Abstract: A multilayer wiring in a semiconductor device includes a first lower wiring formed in a first insulating layer, a via which is formed in a second insulating layer over the first insulating layer and which is connected to the first lower wiring, and an upper wiring connected to the via. The upper wiring has an outer edge at which a nick portion is formed beside a portion of the upper wiring to which the via is connected. The formation of the nick portion at the outer edge of the upper wiring prevents the via from enlarging.

Abstract: A method, computer-readable medium and apparatus for creating a platform-specific logic design from an input design are disclosed. For example, a method includes receiving an input design and an identification of a target device. The method next determines an unconnected external interface of the input design and detects an unconnected external interface of the target device. The method then generates an updated design from the input design. The updated design includes the input design and further includes a connection between the unconnected external interface of the input design and the unconnected external interface of the target device.

Abstract: A method is for designing an accelerator for digital signal processing including defining a software programmable fully pre-laid out macro by pre-laying out with a fixed topology a control logic of the DSP accelerator to obtain a fully pre-laid out control logic. The method further includes defining a hardware programmable partially pre-laid out macro by customizing a configurable layout area, thereby mapping a computational logic based on computation kernels related to an application of the DSP accelerator. A partially pre-laid out computational logic is therefore obtained.

Abstract: The subject system and method are generally directed to the user-friendly insertion of at least one device, and optionally chains of devices, into at least one pre-existing chain of interconnected devices within a graphical representation of a circuit design such as a circuit layout, circuit mask, or a schematic. The system and method provide for discerning the intended insertion points and performing remedial transformations of the devices within the chains to ensure compliance with both structural and operational requirements of the circuit design.

Abstract: A system and method for balancing the capacitive charge on touch sensor electrodes so that every two adjacent routes have the same capacitance as any other adjacent two routes, wherein routing electrodes are spaced further and further apart, or graduated, as they get longer, to thereby balance the capacitance on the touch sensor electrodes without having to add or subtract an offset from each touch sensor electrode.

Abstract: The present disclosure relates to a method for routing in an electronic circuit design. The method may include assigning a plurality of rats interconnecting one or more terminals associated with a layout of the electronic circuit design to a bundle. The method may also include generating an independent breakout of the plurality of rats from a source end and a target end of the bundle. The method may further include sequencing the plurality of rats within the assigned bundle to generate a defined sequence of rats within the assigned bundle based upon, at least in part, the source end of the bundle. The method may additionally include generating a costed sequence breakout at the target end of the bundle, based upon, at least in part, a costed sequence analysis. The method may also include determining if the costed sequence breakout meets at least one criteria associated with the electronic design.

Abstract: Various embodiments identify a design including circuit features and identify an operation that produces an aggressor for victim(s). The operation on the aggressor and the set of victims are implemented using local maximally spanning spacetile(s) while satisfying some design requirements. Where the set of victims includes interconnects, the design may allow no bend in some interconnects. One or more spacetiles are used to perform the operation on the aggressor and implement the interconnects while introducing no bends in the interconnects by using local maximally spanning spacetile(s). Some implementation may perform block modeling for the aggressor to perform the operation on the aggressor and implement a set of victims while preserving the relative order of the interconnects by using the block modeling for the aggressor.

Abstract: A method comprising placing elements in a layout, performing clock tree synthesis, and performing routing. The method further comprising, in parallel with one of the clock tree synthesis or the routing, performing a footprint based optimization, substituting a footprint equivalent element in a path based on a timing slack of the path.

Abstract: The present disclosure relates to a method for visualizing an electronic circuit design. The method may include receiving the electronic circuit design, wherein the electronic circuit design includes at least one timing constraint. The method may also include identifying the at least one timing constraint and displaying, at a graphical user interface associated with the one or more computing devices, the at least one timing constraint and a physical routing associated with the electronic circuit design. The method may further include receiving a user input associated with the electronic circuit design and dynamically updating a graphical representation of the at least one timing constraint, in response to the received user input.

Abstract: In a semiconductor device design method performed by at least one processor, location data of at least one electrical component in a layout of a semiconductor device is extracted by the at least one processor. Voltage data associated with the at least one electrical component and based on a simulation of an operation of the semiconductor device is extracted by the at least one processor. Based on the extracted location data, the extracted voltage data is incorporated, by the at least one processor, in the layout to generate a modified layout of the semiconductor device.

