Abstract: A method and an apparatus for measuring the amount (CW) of a coating (2) on a paper web (1). The amount (CA) of at least one component in the coating (2) on the paper web (1) is measured and the composition (CC) of the coating (2) to be transferred to the paper web (1) is determined. The amount (CW) of the coating (2) on the paper web (1) is determined on the basis of the amount (CA) of at least one component in the coating (2) on the paper web (1) and the composition (CC) of the coating (2) to be transferred to the paper web (1).

Abstract: This invention provides a thin film deposition process making it possible to form a thin film having a desired composition with good reproducibility and high efficiency; a thin film deposition device therefore; a FTIR gas analyzer used in the thin film deposition process; and a mixed gas supplying device used in the thin film deposition process. The thin film deposition process comprises the steps of mixing a plurality of organic metal gases in a gas mixing chamber and supplying the mixed gas into a reaction chamber to deposit a thin film on a substrate positioned in the reaction chamber, wherein the mixture ratio between/among the organic metal gases supplied into the gas mixing chamber is measured with a FTIR gas analyzer fitted to either the gas mixing chamber or the reaction chamber and then on the basis of results of the measurement, the flow rates of the organic metal gases are individually adjusted.

Abstract: In the present invention, a plurality of solvent supply nozzles for solvents having different solubility parameters are provided in a coating treatment apparatus. For a solvent supply nozzle for use at the time of edge rinse, a solvent supply nozzle is selected that discharges a removal solvent having a solubility parameter different by a set value or more from that of a coating solvent contained in a coating solution. During coating treatment, the coating solution is discharged from a coating solution supply nozzle onto the central portion of a rotated substrate to form a solution film having a predetermined film thickness. Immediately after the formation, edge rinse is started with the coating solution on the substrate not dry yet, in which the removal solvent is supplied to the peripheral portion of the substrate from the selected solvent supply nozzle.

Abstract: The present invention aims to provide a viscous fluid application device which allows improving manufacturing efficiency of semiconductor packages without deteriorating application position accuracy and decreasing designing flexibility. The device includes: an application unit (101) which applies viscous fluid to a substrate 140a; an application head (100) having a supply unit (102) which supplies the viscous fluid to the application unit (101); an X axis unit (110); a Y axis unit (120); a Z axis unit (130); a substrate carrying unit (140); a head height detection sensor (150); and a control unit (160). The supply unit (102) moves in the Y direction in cooperation with a movement in the Y direction of the application unit (101), and remains unmoved irrespective of a movement in the X and Z direction of the application unit (101).

Abstract: A conductor forming apparatus includes a reaction container having housed therein a processing target on a surface of which a recess in which a conductor is to be provided is formed, and a process for providing the conductor in the recess being carried out inside the container after a supercritical fluid dissolved with a metal compound is supplied into the container, a supply device which supplies the fluid from an outside to the inside of the container, and a discharge device which discharges the fluid that is not submitted for the process from the inside to the outside of the container, wherein while an amount of the fluid in the container is adjusted by continuously supplying the fluid into the container by the supply device and continuously discharging the fluid that is not submitted for the process to the outside of the container by the discharge device.

Abstract: The invention relates to a device and method for controlling the operation of a thermal spray torch (12). The inventive device and method are characterized in that an on-board camera (54) and pyrometer (70) are used to measure the properties of the jet (16) and the temperature of the deposit (24) on the part (22) and in that the correction to be made to supply parameters of the torch (12) is deduced. Furthermore, the invention is characterized in that the corrected parameters are sent to the cabinet (30) that controls the torch (12).

Abstract: An apparatus for depositing a ceramic coating on a component. The apparatus includes an evaporation source containing multiple different oxide compounds, at least one of the oxide compounds having a vapor pressure that is higher than the remaining oxide compounds, to deposit on the component a coating of the multiple oxide compounds. The apparatus further includes a device for introducing the evaporation source into a coating chamber, a device for suspending the component near the evaporation source, a device for projecting a high-energy beam on the evaporation source to melt and form a vapor cloud of the oxide compounds of the evaporation source, a device capable of preventing the vapor cloud from contacting and condensing on the component, and a device for moving the preventing device to allow the vapor cloud to contact and condense on the component.

