Abstract: An object of the present invention is to provide wiring board design system and wiring board design method to determine a component and a wiring pattern in real-time when designing a wiring on a circuit board. The wiring board design system provides a cloud service for a terminal which is used by users via a network. When to arrange components on the circuit board, while pushing out automatically wirings which are overlapped with the components on the arranging position, the wiring board design system secures a space on that can arrange the component. The wiring processing is performed automatically and the fine adjustment such as rotation, movement of arranged components is performed automatically if necessary. The processing for equalization is performed so as to be the equal wiring density on the circuit board.

Abstract: In congestion aware point-to-point routing using a random point in an integrated circuit (IC) design, the random point is selected in a bounding area defined in a layout of the IC design. A set of pattern routes is constructed between a source pin and a sink pin in the bounding area, a pattern route in the set of pattern routes passing through the random point. A set of congestion cost corresponding to the set of pattern routes is computed. A congestion cost in the set of congestion costs corresponds to a pattern route in the set of pattern routes. A preferred pattern route is selected from the set of pattern routes, the preferred pattern route having the smallest congestion cost in the set of congestion costs. The preferred pattern route is output as a point-to-point route between the source pin and the sink pin.

Abstract: A method of designing arrangement of through silicon vias (TSVs) in a stacked semiconductor device is provided The method includes: determining a plurality of TSV candidate grids representing positions, into which the TSVs are insertable, in each of a plurality of semiconductor dies stacked mutually and included in a stacked semiconductor device; creating a plurality of path graphs representing linkable signal paths for a plurality of signals transmitted through the stacked semiconductor device, respectively, based on the TSV candidate grids; determining initial TSV insertion positions corresponding to shortest signal paths for the signals based on the path graphs; and determining final TSV insertion positions by verifying the initial TSV insertion positions so that a plurality of signal networks corresponding to the shortest signal paths for the signals have routability.

Abstract: A method of designing a 3D Integrated Circuit, the method including: performing placement using a 2D placer, performing placement for at least a first strata and a second strata, and then performing routing and completing the physical design of said 3D Integrated Circuit.

Abstract: A multiple-patterned semiconductor device is provided. The semiconductor device includes one or more layers with signal tracks defined by masks and a structure for transferring a signal between signal tracks and repowering the signal.

Abstract: A method for routing a design may comprise receiving a design for implementing in a target device, wherein the design includes an input/output (I/O) signal of a functional block, and wherein the functional block is assigned to a physical component of the target device; based on the design and on a routing resource graph representing the target device, calculating a route including the physical component and a physical pin of the target device; and assigning the physical pin of the target device to the I/O signal based on the calculated route.

Abstract: An apparatus includes a memory device that includes instructions for analyzing RTL code to determine congestion of a logic design without completing a synthesis phase of a chip design process. The instructions can include receiving RTL code, and identifying a statement in the RTL code. The instructions can include determining that the statement in the RTL code corresponds to a structured device group in a component library, wherein the structured device group includes logic devices configured to occupy an area in a predefined spatial arrangement and with predetermined connectivity between the logic devices. The instructions can include determining congestion associated with the structured device group by performing operations including determining a congestion figure. The instructions can also include providing, based on the congestion figure, an indication of the congestion associated with the structured device group.

Abstract: Systems and techniques are described for automatically generating a set of non-default routing rules for routing a net in a clock tree based on one or more metrics. The metrics can include a congestion metric, a latency metric, a crosstalk metric, an electromigration metric, and a clock tree level. Next, the embodiments can generate the set of non-default routing rules for routing the net based on one or more metrics. A routing rule can specify how wide the wires are supposed to be and how far apart adjacent wires are to be placed. A non-default routing rule can specify a wire width that is different from the default width and/or specify a spacing (i.e., the distance between two wires) that is different from the default spacing.

Abstract: A method for determining an interface timing of an integrated circuit includes: reading a netlist file and a timing constraint file of the integrated circuit, and determining a first interface port of the netlist file according to the netlist file and the timing constraint file; determining a first transmission path and a load on the first transmission path between the first interface port and a specific circuit element in the netlist file; generating an interface circuit file according to the first transmission path and the load on the first transmission path; and calculating a first signal transmission time of the first transmission path out according to the interface circuit file.

