Semiconductor module

- FUJI ELECTRIC CO., LTD.
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Description

FIG. 1 is a front view of a semiconductor module showing our new design;

FIG. 2 is a rear view of the semiconductor module of FIG. 1;

FIG. 3 is a left side view of the semiconductor module of FIG. 1;

FIG. 4 is a right side view of the semiconductor module of FIG. 1;

FIG. 5 is a top view of the semiconductor module of FIG. 1;

FIG. 6 is a bottom view of the semiconductor module of FIG. 1; and,

FIG. 7 is a top, front, right side perspective view of the semiconductor module of FIG. 1.

The broken lines shown in the drawings represent portions of the semiconductor module that form no part of the claimed design.

Claims

The ornamental design for a semiconductor module, as shown and described.

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Patent History
Patent number: D810036
Type: Grant
Filed: Mar 27, 2017
Date of Patent: Feb 13, 2018
Assignee: FUJI ELECTRIC CO., LTD. (Kawasaki)
Inventors: Satoshi Sawayanagi (Matsumoto), Masahiro Taoka (Matsumoto), Tomofumi Oose (Matsumoto), Hideaki Takahashi (Omachi)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/598,481