Abstract: The present invention provides a surface inspection method and apparatus for inspecting a surface of a sample, in which a resistive film is coated on the surface, and a beam is irradiated to the surface having the resistive film coated thereon, to thereby conduct inspection of the surface of the sample. In the surface inspection method of the present invention, a resistive film having an arbitrarily determined thickness t1 is first coated on a surface of a sample. Thereafter, a part of the resistive film having the arbitrarily determined thickness t1 is dissolved in a solvent, to thereby reduce the thickness of the resistive film to a desired level. This enables precise control of a value of resistance of the resistive film and suppresses distortion of an image to be detected.

Abstract: The present invention generally provides methods and apparatus for controlling ion dosage in real time during plasma processes. In one embodiment, ion dosages may be controlled using in-situ measurement of the plasma from a mass distribution sensor combined with in-situ measurement from an RF probe.

Abstract: The invention relates to a device and a method for control of the operation of a thermal projection torch (12), characterized in that the characteristics of the jet (16) and the temperature of the deposit (24) on the piece (22) are measured by means of a camera (54) and a combined pyrometer (70). The correction to be made to the supply parameters of the torch (12) are deduced therefrom and the corrected parameters are transmitted to the unit (30) controlling the torch (12).

Abstract: The invention relates to a device and a method for control of the operation of a thermal projection torch (12), characterized in that the characteristics of the jet (16) and the temperature of the deposit (24) on the piece (22) are measured by means of a camera (54) and a combined pyrometer (70). The correction to be made to the supply parameters of the torch (12) are deduced therefrom and the corrected parameters are transmitted to the unit (30) controlling the torch (12).

Abstract: The invention relates to a device and method for controlling the operation of a thermal spray torch (12). The inventive device and method are characterised in that an on-board camera (54) and pyrometer (70) are used to measure the properties of the jet (16) and the temperature of the deposit (24) on the part (22) and in that the correction to be made to the supply parameters of the torch (12) is deduced. Furthermore, the invention is characterised in that the corrected parameters are sent to the cabinet (30) that controls the torch (12).

Abstract: The present invention presents an improved apparatus and method for monitoring a material processing system, where the material processing system includes a processing tool, test signal source, and a filter/detector. The test signal source providing a first test signal and a second test signal to the processing chamber, and the filter/detector detecting an intermodulation product of the first test signal and the second test signal generated when a plasma is created.

Abstract: The present invention provides a system to dispense a liquid, contained in a cartridge, onto a substrate employing a dispensing system under control of a processor in data communication with a memory.

Abstract: In a film forming apparatus according to the aerosol deposition method, the thickness of a structure being formed can be controlled accurately. The film forming apparatus includes an aerosol generating part in which raw material powder is to be provided, a compressed gas cylinder and a pressure regulating part for introducing a gas into the aerosol generating part to blow up the raw material powder thereby generating an aerosol, a substrate holder for holding a substrate on which a structure is to be formed, a nozzle for spraying the aerosol generated in the aerosol generating part toward the substrate, and a sensor to be used for obtaining an amount of primary particles that have contributed to film formation by impinging on the substrate or the structure formed thereon from among the raw material powder contained in the aerosol sprayed from the nozzle.

Abstract: A film formation apparatus by which a film thickness can be precisely measured and whether the film quality is good or bad can be confirmed in a process of performing film formation according to the aerosol deposition method. The film formation apparatus includes: an aerosol generating unit for generating an aerosol by dispersing a raw material powder by a gas; a holding unit for holding a substrate on which a structure is to be formed; a nozzle for injecting the aerosol generated by the aerosol generating unit toward the substrate; and a measurement unit for measuring an electric potential of a film formation surface on the substrate.

