Abstract: Device for stripping a product substrate from a carrier substrate connected to the product substrate by an interconnect layer by means of a flexible film that is mounted on a film frame and that comprises an adhesive layer for holding the product substrate in a bonding surface section of the film, the film being mounted on the film frame in an attachment section of the film that surrounds the bonding surface section, and the film comprising a stripping section that is located between the bonding surface section and the attachment section, the device having stripping means for effecting a stripping of the product substrate from the carrier substrate from a periphery of the product substrate.

Abstract: A device for releasing an interconnect layer that provides a connection between a carrier and a wafer which forms a carrier-wafer combination. The device includes rotation means for rotation of the carrier-wafer combination in a release position, and a connection release means for providing an immersion bath that receives the carrier-wafer combination.

Abstract: Method for stripping a wafer from a carrier that is connected to the wafer by an interconnect layer. The method includes the steps of accommodating the carrier-wafer combination on a receiving means, breaking the connection provided by the interconnect layer by a connection release means, and stripping the wafer from the carrier, or stripping the carrier from the wafer by stripping means.

Abstract: A board separation apparatus and an operating method thereof are provided. The board separation apparatus includes a board separation machine and a composite board constituted of a plurality of circuit boards and carrier panels. The board separation machine includes a frame, first and second suction devices, and a linkage. The second suction device is positioned above the first suction device, and the composite board is placed in between the suction devices. The linkage connects the driving mechanism and second suction device. A separable interface layer is located in the composite board. When the suction devices are powered up to stick to the top and the bottom surfaces of the composite board, the linkage is pushed by the driving mechanism, so that the second suction device can move in relation to the first suction device, and one of the circuit board is separated from another one of the carrier panels.

Abstract: A separating fluid, method and use for separating multilayer systems, especially photovoltaic modules, for the purpose of recycling, which allow the separation of multilayer systems. Especially photovoltaic modules, in comparatively simple manner in terms of the processes used, in as environmentally friendly a manner as possible, at high recycling rates. For this purpose, the separating fluid is a nanoscale dispersion or a precursor thereof.

Abstract: On a guide surface 21e formed on a pressing member 21 for guiding carrier tape 15 while pressing it down from its upper surface side, there is provided a projecting portion 27 which projects downwardly in a given range along a tape feed direction correspondingly to such outer edge position of base tape 15a as exists downstream of a tape peeling position peeling off a top tape from the base tape 15a and more outwardly than the feed hole 15d of the base tape 15a. Thus, while the pressing member 21 is pressing down the carrier tape 15 from its upper surface side, the projecting portion 27 is contacted with the outer edge position of the base tape 15a from its upper surface side to thereby prevent the base tape 15a against vibration.

Abstract: A device is provided for ensuring the sterile integrity of two separate fluid pathways during interconnection of the two pathways with a two-part connector assembly. The two-part connector assembly is of the type which comprises a male portion and a female portion, each portion initially having a port covered and protected by a peel-away strip. The device comprises a base assembly, a connector clamp assembly mounted to the base assembly and configured for securing the two-part connector assembly in position for interconnection of the male and female portions, and a strip withdrawal assembly mounted to the base assembly and configured for simultaneous withdrawal of the peel-away strips from the ports of the male and female portions.

Abstract: According to an embodiment of the present disclosure, a substrate inverting device for inverting front and rear surfaces of a substrate is provided. The substrate includes a first holding unit configured to hold one surface of the substrate and a second holding unit disposed to face the first holding unit and configured to hold one surface of the substrate. Further, the substrate includes a moving mechanism configured to relatively move at least one of the first holding unit and the second holding unit to approach each other and stay spaced apart from each other, and a transfer mechanism configured to hold the one surface of the substrate. In this case, a support of the substrate in the first holding unit, the second holding unit and the transfer mechanism is performed by a Bernoulli chuck.