Abstract: A method is provided for designing an IC chip. The method includes receiving data from a pre-layout design process for the IC chip, routing a plurality of interconnecting wires to connect various devices of the IC chip, and extracting various circuit parameters. The method also includes simulating the IC chip using the extracted various circuit parameters to detect logic or timing error in the IC chip. The extracting the various circuit parameters includes establishing a statistical interconnect technology profile (ITP) file containing at least interconnect parasitic parameters based on correlations of interconnect layer geometric parameter variations.

Abstract: A receiving unit receives specification of two parts to be connected by wirings and the number of wirings connecting the two parts. A generating unit generates a schematic route connecting the two parts on a substrate with a width in accordance with the number of wirings received by the receiving unit. A derivation unit derives the number of arrangeable wirings by checking interference whether the schematic route generated by the generating unit is capable of being arranged on the substrate.

Abstract: A method of layout of pattern includes the following processes. A graphic data of a first wiring in a first area of a semiconductor wafer is extracted. The first area is a semiconductor chip forming area. The first area is surrounded by a scribed area of the semiconductor wafer. The first area includes a second area. The second area is bounded with the scribed area. The second area has a second distance from a boundary between the semiconductor chip forming area and the scribed area to an boundary between the first area and the second area. A first dummy pattern in the first area is laid out. The first dummy pattern has at least a first distance from the first wiring. A second dummy pattern in the second area is laid out. The second dummy pattern has at least the first distance from the first wiring. The second dummy pattern has at least a third distance from the first dummy pattern.

Abstract: A process and apparatus are provided for automated pattern-based semiconductor design layout correction. Embodiments include: determining a portion of a layout of an IC design, the portion comprising a first pattern of a plurality of routes connecting a plurality of design connections; determining one or more sets of the plurality of design connections based on the plurality of routes; and determining, by a processor, a second pattern of a plurality of routes connecting the plurality of design connections within the portion based on the one or more sets.

Abstract: A method for performing routing for a logic design includes utilizing signal transition time as a criteria for selecting resources to provide interconnection between the components of the logic design.

Abstract: In various embodiments, each possible different instance of a repeated block can be concurrently modified for chip routing. Repeated blocks can be implemented where all instances of a repeated block are identical or substantially identical. Pin placement may be determined based on analysis of the I/O for all instances. The pin placement may be generated to be identical or substantially similar for all instances. Flyover blockages can be designed into repeated blocks to enable the global router to wire through the repeated block. Buffers and associated pins can be inserted into repeated block within the flyover space where the global router wires to the needed buffer through area pins.

Abstract: Embodiments described herein provide approaches for improving a standard cell connection for circuit routing. Specifically, provided is an IC device having a plurality of cells, a first metal layer (M1) pin coupled to a contact bar extending from a first cell of the plurality of cells, and a second metal layer (M2) wire coupled to the contact bar, wherein the contact bar extends across at least one power rail. By extending the contact bar into an open area between the plurality of cells to couple the M1 pin and the M2 wire, routing efficiency and chip scaling are improved.

Abstract: A set of nets in an integrated circuit design, having a timing margin and traverse routing tiles, are identified. The set of nets are assigned a utilization metric based on the traversed routing tiles. A set of sparse nets are determined from the set of nets, based on the utilization metric of each net in the set of sparse nets. One or more target nets are selected from the set of sparse nets, based on the timing margin of the target nets. The target nets may be modified.

Abstract: A design methodology for routing for an integrated circuit is disclosed. The method includes placement of cells having double diffusion breaks, which create an extended intercell region. Metal layer prohibit zones are defined to prohibit any M1 structures in the prohibit zones. Metal layer allow zones are placed adjacent to outer metal lines, and jogs are formed in the metal layer allow zones. Vias and viabars may then be applied on the jogs.

