Peripheral component interconnect card panel set

Info

Patent number: D876443
Type: Grant
Filed: Sep 17, 2019
Date of Patent: Feb 25, 2020
Assignee: Intel Corporation (Santa Clara, CA)
Inventors: Wesley Brook Morgan (Olympia, WA), Aleksander Magi (Portland, OR), Duck Young Kong (Beaverton, OR), Michael Hyde (San Francisco, CA)
Primary Examiner: Marie D. Fast Horse
Application Number: 29/705,978

Description

Description

FIG. 1 is a right, front, top perspective view of two peripheral component interconnect card panel set.

FIG. 2 is a top view of the peripheral component interconnect card panel set of FIG. 1.

FIG. 3 is a bottom view of the peripheral component interconnect card panel set of FIG. 1.

FIG. 4 is an enlarged front view of the peripheral component interconnect card panel set of FIG. 1.

FIG. 5 is an enlarged rear view of the peripheral component interconnect card panel set of FIG. 1.

FIG. 6 is a right side view of the peripheral component interconnect card panel set of FIG. 1; and,

FIG. 7 is a left side view of the peripheral component interconnect card panel set of FIG. 1.

The broken lines in the drawings depict portions of the peripheral component interconnect card panel set that form no part of the claimed design.

Claims

The ornamental design for a “peripheral component interconnect card panel set”, as shown and described.