Abstract: A feeder capable of transferring and separating an adhesive component on a tap, includes a frame, a separator, and a drive device. The frame has a top portion for supporting the tap. The separator is mounted to the frame to separate the adhesive component from the tap when the tap passes through the separator. The drive device drives the tap to pass through the separator.

Abstract: Device for stripping a product substrate off a carrier substrate connected to the product substrate by an bonding layer by means of a film frame, a flexible film which is connected to the film frame and which has an adhesive layer for holding the product substrate in a contacting surface section of the film, the film being connected to the film frame in an attachment section of the film which surrounds the contacting surface section, as well as a solvent reservoir formed by the film frame and the film, especially of variable volume, for holding the solvent for detaching the bonding layer, and the product substrate and the bonding layer can be accommodated in the solvent reservoir, and by delivery means for delivering the solvent into the solvent reservoir and by stripping means for stripping the product substrate off the carrier substrate.

Abstract: A peeling system includes: a carry-in/carry-out station that loads/unloads substrates to be processed, support substrates, or stacked substrates in which these are made to adhere; a peeling process station that carries out prescribed processing on substrates to be processed, support substrates and stacked substrates; and a transport station provided between the carry-in/carry-out station and the peeling process station. The peeling process station has a peeling device that peels the stacked substrates, a first washing apparatus that washes peeled substrates to be processed, and a second washing apparatus that washes the peeled support substrates. The pressure inside the transport station is a positive pressure in relation to the pressure inside the peeling device, the pressure inside the first washing apparatus, and the pressure inside the second washing apparatus.

Abstract: A feeder capable of transferring and separating an adhesive component from a tap, includes a frame, a driven capstan device, a separating device, and a drive device. The driven capstan device is mounted to the frame. The separating device is mounted to the frame to separate the adhesive component from the tap. The drive device drives the tap to unwind from the driven capstan and transfer to the separating device to enable the separating device to separate the adhesive component.

Abstract: A system and method for refurbishing or recycling a layered article such as a golf ball is disclosed that includes removing a cover from the article. The system can include a golf ball guide, a golf ball scorer-driver that can score the outer shell of the golf ball while simultaneously advancing it along the golf ball guide, a cover peeler having an orifice with an inner diameter that is less than an outer diameter of the golf ball cover, and a press that can drive the golf ball core through the cover peeler orifice. The method includes inducing at least one weakened region in the outer shell of the golf ball, rupturing the weakened region to create at least one opening in the golf ball outer shell, and forcing a core portion of the golf ball through the opening in the golf ball outer shell.

Abstract: An aspect of the present embodiment, there is provided a method of fabricating a semiconductor device, including curving a semiconductor substrate onto which a protection tape is bonded, and removing the protection tape in a state where the semiconductor substrate is curved.

Abstract: A label dispensing device is disclosed for dispensing labels from a web that has a web path extending through the label dispensing device. The label dispensing device includes a dispensing member and a transition member. The dispensing member is shaped to effectuate a flexure of the web and includes a peel edge disposed along a portion of the web path. The transition member has a web control surface disposed along a portion of the web path. The web control surface is downstream of the peel edge and is configured to engage the first side of the web, thereby reducing the flexure of the web effectuated by the dispensing member.

Abstract: A sealant-attached template includes a template, a sealing substrate, and a sealing resin. The template has a major surface and a pattern including at least one of a depression and a protrusion provided on the major surface. The sealing substrate is provided opposite to the pattern of the template. The sealing resin is provided between the major surface and the sealing substrate.

Abstract: A manufacturing system of an optical display device in which the following can be attained in the case of bonding optical members to optical display units, respectively: an optical member to be excluded, which is, for example, an optical member judged as a defective member, can be appropriately excluded so that the optical member is not bonded onto any optical display unit and a manufacturing method of an optical display device.