Abstract: A method and system for reducing power consumption of an integrated circuit with an EDA tool by analyzing and modifying a layout design having a plurality of nets across multiple metal layers. The method includes identifying long nets in the layout design, determining an interconnect capacitance of each of the long nets, determining a net level switching activity of each of the long nets, generating a high power impact list using the interconnect capacitance and the switching activity of each of the long nets, modifying a metal spacing of the long nets listed in the high power impact list.

Abstract: Techniques for reducing post-routing delay variance are described herein. In an example embodiment, an initial netlist includes multiple instances that represent digital components of an electronic design. An base signature is assigned to each instance in the initial netlist, where the base signature is based on two or more design or connectivity attributes of the instance. The base signatures are then used to generate an initial instance ordering of the instances in the initial netlist. A subsequent netlist, different from the initial netlist but representing the same electronic design, is received. Base signatures are assigned to the instances on the subsequent netlist and a subsequent instance ordering is generated. The subsequent instance ordering preserves the same order as the initial instance ordering for those instances that are included in both the initial netlist and the subsequent netlist. In this manner, any later netlist-based processing (e.g.

Abstract: Techniques for optimizing application specific integrated circuit (ASIC) and other IC pin assignment corresponding to a high density interconnect (HDI) printed circuit board (PCB) layout are provided. Applying the techniques described herein, pin assignments may be systematically and strategically planned, for example, in an effort to reduce the PCB layer count and associated cost, increase signal integrity and speed, reduce the surface area used by an ASIC and its support circuitry, reduce plane perforations, and reduce via crosstalk when compared to conventional designs with an ASIC mounted on a multilayered PCB.

Abstract: A method of designing a circuit is described. In an embodiment, a physical design implementation for the circuit is created using a plurality of entities. These entities are named “genomes”. Each entity includes a portion of a functional description of the circuit that has been synthesized into a gate-level implementation. An entity is selected to facilitate the physical design implementation meeting a plurality of design constraints. Several steps (e.g., beginning with selection of an entity) of this method are repeated several times to meet the design constraints. As a consequence, the physical design implementation provides more accurate information for use in a final physical design implementation. Moreover, the physical design implementation can be created faster than prior techniques while still allowing a global view of the physical design implementation in meeting design constraints.

Abstract: A computer-implemented method for routing at least one conductor includes generating the at least one conductor within a bounded region on a planar surface in accordance with a template, and placing at least one slit in the conductor when the conductor overlaps a specified region of the bounded region in accordance with a specified pattern.

Abstract: One embodiment of the present invention provides a system that concurrently performs redundant via insertion and timing optimization during routing of an integrated circuit (IC) chip design. During operation, the system performs an initial routing on the IC chip design to obtain a routing solution, which includes a set of vias. The system then performs a redundant-via-insertion operation on the routing solution, wherein the redundant-via-insertion operation attempts to modify a via within the set of vias into a redundant via. Next, the system performs a timing optimization on the routing solution by iteratively: (1) performing a timing analysis on the routing solution; (2) performing a logic optimization on the routing solution; and (3) performing an incremental routing adjustment on the routing solution, wherein the incremental routing adjustment adjusts the redundant vias.

Abstract: A received layout identifies a plurality of circuit components to be included in an integrated circuit (IC) layer for double patterning the layer using two photomasks, the layout including a plurality of first patterns to be included in the first photomask and at least one second pattern to be included in the second photomask. A selected one of the first patterns has first and second endpoints, to be replaced by a replacement pattern connecting the first endpoint to a third endpoint. At least one respective keep-out region is provided adjacent to each respective remaining first pattern except for the selected first pattern. Data are generated representing the replacement pattern, such that no part of the replacement pattern is formed in any of the keep-out regions. Data representing the remaining first patterns and the replacement pattern are output.

