestion conditions of the other signal lines in the block and the signal lines of the top coupled to the other blocks. Accordingly, location information of the signal terminal is deleted before the signal line is coupled, so that the signal line can be coupled irrespective of the location information of the signal terminal of the block.

Abstract: A method for manufacturing a semiconductor integrated circuit includes: generating first data by performing floor planning based on semiconductor integrated circuit information and monitor path circuit information; generating second data by arranging at least one monitor path flip-flop and at least one monitor path circuit element in the first data based on monitor path position information; generating third data by performing arrangement or wiring based on the second data; generating a first timing analysis result by performing timing analysis on data corresponding to the semiconductor integrated circuit information of the third data; generating a second timing analysis result by performing timing analysis on data corresponding to the monitor path circuit information of the third data; modifying the semiconductor integrated circuit information by comparing the first timing analysis result with the second timing analysis result; and manufacturing the semiconductor integrated circuit based on the modified semi

Abstract: An automated method and apparatus for positioning gate array circuits in an integrated circuit design. An initial integrated circuit design includes logic cells and gate array fill circuits positioned thereon. The gate array fill circuits are positioned in available space between the adjacent logic cells so as to fill the available space with the maximum gate array fill circuits. A gate array logic element to be positioned in the integrated circuit design, such as may be required by an engineering change to the circuit design, is automatically positioned between adjacent logic cells so as to allow for full utilization of any space remaining between the adjacent logic cells by gate array fill circuits.

Abstract: A mixed-height cell library for designing integrated circuits is provided. The mixed-height cell library includes a first plurality of cells having a first track height and a second plurality of cells having a second track height that are configured to be coupled to the first plurality of cells at respective power and ground rail lines. A method for mixed-height cell placement and optimization is also provided. The method comprises abutting cells of different track heights to form a plurality of rows of cells by coupling power and ground rails of the cells at a secondary layer that is different from a primary layer that is used to connect active material and determining whether re-ordering cells within rows allows for further compaction of adjacent rows. The method further comprises re-ordering cells within rows so to allow for further compaction of adjacent rows. The method also includes the steps of splitting rows vertically to minimize the distance between the split rows.

Abstract: Provided in the present invention is a reconfiguration method and device for scan chains with the planned unit taken into consideration, wherein said reconfiguration method of the scan chains comprises a first phase reconfiguration and second phase reconfiguration. Said first phase reconfiguration first classifies a number of scan chains, wherein scan chains with the starting point and the ending point in the same planned unit are classified as a first aggregation of scan chains; scan chains with the starting point and the ending point not in the same planned unit are classified as a second aggregation of scan chains; and scan chains with both the starting point and the ending point at the same top level are classified as a third aggregation of scan chains.

Abstract: A power transistor and a power converter are disclosed that may improve the on-resistance and corresponding silicon area of a power transistor. The power transistor may comprise a drain, a source, and a channel therebetween divided into a plurality of transistor stripes, the plurality of transistor stripes being grouped in a plurality of different groups. The power transistor may further comprise a first top metal associated with one of the drain and the source, and a second top metal associated with the other of the drain and the source. The second top metal includes at least one portion that is coupled to different groups of transistor stripes. A related method for determining a layout topology of a power transistor is also disclosed.

Abstract: A semiconductor integrated circuit includes a first wiring formed on a first wiring layer and prolonged in a first direction, a second wiring formed on a second wiring layer and prolonged in a second direction, a third wiring formed on the first wiring layer and prolonged in the first direction, a fourth wiring formed on the second wiring layer and prolonged in the second direction, a multi-cut via formed to connect the first wiring to the second wiring, the multi-cut via including a first via and a second via formed in the first direction, and a single-cut via formed to connect the third wiring to the fourth wiring. A first overhang is provided in a direction opposite to the first direction, the first overhang being larger than a second overhang, the second overhang being smaller than a third overhang.

Abstract: A method can include allowing a user to place a first wiring harness design component within a wiring harness topology in a wiring harness design workspace, allowing the user to place a first plurality of ground devices within the first wiring harness design component placed in the wiring harness topology, allowing the user to request an automatic ground combination, and, in response to the user requesting an automatic ground combination, automatically applying at least one electronically stored ground combination rule to a first set of ground devices comprising a plurality of the first plurality of ground devices and automatically combining at least two of the first set of ground devices into a first combined ground device based at least in part on the applied at least one electronically stored ground combination rule.