Abstract: A method and apparatus for removing a pad adhesively secured to a platen. The apparatus includes a barrel assembly having a clamp assembly fixedly attached to a perimeter of the barrel assembly; a rotatable handle assembly nested within the barrel assembly; and a ratchet assembly nested between the handle assemble and the barrel assembly the ratchet assembly configured to engage the rotatable handle assembly.

Abstract: Device for separating a substrate from a carrier substrate which is connected to the substrate by an interconnect layer. The device includes a carrier substrate holder with a holding surface for holding the carrier substrate. A substrate holder is located opposite the carrier substrate holder. The substrate holder has a substrate holding surface which can be located parallel to the holding surface of the carrier substrate holder. A separating means is provided for parallel displacement of the substrate relative to the carrier substrate in the interconnected state of the substrate and carrier substrate.

Abstract: The present invention is used for separating a superposed substrate in which a processing target substrate and a supporting substrate are joined together with an adhesive into the processing target substrate and the supporting substrate, and includes: a separation processing station performing predetermined processing on the processing target substrate, the supporting substrate, and the superposed substrate; a transfer-in/out station transferring the substrates into/from the separation processing station; and a transfer unit transferring the substrates between the separation processing station and the transfer-in/out station, wherein the separation processing station includes: a separation unit separating the superposed substrate into the processing target substrate and the supporting substrate; a first cleaning unit cleaning the processing target substrate separated in the separation unit; and a second cleaning unit cleaning the supporting substrate separated in the separation unit.

Abstract: A separation apparatus for separating a superposed substrate in which a processing target substrate and a supporting substrate are joined together with an adhesive, into the processing target substrate and the supporting substrate, includes: a first holding unit which holds the processing target substrate; a second holding unit which holds the supporting substrate; a moving mechanism which relatively moves the first holding unit or the second holding unit in a horizontal direction; a load measurement unit which measures a load acting on the processing target substrate and the supporting substrate when the processing target substrate and the supporting substrate are separated; and a control unit which controls the moving mechanism based on the load measured by the load measurement unit.

Abstract: A sheet peeling machine includes a movable table for moving a substrate in a moving direction, a planar member, a holder for holding the planar member; an elevating unit for supporting the holder and moving the holder in an elevating direction, a forwarding unit for contacting an end of the planar member with an edge of a sheet member on the substrate, a tape roller for affixing a peeling tape from the planar member and the sheet member, and a tape wind-up unit for peeling off the sheet member together with the peeling tape. According to the sheet peeling machine, the peeling tape is affixed onto the sheet member and then the sheet member is peeled off together with the peeling tape with a support by the planar member.

Abstract: A position control method for controlling a position of a movable portion, includes: performing control of allowing the movable portion to approach a predetermined position by moving the movable portion; and performing control of moving the movable portion to the predetermined position by moving the movable portion and detecting a relative position of the movable portion with respect to the predetermined position by using an imaging unit.

Abstract: Device and method for stripping a wafer from a carrier that is connected to the wafer by an interconnect layer. The device includes a receiving means for accommodating the carrier-wafer combination consisting of the carrier and the wafer, a connection release means for breaking the connection provided by the interconnect layer between the carrier and the wafer, and stripping means for stripping the wafer from the carrier, or for stripping the carrier from the wafer. The connection release means operates in a temperature range from 0° to 350° C., especially from 10° to 200° C., preferably from 20° to 80° C., and more preferably at ambient temperature. The method includes the steps of accommodating the carrier-wafer combination on a receiving means, breaking the connection provided by the interconnect layer by a connection release means, and stripping the wafer from the carrier, or stripping the carrier from the wafer by stripping means.

Abstract: Improved semiconductor wafer debonding system, method, and apparatus, including a stress-free means for multi-axis debonding utilizing a specialized tool or fixture having at least one ultrasonic transducer.

