Retainer ring for chemical mechanical polishing device

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Description

FIG. 1 is a top perspective view of a retainer ring for chemical mechanical polishing device showing my new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left-side view thereof;

FIG. 5 is a right-side view thereof;

FIG. 6 is a top view thereof;

FIG. 7 is a bottom view thereof; and,

FIG. 8 is a bottom perspective view thereof.

The broken lines in the figures depict portions of the retainer ring for chemical mechanical polishing device which form no part of the claimed design.

Claims

I claim the ornamental design for a retainer ring for chemical mechanical polishing device, as shown and described.

Referenced Cited
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Other references
  • “Kyodo International CMP Retaining Ring”, Aug. 27, 2015, Kyodo-Inc.co.jp, site visited Nov. 1, 2021: https://web.archive.org/web/20150827052115/http://www.kyodo-inc.co.jp/english/electronics/parts/index.html (Year: 2015).
  • “Novellus Wafer Retaining Ring CMP Polishing”, Apr. 17, 2017, Ebay.com, site visited Nov. 1, 2021: https://www.ebay.com/itm/301515679216 (Year: 2017).
Patent History
Patent number: D940670
Type: Grant
Filed: Mar 23, 2020
Date of Patent: Jan 11, 2022
Assignee: WILLBE S&T CO., LTD. (Hwaseong-si)
Inventor: Jinwoo Kim (Seongnam-si)
Primary Examiner: Jack Reickel
Assistant Examiner: Michael A Kervin
Application Number: 29/728,917