Abstract: An integrated circuit chip is disclosed having a semiconductor substrate and a plurality of conduction layers (metalz, metalz+1), disposed on the semiconductor substrate and separated by dielectric layers, for distribution of power and electrical signals on the chip. The integrated circuit chip comprises a power-supply distribution network (200) which comprises, in a first one (metalz) of the conduction layers, a first mesh structure (210) of electrically conductive material for distribution of a first electrical potential (POWER) of the power supply. The power-supply distribution network also comprises, in a second one (metalz+1) of the conduction layers, different from the first one of the conduction layers, a second mesh structure (220) of electrically conductive material for distribution of a second electrical potential (GROUND) of the power supply.

Abstract: Methods and apparatuses for an Integrated Circuit (IC) with a shielding of wires. In at least one embodiment, an integrated Circuit (IC) device comprises a first plurality of signal wires disposed within a substrate a shielding mesh disposed on the substrate. In at least one embodiment, the shielding mesh comprises a first plurality of connected wires for a first reference voltage and a second plurality of connected wires for a second reference voltage. Wherein at least a first portion of each of the first plurality of the signal wires is shielded between one of the first plurality of connected wires and one of the second plurality of connected wires from adjacent signal wires and a second portion of the first plurality of signal wires are adjacent to each other in a region defined by the first and second pluralities of connected wires.

Abstract: A method of evaluating a layout cell for electrostatic discharge (ESD) protection can include identifying at least one feature of the layout cell for use in implementing an integrated circuit (IC) and comparing the at least one feature of the layout cell to an ESD requirement for the IC. The method can include indicating whether the feature of the layout cell complies with the ESD requirement.

Abstract: Disclosed herein are rouging methods and devices for a flip-chip package. The flip chip includes several outer pads and several inner pads. The routing method includes: setting an outer sequence based on the arrangement order of the outer pads; setting several inner sequences based on the connection relationships between inner pads and the outer pads; calculating the longest common subsequence of each inner sequence and the outer sequence, defining the connection relationships between the inner pads and the outer pads corresponding to the longest common subsequence as direct connections, and defining the connection relationships between the inner pads and the outer pads that do not correspond to the longest common subsequence as detour connections; establishing the routing scheme of the flip chip based on the connection relationships between the inner pads and the outer pads.

Abstract: A method for designing and making an integrated circuit is described. That method utilizes statistical models of wire segments to accurately estimate the expected length of minimum-length, orthogonal wire segments within a block. From these estimates, the method accurately estimates an ratio between the horizontal and vertical routing resources required, termed the “H/V Demand Ratio.” From the H/V Demand Ratio, an accurate estimate of the height and width of the block may be determined. Thereafter, placement and routing may be performed quickly and accurately, thereby allowing the block to be designed and manufactured quickly and cost effectively. A method for designing an integrated circuit with efficient metal-1 resource utilization is also described.

Abstract: A programmable device system includes one or more network-on-chip (NoC) die layers vertically connected to one or more programmable chip dice layers. The NoC die layer includes interconnects, a bus or non-blocking switches, and optionally memory blocks and direct memory access engines. The NoC die layer improves on-chip communications by providing fast and direct interconnection circuitry between various parts of the programmable chip die.

Abstract: A computer-readable software product is provided for executing a method of determining the location of a plurality of power rail vias in a semiconductor device. The semiconductor device includes an active region and a power rail. Locations of a first via and a second via are assigned along the power rail. The spacing between the location of the first via and the location of the second via is a minimum spacing allowable. The spacing between the location of the second via and the locations of structures in the active region which may electrically interfere with the second via is determined. The location of the second via is changed in response to the spacing between the location of the second via and the location of one of the structures in the active region being less than a predetermined distance.

Abstract: High performance clock distributions and similar wiring networks require improvements in reliability and performance. This is especially true when hierarchical wiring with different metal thicknesses is employed and when a smaller number of large, higher-power buffers are used to reduce timing variability. Routing of critical nets improves robustness, reliability, and resistance while minimizing track and power usage. The method further optimizes the use of multiple physical pins on buffers to achieve desired electrical criteria. This involves optimal selection of additional routing beyond what is needed to satisfy simple connectivity. The routing involves an iterative process to select and evaluate additional possible routes on multiple layers. Each iteration involves extraction and simulation or estimation, and additional routes are added until the desired electrical criteria are met.