Abstract: In a device for removing a protective film off a sheet such as game tickets or the like is described. The device has scraping means of the protective film and drawing means of the sheet, together with automatic reading means from which a winning ticket can be detected. The device also includes a recognition unit of the data read by the automatic reading means and warning or displaying means to signal or visualize information relating to a possible win of the ticket.

Abstract: Systems and methods are provided for mechanically cleaving a bonded wafer pair by controlling the rate of cleaving. This controlled rate of cleaving results in a reduction or elimination of non-uniform thickness variations in the cleaved surface of the resulting SOI wafer. One embodiment uses flexible chucks attached to the faces of the wafers and actuators attached to the flexible chucks to cleave the bonded wafer pair. Other embodiments also use rollers in contact with the surfaces to control the rate of cleaving.

Abstract: Described methods and apparatus provide a controlled perturbation to an adhesive bond between a device wafer and a carrier wafer. The controlled perturbation, which can be mechanical, chemical, thermal, or radiative, facilitates the separation of the two wafers without damaging the device wafer. The controlled perturbation initiates a crack either within the adhesive joining the two wafers, at an interface within the adhesive layer (such as between a release layer and the adhesive), or at a wafer/adhesive interface. The crack can then be propagated using any of the foregoing methods, or combinations thereof, used to initiate the crack.

Abstract: A substrate separating method includes: holding, in a predetermined position, a substrate sandwiched between a first holder and a second holder opposed to each other; and relatively moving the first holder and the second holder while the substrate is held in the predetermined position. In holding the substrate, the substrate may be held in the predetermined position by effecting a pressurizing force or a suction force onto the substrate. Also in holding the substrate, the substrate may be held in contact with one of the first holder and the second holder.

Abstract: Provided is an apparatus, system and method for treating a substrate, and more particularly, a substrate treating apparatus having a cluster structure, a substrate treating system, and a substrate treating method using the substrate treating system. The substrate treating apparatus includes a load port on which a container containing a substrate is installed, a plurality of process modules treating the substrate, a transfer module disposed between the load port and the process modules, and transferring the substrate between the container and the process modules, and a buffer chamber disposed between neighboring ones of the process modules, and providing a space for carrying the substrate between the neighboring process modules.

Abstract: Device for stripping a product substrate off a carrier substrate connected to the product substrate by an bonding layer by means of a film frame, a flexible film which is connected to the film frame and which has an adhesive layer for holding the product substrate in a contacting surface section of the film, the film being connected to the film frame in an attachment section of the film which surrounds the contacting surface section, as well as a solvent reservoir formed by the film frame and the film, especially of variable volume, for holding the solvent for detaching the bonding layer, and the product substrate and the bonding layer can be accommodated in the solvent reservoir, and by delivery means for delivering the solvent into the solvent reservoir and by stripping means for stripping the product substrate off the carrier substrate.

Abstract: A temporary decoration which can be applied by a user to fabrics such as articles of clothing. The temporary decoration may be easily applied to the fabric in a quick and efficient manner without the use of heat or a solvent. Once applied to fabric, the temporary decoration is durable and does not undesirably crack. Additionally, the temporary decoration is easily removable. The present invention also relates to a method for making a temporary decoration.

Abstract: Methods and apparatuses for releasably attaching support members to microfeature workpieces to support members are disclosed herein. In one embodiment, for example, a method for processing a microfeature workpiece including a plurality of microelectronic dies comprises forming discrete blocks of material at a first side of a support member. The blocks are arranged on the support member in a predetermined pattern. The method also includes depositing an adhesive material into gaps between the individual blocks of material and placing a first side of the workpiece in contact with the adhesive material and/or the blocks. The method further includes cutting through a second side of the workpiece to singulate the dies and to expose at least a portion of the adhesive material in the gaps. The method then includes removing at least approximately all the adhesive material from the support member and/or the workpiece with a solvent.

