Circuit board material
Latest SUMITOMO ELECTRIC FINE POLYMER, INC. Patents:
- HEAT SHRINKABLE TUBE, HEAT SHRINKABLE COUPLING COMPONENT, METHOD OF MANUFACTURING HEAT SHRINKABLE TUBE, AND METHOD OF MANUFACTURING HEAT SHRINKABLE COUPLING COMPONENT
- Hollow-fiber membrane and hollow-fiber membrane module
- Formed article
- METHOD FOR MANUFACTURING SLIDING MEMBER
- Electricity storage device member, method of manufacturing the same, and electricity storage device
The patent or application file contains at least one drawing executed in color. Copies of this patent or patent application publication with color drawing(s) will be provided by the Office upon request and payment of the necessary fee.
The upper layer of the circuit board material is a flat, transparent surface in which an underlying second layer showing a woven structure is visible through the first upper layer.
Dashed-dot-dashed broken lines define the boundary lines of the enlarged portions of the design in
Claims
The ornamental design for a circuit board material, as shown and described.
835765 | November 1906 | Richter |
D206121 | November 1966 | Christensen et al. |
3372310 | March 1968 | Kantor |
D235264 | June 1975 | Murphy |
D246454 | November 22, 1977 | Ebner et al. |
D258281 | February 17, 1981 | Murphy |
D318461 | July 23, 1991 | Hasegawa et al. |
D319045 | August 13, 1991 | Hasegawa et al. |
D319629 | September 3, 1991 | Hasegawa et al. |
D319814 | September 10, 1991 | Hasegawa et al. |
D510327 | October 4, 2005 | Smith |
D544216 | June 12, 2007 | Prestridge |
D552048 | October 2, 2007 | He |
D589473 | March 31, 2009 | Takamoto et al. |
D598380 | August 18, 2009 | Kuriki |
D605613 | December 8, 2009 | Carter et al. |
D613690 | April 13, 2010 | Kuriki |
D615927 | May 18, 2010 | Kuriki |
D625695 | October 19, 2010 | Wieting |
D628394 | December 7, 2010 | Steeman et al. |
D641720 | July 19, 2011 | Heng et al. |
D651809 | January 10, 2012 | Steeman et al. |
D655921 | March 20, 2012 | Snyder |
D672155 | December 11, 2012 | Steeman et al. |
D672968 | December 25, 2012 | Steeman et al. |
D691817 | October 22, 2013 | Steeman et al. |
- Products News 173, “Black colored flexible printed circuit stiffener,” http://www.risho.co.jp/rishonews/pn173/productnews.html, Risho Kogyo Co., Ltd., Jul. 10, 2010, 4 pgs., with English abstract.
- Chukoh Flo, “Copper-Clad Laminates,” Chukoh Chemical Industries, Ltd., Nov. 1, 2007, 5 pgs., with English abstract.
- Pillar PC-Clad, “Microwave Copper-Clad Laminates,” Release date Unknown but publicly known at least as early as 2008, Nippon Pillar Packing Co., Ltd., 5 pgs., with English abstract.
Type: Grant
Filed: Jan 7, 2014
Date of Patent: Jul 21, 2015
Assignees: SUMITOMO ELECTRIC FINE POLYMER, INC. (Osaka), SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. (Shiga)
Inventors: Makoto Nakabayashi (Osaka), Masahiko Kouchi (Koka)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/478,679