Abstract: A layout of a standard cell is created by prioritizing routability characteristics of the standard cell layout. The routability characteristics are prioritized so that the characteristics that are more likely to enhance routing efficiency are emphasized in the cell layout. The prioritization of the routability characteristics can be indicated by a set of weights, with each weight in the set indicating the priority of a corresponding routability characteristic of the standard cell layout. The weights can be used to calculate a weighted sum of the routability characteristics of the standard cell, thereby providing a way to efficiently compare the routability of different standard cell layouts.

Abstract: A method for designing a semiconductor integrated circuit includes: determining, by a designing device, a first wiring over which a signal is propagated and a second wiring which is not used for a propagation of the signal among a plurality of wirings of a semiconductor integrated circuit; and determining, by the designing device, the second wiring to be used as a wiring for storing electrical charge for an electrical charge recycling of the first wiring using the most number of the first wiring in a range that satisfies a timing constraint based on an operation rate of the signal propagated over the first wiring and a delay time of the first wiring.

Abstract: A design method of a repeater chip is provided, the repeater chip designed by using the method can implement interconnection among nodes, and implement packet sequence receiving, classifying, storing, forwarding, sorting, and transmitting functions of the repeater chip, thereby implementing effective extension of a high-speed transmission link among the nodes, so as to reduce hardware design difficulties and design risks. The structure of the repeater chip is formed by: an interface detecting unit, a sequence storing unit, a sequence forwarding unit, a sequence determining unit, and a sequence sorting unit.

Abstract: A method includes generating one or more routes usable for implementing a conductive path of an integrated circuit. A corresponding cost function value for the one or more routes is calculated according to a first cost function, including adjusting the corresponding cost function value based on whether the corresponding route is at least partially assigned to be formed in a conductive layer by a first patterning process or a second patterning process. The integrated circuit has electrical devices and the conductive layer, and the conductive layer has a first set of conductive lines formed by the first patterning process and a second set of conductive lines formed by the second patterning process. The first set of conductive lines has a unit resistance less than that of the second set of conductive lines. The conductive path electrically connects two of the electrical devices of the integrated circuit.

Abstract: A method for checking the inter-chip connectivity of a three-dimensional (3D) integrated circuit (IC) generally comprises receiving a design file for each of a plurality of chips of the 3D IC and generating a plurality of inter-layer ports to be shared between at least two of the of chips based on the design files for each of the chips. A layout without the share ports for each of the chips based on the design files for each of the chips is generated and a layout versus schematic (LVS) check is conducted for each of the generated layouts by using the identified inter-layer ports.

Abstract: One embodiment relates to a method of achieving an circuit dimension which is greater than a size of an exposure field of an illumination tool. A first area of a first reticle field and a second area of a second reticle field are defined. An extension zone is created as a region outside the first area, and includes a first layout shape formed on a first design level. A corresponding forbidden zone is created for the second reticle field as a region inside the second area where no layout shape on the first design level is permitted. A second layout shape is formed on a second design level within the forbidden zone. The first and second areas are then abutted. Upon abutment of the first and second areas, the second layout shape overlaps the first layout shape to form a connection between circuitry of the first and second reticle fields.

Abstract: A method includes forming a connection between a first metal layer and a second metal layer. The second metal layer is over the first metal layer. A via location for a first via between the first metal layer and the second metal layer is identified. Additional locations for first additional vias are determined. The first additional vias are determined to be necessary for stress migration issues. Additional locations necessary for second additional vias are determined. The second additional vias are determined to be necessary for electromigration issues. The first via and the one of the group consisting of (i) the first additional vias and second additional vias (ii) the first additional vias plus a number of vias sufficient for electromigration issues taking into account that the first additional vias, after taking into account the stress migration issues, still have an effective via number greater than zero.

Abstract: A system and method is disclosed for functional verification of multi-die 3D ICs. The system and method include a reusable verification environment for testing each die in a stack of dies individually without having to simultaneously operate all of the dies in the stack. The system and method includes converting an input/output (“IO”) trace from a die verification test from a first format to a second format to improve performance.