Abstract: A semiconductor process system (10) includes a measuring section (40), an information processing section (51), and a control section (52). The measuring section (40) measures a characteristic of a test target film formed on a target substrate (W) by a semiconductor process. The information processing section (51) calculates a positional correction amount of the target substrate (W) necessary for improving planar uniformity of the characteristic, based on values of the characteristic measured by the measuring section (40) at a plurality of positions on the test target film. The control section (52) controls a drive section (30A, 32A) of a transfer device (30), based on the positional correction amount, when the transfer device (30) transfers a next target substrate (W) to the support member (17) to perform the semiconductor process.

Abstract: The invention relates to an adhesive robot, comprising a device for applying adhesive to a workpiece. The adhesive robot has a nozzle head (18), which has an application nozzle (24) and can be supplied with a pressurized viscous adhesive, the nozzle head (18) and the workpiece (14) being displaceable in relation to one another. The adhesive which is issued from the application nozzle (24) in a spray jet (28) is applied to a workpiece (14) along a predefined line of application (36) in the form of a strip of adhesive (40). To facilitate the adjustment and re-calibration process, the system comprises at least one camera unit (42), which is located on the nozzle head (18) and whose leans is directed towards the spray jet (28) or the adhesive strip (40). The output of said camera unit is connected to an image evaluation unit (45). The image data (40) recorded by the camera unit (42) is buffered and compared with predetermined image values (40).

Abstract: A method of designing and the resulting thermally stable heated coating die apparatus, the die apparatus including a die having a die geometry and a heating system with heaters and temperature sensors. The method and resultant apparatus provides minimized temperature gradients, flat die lip faces in a die to roll plane and a flat die in a plane perpendicular to die flat lip faces and parallel to substrate width. The method optimizes simultaneously: die geometry, placement of the heaters, placement of temperature sensors, and shielding from operating conditions, using heat transfer and structural numerical modeling and statistical analysis while considering die functionality characteristics, minimum increment of temperature measurement and control accuracy related to minimum acceptable deviation from flatness, coating die material of construction relative to thermo-structural material properties, and desirable coating die material properties.

Abstract: This invention provides a stable process for depositing an antireflective layer. Helium gas is used to lower the deposition rate of plasma-enhanced silane oxide, silane oxynitride, and silane nitride processes. Helium is also used to stabilize the process, so that different films can be deposited. The invention also provides conditions under which process parameters can be controlled to produce antireflective layers with varying optimum refractive index, absorptive index, and thickness for obtaining the desired optical behavior.

Abstract: A desired level of pressure is established in at least one chamber that forms part of a closed atmosphere, such as in a semiconductor device processing facility. A pressure control system includes at least one space increase/decrease device that has a partition which is movable to increase and/or decrease the volume of free space within the chamber(s), a pressure sensor for detecting the pressure within the chamber(s), and a controller for controlling the movement of the partition based on the detected pressure. A chamber is provided with positive or negative pressure to increase or decrease the pressure therein while the pressure in the chamber is monitored. As soon as the pressure within the chamber equals a predetermined pressure, the providing of the positive or negative pressure is stopped. The partition is moved to vary the effective volume of free space in the chamber(s) to change the pressure in the chamber from the predetermined pressure to the desired pressure.

Abstract: Methods and apparatuses estimate and control optical fiber primary coating diameter for wet-on-wet optical fiber manufacturing. The primary coating diameter for a particular length of optical fiber is calculated based upon a measurement of the weight of primary and/or secondary coating material consumed during optical fiber manufacturing. Control of the primary coating diameter is effected by a coating controller which can increase or decrease the primary coating diameter through control of glass temperature, coating viscosity and/or other parameters during wet-on-wet fiber manufacture.

