Holding pad for transferring a wafer

- Tokyo Electron Limited
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Description

FIG. 1 is a front view of a holding pad for transferring a wafer showing my new design.

FIG. 2 is a rear view of the holding pad for transferring a wafer of FIG. 1.

FIG. 3 is a top plan view of the holding pad for transferring a wafer of FIG. 1.

FIG. 4 is a bottom plan view of the holding pad for transferring a wafer of FIG. 1.

FIG. 5 is a right side view of the holding pad for transferring a wafer of FIG. 1.

FIG. 6 is a left side view of the holding pad for transferring a wafer of FIG. 1.

FIG. 7 is a perspective view of the holding pad for transferring a wafer of FIG. 1; and,

FIG. 8 is another front view of the holding pad for transferring a wafer of FIG. 1 shown in a used condition.

The features shown only in broken lines depict environmental subject matter only and form no part of the claimed design.

Claims

The ornamental design for a holding pad for transferring a wafer, as shown and described.

Referenced Cited
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Patent History
Patent number: D691974
Type: Grant
Filed: Jun 21, 2012
Date of Patent: Oct 22, 2013
Assignee: Tokyo Electron Limited (Tokyo)
Inventor: Hideyuki Osada (Miyagi)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/425,315