Abstract: A circuit board design aid is achieved by generating a shield pattern for a wiring pattern including a pattern element in a circuit board by increasing a width of a geometry of the pattern element by an amount corresponding to a shield pattern spacing set as a preset pattern generation condition. A prohibition region is generated based on a geometry of an element for which a clearance check is to be performed located around the wiring pattern and a clearance condition between the element for performing a clearance check and the wiring pattern. Then, the shield pattern is generated by excluding the geometry of the prohibition region from the geometry of the basic shield pattern element.

Abstract: A computer-implemented method of estimating signal congestion in routing resources of a programmable logic device (PLD), wherein the routing resources include configurable interface blocks (CIBs) and wires of different types supported by the CIBs. The method includes identifying, from a representation of a PLD stored within a computer system, components of the PLD to be connected in a configuration of the PLD. A CIB associated with an identified PLD component is then selected. A wire type supported by the selected CIB is also selected. The number of wires of the selected type needed at the selected CIB to implement the PLD configuration and the number of wires of the selected type provided by the CIB are calculated. Signal congestion at the selected CIB is estimated from at least the needed number of wires and the provided number of wires.

Abstract: A design supporting device includes a calculator that calculates an estimated value of a width, shifted by etching, of a wiring arranged in each of partial regions formed by dividing a layout region of a circuit to be designed on basis of a density of the wiring of the partial region, a length of a circumference of the wiring and a distance between the partial region and another partial region affecting the partial region, and uses the calculated estimated value to recalculate the density of the wiring of the partial regions, and a changer that changes the density of the wiring on basis of relationships between a recalculated density of the wiring and a preset threshold for the density.

Abstract: A method for designing a system on a target device includes entering the system. The system is synthesized. The system is mapped. The system is placed on the target device. The system is routed. Physical synthesis is performed on the system immediately after more than one of the entering, synthesizing, mapping, placing and routing procedures.

Abstract: A method for designing a system on a target device includes identifying candidate portions in the system to preserve based on similarities between the system and another system. Preservation criteria are applied on the candidate portions in the system to preserve to identify portions of the system to preserve. Design results from the another system are reused for portions in the system that are preserved.

Abstract: Among other things, one or more techniques and/or systems for performing design layout are provided. In an example, a design layout corresponds to a layout of a standard cell whose connectivity is described by a netlist. For example, the netlist specifies net types for respective vias of the standard cell. One or more connectivity rings are formed within the design layout to provide connectivity for one or more vias of the design layout. For example, a first connectivity ring is generated, such as from mandrel, to connect one or more ring one vias. A second connectivity ring is generated, such as from passive pattern, to connect one or more ring two vias. One or more cuts are generated within the design layout to isolate vias having different net types. In this way, the design layout is self-aligned double patterning (SADP) compliant.

Abstract: A rectangular interlevel connector array (RICA) is defined in a semiconductor chip. To define the RICA, a virtual grid for interlevel connector placement is defined to include a first set of parallel virtual lines that extend across the layout in a first direction, and a second set of parallel virtual lines that extend across the layout in a second direction perpendicular to the first direction. A first plurality of interlevel connector structures are placed at respective gridpoints in the virtual grid to form a first RICA. The first plurality of interlevel connector structures of the first RICA are placed to collaboratively connect a first conductor channel in a first chip level with a second conductor channel in a second chip level. A second RICA can be interleaved with the first RICA to collaboratively connect third and fourth conductor channels that are respectively interleaved with the first and second conductor channels.

Abstract: A method and apparatus for insertion of a via improving a manufacturability of a resulting device while ensuring compliance with DRC rules are disclosed. Embodiments include: determining a layer of a substrate of an IC design having a first via and a plurality of routes, the plurality of routes extending horizontally on the substrate and placed on one of a plurality of equally spaced vertical positions; comparing a region of the layer extending vertically between a first set of the plurality of routes and extending horizontally between a second set of the plurality of the routes with one or more threshold values, the region being adjacent to the first via and being separated from the plurality of routes; and inserting a second via based on the comparison.