Abstract: A method of modification of a semiconductor layout is provided. The layout comprises objects of semiconductor material with corners and edges. The method comprises a step of receiving (61) a set of proximities, triggers and design rules, the proximities indicating relations between neighboring edges and/or corners, the triggers defining boundaries for the modification within which boundaries the proximities are valid, the design rules describing physical requirements for the semiconductor layout. The method further comprises a step of generating (62) a set of constraints, based on the received proximities, triggers and design rules, each constraint in the set of constraints defining a limit within which the semiconductor layout may be modified without changing the proximities. Then the set of constraints to obtain a modified semiconductor layout is solved (63).

Abstract: Spare cells are placed in an IC design using stability values associated with logic cones of the design. A desired spare cell utilization rate is assigned to a cone based on its stability value, and an actual spare cell utilization rate for the cone bounding box is calculated. If the actual utilization rate is less than the desired utilization rate, additional spare cells are inserted as needed to attain the desired utilization rate. The stability value is provided by a logic or circuit designer, or derived from historical information regarding the logic cone in a previous design iteration. Spare cells are placed for each logic cone in the design until a global spare cell utilization target is exceeded. The spare cell placement method can be an integrated part of a placement directed synthesis which is followed by early mode padding and design routing.

Abstract: Components are inserted into a cell-based current chin design with multiple levels of nested hierarchy. A selection of components having various silicon densities to insert into the current chip design is received. The components are inserted into the current chip design such that the components do not touch or overlap existing circuits or silicon shapes in the current chip design. The components are inserted such that components having highest silicon densities are placed further away from the existing circuits or silicon shapes than components having lower silicon densities.

Abstract: A semiconductor integrated circuit includes a first transistor which is formed of a first gate extending in a first direction and a first diffusion region and which is capable of being active, a second transistor which is formed of a second gate extending in the first direction and a second diffusion region and which is arranged adjacent to the first transistor in a second direction intersected at a right angle with the first direction, and a third gate which extends in the first direction and which is arranged adjacent in the second direction to the first transistor on an opposite side to the second transistor. A space between the first gate and the second gate is larger than a space between the first gate and the third gate.

Abstract: A placer produces a global placement plan specifying positions of cell instances and orientations of macros within an integrated circuit (IC) by initially clusterizing cell instances and macros to form a pyramidal hierarchy of blocks. Then the placer iteratively repeats the declusterization and routability improvement process from the highest level to the lowest level of the hierarchy. An objective function is provided in Cartesian coordinate for representing the position of each movable instance and in polar coordinate for representing the orientation of a macro relative to its the center. For each movable instance and each rotatable macro, its position or orientation is determined by conjugate gradient method to minimize total wire length. Finally, the placer uses a look-ahead legalization technique to rotate rotatable macros to legal orientations and move cell instances to legal positions in the end of global placement.

Abstract: A system and method for constructing a clock tree based on replica stages is described. The system and method may comprise determining a size of an input buffer for driving a load capacitance of the output buffer based on a fanout, determining a wire width and a wire length based on the size of the output buffer, the fanout and a replica stage mathematical model, and connecting the output buffer and the corresponding input buffer to a conductor routed on one or more predetermined metal layers and having the wire length and the wire width. The conductor is placed within ground shields having a fixed width.

Abstract: A method for merging polygons of a printed circuit board layout system is provided. The system generates PCB files according to the input wiring diagram, and generates polygons and records the profile attributes of each of the generated polygons. The method includes obtaining the profile attributes in response to user input. Then storing the obtained profile attributes and selecting two profile attributes. Then determining whether the polygons are overlapping and recording a new file attribute describing the shape of a new polygon of the two polygons combined shape excluding the lines indicating the overlapping portions of the two polygons. Finally, updating the opened PCB file with the new profile attribute if the polygons are overlapping. A related system is also provided.

Abstract: An area partitioning processing unit equally partitions a power source network analysis object area of an LSI according to the number or size of partitioned areas specified by a user or partitions the power source network analysis object area according to the user's specification. A border processing unit extracts and adds a range-of-influence part of the power source network that can electrically influence a border between the partitioned area partitioned by the area partitioning processing unit and an adjacent power source network area. A modeling processing unit performs processing of resistance modeling of the partitioned area or a correction spot with the range-of-influence part added thereto by the border processing unit. A power source network analyzing processing unit analyzes a resistance model modeled by the modeling processing unit and calculates potential of each via as a current source to a load element.

