Semiconductor module

- ROHM CO., LTD.
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Description

FIG. 1 is a front, top and right side perspective view of a semiconductor module showing our new design;

FIG. 2 is a rear, bottom and left side perspective view thereof;

FIG. 3 is a front view thereof;

FIG. 4 is a rear view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a right side view thereof; and,

FIG. 8 is a left side view thereof.

The broken lines illustrate portions of the semiconductor module that form no part of the claimed design. The dash-dotted lines denote the boundary of the claim and form no part of the claimed design. The member illustrated with fine, diagonal, parallel lines is translucent.

Claims

The ornamental design for a semiconductor module, as shown and described.

Referenced Cited
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Other references
  • DigiKey, No Announcement Date [online], retrieved on Sep. 6, 2022, retrieved from internet, https://www.xppower.com/resources/press-releases/high-voltage-dc-dc-power-module-for-scientific-and-semiconductor-applications.
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Patent History
Patent number: D974311
Type: Grant
Filed: Jan 6, 2021
Date of Patent: Jan 3, 2023
Assignee: ROHM CO., LTD. (Kyoto)
Inventors: Okimoto Kondo (Kyoto), Yusuke Nakakohara (Kyoto)
Primary Examiner: Messina L Smith
Assistant Examiner: Noah Perez
Application Number: 29/765,197