Abstract: A photoresist supply apparatus is provided. The photoresist supply apparatus includes a lower photoresist sensor and an upper photoresist sensor respectively installed near the bottom and the top of a trap tank to detect a photoresist in the trap tank. A drain line is connected to an upper side of the trap tank to release air. A photoresist-blocking valve is installed at the drain line, the photoresist-blocking valve structured to be opened to release air or closed to prevent photoresist loss according to signals detected by the lower photoresist sensor and the upper photoresist sensor. While the photoresist is supplied into the trap tank, the photoresist-blocking valve is opened to release air. After the photoresist supply into the trap tank is completed, the photoresist-blocking valve is closed to prevent the loss of a large amount of the photoresist through the drain line.

Abstract: A method and apparatus for improving an operating efficiency for a process including temperature dependent fluid delivery including determining a projected time period to start a process during a non-operating time period; delivering a process fluid for performing the process along at least one fluid recirculation pathway for at least one selected time period the at least one fluid recirculation pathway including a substantial portion of a fluid delivery pathway for providing the process fluid to the process at a predetermined process temperature; and, providing the process fluid following the at least one selected time period to the process at the predetermined process temperature.

Abstract: A slurry raw material is applied onto a carrier film 3 in a coating section 4, and a predetermined property related to the thickness of the slurry raw material is measured in a property-measuring section 5 in a wet mode before the slurry raw material is dried in a drying section 6. A processing sub-section 7a calculates an estimated value t of the thickness of a sheet from the target thickness of the sheet, a measurement of the slurry raw material property, and the slurry raw material density, to compare the estimated value t with the target value T of the sheet thickness. An adjusting output sub-section 7b transmits signals for adjusting the thickness to a thickness-adjusting device 9 on the basis of the above comparison result, to efficiently and precisely control the thickness of the slurry raw material applied onto the carrier film 3.

Abstract: A controller for a moisture adjusting device of the present invention reads out a target moisture content set in advance in a data table in accordance with a type of a planographic printing plate; determines, every predetermined control period, a moisture content of an overcoat layer (measured moisture content) based on a measured signal SW; and calculates a difference (deviation) between the measured moisture content and the target moisture content. For example, if the measured moisture content of the overcoat layer is lower than the target moisture content, the controller sets an adjusted moisture content which is higher than the measured moisture content and controls the humidity and the temperature within a humidity conditioning zone so that an interposing paper web (protective sheet material) attains the adjusted moisture content within the humidity conditioning zone.

Abstract: Real-time analysis and control of a semiconductor silicidation process. The architecture includes system and methods for monitor and control of a silicidation process during rapid thermal anneal. An FTIR system analyzes selected and/or random regions where silicidation is occurring, and signals the process control system to control the process according to the status of the analyzed silicide formations.

Abstract: A coating apparatus coats a liquid material on a substrate in a coating chamber. A first liquid supply system that supplies the liquid material is provided in the coating chamber. A second liquid supply system is provided in the first liquid supply system that supplies a liquid that cleans or that deactivates the liquid material remaining in the coating chamber and/or in the first liquid supply system. A coating apparatus, a thin film forming method, a thin film forming apparatus, a semiconductor device manufacturing method, an electro-optic device, and an electronic instrument are provided that enable a high performance thin film with few defects and with a high degree of reproducibility to be obtained, that allow maintenance of the apparatus to be performed efficiently and safely, and that enable a thin film to be formed at low cost.

Abstract: A substrate processing apparatus comprises a chamber 28 capable of processing a substrate 20. A radiation source 58 provides radiation that is at least partially reflected from the substrate in the chamber. A radiation detector 62 is provided to detect the reflected radiation and generate a signal. A controller 100 is adapted to receive the signal and determine a property of the substrate 20 in situ during processing, before an onset of during or after processing of a material on the substrate 20.

Abstract: A method and apparatus for coating hams is provided. Sugar is uniformly dispensed on an inclined plate that is heated to melt the sugar. The sugar flows into a reservoir from which it is poured onto hams passing below the reservoir on a conveyor. Spices are poured onto the melted sugar that sticks to the ham to form a glaze. Jets of water can cool the glaze to increase retention on the ham. The process can be repeated.