Abstract: A congestive placement preventing apparatus applied to a circuit layout including electrical devices is provided. The congestive placement preventing apparatus includes an analyzing module, a reserving module and a placing module. The analyzing module performs a routing congestion analysis on the circuit layout to generate an analysis result of the circuit layout. The reserving module correspondingly disposes a plurality of blockages in the circuit layout according to the analysis result, so that a first space with the blockages and a second space are formed in the circuit layout. After the placing module places the electrical devices in the second space, the placing module removes the blockages from the first space, and redistributes the electrical devices in the first space and the second space according to a redistribution rule.

Abstract: High density circuit modules are formed by stacking integrated circuit (IC) chips one above another. Unused input/output (I/O) locations on some of the chips can be used to connect other I/O locations, resulting in decreased impedance between the chips. Additional apparatus, systems, and methods are disclosed.

Abstract: A method for defining and producing a power grid structure (having stripe, rail, and via components) of an IC. The method reduces the number of vias in the power grid structure and the diagonal wiring blockage caused by the vias while still meeting design specifications. Other embodiments provide a method for locating vias in the power grid structure in such a way as to be especially beneficial to 45° or 135° diagonal wiring paths. The method includes processes of a power grid planner, power grid router, power grid verifier, and global signal router that are used iteratively to define and produce a power grid structure. Other embodiments of the invention provide for arrangements of vias in via arrays where diagonal wiring paths are facilitated near the edges of the via arrays. A bounding box enclosing these via arrays have an aspect ratio that is approximately equal to 1.

Abstract: Disclosed are a method, a system, and a computer program product for implementing interactive cross-domain package driven I/O planning and placement optimization of an electronic circuit design. In some embodiments, the method identifies an object on a first EDA tool session, determines a drop location for the first object based on a tentative location in the first EDA tool session, places the first object at the drop location, and adjusts the drop location via a second EDA tool session, performs placement or routing of a portion of the design. The method or the system further comprises placing a corresponding first object in the second EDA tool session, initiating the second EDA tool session object move in the first EDA tool session, determining whether a constraint is satisfied.

Abstract: Scheduling of parallel processing for regionally-constrained object placement selects between different balancing schemes. For a small number of movebounds, computations are assigned by balancing the placeable objects. For a small number of objects per movebound, computations are assigned by balancing the movebounds. If there are large numbers of movebounds and objects per movebound, both objects and movebounds are balanced amongst the processors. For object balancing, movebounds are assigned to a processor until an amortized number of objects for the processor exceeds a first limit above an ideal number, or the next movebound would raise the amortized number of objects above a second, greater limit. For object and movebound balancing, movebounds are sorted into descending order, then assigned in the descending order to host processors in successive rounds while reversing the processor order after each round. The invention provides a schedule in polynomial-time while retaining high quality of results.

Abstract: A computer system selects a signal conductor from an electronic circuit design layout and assigns a first potential to the selected signal conductor. Next, the computer system assigns a second potential to other signal conductors included in the electronic circuit design layout. The computer system then selects a metal fill from the electronic circuit design layout, which is void from carrying an electrical signal, and generates a zero charge equation for the selected metal fill. The zero charge equation establishes that a total charge residing on the selected metal fill is equal to zero. The computer system includes the zero charge equation in a system of equations, which includes grid point potential equations, and solves the system of equations. In turn, the computer system computes capacitance values for the signal conductors based upon the system of equation solutions, and simulates the electronic circuit design layout using the computed capacitance values.

Abstract: A computer system selects a signal conductor from an electronic circuit design layout and assigns a first potential to the selected signal conductor. Next, the computer system assigns a second potential to other signal conductors included in the electronic circuit design layout. The computer system then selects a metal fill from the electronic circuit design layout, which is void from carrying an electrical signal, and generates a zero charge equation for the selected metal fill. The zero charge equation establishes that a total charge residing on the selected metal fill is equal to zero. The computer system includes the zero charge equation in a system of equations, which includes grid point potential equations, and solves the system of equations. In turn, the computer system computes capacitance values for the signal conductors based upon the system of equation solutions, and simulates the electronic circuit design layout using the computed capacitance values.

Abstract: A circuit design process is presented that includes a block placement operation, followed by global routing based upon the initial placement of the blocks. Congestion data is generated from the global routing and, in an automated process, the blocks are placed again based upon the congestion data to reduce the routing congestion of the design. This can be used as part of a custom layout design process, for example.