Abstract: A workpiece composed of a glass plate and a display panel joined to each other via an adhesive sheet is suction-held on both surfaces thereof by a pair of upper and lower holding members. The glass plate is detached from the display panel through swinging downward one end of the lower holding member around a support shaft provided on the other end side thereof with an entire surface of the glass plate being held in a planar state with a suction surface of the lower holding member.

Abstract: A method and an apparatus for processing display laminate, wherein the display laminate comprises a front electrode layer (106), a display material layer (104) and a protective film layer (102). The display laminate is continuous. A section of protective film layer (102) is continuously removed from the edge of the display laminate by a cutting unit (304) while the display laminate is running through the cutting unit (304). After removing the section of the protective film layer (102), a section of the display material layer (104) located at the same edge as the removed section of the protecting film layer (102) is continuously removed by spraying medium in a spraying unit (310) while the display laminate is running through the spraying unit (310).

Abstract: A method for stripping a wafer from a supporting plate to which the wafer is adhered via an adhesive agent, wherein the supporting plate has a through hole penetrating the supporting plate in a thickness direction thereof, the method including dissolving the adhesive agent with a stripping solution by contacting the stripping solution with the adhesive agent via the through hole. The adhesive agent has a hydrocarbon resin as a viscous component, and the stripping solution is a hydrocarbon-based solvent having a viscosity of 1.3 mPa·s or less and a dissolving rate of 30 nm/sec or greater to dissolve the adhesive agent.

Abstract: An apparatus for removing a protective film for a flat display panel includes a laser oscillating member configured to be disposed over the protective film, the protective film attached to a surface of the flat display panel, the laser oscillating member configured to cut the protective film into a plurality of division regions by irradiating a laser beam; a separation member configured to peel at least one of the plurality of division regions from the flat display panel; a spacer member configured for insertion between the protective film and the at least one division region to be peeled from the flat display panel; and an adhesive member configured for attachment to a surface of the division region opposite the spacer member on the division region, the spacer member and the adhesive member being configured to move in a same direction.

Abstract: A first process for making labels comprises the steps of feeding a laminated combination of a face stock and a process liner to a cutting station such as a microperforator or die-cutter and thereafter stripping the process liner from the face stock and further processing the face stock. The process liner may be recycled and reused. A second method includes all of the steps described above along with the further step of laminating the cut or perforated face stock, immediately after stripping off the process liner, to a second lighter liner which carries the face stock, minus the web or matrix of waste material, to a roller. A complete description of the machinery is given herein.

Abstract: It is an object of the invention to provide a method for producing a combined optical film that includes opposing the end faces of a plurality of optical films to one another and can narrow the gap between the opposed end faces.

Abstract: Device for separating a substrate from a carrier substrate which is connected to the substrate by an interconnect layer. The device includes a carrier substrate holder with a holding surface for holding the carrier substrate, and a substrate holder which is located opposite the carrier substrate holder with a substrate holding surface which can be located parallel to the holding surface for accommodating the substrate. There are separating means for parallel displacement of the substrate relative to the carrier substrate in the interconnected state of the substrate and carrier substrate.

Abstract: A debonder to manufacture a semiconductor that includes: a stage to support a carrier wafer that is attached to a chip stack assembly by a temporary adhesive layer coated on the surface of the carrier wafer; a chuck arranged above the stage to selectively secure the chip stack assembly; a lifting unit to lift the chuck from the stage; a lateral driving unit to move the chuck laterally with respect to the stage; and a controller to control the lifting unit and the lateral driving unit.

Abstract: The invention pertains to a combination of a substrate and a wafer, wherein the substrate and the wafer are arranged parallel to one another and bonded together with the aid of an adhesive layer situated between the substrate and the wafer, and wherein the adhesive is chosen such that its adhesive properties are neutralized or at least diminished when a predetermined temperature is exceeded. According to the invention, the adhesive layer is only applied annularly between the substrate and the wafer in the edge region of the wafer.