Abstract: A technique generates small scale clock trees using a spine-based architecture (using spine routing) while also using clustered placement. Techniques are used to control clock sink cluster contents in order to minimize clock skew, minimize clock buffer count, and minimize use of routing resources. This approach also provides the user with ample structure and control to customize small efficient clock trees, and can also reduce clock power consumption.

Abstract: A method for the identification and implementation of a logic function includes determining logic gates connected to a control signal that is common among the logic gates of the identified logic function. Standard cells may be created and characterized in order to implement the identified logic function. Creating the standard cell includes aligning respective portions of the logic devices included in the logic gates that are coupled to the control signal. In addition, creating the standard cell may also include routing the control signal using a single layer conductive material uni-directionally to interconnect the logic devices.

Abstract: Multiple level spine routing is disclosed. In some embodiments, in response to receiving a specification of a plurality of nets and a specification of a set of routing tracks available for main spines, a main spine routing track is assigned to each of the plurality of nets based at least in part on a cost function and main spine wires are generated on the assigned main spine routing tracks for each of the plurality of nets.

Abstract: Routing a multi-fanout net includes selecting a driver component of the multi-fanout net of a circuit design, wherein the circuit design is specified programmatically, and determining a plurality of targets of the driver component. A source wave is created at each of a plurality of nodes of the driver component. One target is assigned to each source wave. Each source wave is expanded.

Abstract: One method disclosed herein involves, among other things, generating a set of mandrel mask rules, block mask rules and a virtual, software-based non-mandrel-metal mask. The method also includes creating a set of virtual non-mandrel mask rules that is a replica of the mandrel mask rules, generating a set of metal routing design rules based upon the mandrel mask rules, the block mask rules and the virtual non-mandrel mask rules, generating the circuit routing layout based upon the metal routing design rules, decomposing the circuit routing layout into a mandrel mask pattern and a block mask pattern, generating a first set of mask data corresponding to the mandrel mask pattern, and generating a second set of mask data corresponding to the block mask pattern.

Abstract: An integrated circuit comprising a plurality of standard cell circuit elements is disclosed, wherein for at least one layer of the integrated circuit, a majority of minimum-width patterns are in a preferred diagonal orientation.

Abstract: A set of nets in an integrated circuit design, having a timing margin and traverse routing tiles, are identified. The set of nets are assigned a utilization metric based on the traversed routing tiles. A set of sparse nets are determined from the set of nets, based on the utilization metric of each net in the set of sparse nets. One or more target nets are selected from the set of sparse nets, based on the timing margin of the target nets. The target nets may be modified.

Abstract: A method and apparatus to design a circuit is described. In on embodiment, the method comprises selecting a target clock for a design of the circuit, and determining a plurality of latencies for a portion of the circuit. The method further comprises determining a representation of a data flow graph for the portion of the circuit, the data flow graph having a first node connected with a second node by a number of extra delays determined based on the target clock and the plurality of latencies, the first node and second node representing paths that start from and end in registers in the portion of the circuit, the first node connecting to a node between a first input of the portion of the circuit and an input of a register of the portion of the circuit. The method continues to retime the design for the circuit to operate at the target clock based on the representation of the data flow graph, wherein at least one of the selecting, determining, and retiming is performed by a processor.

Abstract: A method for visually verifying an implementation of a design is described. The method includes integrating logical design data, physical design data, and physical implementation data into a common data format and graphically displaying the commonly formatted data to provide a visualization of the design, the visualization including a spatial context component associated with the physical implementation data.

Abstract: A system for computer-aided design (CAD) of an integrated circuit (IC) uses a computer. The computer is configured to optimize placement, routing, and/or region configuration of the integrated circuit (IC) by maximizing a number of low-power regions in the integrated circuit (IC).

Abstract: A method for forming CA power rails using a three mask decomposition process and the resulting device are provided. Embodiments include forming a horizontal diffusion CA power rail in an active layer of a semiconductor substrate using a first color mask; forming a plurality of vertical CAs in the active layer using second and third color masks, the vertical CAs connecting the CA power rail to at least one diffusion region on the semiconductor substrate, spaced from the CA power rail, wherein each pair of CAs formed by one of the second and third color masks are separated by at least two pitches.