Abstract: A color adjustment system for changing the color of fluid flowing from a source. The color adjustment system includes a main mixing pipe connected to storage vessels to continuously receive flows of colorants from the storage vessels. A fluid inspection cell is connected to the main mixing pipe for continuously receiving a sample portion of the flow of the fluid composition. A spectrophotometer is positioned to view the sample portion of the flow of the fluid composition through a window of the fluid inspection cell. The spectrophotometer transmits measured color values to a control unit, which generates control signals in response thereto. The control signals are transmitted to colorant pumps, which pump colorants to the main mixing pipe in response to the control signals.

Abstract: An automatic tissue processor for processing tissue samples for histological analysis. The tissue processor in one configuration includes a retort chamber, a wax storage chamber holding multiple wax containers, a reagent storage chamber holding multiple reagent containers, and a fluid transporting system including a rotary valve operated by a Maltese Cross gear, for selectively connecting the retort chamber with a particular wax or reagent container to supply wax or reagents to the retort chamber. Differential heating of the wax chamber is accommodated by multiple heating elements, with indirect heating of the rotary valve and the fluid transporting system. A computerized central control system for automatic monitoring and control of such tissue processor is advantageously arranged to execute a reagent management program, which enables the central control system to automatically manage reagent usage and replacement.

Abstract: During the application of glue, in particular hot-melt glue, to a material web (21) for blanks, the transfer of glue is dependent on the conveying speed of the material web (21) and other parameters. In particular, a glue pressure, which is exerted on the glue in accordance with the movement of the material web, is regulated by means of a pressure control valve (37) which is connected to a central machine control unit (31). This ensures a uniform delivery of glue.

Abstract: Methods and systems for controlling evaporative drying processes using environmental equivalency control process parameters to provide a specified product quality. In an environmental equivalency-based control system, measured values are received by environmental equivalency calculation hardware or software. An environmental equivalency value is calculated based on the measured parameters. One or more of the process parameters may then be varied to maintain the environmental equivalency value for the process within a predetermined range of environmental equivalency values.

Abstract: An apparatus and method supports thermal processing of a microelectronic device such as a semiconductor chip in a substrate by heating the substrate with secondary radiation from an energy transfer device 40, which has a first set of energy transfer regions comprised of an emissive and thermally conductive material, and a second set of thermally insulating regions comprised of a reduced emissivity and reduced thermal conductivity material or free space. A multi-zone-radiant energy source 30 provides radiative energy to energy transfer device 40, with a process controller 36, preferably a multi-zone controller, altering the amount of energy provided by each heat zone associated with each emissive region of energy transfer device 40. Sensors detect the thermal energy level of each energy transfer region to allow controller 36 to adjust the secondary radiation emitted by each region in real time, resulting in a predetermined and controlled distribution of thermal energy on substrate 20.

Abstract: An object of the present invention is to provide a method of monitoring deterioration of an electrolytic gold plating solution which can always stably performing gold plating by continuously detecting a deterioration state of the gold sulfite complex plating solution, and to provide an apparatus for monitoring the deterioration of the electrolytic gold plating solution. The present invention is characterized by an electrolytic gold plating method for performing electrolytic gold plating on a surface of a substrate body using a gold sulfite plating solution, wherein the gold plating is performed while deterioration of the plating solution is being always or intermittently detected during plating.

Abstract: The present invention pertains to an arrangement for the controlled application of adhesive to substrate. In at least one embodiment, the arrangement comprises a) an adhesive reservoir, b) a pump, c) an applicator head having at least one applicator nozzle, d) a volume throughput sensor, and e) a monitoring unit. The reservoir, the pump, and the applicator head are connected together by a conduit system carrying the adhesive. The volume throughput sensor and the monitoring unit are connected together by a pulse transmission line. The monitoring unit, the feed pump, and the applicator head are connected together by control lines. In at least one embodiment, the application of adhesive to substrates is controlled by measuring the volume throughput of the adhesive, transmitting signals indicative of volume throughout to the monitoring unit, and controlling the amount of adhesive applied to the substrate material in-line in response to the signals.