Abstract: Device for stripping a product substrate from a carrier substrate connected to the product substrate by an interconnect layer by means of a flexible film that is mounted on a film frame and that comprises an adhesive layer for holding the product substrate in a bonding surface section of the film, the film being mounted on the film frame in an attachment section of the film that surrounds the bonding surface section, and the film comprising a stripping section that is located between the bonding surface section and the attachment section, the device having stripping means for effecting a stripping of the product substrate from the carrier substrate from a periphery of the product substrate.

Abstract: A delaminating apparatus (1) includes: a delamination stage (3) configured so that an LCD device (30) having an LCD panel is placed thereon; a wire (10) that is placed to extend along an entire outer periphery of a polarizing plate, so that the wire is inserted into a gap formed between the LCD panel and the polarizing plate in four corners of the polarizing plate; and a wire wind-up portion (5) configured to wind up the wire (10) to move the wire (10). By winding up the wire (10), the polarizing plate is separated from the LCD panel while moving the wire (10) between the polarizing plate and the LCD panel, whereby the polarizing plate is delaminated from the LCD panel.

Abstract: A separating device according to the present invention separates a support plate (14) from a substrate (12) of a laminate (10) including the substrate (12) and the support plate (14) bonded to each other. The separating device includes: a first storing section (20) for storing the laminate (10); a plurality of first processing sections (30) for reducing adhesive force of an adhesive (13) applied between the substrate (12) and the support plate (14); and a first carrying section (50) which is capable of moving in the first direction and carries the laminate (10) from the first storing section (20) to the first processing section (30) while holding the laminate (10). With the first carrying section (50), it is possible to provide a separating device (100) which moves straightly so as to carry the laminate (10).

Abstract: The invention described herein offers a simple, safe, elegant and effective method for the removal of labels from containers. Furthermore, for consumers who are interested in maximizing the effectiveness of their recycling effort, paper labels must be separated from metal cans before submitting for recycling. This device facilitates that removal in a safe and effective manner.

Abstract: A device is provided for ensuring the sterile integrity of two separate fluid pathways during interconnection of the two pathways with a two-part connector assembly. The two-part connector assembly is of the type which comprises a male portion and a female portion, each portion initially having a port covered and protected by a peel-away strip. The device comprises a base assembly, a connector clamp assembly mounted to the base assembly and configured for securing the two-part connector assembly in position for interconnection of the male and female portions, and a strip withdrawal assembly mounted to the base assembly and configured for simultaneous withdrawal of the peel-away strips from the ports of the male and female portions.

Abstract: To provide a mounting apparatus for uniting a semiconductor wafer with a ring frame, the wafer having an adhesive sheet stuck on one surface thereof. In the mounting apparatus, a portion of the adhesive sheet is preliminarily peeled off through a preliminary peeling means, the wafer is disposed inside the ring frame after a preliminarily peeled portion is formed, and a mounting tape is stuck to the ring frame and the wafer through a sticking means. The mounted wafer is fully peeled off by holding the preliminarily peeled portion.

Abstract: The invention can firmly and easily remove a finely divided weft piece without leaving the weft piece by constituting a method and an apparatus of removing weft from a cord fabric for a topping sheet in a calender line for topping rubber on a number of pieces of aligned cords by a calender roll. In the midst of transferring a cord fabric (F) transferred to a calender apparatus, weft is finely divided by passing the cord fabric (F) through weft dividing means, thereafter, a plurality of blades (45) arranged movably in a width direction on an upper face side of the cord fabric (F) are reciprocally moved in the width direction over an entire width thereof to be brought into contact with the cord fabric (F), and the divided weft piece (W1) is wiped off to remove by respectively striking respective cords (C) of the cord fabric (F) by the respective blades (45).

Abstract: An apparatus for stripping metal from a cathode plate, the apparatus comprising stripping means adapted for positioning between the metal and the cathode plate in order to separate the metal from the cathode plate, and wherein movement of the stripping means is achieved through movement of a robotic arm.