Abstract: An assignment method of terminals of a semiconductor package executed by an assignment supporting apparatus includes: deciding a maximum allowable distance to be a constraint condition regarding a relative distance between each of the pads and a terminal to be assigned to the pad, and extracting one or a plurality of assigned terminal candidates for each of the pads so that the relative distance between each of the pads and a terminal selected for the pad falls within a range of the maximum allowable distance; and deciding one of the terminals as a assigned terminal based on the assigned terminal candidates and assigning the one of the terminals to one of the pads. The process is a process to assign one of the terminals with priority to a pad having a smallest number of assigned terminal candidates in a not-assigned condition based on the assigned terminal candidates.

Abstract: An improved multi-layered ceramic package includes a plurality of signal planes, each having one or more signal lines; a plurality of vias, each providing one of a voltage (Vdd) power connection or a ground (Gnd) connection; and at least one reference mesh plane adjacent to one or more signal planes. The reference mesh plane includes spaced mesh lines that are separated by spaces that alternate in a narrow-wide or wide-narrow pattern. A multi-layered ceramic package, using the mesh plane with alternating spaces, generates significantly lower far-end (FE) noise in the ceramic package than a conventional mesh plane with constant spaces. The noise is further reduced by placing shield lines on opposite sides of signal lines in the signal plane. A method, computer system, and program code that generate the design for the multi-layered ceramic package are also disclosed.

Abstract: A method and apparatus for insertion of a via improving a manufacturability of a resulting device while ensuring compliance with DRC rules are disclosed. Embodiments include: determining a layer of a substrate of an IC design having a first via and a plurality of routes, the plurality of routes extending horizontally on the substrate and placed on one of a plurality of equally spaced vertical positions; comparing a region of the layer extending vertically between a first set of the plurality of routes and extending horizontally between a second set of the plurality of the routes with one or more threshold values, the region being adjacent to the first via and being separated from the plurality of routes; and inserting a second via based on the comparison.

Abstract: A Read Only Memory (ROM) bitline cell apparatus and programming method therefore. The programming methodology ensures a ROM structure having open state and/or breaks in the diffusion and/or dummy wordline rows to provide bitline load balancing. The ROM bitline cell apparatus and programming method exhibits improved load balancing for any combination of 1's or all 0's on the bitline. The programming methodology identifies groups of consecutive ‘1’s on the bitline and instead of connecting the ‘1’ devices between BL/BL or GND/GND, those ‘1’ devices can be connected between BL/OPEN, OPEN/BL, GND/OPEN, OPEN/GND or OPEN/OPEN. With little or no variation in bitline loading, timing can be optimized for that single case of bitline loading.

Abstract: Techniques for computer-assisted routing of an electronic design for a programmable target device are described herein. In an example embodiment, a computer system displays a representation of the programmable target device in a user interface. The computer system receives first user input that indicates a first component in the electronic design for the programmable target device. The computer system determines one or more second components of the electronic design that can be routed to the first component and displays one or more visual objects that indicate the one or more second components. The computer system then receives second user input that selects a particular component from the one or more second components and stores interconnect data indicating that the first component is routed to the particular component.

Abstract: A semiconductor device includes a first semiconductor chip including a plurality of driver circuits and an output switching circuit coupled to the plurality of driver circuits. The device also includes a second semiconductor chip and a plurality of through silicon vias provided on at least one of the first and second semiconductor chips. The output switching circuit is coupled between the plurality of driver circuits and the plurality of the through silicon vias, and outputs each of signals from the plurality of driver circuits to corresponding one of the plurality of through silicon vias.

Abstract: An electronic design automation (EDA) tool alters a user's netlist to provide timing success for distribution of asynchronous signals. Distribution networks are used with the addition of pipeline registers before and/or after the distribution buffer. Or, a tree of pipeline registers is inserted between the asynchronous source and the destination registers. Or, any number of distribution networks are stitched together and pipeline stages may be inserted before and/or after each distribution buffer. Or, beneficial skew is utilized by introducing a delay component that skews a clock signal. The skewed clock signal drives a pipeline register that is inserted before a distribution buffer in order to improve timing margin. Any of various compilation techniques may be used within the EDA tool to solve the problem of distributing high-speed, high-fanout asynchronous signals.