Abstract: Methods and apparatuses are disclosed for generating a placed, routed, and optimized circuit design. Other embodiments are a circuit design and circuit created with the technology. The placed, routed, and optimized circuit design obeys relative positioning rules of a set of the circuit elements. Such relative positioning rules were created specifically for these circuit elements.

Abstract: A layout method of a semiconductor integrated circuit by using cell library data includes specifying a gate in a predetermined cell as a reference gate, and automatically arranging a plurality of cells by a computer such that a number of gates arranged in an area in a predetermined distance from the reference gate meets a preset gate data density condition.

Abstract: Computing the gradients of capacitances in an integrated circuit chip layout with respect to design and process parameters is described. Included is a shape processing engine in the form of a variational mapping engine and a capacitance calculation engine that includes a gradient calculation engine. The variational mapping engine translates physical parameter variations into variations on the edges of the elementary patterns to which the layout of the integrated circuit is decomposed. The gradient calculation engine computes capacitance gradients by combining information from two sources. The first source consists of pre-existing gradients in a capacitance lookup table. The second source consists of analytical expressions of capacitance correction factors.

Abstract: A 3-dimensional integrated circuit designing method includes forming a temporary layout region for an original integrated circuit on an XY plane, the plane being short in an X direction and long in a Y direction perpendicular to the X direction, dividing the temporary layout region into 2N (N is an integral number of not smaller than 2) or more subregions in the Y direction, configuring one block for every successive N subregions to prepare a plurality of blocks, and forming N layers of layout by alternately folding each of the blocks in the Y direction in units of one subregion to selectively set a kN-th (k is an integral number not less than 1) subregion and (kN+1)th subregion of each block to one of an uppermost layer and lowermost layer.

Abstract: A method for generating a standard cell layout pattern for standard cell placement in an integrated circuit uses a congestion map. First, congestion zones are identified in a congestion map generated by an Electronic Design Automation (EDA) application. Next, routing tracks data corresponding to bounding boxes belonging to the congestion zones are used to calculate values of average vertical and horizontal congestion. Subsequently, a value of modified standard cell density is calculated based on the values of average vertical and horizontal congestion, and an unmodified standard cell density. The dimensions of a layout pattern unit are calculated using the value of the modified standard cell density and the width of standard cells. Various layout pattern units then are placed adjacent to one another to form a standard cell layout pattern.

Abstract: Spare cells are placed in an IC design by assigning different spare utilization rates to logic cones, applying the rates to corresponding spare cell regions surrounding cells in the cones, identifying any overlap of regions from different logic cones, and inserting a spare cell at the overlapping region having the highest spare utilization rate. The best location for the spare cell is computed using a hypergraph wherein the cells are edges and the regions are nodes. Any node that is dominated by another node is removed and its edge is extended to the dominating node. The spare cell is inserted in the region having the most edges (the edges can be weighted). The process is repeated iteratively, updating the hypergraph by removing nodes connected to spare cell location, and inserting the next spare cell at a region corresponding to the node which then has the greatest number of connected edges.

Abstract: A method for laying out process dummy cells in relationship to inside memory cells of a memory array includes (a) calculating an initial process performance parameter for the memory array; (b) changing dummy cell layout configuration for a layer electrically connected to inside cells; (c) applying lithographic simulation and yield model for both the inside memory cells and the changed layout configuration process dummy cells; and (d) repeating steps (b) and (c) until yield is maximized. Checks may be performed to ensure that there is enough room to make the change and that there is no significant adverse effect to neighboring circuits. The process performance parameter may be yield or a process window for the inside memory cells.

Abstract: A mixed-height cell library for designing integrated circuits is provided. The mixed-height cell library includes a first plurality of cells having a first track height and a second plurality of cells having a second track height that are configured to be coupled to the first plurality of cells at respective power and ground rail lines. A method for mixed-height cell placement and optimization is also provided. The method comprises abutting cells of different track heights to form a plurality of rows of cells by coupling power and ground rails of the cells at a secondary layer that is different from a primary layer that includes active material and determining whether re-ordering cells within rows allows for further compaction of adjacent rows. The method further comprises re-ordering cells within rows so to allow for further compaction of adjacent rows. The method also includes the steps of splitting rows vertically to minimize the distance between the split rows.

Abstract: With a conventional method for designing cell layout, it is necessary to give relative positional information in advance to all cells to be arranged. Furthermore, the conventional method is troublesome because it is necessary to correct relative positional information of cells after confirming a result of temporary layout. Therefore, it takes time to obtain a layout result. To avoid these problems, cells of a specific type specified from outside, or cells satisfying specific conditions, are extracted and arranged first or limited to a layout position by specifying a layout position, then arranging the remaining cells using a general layout algorithm.

