Abstract: Implementations and techniques for removing and segregating components from printed circuit boards are generally disclosed.

Abstract: Apparatus are provided for attaching to a composite tape lamination machine in order to remove composite scrap tape material from a backing paper. When a moveable member is in one position composite non-scrap tape material on a backing paper is directed along a path to avoid a removing member and keep composite non-scrap tape material on a backing paper. When the moveable member is in another position composite scrap tape material on a backing paper is directed along a different path to contact the removing member and remove composite scrap tape material from a backing paper. Composite scrap tape material may be disposed in a scrap disposal member. Backing paper having attached composite non-scrap tape material and not having attached composite scrap tape material may be spooled using a spool roller.

Abstract: Device for stripping a wafer from a carrier that is connected to the wafer by an interconnect layer with: a receiving means for accommodating the carrier-wafer combination consisting of the carrier and the wafer, a connection release means for breaking the connection provided by the interconnect layer between the carrier and the wafer, and stripping means for stripping the wafer from the carrier, or for stripping the carrier from the wafer, the connection release means being made to work in a temperature range from 0 to 350° C., especially from 10 to 200° C., preferably from 20 to 80° C., and more preferably at ambient temperature.

Abstract: There is disclosed a hand-held portable labeler that enables the label web supply to be quickly threaded into the labeler. The path of the carrier web for the labels from the nip of the print head and platen roll, about the delaminator, into the nip between the platen roll and a pressure roll, and out of the labeler is short and the pressure roll is widely separable from the platen roll to facilitate threading.

Abstract: Methods of attaching a ligand to a surface are described that include contacting a surface with a substrate containing an amphiphilic comb polymer. The substrate is configured to provide a pattern of the amphiphilic comb polymer on a selected region of the surface. The substrate can be separated from the surface leaving the amphiphilic comb polymer on the selected region of the surface, thus providing a selected region of the surface having amphiphilic comb polymer on it. A ligand can then be deposited on the surface such that the selected region of the surface having the amphiphilic comb polymer is substantially free of the ligand.

Abstract: A stripping method for stripping a support plate from a laminate including a substrate and the support plate adhered to the wafer via an adhesive layer, in which the adhesive layer is formed from an adhesive compound soluble in a non-polar solvent or a highly polar solvent; and the stripping method includes the step of supplying the non-polar solvent or the highly polar solvent, so that the non-polar solvent or the highly polar solvent is retained at least on an edge portion of that surface of the laminate which faces the support plate, and on a lateral surface of the laminate.

Abstract: Provides a method and a terminus processing tool whereby terminus processing for the purpose of connection to another optical fiber may be carried out simply. The terminus processing method entails cutting an optical fiber 20 composed of a glass fiber 21 and a coating 24; and with the optical fiber 20 positioned relative to a terminus processing tool that is disposed contacting the coating at the end surface of the optical fiber 20 and that has a protruded-into space for accommodating inward protrusion of the glass fiber 21, and with the cut end surface of the glass fiber 21 facing the protruded-into space, pushing the optical fiber 20 to thereby strip the coating 24 from the glass fiber 21.

Abstract: A method and a device for removing backing adhesive, typically a mixture of CaCO3 and SBR, from a carpet. The method includes: (a) sorting the carpets into different categories according to the materials from which the fibers of the carpets are made; (b) removing the bottom layer from a sorted carpet; and (c) removing the backing adhesive by grinding it off the carpet with a grinder until all the adhesive is removed and the fibers of the carpet become loss, which is then collected for recycle. The device is specifically designed to perform the above method and includes a grinder, a feeding device and a pressing wheel device on a frame. The feeding device has an active roller and a passive roller positioned on a support base.

Abstract: The present invention relates to a peeling device which peels off a reinforcing sheet stuck on a substrate, including: a supporting unit which supports one main surface of a laminate having the substrate and the reinforcing sheet; a plate-shaped flexible member to be attached to the other main surface of the laminate; a plurality of pads fixed to a surface of the flexible member lying opposite to the laminate side; a plurality of rods each of which is coupled to any one of the plurality of pads; a plurality of driving devices by which the plurality of rods are made to move, respectively, in their individual axial directions; and a control device by which a position of each of the plurality of rods is controlled on an individual basis, in which each of the plurality of pads is coupled to any one of the plurality of the rods via any one of a plurality of joints so that each pad is allowed to be pivotable centering on a vicinity of an intersection point of a centerline of the rod coupled thereto with a surface o

Abstract: In An Al composite material collapsible in the presence of moisture, the external surface of small pieces or powder constructed from a single or a plurality of crystalline grains of Al or an Al alloy is covered with a film of a low melting point metal or alloy selected from the group consisting of In, Sn, combinations of In and Sn, and alloys thereof. The content of the foregoing low melting point metal or alloy ranges from 0.1 to 20% by mass on the basis of the total mass of the composite material. A material obtained by adding a low melting point metal in an amount specified above to, for instance, Al and then fusing and melting the resulting mixture is quenched and solidified within a non-oxidizing atmosphere to thus form an Al composite material. An Al film, an Al spray-coated film and Al powder can be prepared from the foregoing Al composite material. A component member for a film-forming chamber is also provided, which is provided with a water-collapsible Al film on the surface thereof.

Abstract: A device is disclosed for use with a method for reworking a bonded display (e.g., a LCD) having a substrate (e.g., plate or film) adhesively bonded to a face (e.g., front face) of the LCD. Use of the device provides for efficient and clean removal of the substrate from the display when necessary (e.g., when defect(s) are present) without damage to the display such that the display can subsequently be re-bonded as a component in a device being manufactured.

Abstract: A substrate bonding apparatus includes a first chamber including a first surface plate on which a first substrate is supported, a second chamber spaced from the first chamber and including a second surface plate on which a second substrate to be bonded to the first substrate is supported, an adhesive module provided on the first surface plate and including a plurality of adhesive rubber areas holding the first substrate, and a lift module for lifting at least one of the plurality of adhesive rubber areas.

Abstract: Embodiments of the invention provide for fabricating a filter, for electromagnetic radiation, in at least three ways, including (1) fabricating integrated thin film filters directly on a detector; (2) fabricating a free standing thin film filter that may be used with a detector; and (3) treating an existing filter to improve the filter's properties.

Abstract: The apparatus includes an operating unit, which can be a welding unit for welding a closing film to an edge zone of a containing element or a separating unit for separating containing elements from portions of sheet material. The apparatus includes a control unit programmed to enable the operating unit to selectively process a continuous strip of containing elements or discrete groups of containing elements.