Abstract: A method of performing dip coating of a layer of a resist material on a surface of a substrate, comprising steps of: (a) providing a dip coating vessel having an interior space containing a dip coating liquid comprising a solution of the resist material in a solvent, the dip coating vessel being open at the top thereof; (b) providing a substrate having a surface, immersing the substrate in the dip coating liquid in the vessel via the open top, and withdrawing the substrate from the vessel via the open top thereof, thereby forming a layer of resist material on the surface; and (c) monitoring and maintaining the viscosity of the dip coating liquid supplied to the dip coating vessel at a predetermined value. Also disclosed is an apparatus for performing the method.

Abstract: A deposit is formed on a deposition substrate using a deposition gun that bums a mixture of a fuel and an oxidizer to form a deposition gas flow, mixes a powder into the deposition gas flow to form a deposition mixture flow, and projects the deposition mixture flow therefrom. The deposition gun is provided with a flowing coolant. A flow rate of the fuel to the deposition gun, a flow rate of the oxidizer to the deposition gun, a flow rate of the powder to the deposition gun, and a cooling capacity of the coolant flow are all measured. The flow rate of the fuel, the flow rate of the oxidizer, the flow rate of the powder, and the cooling capacity of the coolant flow are all controlled responsive to the step of measurements.

Abstract: Apparatus and methods for monitoring the application of a viscous material onto at least one moving strand or other narrow substrates. A detection unit, such as a machine vision system, an infrared sensor, an ultraviolet detector, or a light curtain with multiple detectors, senses radiation originating from the viscous material after it is applied to the strand or strands and, typically, before each strand is contacted with a substrate. The detection unit determines a detected value representative of a characteristic of the pattern from the sensed radiation, compares the detected value with a reference value representative of a desired standard for the characteristic, and outputs a signal in accordance with the result of the comparison.

Abstract: A bubble detection system to detect bubbles in photoresist. The system includes photoresist at least one tank, a buffer tank, a pump, and a bubble sensor. The photoresist tank provides the photoresist. The buffer tank stores the photoresist from the photoresist tank. The pump pumps the photoresist from the buffer tank to an end terminal. The bubble sensor is set between the buffer tank and the pump to detect bubbles in the photoresist, and outputs an alarm signal when bubbles are detected. The nozzle is set at the end terminal to output the photoresist.

Abstract: The present invention is generally relates to the field of research for the discovery of films with desirable properties, and to a process for making such films. More particularly, the present invention is directed to a system or an apparatus and a method for the rapid formation of a library of liquid samples and a library of thin films therefrom, as well as to the rapid screening of these films to identify those having desirable properties, all of which may be achieved using combinatorial techniques.

Abstract: An integrated phase separator for use in an ultra high vacuum system, for example, a molecular beam epitaxy system, is described. The vacuum chamber has a cryogenic panel disposed therein. The cryogenic panel includes a cryogenic shroud region and a phase separator region. Liquid nitrogen is introduced into the cryogenic panel via an inlet line. As the liquid nitrogen warms and vaporizes, nitrogen vapor rises within the shroud. The phase separator region within the cryogenic panel provides a near atmospheric pressure vapor barrier over the liquid nitrogen so that the nitrogen vapor may escape smoothly through the outlet of the panel, without forming gas bursts. Also, the phase separator region is vacuum jacketed to prevent cryogenic shroud surface temperature changes due to variations in liquid nitrogen levels, thereby increasing the cryogenic shroud's pumping stability. In one embodiment, used in molecular beam epitaxy (MBE), the cryopanel is divided into first and second cooling chambers.