Abstract: A computer-implemented method of globally placing a circuit design on a programmable integrated circuit (IC) includes dividing, by a placement system, the programmable IC into a grid comprising a plurality of cells, assigning each component of a selected component type of the circuit design to one of a plurality of control set groups according to a control set of the component, and calculating a force including a control set force that depends upon overlap of control sets within the plurality of cells. The method further can include applying the force to at least one selected component of the circuit design and assigning components of the circuit design to locations on the programmable IC by solving a set of linear equations that depend upon application of the force to the at least one selected component to create a global placement. The circuit design including the global placement can be output.

Abstract: An FEM analysis system is provided which is capable of analyzing with high accuracy and within a short time in a drop shock analysis of electronic devices in which a very small mesh size is incorporated. Processing to be performed by an optimal solution selecting and analyzing section includes a step of checking whether an analysis to be performed is a shock analysis, a step of searching for a minimum mesh size when the analysis to be performed is judged to be a shock analysis, a step of creating a simplified analysis model using the minimum mesh size, a step of performing a preliminary analysis on a simplified model by an implicit method and explicit method, and a step of selecting either of the implicit method or explicit method as an optimal analysis method by comparing results from preliminary analysis, results from these analyses and experiments or exact solution.

Abstract: Embodiments of the invention provide an integrated circuit (IC) having reduced through silicon via (TSV)-induced stresses and related IC design structures and methods. In one embodiment, the invention includes a method of designing an integrated circuit (IC) having reduced substrate stress, the method including: placing in an IC design file a plurality of through silicon via (TSV) placeholder cells, each placeholder cell having an undefined TSV orientation; replacing a first portion of the plurality of TSV placeholder cells with a first group of TSV cells having a first orientation; and replacing a second portion of the plurality of TSV placeholder cells with a second group of TSV cells having a second orientation substantially perpendicular to the first orientation, wherein TSV cells having the first orientation and TSV cells having the second orientation are interspersed to reduce a TSV-induced stress in an IC substrate.

Abstract: A memory circuit includes a plurality of bit line structures (each including a true and a complementary bit line), a plurality of word line structures intersecting the plurality of bit line structures to form a plurality of cell locations; and a plurality of cells located at the plurality of cell locations. Each of the cells includes a logical storage element, a first access transistor selectively coupling a given one of the true bit lines to the logical storage element, and a second access transistor selectively coupling a corresponding given one of the complementary bit lines to the logical storage element. One or both of the first and second access transistors are configured with asymmetric current characteristics to enable independent enhancement of READ and WRITE margins. Also included within the 6-T scope are one or more design structures embodied in a machine readable medium, comprising circuits as set forth herein.

Abstract: This invention comprises a layout method to effectively protect logic circuits against soft errors (non-destructive errors) and circuit cells, with layout, which are protected against soft errors. In particular, the method protects against cases where multiple nodes in circuit are affected by a single event. These events lead to multiple errors in the circuit, and while several methods exist to deal with single node errors, multiple node errors are very hard to deal with using any currently existing protection methods. The method is particularly useful for CMOS based logic circuits in modern technologies (.ltoreq.90 nm), where the occurrence of multiple node pulses becomes high (due to the high integration level). It uses a unique layout configuration, which makes the circuits protected against single event generated soft-errors.

Abstract: Systems, devices, and methods for designing and/or manufacturing transparent conductors. A system is operable to evaluate optical and electrical manufacturing criteria for a transparent conductor. The system includes a database including stored reference transparent conductor data, and a controller subsystem configured to compare input acceptance manufacturing criteria for a transparent conductor to stored reference transparent conductor data.

Abstract: First and second virtual grates are defined as respective sets of parallel virtual lines extending across a layout area in first and second perpendicular directions, respectively. The virtual lines of the first and second virtual grates correspond to placement locations for layout features in lower and higher chip levels, respectively. Each intersection point between virtual lines of the first and second virtual grates is a gridpoint within a vertical connection placement grid. Vertical connection structures are placed at a number of gridpoints within the vertical connection placement grid so as to provide electrical connectivity between layout features in the lower and higher chip levels. The vertical connection structures are placed so as to minimize a number of different spacing sizes between neighboring vertical connection structures across the vertical connection placement grid, while simultaneously minimizing to an extent possible layout area size.