Abstract: A method is provided for optimising cell variant selection within a design process for an integrated circuit device. The method comprises performing cell placement and signal routing for an integrated circuit being designed using default cell layout information for cell variants of at least one cell type. The method further comprises performing cell variant optimization comprising identifying at least one cell of the at least one cell type to be substituted and substituting a default cell variant of the at least one identified cell with an alternative variant of the at least one identified cell. The method further comprises, during cell optimization, configuring a pin interconnect modification for mapping at least one pin location of the alternative variant of the at least one identified cell to at least one pin contact for the default cell layout.

Abstract: High density circuit modules are formed by stacking integrated circuit (IC) chips one above another. Unused input/output (I/O) locations on some of the chips can be used to connect other I/O locations, resulting in decreased impedance between the chips. Additional apparatus, systems, and methods are disclosed.

Abstract: Layout information indicating locations of at least components and conductive layers in a printed circuit board, and layouts of conductive wiring patterns on the respective conductive layers and vias which electrically connect between the conductive layers is obtained from a memory. With reference to the layout information, path information indicating a path of one signal line is generated. With reference to the layout information and path information, a divide portion where a path of a return current corresponding to a signal current of the signal line is divided are detected. With reference to the layout information and path information, information indicating a detour path of the return current in a neighborhood of the divide portion is generated.

Abstract: Techniques for compacting routing in lower level blocks to free routing resources for upper level blocks are disclosed. In some embodiments, a specification of a hierarchical integrated circuit design comprising a lower level block and an upper level block is obtained. The specification includes an initial routing plan for the lower level block. Subsequently, a compacted routing plan for the lower level block using constrained routing resources comprising fewer routing tracks than the initial routing plan and resulting in at least one unused track as well as a routing plan for the upper level block using the at least one unused track are generated.

Abstract: A method of designing a circuit is described. In an embodiment, a physical design implementation for the circuit is created using a plurality of entities. These entities are named “genomes”. Each entity includes a portion of a functional description of the circuit that has been synthesized into a gate-level implementation. An entity is selected to facilitate the physical design implementation meeting a plurality of design constraints. Several steps (e.g., beginning with selection of an entity) of this method are repeated several times to meet the design constraints. As a consequence, the physical design implementation provides more accurate information for use in a final physical design implementation. Moreover, the physical design implementation can be created faster than prior techniques while still allowing a global view of the physical design implementation in meeting design constraints.

Abstract: A method, system and computer program product are provided for implementing an enhanced Z-directional macro port assignment or three-dimensional port creation for random logic macros of heterogeneous hierarchical integrated circuit chips. An initial port placement is provided on a layer for a macro. The initial port placement is expanded to provide a three-dimensional port shape including a plurality of metal layers along a z-axis. Wire routing of each of the macro level and a chip top level is defined within the expanded three-dimensional port shape. Each unnecessary metal layer of the expanded three-dimensional port shape is removed, providing a final three-dimensional port shape.

Abstract: Method of placing and routing circuit components including: dividing a layout area of an integrated circuit (IC) design into an array of tiles, each tile having a plurality of edges that are common to adjoining tiles; placing of circuit components into the layout area of the IC design such that each tile including a plurality of circuit components, the placing of circuit components being performed for primarily routability without resort to a timing model, routability being measured by congestion of wiring nets at the tile edges; performing a virtual timing operation of the IC design with a virtual timing model assuming ideal buffering is done to test the placement of circuit components; performing a wire synthesis operation of the IC design for layer assignment, buffering and timing optimization while minimizing degradation in routability; and performing a plurality of timing optimizations of the IC design while minimizing degradation in routability.

Abstract: A system and method for automatically modifying a first layout of a circuit. The first layout may describe a plurality of layers used in a fabrication process to manufacture the circuit. When performed, the fabrication process may result in a vertical electrical connection between two of the layers. However, the vertical electrical connection may not be directly specified by the first layout. The system and method may operate to apply a set of rules to the first layout to automatically generate a modified layout directly specifying a vertical electrical connection between the two layers. The set of rules may be based on knowledge of the fabrication process, and may be designed to modify the geometry of the first layout to more closely model the real geometry of the circuit that will result from the fabrication process. The modified layout may enable an electromagnetic (EM) simulation of the circuit to be accurately performed.