Abstract: A system and method for manufacturing thin-film structures disposed on a substrate. The thin-film structures have different respective thicknesses that vary along a radius of the substrate. A substrate rotates about an axis of rotation and a source of deposited material is directed at the rotating substrate. A mask having a stepped profile is positioned between the rotating substrate and the source. The stepped mask selectively blocks material emanating from the source from reaching the substrate. Each step of the profile of the mask corresponds to one of the respective thicknesses of the thin-film structures. The radius along which the different respective thicknesses of the film-thin structures vary is measured from the axis of rotation of the rotating substrate, and the substrate includes at least one wafer having a center that is either coincident or offset from the axis of rotation.

Abstract: The invention relates to an adhesive robot, comprising a device for applying adhesive to a workpiece. The adhesive robot has a nozzle head (18), which has an application nozzle (24) and can be supplied with a pressurized viscous adhesive, the nozzle head (18) and the workpiece (14) being displaceable in relation to one another. The adhesive which is issued from the application nozzle (24) in a spray jet (28) is applied to a workpiece (14) along a predefined line of application (36) in the form of a strip of adhesive (40). To facilitate the adjustment and re-calibration process, the system comprises at least one camera unit (42), which is located on the nozzle head (18) and whose leans is directed towards the spray jet (28) or the adhesive strip (40). The output of said camera unit is connected to an image evaluation unit (45). The image data (40) recorded by the camera unit (42) is buffered and compared with predetermined image values (40).

Abstract: A technique for more efficiently forming conductive elements, such as conductive layers and electrodes, using chemical vapor deposition. A conductive precursor gas, such as a platinum precursor gas, having organic compounds to improve step coverage is introduced into a chemical vapor deposition chamber. A reactant is also introduced into the chamber that reacts with residue organic compounds on the conductive element so as to remove the organic compounds from the nucleating sites to thereby permit more efficient subsequent chemical vapor deposition of conductive elements.

Abstract: An apparatus for manufacturing a semiconductor device, comprising a process chamber which holds a substrate to be subjected to a prescribed process, a gas inlet pipe which introduces a process gas into the process chamber, a gas outlet pipe which discharges the gas from the process chamber to outside the process chamber, component-measuring devices which measure components of the gas in the process chamber or at least two different gases, concentration-measuring devices which measure concentration of each component of the gas in the process chamber, or the concentration of each component of at least two different gases, and a control device which adjusts the components of the process gas, the concentration of each component of the process gas and an atmosphere in the process chamber, on the basis of values measured by the composition-measuring device and concentration-measuring device.

Abstract: A resist recycling apparatus includes a viscosity control tank supplied with wasted resist liquid; a solvent tank that supplies a solvent to the viscosity control tank; a viscometer that measures viscosity of the resist according to the viscosity measured by the viscometer and the temperature of the resist, and that determines an amount of solvent to supply to the viscosity control tank according to the difference between the calculated resin density and a predetermined resin density; and a filter that removes dust from the resist.

Abstract: A system and method for real time deposition process control based on resulting product detection, where the system and method detect an amount of at least one reaction product in real time, while the deposition process is being performed, the detected amount of reaction product is compared with a reference amount, and a comparison result is fed back in real time to adjust a supply of one or more reactants. The system and method provide real time control over the deposition process and/or reduce the number of wafers produced that do not meet processing target values.

Abstract: A coating equipment managing system for controlling and monitoring a coating equipment of an automobile manufacturing line, comprising local installations which are provided in the manufacturing lines at a plurality of localities, and a central installation for receiving data from the plurality of local installations, wherein the local installation comprises a sensor installed in the coating equipment, a data acquisition unit for receiving signals from the sensor, a control unit for controlling the coating equipment, and a local communication unit; the central installation comprises a server unit and a central analysis unit; the local communication unit transmits the data from the data acquisition unit to the server unit by E-mail; the server unit transmits correction data for the coating equipment obtained from the analysis of the measured data by the central analysis unit to the local communication unit by E-mail; and the local communication unit converts the correction data into a control code and transmit