Abstract: A technique for routing signal wires in an integrated circuit design includes applying a first rule that attempts to route a signal wire along existing power supply shapes of the integrated circuit design and applying a second rule that provides shield wires along segments of the signal wire that are not routed along one of the existing power supply shapes. The technique also includes routing the signal wire between a first endpoint and a second endpoint while applying the first and second rules to substantially minimize a route cost for the signal wire between the first and second endpoints.

Abstract: A technique will automatically route interconnect of an integrated circuit and adjust spacing between tracks or interconnect in order to improve performance or reduce electromigration effects. By increasing spacing between certain tracks or moving tracks, performance can improve because a track will be more noise immunity from nearby tracks on the same layer or on different layers. The automatic router will adjust spacing between tracks depending on one or more factors. These factors may include current associated with a track, width of a track, capacitance, inductance, and electromigration. In a specific implementation, the technique uses a shape-based approach where a grid is not used. The technique may further vary the width of the tracks.

Abstract: An apparatus and method that improve design efficiency when designing an LSI. A selector module generating section inputs IP connection information describing input/output flows of signals between IPs included in an LSI to be designed, analyzes the inputted IP connection information, and generates a selector module of a selector that matches the input/output flows of signals between IPs described in the IP connection information. A macro module generating section generates a macro module in which relationships between the selector and function blocks are indicated, using the selector module generated by the selector module generating section.

Abstract: Systems and methods for semiconductor device reliability qualification during semiconductor device design. A method is provided that includes defining performance process window bins for a performance window. The method further includes determining at least one failure mechanism for each bin assignment. The method further includes generating different reliability models when the at least one failure mechanism is a function of the process window, and generating common reliability models when the at least one failure mechanism is not the function of the process window. The method further includes identifying at least one risk factor for each bin assignment, and generating aggregate models using a manufacturing line distribution. The method further includes determining a fail rate by bin and optimizing a line center to minimize product fail rate. The method further includes determining a fail rate by bin and scrapping production as a function of a manufacturing line excursion event.

Abstract: A method for determining the layout of an interconnect line is provided including: providing a required width for the interconnect line; determining a layout of the interconnect line including slotting the interconnect line to provide two or more fingers extending along the interconnect line with an elongate slot separating adjacent fingers; and determining a number of elongate apertures to be arranged across the width of the interconnect line by comparing the required width with a maximal width for a solid metal feature, and a minimal elongate aperture width. The two or more fingers and elongate slot may be of constant width and equally spaced across the interconnect line width. The method may include selecting the number of fingers and the width of the slots to optimize the layout for a given layer technology.

Abstract: Methods for standard cells using finFET standard cell structures with polysilicon on OD edges. Standard cells are defined using finFET transistors and having gate structures forming a transistor at an intersection with a semiconductor fin. Polysilicon dummy structures are formed on the edges of the active areas or OD areas of the standard cells. In a design flow, a pre-layout netlist schematic for the standard cells includes a three terminal MOS device corresponding to the polysilicon dummy structure on the edges of the standard cell. After an automated place and route process forms a device layout using the standard cells, a post layout netlist is extracted. Where two standard cells abut one another, a single polysilicon dummy structure is formed on the common boundary. A layout versus schematic comparison is then performed comparing the pre-layout netlist and the post-layout netlist to verify the layout obtained. Additional methods are disclosed.

Abstract: Methods and apparatuses are described for creating, editing, and viewing a floorplan of a circuit design. Specifically, some embodiments enable a user to perform a graphical operation at an inference point in a circuit design layout, wherein the location of the inference point is determined based on existing graphical objects in the circuit design layout. Some embodiments substantially instantaneously update a congestion indicator in a circuit design layout in response to modifying the circuit design layout. Some embodiments substantially instantaneously update pin locations of a block or partition in response to changing the size or shape of the block or partition. Some embodiments enable a user to view a circuit design layout based on the logical hierarchy, and also based on at least one additional attribute type such as voltage, power, or clock domain.

Abstract: A method for designing a system to be implemented on a target device includes generating bounding boxes on the target device for nets in the system where a bounding box identifies routing resources available for routing its corresponding net. The nets in the system are assigned to a plurality of threads to be routed. The threads are executed so that a plurality of the nets are routed in parallel within their corresponding bounding box.

Abstract: A semiconductor circuit includes an array of repeating blocks, each of the blocks having a device, and at least one signal line connecting the devices of the blocks. A model of the semiconductor circuit is generated to include a functional area corresponding to at least one first block of the array, and a loading area corresponding to at least one second block of the array. In the functional area, parasitic parameters of the at least one signal line and the device of the at least one first block are extracted. In the loading area, parasitic parameters of the at least one signal line are extracted, but parasitic parameters of the device of the at least one second block are not extracted.

Abstract: Systems and methods are disclosed for modifying the hierarchy of a System-on-Chip and other circuit designs to provide better routing and performance as well as more effective power distribution. A user specifies desired modifications to the design hierarchy and then the system automatically alters the hierarchy by performing group, ungroup, and move operations to efficiently and optimally implement the desired hierarchy modifications. Any modifications to port and signal names are automatically resolved by the system and the resultant RTL matches the function of the input RTL. The user then evaluates the revised hierarchy with regard to power distribution and routing congestion, and further hierarchy modifications are performed if necessary. A widget user interface facility is included to allow user-guided direction of hierarchy modifications in an iterative fashion.

Abstract: Optimized buffer placement is provided based on timing and capacitance assertions in a functional chip unit including a single source and multiple macros, each having a sink. Placement of the source and macros with the sinks is pre-designed and buffers are placed in branches connecting the source with the multiple sinks. An estimated slack is calculated for each branch, the branches are arranged according to the calculated slack, decoupling buffers are inserted in all branches except the most critical branch(es), the most critical branch(es) are globally routed and slew conditions are fixed within this branch, and at least one next branch is globally routed and slew conditions are fixed therein.

Abstract: Methods and apparatuses for routing traces in a layout design, such as for example a layout design for an integrated circuit, are disclosed. In various implementations, a group of netlines within a layout design and a freeform sketch are identified. Subsequently, the netlines are routed as traces according to the freeform sketch. More particularly, the geometry of the traces is determined by approximating the geometry of the freeform sketch. Various implementations of the invention provide for the netlines to be routed by an automated trace routing engine. With further implementations of the invention, ball grid array escapes and trace fanouts are additionally routed. For example, ball grid array escapes may be routed prior to netlines being routed according to the freeform sketch. In further implementations of the invention, the freeform sketch is deleted after the traces have been routed.

Abstract: A wiring-design aiding method for causing a computer to execute generating paths for buses so that the buses do not cross each other with respect to a wiring area including at least one wiring layer, the paths being represented by corresponding graphics The computer further executes verifying, for each bus, whether wires for nets belonging to the bus are successfully extracted from a component to which the bus is connected; and recording, in the wiring area, graphics representing the nets belonging to a bus for which it is determined in the verification that all the nets belonging to the bus are successfully extracted. The bus-path generation is re-executed with respect to the bus for which it is determined in the verification that at least one of the nets is not successfully extracted.

Abstract: A method includes placing two conductive lines in a layout. Two cut lines are placed over at least a part of the two conductive lines in the layout. The cut lines designate cut sections of the two conductive lines and the cut lines are spaced from each other within a fabrication process limit. The two cut lines are connected in the layout. The two conductive lines are patterned over a substrate in a physical integrated circuit using the two connected parallel cut lines. The two conductive lines are electrically conductive.

Abstract: A method of displaying a schematic diagram of an integrated circuit design is disclosed. The integrated circuit design includes a plurality of logic blocks and the schematic diagram may include a plurality of connections between respective pairs or groups of the logic blocks. The method includes identifying a plurality of interconnect lines that is adapted to schematically illustrate the plurality of connections. Selected interconnect lines out of the plurality of interconnect lines is identified. Portions of the selected interconnect lines may be channeled through a global connection line on the schematic diagram. The global connection line may be a graphical line that spans from one edge of the schematic diagram to another.